Datasheet
Serial-in Parallel-out LED Driver
12ch LED Driver IC for Automotive
with 3-line Serial Interface
BD8389FV-M
General Description
Key Specifications
The BD8389FV-M is a serial-in parallel-out controlled
LED driver with 40V output voltage rating.
With the input of 3-line serial data, it turns the 12ch open
drain output on/off.
Due to its compact size, it is optimal for small space.
Input Voltage Range:
Output Voltage Range:
DC Output Current:
Output ON Resistance:
Static Current:
Operating Temperature Range:
3.0V to 5.5V
40V(Max)
50mA(Max)
6Ω(Typ)
0μA(Typ)
-40°C to +125°C
Features
Package
AEC-Q100 Qualified(Note 1)
Open Drain Output
3-line Serial Control + Enable Signal
Cascade Connection Compatible
SSOP-B20 Package
Internal 12ch Power Transistor
Output Slew Rate 20V/μs(Typ)
(for Low EMC Noise)
SSOP-B20
W(Typ) x D(Typ) x H(Max)
6.50mm x 6.40mm x 1.45mm
(Note 1) Grade 1
SSOP-B20
Application
For Indicator of Cluster Panel
Typical Application Circuit
VBAT
VCC
Micro
Computer
VCC
OEN_B
LATC H
RST_B
CLK
SERIN
SEROUT
GND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
VCC
OEN_B
LATC H
RST_B
CLK
SERIN
SEROUT
GND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
VCC
VBAT: Battery
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit
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〇This product has no designed protection against radioactive rays
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Pin Configuration
Pin Description
(TOP VIEW)
Pin No.
1
2
3
4
5
6
7
8
Pin Name
VCC
SERIN
D0
D1
D2
D3
D4
D5
9
RST_B
10
OEN_B
VCC
1
20
GND
SERIN
2
19
CLK
D0
3
18
D11
D1
4
17
D10
D2
5
16
D9
D3
6
15
D8
D4
7
14
D7
D5
8
13
D6
11
SEROUT
RST_B
9
12
LATCH
12
LATCH
OEN_B
10
11
SEROUT
13
14
15
16
17
18
19
20
D6
D7
D8
D9
D10
D11
CLK
GND
Figure 2. Pin Configuration
Function
Power supply voltage input
Serial data input
Drain output 0
Drain output 1
Drain output 2
Drain output 3
Drain output 4
Drain output 5
Reset invert input
(Low: Shift register data 0)
Output enable
(High: Output OFF)
Serial data output
Latch signal input
(High: Data latch)
Drain output 6
Drain output 7
Drain output 8
Drain output 9
Drain output 10
Drain output 11
Clock input
GND
Block Diagram
VCC
D0
D1
CLK
D2
Shift Register
SERIN
D3
Latch & Control Logic
SEROUT
LATCH
D4
D5
D6
D7
RST_B
D8
OEN_B
D9
D10
D11
GND
Figure 3. Block Diagram
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Description of Function
If there is no description, please refer as typical value.
1. Serial Communication
The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a
register to store those signals with a LATCH signal. The registers are reset by applying a voltage below VTL to the RST_B
pin, and D11 to D0 become open. To prevent erroneous LED lighting, please apply voltage below VTL to RST_B during
start-up.
CLK
Shift
Register
12bit
12bit
Driver
SERIN
Register
LATCH
Figure 4. Block Diagram of Serial Communication
(1) Serial Communication Timing
The 12bit serial data input from the SERIN pin is taken into the shift register by the rising edge of the CLK signal,
and is recorded in the register by the rising edge of the LATCH signal. The recorded data is valid until the next rising
edge of the LATCH signal.
(2) Serial Communication Data
The serial data input configuration of the SERIN pin is shown below:
First →
d11 d10 d9 d8 d7 d6 d5 d4 d3 d2
Data
Pin
D11
D10
D9
D8
…
D3
D2
D1
D0
Output
Condition d11 d10 d9
ON
1
*
*
OFF
0
*
*
ON
*
1
*
OFF
*
0
*
ON
*
*
1
OFF
*
*
0
ON
*
*
*
OFF
*
*
*
→ Last
d1 d0
Data
d8
*
*
*
*
*
*
1
0
d7
*
*
*
*
*
*
*
*
d6
*
*
*
*
*
*
*
*
d5
*
*
*
*
*
*
*
*
d4
*
*
*
*
*
*
*
*
d3
*
*
*
*
*
*
*
*
d2
*
*
*
*
*
*
*
*
d1
*
*
*
*
*
*
*
*
d0
*
*
*
*
*
*
*
*
…
…
…
…
…
…
…
…
…
…
…
…
…
ON
OFF
ON
OFF
ON
OFF
ON
OFF
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
1
0
* Indicate don’t care.
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Description of Function - continued
(3) Enable Signal
By applying voltage VTH or more to the OEN_B pin, D11 to D0 become open forcibly.
All output terminals become PWM operation by having the PWM signal to the OEN_B pin at the same time.
OEN_B
(Input)
L
VTH
H
D11 to D0
(Output)
LED ON
ILED
LED ON
VTL
VBAT
LED OFF
VOL
ON
LED OFF
OFF
Figure 5. PWM Dimming Control
(4) SEROUT
A cascade connection can be made(connecting at least 2 or more IC’s in serial). Serial signal input from SERIN is
transferred into the receiver IC by the falling edge of the CLK signal. Since this functionality gives enough margins
for the setup time prior to the rising edge of the CLK signal on the receiver IC(using the exact same CLK signal of
the sender IC), the application reliability can be improved as cascade connection functionality.
LATCH
SERIN
d11
d10
CLK
1
2
d9
d8
3
d7
4
d6
5
d5
6
d4
d3
8
7
d2
9
d1
10
d0
11
12
SEROUT
d11
Figure 6. SEROUT Output Signal
2. Cascade Connection
As an application, BD8389FV-M can turn on 13 or more LED lights. By making a cascade connection between 2 ICs, the
LED application of up to 24 lights can be constructed. In this case, connect the SEROUT pin of the sender IC and the
SERIN pin of the receiver IC. When send 24bit signal to the sender IC, the serial data is sent to the receiver IC from the
SEROUT pin of the sender IC. In addition, it is possible to construct 3 or more applications.
Receiver IC
Sender IC
LATCH
SERIN
d23
CLK
1
d22
2
d21
3
d14
10
d13
11
d12
12
d11
13
d10
14
d9
15
d2
22
d1
23
d0
24
Figure 7. Cascade Connection
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BD8389FV-M
Absolute Maximum Ratings(Ta=-40°C to +125°C)
Parameter
Power Supply Voltage
Output Pin Voltage
(D0, D1, D2, D3, D4, D5, D6, D7, D8, D9, D10, D11)
SERIN, RST_B, CLK, OEN_B, LATCH
Pin Voltage
SEROUT Pin Voltage
Power Dissipation
Symbol
Rating
Unit
VCC
VD0, VD1,
VD2, VD3,
VD4, VD5,
VD6, VD7,
VD8, VD9,
VD10, VD11
VSERIN,
VRST_B,
VCLK,
VOEN_B,
VLATCH
VSEROUT
-0.3 to +7
V
-0.3 to +40
V
-0.3 to +VCC
V
-0.3 to +VCC
V
Pd
1083
mW
(Note 1)
Storage Temperature
Tstg
-55 to +150
°C
DC Output Current
IomaxD
50
mA
Pulse Output Current(Note 2)
IomaxP
150
mA
Tjmax
150
°C
Maximum Junction Temperature
Caution 1:
Caution 2:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the
maximum junction temperature rating.
(Note 1) Pd decreased at 7.5mW/℃ for temperatures above Ta=25℃, mounted on 70x70x1.6mm Glass-epoxy PCB.
(Note 2) Do not however exceed Pd. Time to impress ≦ 200msec.
Thermal Resistance(Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
θJA
115.4
57.3
°C/W
ΨJT
10
8
°C/W
SSOP-B20
Junction to Ambient
Junction to Top Characterization Parameter
(Note 2)
(Note 1) Based on JESD51-2A(Still-Air),
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 4) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
4 Layers
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Condition
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VCC
3.0
-
5.5
V
Operating Temperature
Topr
-40
-
+125
°C
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BD8389FV-M
Electrical Characteristics(Unless otherwise specified Ta=-40°C to +125°C, VCC=3.0V to 5.5V)
Parameter
Limit
Symbol
Min
Typ
Max
Unit
Condition
Output D0 to D11
ON Resistance 1(Note 1)
RON1
-
6
12
Ω
IDn=20mA, VCC=4.5V to 5.5V
ON Resistance 2(Note 1)
RON2
-
9
18
Ω
IDn=20mA, VCC=3.0V to 4.5V
IDL
-
-
0.3
μA
VDn=39V
Upper Limit Threshold Voltage
VTH
VCC
x 0.7
-
-
V
Bottom Limit Threshold Voltage
VTL
-
-
VCC
x 0.2
V
Serial Clock Frequency
fCLK
-
-
1.25
MHz
Input Leakage Current L
IINLL
-5
0
-
μA
VTL=0V
Input Leakage Current H
IINLH
-
0
5
μA
VTH=5V
Output Leakage Current(Note 2)
Logic Input
WHOLE
Circuit Current
ICC
-
0.05
1
mA
Serial Data Input,
VCC=5V, fCLK=500kHz,
VTH=VCC, VTL=0V,
SEROUT=OPEN
Static Current
ISTN
-
0
50
μA
SEROUT=OPEN
Output Voltage High1(Note 3)
VOH1
4.6
4.8
-
V
VCC=5V, ISO=-4mA
Output Voltage Low1(Note 3)
VOL1
-
0.2
0.4
V
VCC=5V, ISO=4mA
Output Voltage High2(Note 3)
VOH2
2.7
3.0
-
V
VCC=3.3V, ISO=-4mA
Output Voltage Low2(Note 3)
VOL2
-
0.3
0.6
V
VCC=3.3V, ISO=4mA
SEROUT
(Note 1) IDn: Current flowing to the output Dn pin. (n: 0 to 11)
(Note 2) VDn: Output Dn pin voltage. (n: 0 to 11)
(Note 3) ISO: Current flowing to the SEROUT pin.
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Typical Performance Curves
50
50
3.0V
3.6V
5.0V
-40°C
40
+25°C
Circuit Current : ICC [μA]
Circuit Current : ICC [μA]
40
+125°C
30
20
30
20
10
10
0
0
0
1
2
3
4
Power Supply Voltage : VCC [V]
-40
5
Figure 8. Circuit Current vs Power Supply Voltage
14
14
12
12
10
8
6
4
-40°C
+25°C
2
-15
10
35
60
85
110
Ambient Temperature : Ta [ C]
Figure 9. Circuit Current vs Ambient Temperature
Output On Resistance : RON [Ω]
Output On Resistance : RON [Ω]
3.3V
4.5V
5.5V
10
8
6
4
3.0V
3.6V
5.0V
2
+125°C
3.3V
4.5V
5.5V
0
0
3.0
3.5
-40
4.0
4.5
5.0
5.5
Power Supply Voltage : VCC [V]
10
35
60
85
110
Ambient Temperature : Ta [ C]
Figure 10. Output On Resistance vs
Power Supply Voltage
(@IDn=20mA)
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Figure 11. Output On Resistance vs Ambient Temperature
(@IDn=20mA)
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400
6.0
350
5.5
Output Voltage High : VOH [V]
Output Voltage : VDn [mV]
Typical Performance Curves - continued
300
250
200
150
100
3.0V
3.6V
5.0V
50
3.3V
4.5V
5.5V
4.5
4.0
3.5
-40°C
3.0
+25°C
2.5
+125°C
2.0
0
10
20
30
40
Input Current : IDn [mA]
3.0
50
0.35
5.5
0.30
Output Voltage Low : VOL [V]
5.0
4.5
4.0
3.5
3.0
2.5
3.0V
3.6V
5.0V
4.0
4.5
5.0
5.5
Figure 13. Output Voltage vs Supply Voltage
(@ISO=-4mA)
6.0
2.0
3.5
Supply Voltage : VCC [V]
Figure 12. Output Voltage vs Input Current
Output Voltage High : VOH [V]
5.0
3.3V
4.5V
5.5V
0.25
0.20
0.15
0.10
-40°C
+25°C
0.05
+125°C
0.00
1.5
-40
-10
20
50
80
3.0
110
4.0
4.5
5.0
5.5
Supply Voltage : VCC [V]
Ambient Temperature : Ta [ C]
Figure 14. Output Voltage vs Ambient Temperature
(@ISO=-4mA)
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3.5
Figure 15. Output Voltage vs Supply Voltage
(@ISO=4mA)
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Typical Performance Curves - continued
0.35
Output Voltage Low : VOL [V]
0.30
0.25
0.20
0.15
0.10
3.0V
3.6V
5V
0.05
3.3V
4.5V
5.5V
0.00
-40
-15
10
35
60
85
110
Ambient Temperature : Ta [ C]
Figure 16. Output Voltage vs Ambient Temperature
(@ISO=4mA)
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Input Signal’s Timing Chart
tCK
50%
CLK
tCKH
tSEST
tCKL
tSEHD
50%
SERIN
tLADZ
tSEW
tLAH
50%
LATCH
Figure 17. Timing Chart of Input Signal
Input Signal’s Timing Rule (Ta=-40°C to +125°C, VCC=3.0V to 5.5V)
Parameter
Symbol
Min
Unit
CLK Period
tCK
800
ns
CLK High Pulse Width
tCKH
380
ns
CLK Low Pulse Width
tCKL
380
ns
SERIN High and Low Pulse Width
tSEW
780
ns
SERIN Setup Time
tSEST
150
ns
SERIN Hold Time
tSEHD
150
ns
LATCH High Pulse Time
tLAH
380
ns
D0 to D11 Output Terminal Setup Time
tLADZ
200
ns
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Output Signal’s Timing Chart
50%
OEN_B
tDOENH
tDOENL
90%
50%
OUTPUT
(D11 to D0)
10%
SRFALL
SRRISE
50%
LATCH
tDLAH
50%
OUTPUT
(D11 to D0)
CLK
50%
tDSOH
tDSOL
50%
SEROUT
Figure 18. Timing Chart of Output Signal
Output Signal’s Delay Time (Ta=-40°C to +125°C, VCC=3.0V to 5.5V)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
OEN_B Switching Time (Low→High)
tDOENH
-
-
3000
ns
OEN_B Switching Time (High→Low)
tDOENL
-
-
2000
ns
LATCH Switching Delay Time
tDLAH
-
-
3000
ns
SEROUT Propagation Delay Time
(Low→High)
tDSOH
-
-
350
ns
SEROUT Propagation Delay Time
(High→Low)
tDSOL
-
-
350
ns
Output Rising Slew Rate(Note 1)
SRRISE
-
20
-
V/μs
Ta=25°C, VCC=5V,
RL=500Ω, VBAT=10V
Output Falling Slew Rate(Note 1)
SRFALL
-
20
-
V/μs
Ta=25°C, VCC=5V,
RL=500Ω, VBAT=10V
(Note 1) Please refer to the application circuit example on P.12 for measurement conditions. However, LED load is not used and it is shorted.
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BD8389FV-M
Application Example
CVBAT
VBAT
VCC
CVCC1
RL
VCC
OEN_B
LATC H
RST_B
CLK
SERIN
SEROUT
GND
Micro
Computer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
VCC
RL
CVCC2
VCC
OEN_B
LATC H
RST_B
CLK
SERI N
SEROUT
GND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
Figure 19. Application Example
Component Name
Component Value
Product Name
Manufacturer
CVCC1
0.1μF
GCM155R11A104KA01
murata
CVCC2
0.1μF
GCM155R11A104KA01
murata
CVBAT
4.7μF
GCM32ER71H475KA40
murata
RL
620Ω
ESR10EZPJ621
Rohm
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I/O Equivalence Circuit
2. SERIN
12. LATCH
9. RST_B
19. CLK
3. D0
7. D4
15. D8
10. OEN_B
4. D1
8. D5
16. D9
5. D2
13. D6
17. D10
6. D3
14. D7
18. D11
VCC
11. SEROUT
VCC
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BD8389FV-M
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD8389FV-M
Operational Notes - continued
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
Parasitic
Elements
Pin B
B
GND
GND
Parasitic
Elements
GND
N Region
close-by
Figure 20. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within
the Area of Safe Operation (ASO).
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TSZ22111 • 15 • 001
15/18
TSZ02201-0T2T0B100260-1-2
26.Sep.2018 Rev.003
BD8389FV-M
Ordering Information
B
D
8
3
8
Part Number
9
F
V
-
Package
FV: SSOP-B20
ME2
Product Rank
M: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
(SSOP-B20)
Marking Diagram
SSOP-B20(TOP VIEW)
Part Number Marking
D8389FV
LOT Number
1PIN MARK
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/18
TSZ02201-0T2T0B100260-1-2
26.Sep.2018 Rev.003
BD8389FV-M
Physical Dimension, Tape and Reel Information
Package Name
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B20
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TSZ02201-0T2T0B100260-1-2
26.Sep.2018 Rev.003
BD8389FV-M
Revision History
Date
Rev.
16.Jan.2018
001
New release of specification.
002
P.5
○Absolute Maximum Ratings
Add Power Dissipation、Pulse output current item
And symbol of DC output current item change for additional Pulse output current item.
15.Jun.2018
26.Sep.2018
003
Changes
○Thermal Resistance
Modify that Junction to Top Characterization Parameter.
P.16
○Marking Diagram
Modify Marking Diagram
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TSZ02201-0T2T0B100260-1-2
26.Sep.2018 Rev.003
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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