EMARMOURTM
Datasheet
Operational Amplifier
Automotive Excellent EMI Characteristics
Input/Output Rail-to-Rail
CMOS Operational Amplifier
BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
General Description
Key Specifications
BD87581YG-C, BD87582YFVM-C and BD87584YFV-C
are input/output Rail-to-Rail CMOS operational amplifier.
An operating voltage range is wide with 4 V to 14 V. This
operational amplifier is the most suitable for automotive
requirements such as sensor amplifier, engine control
unit, electric power steering, anti-lock braking system
and so on because it has features of high slew rate and
low input bias current.
Furthermore, they have the advantage of EMI tolerance.
It makes easier replacing with conventional products or
simpler designing EMI.
◼ Operating Supply Voltage Range
Single Supply:
Dual Supply:
◼ Operating Temperature Range:
◼ Slew Rate:
◼ Input Offset Current:
◼ Input Bias Current:
Package
4.0 V to 14.0 V
±2.0 V to ±7.0 V
-40 °C to +125 °C
3.5 V/µs (Typ)
1 pA (Typ)
1 pA (Typ)
W (Typ) x D (Typ) x H (Max)
2.9 mm x 2.8 mm x 1.25 mm
2.9 mm x 4.0 mm x 0.9 mm
5.0 mm x 6.4 mm x 1.35 mm
SSOP5
MSOP8
SSOP-B14
Features
◼
◼
◼
◼
◼
◼
EMARMOURTM Series
AEC-Q100 Qualified(Note 1)
Input/Output Rail-to-Rail
Low Supply Current
Wide Operating Supply Voltage Range
High Open Loop Voltage Gain
(Note 1) Grade 1
SSOP5
Applications
◼
◼
◼
◼
MSOP8
Engine Control Unit
Electric Power Steering (EPS)
Anti-lock Braking System (ABS)
Automotive Electronics
SSOP-B14
Typical Application Circuit
CF = 10 pF
RF = 10 kΩ
VDD = +2.5 V
RIN = 100 Ω
VIN
OUT
𝑉𝑂𝑈𝑇 = −
𝑅𝐹
𝑉
𝑅𝐼𝑁 𝐼𝑁
VSS = -2.5 V
EMARMOURTM is a trademark or a registered trademark of ROHM Co., Ltd.
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays
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TSZ02201-0GDG2G500030-1-2
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Pin Description
BD87581YG-C (SSOP5)
+IN
VSS
1
2
5
VDD
+
-
-IN
4
3
Pin No.
Pin Name
1
+IN
2
VSS
3
-IN
4
OUT
5
VDD
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
4
VSS
5
+IN2
OUT
(TOP VIEW)
BD87582YFVM-C (MSOP8)
OUT1 1
-IN1 2
8
CH1
+
+
+IN1 3
7
CH2
+
VSS 4
6
5
VDD
OUT2
-IN2
+IN2
6
-IN2
7
OUT2
8
VDD
(TOP VIEW)
BD87584YFV-C (SSOP-B14)
Pin No.
Pin Name
14 OUT4
1
OUT1
13 -IN4
2
-IN1
+IN1 3
12 +IN4
3
+IN1
VDD 4
11 VSS
4
VDD
5
+IN2
OUT1 1
-IN1 2
CH1
- +
CH4
+ -
10 +IN3
+IN2 5
-IN2 6
- +
CH2
+ CH3
OUT2 7
6
-IN2
9 -IN3
7
OUT2
8 OUT3
8
OUT3
9
-IN3
10
+IN3
11
VSS
12
+IN4
13
-IN4
14
OUT4
(TOP VIEW)
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Block Diagram
BD87581YG-C (SSOP5)
+IN 1
BD87582YFVM-C (MSOP8)
5
Iref
VDD
+
VSS 2
-IN1
2
OPAMP
OPAMP
(CH1)
4
7
OUT2
6
-IN2
+
+IN1 3
3
8 VDD
Iref
-
-IN
OUT1 1
OUT
VSS 4
OPAMP
+ (CH2) -
5 +IN2
BD87584YFV-C (SSOP-B14)
OUT1
1
-IN1
2
14 OUT4
Iref
OPAMP
- (CH1) +
OPAMP
(CH4)
+
13 -IN4
-
+IN1
3
12 +IN4
VDD
4
11 VSS
+IN2
5
10 +IN3
-
-IN2
6
OUT2
7
+
OPAMP
(CH2)
+
-
OPAMP
(CH3)
9
-IN3
8
OUT3
Description of Blocks
1.
OPAMP:
This block is a Rail-to-Rail output operational amplifier with class-AB input / output circuit and differential input stage.
2.
Iref:
This block supplies reference current which is needed to operate OPAMP block.
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Supply Voltage
Differential Input Voltage(Note 1)
Common-mode Input Voltage Range
Input Current
Maximum Junction Temperature
Storage Temperature Range
Symbol
Rating
Unit
VDD-VSS
15.5
V
VID
VDD-VSS
V
VICMR
(VSS - 0.3) to (VDD + 0.3)
V
II
±10
mA
Tjmax
150
°C
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note 4)
2s2p(Note 5)
Unit
SSOP5
Junction to Ambient
θJA
376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
40
30
°C/W
Junction to Ambient
θJA
284.1
135.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
21
11
°C/W
Junction to Ambient
θJA
159.6
92.8
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
13
9
°C/W
MSOP8
SSOP-B14
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Supply Voltage
VDD
4.0
±2.0
-
14.0
±7.0
V
Operating Temperature
Topr
-40
+25
+125
°C
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Function Explanation
1. EMARMOURTM
EMARMOURTM is the brand name given to ROHM products developed by leveraging proprietary technologies covering
layout, process, and circuit design to achieve ultra-high noise immunity that limits output voltage fluctuation to ±300 mV
or less across the entire noise frequency band during noise evaluation testing under the international ISO11452-2
standard. This unprecedented noise immunity reduces design load while improving reliability by solving issues related to
noise in the development of vehicle electrical systems.
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Electrical Characteristics
○BD87581YG-C (Unless otherwise specified VDD = 5 V, VSS = 0 V)
Parameter
Input Offset Voltage
Symbol
VIO
Temperature
Range
Limit
Min
Typ
Max
25 °C
-
1
9
-40 °C to +125 °C
-
-
10
Unit
Conditions
mV
VDD = 4 V to 14 V
Absolute value
Input Offset Current
IIO
25 °C
-
1
-
pA
Absolute value
Input Bias Current
IB
25 °C
-
1
-
pA
Absolute value
25 °C
-
2.3
3.2
Supply Current
IDD
-40 °C to +125 °C
-
4.5
mA
-
RL = ∞, G= 0 dB,
+IN = 2.5 V
25 °C
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
Common-mode Input
Voltage Range
VOH
Total Harmonic Distortion +
Noise
V
RL = 10 kΩ
V
RL = 10 kΩ
dB
RL = 10 kΩ
0.25
-40 °C to +125 °C
-
-
0.3
25 °C
70
110
-
-40 °C to +125 °C
65
-
-
25 °C
0
-
5
25 °C
50
60
-
-40 °C to +125 °C
45
-
-
25 °C
60
80
-
-40 °C to +125 °C
55
-
-
25 °C
2
3.5
-
-40 °C to +125 °C
1
-
-
25 °C
3.5
6
-
-40 °C to +125 °C
1.5
-
-
SR
25 °C
-
3.5
-
V/μs RL = 10 kΩ, CL = 10 pF
GBW
25 °C
-
4
-
MHz
THD+N
25 °C
-
0.05
-
%
AV
VICMR
PSRR
Gain Bandwidth Product
-
0.03
Power Supply Rejection
Ratio
Slew Rate
-
-
CMRR
Output Sink Current(Note 1)
-40 °C to +125 °C VDD - 0.3
-
25 °C
VOL
Common-mode Rejection
Ratio
Output Source Current(Note 1)
VDD - 0.25 VDD - 0.05
IOH
IOL
V
-
dB
-
dB
-
mA
VOUT = VDD - 0.4 V
Absolute value
mA
VOUT = VSS + 0.4 V
Absolute value
RL = 10 kΩ, CL = 10 pF,
G = 40 dB
f = 1 kHz,
VOUT = 1 Vrms
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Electrical Characteristics - continued
○BD87582YFVM-C (Unless otherwise specified VDD = 5 V, VSS = 0 V)
Parameter
Input Offset Voltage
Symbol
VIO
Temperature
Range
Limit
Min
Typ
Max
25 °C
-
1
9
-40 °C to +125 °C
-
-
10
Unit
Conditions
mV
VDD = 4 V to 14 V
Absolute value
Input Offset Current
IIO
25 °C
-
1
-
pA
Absolute value
Input Bias Current
IB
25 °C
-
1
-
pA
Absolute value
25 °C
-
5
7
Supply Current
IDD
-40 °C to +125 °C
-
8
mA
-
RL = ∞, G = 0 dB,
+IN = 2.5 V
25 °C
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
Common-mode Input
Voltage Range
VOH
Total Harmonic Distortion +
Noise
Channel Separation
V
RL = 10 kΩ
V
RL = 10 kΩ
dB
RL = 10 kΩ
0.25
-40 °C to +125 °C
-
-
0.3
25 °C
70
110
-
-40 °C to +125 °C
65
-
-
25 °C
0
-
5
25 °C
50
60
-
-40 °C to +125 °C
45
-
-
25 °C
60
80
-
-40 °C to +125 °C
55
-
-
25 °C
2
3.5
-
-40 °C to +125 °C
1
-
-
25 °C
3.5
6
-
-40 °C to +125 °C
1.5
-
-
SR
25 °C
-
3.5
-
V/μs RL = 10 kΩ, CL = 10 pF
GBW
25 °C
-
4
-
MHz
THD+N
25 °C
-
0.05
-
%
CS
25 °C
-
100
-
dB
AV
VICMR
PSRR
Gain Bandwidth Product
-
0.03
Power Supply Rejection
Ratio
Slew Rate
-
-
CMRR
Output Sink Current(Note 1)
-40 °C to +125 °C VDD - 0.3
-
25 °C
VOL
Common-mode Rejection
Ratio
Output Source Current(Note 1)
VDD - 0.25 VDD - 0.05
IOH
IOL
V
-
dB
-
dB
-
mA
VOUT = VDD - 0.4 V
Absolute value
mA
VOUT = VSS + 0.4 V
Absolute value
RL = 10 kΩ, CL = 10 pF,
G = 40 dB
f = 1 kHz,
VOUT = 1 Vrms
G = 40 dB, f = 1 kHz,
VOUT = 1 Vrms
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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TSZ02201-0GDG2G500030-1-2
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Electrical Characteristics - continued
○BD87584YFV-C (Unless otherwise specified VDD = 5 V, VSS = 0 V)
Parameter
Input Offset Voltage
Symbol
VIO
Temperature
Range
Limit
Min
Typ
Max
25 °C
-
1
9
-40 °C to +125 °C
-
-
10
Unit
Conditions
mV
VDD = 4 V to 14 V
Absolute value
Input Offset Current
IIO
25 °C
-
1
-
pA
Absolute value
Input Bias Current
IB
25 °C
-
1
-
pA
Absolute value
25 °C
-
10
14
Supply Current
IDD
-40 °C to +125 °C
-
16
mA
-
RL = ∞, G = 0 dB,
+IN = 2.5 V
25 °C
Output Voltage High
Output Voltage Low
Large Signal Voltage Gain
Common-mode Input
Voltage Range
VOH
Total Harmonic Distortion +
Noise
Channel Separation
V
RL = 10 kΩ
V
RL = 10 kΩ
dB
RL = 10 kΩ
0.25
-40 °C to +125 °C
-
-
0.3
25 °C
70
110
-
-40 °C to +125 °C
65
-
-
25 °C
0
-
5
25 °C
50
60
-
-40 °C to +125 °C
45
-
-
25 °C
60
80
-
-40 °C to +125 °C
55
-
-
25 °C
2
3.5
-
-40 °C to +125 °C
1
-
-
25 °C
3.5
6
-
-40 °C to +125 °C
1.5
-
-
SR
25 °C
-
3.5
-
V/μs RL = 10 kΩ, CL = 10 pF
GBW
25 °C
-
4
-
MHz
THD+N
25 °C
-
0.05
-
%
CS
25 °C
-
100
-
dB
AV
VICMR
PSRR
Gain Bandwidth Product
-
0.03
Power Supply Rejection
Ratio
Slew Rate
-
-
CMRR
Output Sink Current(Note 1)
-40 °C to +125 °C VDD - 0.3
-
25 °C
VOL
Common-mode Rejection
Ratio
Output Source Current(Note 1)
VDD - 0.25 VDD - 0.05
IOH
IOL
V
-
dB
-
dB
-
mA
VOUT = VDD - 0.4 V
Absolute value
mA
VOUT = VSS + 0.4 V
Absolute value
RL = 10 kΩ, CL = 10 pF,
G = 40 dB
f = 1 kHz,
VOUT = 1 Vrms
G = 40 dB, f = 1 kHz,
VOUT = 1 Vrms
(Note 1) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. When the output pin is short-circuited
continuously, the output current may decrease due to the temperature rise by the heat generation of inside the IC.
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TSZ02201-0GDG2G500030-1-2
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Typical Performance Curves
VSS = 0 V
18.0
16.0
Ta = +25 °C
BD87584YFV-C
Ta = +125 °C
16.0
14.0
Supply Current: IDD [mA]
Supply Current: IDD [mA]
14.0
18.0
Ta = -40 °C
BD87581YG-C
BD87582YFVM-C
12.0
VDD = 4.0 V
BD87584YFV-C
VDD = 14.0 V
VDD = 5.0 V
12.0
10.0
10.0
8.0
6.0
4.0
2.0
8.0
6.0
4.0
2.0
0.0
0.0
4
8
12
16
-50
-25
0
25
50
75
100
125
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 1. Supply Current vs Supply Voltage
Figure 2. Supply Current vs Ambient Temperature
0.09
0.09
0.08
Ta = +125 °C
0.08
Output Voltage High: VOH [V]
Output Voltage High: VOH [V]
BD87581YG-C
BD87582YFVM-C
0.07
Ta = +25 °C
0.06
0.05
Ta = -40 °C
0.04
0.03
4
8
12
16
Supply Voltage: VDD [V]
VDD = 14.0 V
0.07
0.06
0.05
VDD = 4.0 V
VDD = 5.0 V
0.04
0.03
-50
-25
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 3. Output Voltage High vs Supply Voltage
(RL = 10 kΩ, VOH = VDD - VOUT)
Figure 4. Output Voltage High vs Ambient Temperature
(RL = 10 kΩ, VOH = VDD - VOUT)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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TSZ02201-0GDG2G500030-1-2
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Typical Performance Curves - continued
VSS = 0 V
0.06
0.06
0.05
0.05
Output Voltage Low: VOL [V]
Output Voltage Low: VOL [V]
Ta = +125 °C
0.04
Ta = +25 °C
0.03
0.02
Ta = -40 °C
0.01
0.00
VDD = 14.0 V
0.04
0.03
VDD = 4.0 V
VDD = 5.0 V
0.02
0.01
0.00
4
8
12
16
-50
Supply Voltage: VDD [V]
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Figure 5. Output Voltage Low vs Supply Voltage
(RL = 10 kΩ)
Figure 6. Output Voltage Low vs Ambient Temperature
(RL = 10 kΩ)
20
15
Output Source Current: IOH [mA]
20
Output Source Current: IOH [mA]
-25
Ta = -40 °C
Ta = +25 °C
10
Ta = +125 °C
5
15
VDD = 14.0 V
10
VDD = 5.0 V
5
VDD = 4.0 V
0
0
0
1
2
3
4
5
-50
6
-25
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Output Voltage: VOUT [V]
Figure 7. Output Source Current vs Output Voltage
(VDD = 5 V)
Figure 8. Output Source Current vs Ambient Temperature
(VOUT = VDD - 0.4 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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TSZ02201-0GDG2G500030-1-2
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Typical Performance Curves - continued
VSS = 0 V
40
40
Ta = -40 °C
30
Output Sink Current: IOL [mA]
Output Sink Current: IOL [mA]
30
Ta = +25 °C
20
Ta = +125 °C
10
20
VDD = 14.0 V
VDD = 5.0 V
10
VDD = 4.0 V
0
0
0
1
2
3
4
5
-50
6
-25
Output Voltage: VOUT [V]
50
75
100
125
150
Figure 10. Output Sink Current vs Ambient Temperature
(VOUT = VSS + 0.4 V)
10.0
7.5
7.5
Input Offset Voltage: VIO [mV]
10.0
5.0
Input Offset Voltage: VIO [mV]
25
Ambient Temperature: Ta [°C]
Figure 9. Output Sink Current vs Output Voltage
(VDD = 5 V)
Ta = -40 °C
0
Ta = +25 °C
2.5
0.0
Ta = +125 °C
5.0
VDD = 5.0 V
2.5
0.0
VDD = 4.0 V
-2.5
-2.5
VDD = 14.0 V
-5.0
-5.0
-7.5
-7.5
-10.0
-10.0
4
8
12
16
-50
-25
0
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Supply Voltage: VDD [V]
Figure 11. Input Offset Voltage vs Supply Voltage
(VICM = VDD/2, EK = -VDD/2)
Figure 12. Input Offset Voltage vs Ambient Temperature
(VICM = VDD/2, EK = -VDD/2)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BD87582YFVM-C
BD87584YFV-C
Typical Performance Curves - continued
VSS = 0 V
10.0
Large Signal Voltage Gain: Av [dB]
160
Input Offset Voltage: VIO [mV]
7.5
5.0
Ta = -40 °C
Ta = +25 °C
2.5
0.0
Ta = +125 °C
-2.5
-5.0
140
Ta = -40 °C
120
Ta = +25 °C
Ta = +125 °C
100
80
-7.5
-10.0
60
-1
0
1
2
3
4
5
6
4
8
Common-mode Input Voltage: VICM [V]
16
Supply Voltage: VDD [V]
Figure 13. Input Offset Voltage Gain vs Common-mode
Input Voltage
(VDD = 5 V)
Figure 14. Large Signal Voltage Gain vs Supply Voltage
120
Common-mode Rejection Ratio: CMRR [dB]
160
Large Signal Voltage Gain: Av [dB]
12
140
VDD = 14.0 V
120
100
VDD = 4.0 V
VDD = 5.0 V
80
60
-50
-25
0
25
50
75
100
125
150
100
Ta = +125 °C
80
Ta = +25 °C
60
Ta = -40 °C
40
20
0
4
8
12
16
Supply Voltage: VDD [V]
Ambient Temperature: Ta [°C]
Figure 15. Large Signal Voltage Gain vs Supply Voltage
Figure 16. Common-mode Rejection Ratio vs Supply
Voltage
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BD87584YFV-C
Typical Performance Curves - continued
VSS = 0 V
200
Power Supply Rejection Ratio: PSRR [dB]
Common-mode Rejection Ratio: CMRR [dB]
120
100
160
VDD = 14.0 V
80
120
60
VDD = 5.0 V
VDD = 4.0 V
40
20
0
-50
-25
0
25
50
75
100
125
80
40
0
-50
150
-25
25
50
75
100
125
150
Ambient Temperature: Ta [°C]
Ambient Temperature: Ta [°C]
Figure 17. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 18. Power Supply Rejection Ratio vs Ambient
Temperature
9
9
8
8
7
7
Fall
6
Slew Rate: SR [V/µs]
Slew Rate: SR [V/µs]
0
5
4
Rise
3
2
6
Fall
5
4
Rise
3
2
1
1
0
4
8
12
16
0
-50
-25
0
25
50
75
100
125
150
Supply Voltage: VDD [V]
Ambient Temperature: Ta [°C]
Figure 19. Slew Rate vs Supply Voltage
(Ta = 25 °C)
Figure 20. Slew Rate vs Ambient Temperature
(VDD = 5 V)
(Note) The above data are measurement value of typical sample; it is not guaranteed.
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Application Information
EMI Immunity
BD87581YG-C, BD87582YFVM-C and BD87584YFV-C have high tolerance for electromagnetic interference from the
outside because they have EMI filter, and the EMI design is simple. They are most suitable to replace from conventional
products. The data of the IC simple substance on ROHM board are as follows. The test condition is based on ISO11452-2.
VIN++0.15
VIN++0.10
Conventional Product
VIN++0.05
VOUT [V]
Based on ISO11452-2
Test Circuit: Voltage Follower
VDD: 5 V
VIN+: 1.6 V
Test Method: Substituted Law
(Progressive Wave)
Field Intensity: 200 V/m
Test Wave: CW (Continuous Wave)
Frequency: 200 MHz – 1000 MHz (2 % step)
VIN+
BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
VIN+-0.05
VIN+-0.10
VIN+-0.15
200
400
600
800
1000
Frequency [MHz]
Figure 21. EMI Characteristics
Figure 22. EMI Evaluation Board
(BD87581YG-C)
Figure 24. EMI Evaluation Board
(BD87584YFV-C)
Figure 23. EMI Evaluation Board
(BD87582YFVM-C)
Battery
1.6 V
Battery
5V
+
VDD
BIAS
Tee
Oscillo
Scope
VSS
Antenna
Figure 25. Measurement Circuit of EMI Evaluation
(Note) The above data is obtained using typical IC simple substance on ROHM board. These values are not guaranteed.
Design and Evaluate in actual application before use.
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BD87584YFV-C
Application Information - continued
1. Unused Circuits
When there are unused circuits, it is recommended that they are connected
as in right figure, and set the non-inverting input pin to electric potential
within the input common-mode voltage range (VICMR).
2. Input Voltage
Applying VDD + 0.3 V to the input pin is possible without causing deterioration
of the electrical characteristics or destruction, regardless of the supply
voltage. However, this does not ensure circuit operation. Note that the circuit
operates normally only when the input voltage is within the common-mode
input voltage range of the electric characteristics.
3. Power Supply (single/dual)
The Op-Amp operates when the voltage is supplied between the VDD and
VSS pin. Therefore, the single supply Op-Amp can be used as dual supply
Op-Amp as well.
VDD
+
Connect
to VICM
VICM
VSS
Figure 26. Example of application
unused circuit processing
4. Output Capacitor
When the VDD pin is shorted to VSS (GND) electric potential in a state where electric charge is accumulated in the
external capacitor that is connected to the output pin, the accumulated electric charge flow through parasitic elements or
pin protection elements inside the circuit and discharges to the VDD pin. It may cause damage to the elements inside the
circuit (thermal destruction). When using this IC as an application circuit which does not constitute a negative feedback
circuit and does not occur the oscillation by an output capacitive load such as a voltage comparator, connect a capacitor of
0.1 µF or less to the output pin to prevent IC damage caused by the accumulation of electric charge as mentioned above.
5. Oscillation by Output Capacitor
Pay attention to the oscillation by capacitive load in designing an application which constitutes a negative feedback loop
circuit with this IC.
6. Handling the IC
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to the piezo resistance effects. Pay attention to defecting or bending the board.
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BD87584YFV-C
Application Examples
○Voltage Follower
Using this circuit, the output voltage (VOUT) is configured
to be equal to the input voltage (VIN). This circuit also
stabilizes the output voltage (VOUT) due to high input
impedance and low output impedance. Computation for
output voltage (VOUT) is shown below.
VDD
OUT
IN
𝑉𝑂𝑈𝑇 = 𝑉𝐼𝑁
VSS
Figure 27. Voltage Follower Circuit
○Inverting Amplifier
RF
For inverting amplifier, input voltage (VIN) is amplified by
a voltage gain which depends on the ratio of RIN and RF,
and then it outputs phase-inverted voltage. The output
voltage is shown in the next expression.
VDD
VIN
RIN
OUT
𝑉𝑂𝑈𝑇 = −
𝑅𝐹
𝑉
𝑅𝐼𝑁 𝐼𝑁
This circuit has input impedance equal to RIN.
VSS
Figure 28. Inverting Amplifier Circuit
○Non-inverting Amplifier
RIN
RF
For non-inverting amplifier, input voltage (VIN) is
amplified by a voltage gain, which depends on the ratio
of RIN and RF. The output voltage (VOUT) is in-phase with
the input voltage (VIN) and is shown in the next
expression.
VDD
OUT
𝑉𝑂𝑈𝑇 = (1 +
VIN
𝑅𝐹
)𝑉
𝑅𝐼𝑁 𝐼𝑁
Effectively, this circuit has high input impedance since its
input side is the same as that of the operational amplifier.
VSS
Figure 29. Non-inverting Amplifier Circuit
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BD87584YFV-C
I/O Equivalence Circuits
○BD87581YG-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
5
4
OUT
Output
4
2
5
1
3
+IN
-IN
Input
1,3
2
○BD87582YFVM-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
8
1
7
OUT1
OUT2
Output
1,7
4
8
2
3
5
6
-IN1
+IN1
+IN2
-IN2
Input
2,3,5,6
4
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BD87584YFV-C
I/O Equivalence Circuits - continued
〇BD87584YFV-C
Pin No.
Pin Name
Pin Description
Equivalence Circuit
4
1
7
8
14
OUT1
OUT2
OUT3
OUT4
Output
1, 7, 8, 14
8
4
2
3
5
6
9
10
12
13
-IN1
+IN1
+IN2
-IN2
-IN3
+IN3
+IN4
-IN4
2, 3, 5, 6
9, 10, 12, 13
Input
8
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BD87584YFV-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD87584YFV-C
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 30. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Ordering Information
B
D
8
7
5
8
x
Number of
Channels
1: Single
2: Dual
4: Quad
Y
x
x
x
-
C
x
x
Product Rank
C: for Automotive
Packaging and forming specification
TR: Embossed tape and reel
(SSOP5, MSOP8)
E2: Embossed tape and reel
(SSOP-B14)
Package
G: SSOP5
FVM: MSOP8
FV: SSOP-B14
Lineup
Number of Channels
Package
Orderable Part Number
Single
SSOP5
Reel of 3000
BD87581YG-CTR
Dual
MSOP8
Reel of 3000
BD87582YFVM-CTR
Quad
SSOP-B14
Reel of 2500
BD87584YFV-CE2
Marking Diagram
SSOP5 (TOP VIEW)
9
R
Part Number Marking
LOT Number
MSOP8 (TOP VIEW)
Part Number Marking
8
7
8
5
2
LOT Number
Pin 1 Mark
SSOP-B14 (TOP VIEW)
Part Number Marking
87584
LOT Number
Pin 1 Mark
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BD87582YFVM-C
BD87584YFV-C
Physical Dimension and Packing Information
Package Name
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Physical Dimension and Packing Information – continued
Package Name
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Physical Dimension and Packing Information – continued
Package Name
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BD87581YG-C
BD87582YFVM-C
BD87584YFV-C
Revision History
Date
Revision
Changes
15.Nov.2019
001
New Release
16.Jun.2020
002
Update Lineup (BD87582YFVM-C)
05.Feb.2021
003
Update Lineup (BD87584YFV-C)
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Notice
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
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