BM1P10CFJ-E2

Datasheet AC/DC Converter IC PWM Controller IC for AC/DC Converter BM1P10CFJ General Description Key Specifications  Operating Power Supply Voltage Range VCC Pin Voltage: 9.3 V to 55.0 V VH Pin Voltage: 650 V (Max)  Current at Switching Operation 0.70 mA (Typ)  Current at Burst Operation 0.35 mA (Typ)  Current at Power Save Operation 0.11 mA (Typ)  Switching Frequency 100 kHz (Typ)  Operation Temperature Range -40 °C to +105 °C The PWM Controller for AC/DC power supplies provides an optimal system for all products that include an electrical outlet. It realizes the high flexibility in power supply design with external switching MOSFET and current detection resistor. This IC can make efficiency high because it has functions such as AC low voltage protection and X capacitor discharge and operates frequency reduction and burst operation at light load. In addition, this IC also has a built-in power save function and it reduces electric power at no load. This IC has following various protection functions. Package SOP-J7S W (Typ) x D (Typ) x H (Max) 4.9 mm x 6.0 mm x 1.65 mm Pitch: 1.27 mm (Typ) Features                 AC Low Voltage Protection Function (AC UVLO) X Capacitor Discharge Function VCC Pin Low Voltage Protection (VCC UVLO) PWM Type Current Mode Control Frequency Reduction Function Burst Operation at Light Load Switching Function of Operation Modes Power Save Function (Low Consumption Current at no load) Soft Start Function FB Pin Overload Protection Function (FB OLP) CS Pin Overload Protection Function (CS OLP) Switching Function of CS OLP Detection Voltage CS Pin Over Current Protection Function (CS OCP) CS Pin Leading Edge Blanking Function LA/ZT Pin Over Voltage Protection Function (ZT OVP) OUT Pin Gate Clamp Circuit Applications OA Equipment, AC Adapters, Each Household Applications and Power Supplies for Motor Typical Application Circuit FUSE AC Input Filter Diode Bridge VH LA/ZT FB 〇Product structure : Silicon integrated circuit .www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 VCC OUT CS GND 〇This product has no designed protection against radioactive rays 1/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Pin Configuration (TOP VIEW) LA/ZT 1 FB 2 CS GND 7 VH 3 6 VCC 4 5 OUT Pin Descriptions Pin No. Pin Name 1 LA/ZT 2 FB Feedback signal input pin 3 CS Primary current detection pin 4 GND GND pin 5 OUT External MOSFET drive pin 6 VCC Power supply input pin 7 VH www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Function Monitor auxiliary winding / Latch stop pin Startup power supply input / AC input voltage monitor pin 2/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Block Diagram AC Input Fuse Diode Bridge Filter VH 7 6 VCC Starter + - + - VCC UVLO Discharge VCC RECHARGE 4.0 V Line Reg Hi voltage Clamp Circuit VH UVLO Internal Block LA/ZT LA/ZT OVP 1 Q Filter - 5 DR IVER R PWM Control + 4.0 V Min ON Width - MODE2 Power Save + - VO select1 Start CSOLP + 4.0 V Power Save OUT S + + - - VO select2 FB FBOLP Leading Edge + - + - 2 3 Blanking CS OC P Burst Comparator Soft Start + 1/4 PWM Comparator - AC Input Compensation MAX DUTY + Slo pe Co mpen sation + OSC Frequency Hopping GND 4 www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks 1 Startup Circuit This IC has a built-in startup circuit. When the AC input voltage is applied, the VH pin is also applied the voltage. Then the VCC pin voltage is charged by applied current to the VCC pin through the startup circuit. This charge is stopped after the VCC pin voltage rises and VCC UVLO is released. 2 AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function AC UVLO: At startup, the voltage occurs at the VH pin when the AC input voltage is applied. The VCC pin waits the detection of AC input voltage remaining applied voltage until the VH pin peak voltage becomes more than VINLVP because this IC charges the VCC pin through the startup circuit. During this term, the switching operation is not operated because AC UVLO operates. When the VH pin peak voltage becomes more than VINLVP, AC UVLO is released and the operation starts. After stop of supplying of the AC input voltage, the IC stops the switching operation when the status of the VH pin peak voltage ≤ VINLVP continues for tINLVP. In addition, when there is no continuous up/down of voltage in the VH pin, it also stops the switching operation even though the VH pin peak voltage > VINLVP. X Capacitor Discharge Function: When the status of the VH pin peak voltage ≤ VINLVP continues for tINLVP and the switching operation is stopped by AC UVLO, X capacitor discharge function starts to operate. Fuse VH VCC Startup Circuit IVCC IVH Charge UVLO +- Logic Monitor (Note 1) + - Timer tINLVP Recharge + - Logic VINLVP Internal Block X-Capacitor Discharge (Note 1) The VH pin peak voltage is monitored by this block. Figure 1. Block Diagram of VH Pin and VCC Pin www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 2 AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function – continued tINLVP AC input voltage VH pin voltage VCC pin voltage VUVL O1 VCH G2 VCH G1 VUVL O2 VCC pin current ON VCC UVLO ON Switching ON X capacitor discharge function ON ON ON ON VCC recharge function B A C D E F G H I J Figure 2. Timing Chart of X Capacitor Discharge Function A: B: C: D: E: F: G: H: I: J: The AC input voltage is turned OFF, the voltage remains behind because X condenser is charged. After tINLVP from A, the switching operation stops. VCC capacitor is discharged because of the VCC pin voltage > VCHG1. When the VCC pin voltage becomes less than VCHG1, the VCC recharge operation starts. When the VCC pin voltage becomes more than VCHG2, the VCC recharge operation stops. Same as C. Same as D. Same as C. Same as D. When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage. When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 5/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks – continued 3 VCC Pin Protection Function This IC has VCC UVLO and VCC recharge function at the VCC pin. Use the ZT OVP connected from an auxiliary winding for over voltage protection in output because this IC does not have a built-in VCC OVP (Over Voltage Protection). After the latched stop, it is released when the VCC pin voltage becomes less than VLATCH. 3.1 VCC UVLO (Under Voltage Lockout) This is an auto recovery comparator with a voltage hysteresis. When the VCC pin voltage becomes less than VUVLO2, the IC stops the operation. And when the VCC pin voltage becomes more than VUVLO1, the operation is restarted. 3.2 VCC Recharge Function If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin through the startup circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped. VH pin voltage VINLVP tINLVP AC low voltage protection VCC pin voltage VUVLO1 VCHG2 VCHG1 VUVLO2 VLAT CH VCC UVLO tLAT CH ZT OVP detection Latch protection VCC charge VCC recharge function Switching A B C D E FG H I JK L M Figure 3. Timing Chart of VCC UVLO and VCC Recharge Function A: B: C: D: The VH pin is applied voltage and the VCC pin voltage rises. When the VH pin voltage becomes more than VINLVP, AC UVLO is released. When the VCC pin voltage becomes more than VUVLO1, the switching operation starts. When the VCC pin voltage becomes less than VCHG1, the VCC pin is recharged from the VH pin by VCC recharge function. E: When the VCC pin voltage becomes more than > VCHG2, the VCC recharge function is stopped. F: The output voltage rises and auxiliary winding voltage also does. At this moment, ZT OVP is detected. G: When the detection of ZT OVP continues for tLATCH, the switching operation is latched stop. H: When the VCC pin voltage becomes less than VCHG1, VCC recharge function operates. I: When the VCC pin voltage becomes more than VCHG2, VCC recharge function stops. By the operation of H and I, the VCC pin voltage is maintained constantly. J: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin voltage. K: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates. L: When the VCC pin voltage becomes less than VLATCH, the latch protection is released. M: The VH pin is applied voltage and the IC operation restarts. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks – continued 4 DC/DC Driver Block This IC performs a current mode PWM control and it has the following characteristics.  The switching frequency operates in the range of fSW3 to fSW1 by an internal oscillator. It has a built-in frequency hopping function and the fluctuation cycle is at random. It makes the EMI low by swaying the switching frequency within ±6 %.  This IC controls the ON width by detecting the peak current using the CS pin voltage correspond to the FB pin voltage. The CS pin voltage is restricted to 1/AVCS of the FB pin voltage.  Maximum duty is fixed at DMAX.  In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a countermeasure, this IC has a built-in slope compensation circuit.  It has a built-in burst mode and frequency reduction circuit to achieve lower power consumption at light load.  The FB pin is pulled up to the internal power supply by RFB.  The FB pin voltage is changed by the secondary output voltage. operation status. 4.1 This IC monitors this and changes a switching Transition of Switching Frequency by FB Pin Voltage This IC operates the burst operation when the FB pin voltage becomes less than V BST1 at light load. At the peak load, the frequency rises to fSW1 accompanying with the increase of the FB pin voltage. mode a: mode b: mode c: mode d: mode e: mode f: Burst Operation Fixed Frequency Operation 1 Frequency Reduction Operation 1 Fixed Frequency Operation 2 Frequency Reduction Operation 2 Fixed Frequency Operation 3 (The intermittent operation starts.) (It operates in fSW3) (It reduce the frequency.) (It operates in fSW2) (It reduce the frequency.) (It operates in fSW1) Switching Frequency mode a mode b mode c mode d mode e mode f fSW1 fSW2 fSW3 Switching OFF VBST1 VBST2 VFBSW2 VFBSW1 VFBPK1 VFBPK2 FB pin voltage Figure 4. State Transition of Switching Frequency www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4 DC/DC Driver Block – continued 4.2 Transition of CS Pin Voltage by FB Pin Voltage This IC operates as shown below. mode A: Burst Operation mode B: Normal Load Operation (The CS pin voltage changes corresponding to the FB pin voltage.) mode C: CS Overload Operation (Latched stop is operated by CS OLP when this status lasts for tCSOLP.) mode D: FB Overload Operation (The peak voltage is restricted to VOCP1. Latched stop is operated by FB OLP when this status lasts for tFBOLP.) CS Pin Voltage mode A (Note) mode B mode D mode C VOCP VCSOLP Switching OFF FB pin voltage VBST1 VBST2 (Note) VOCP means VOCP1 to VOCP3 and this depends on AC voltage compensation function or operation modes. VCSOLP means VCSOLP1 to VCSOLP5 and this depends on Value of RCSS. Figure 5. State Transition of CS Pin Voltage by FB Pin Voltage 4.3 Switch Function of Operation Modes This IC switches the operation modes by detecting the output voltage at the LA/ZT pin. It contributes to reduction of standby electric power by the three operation modes they correspond to normal, light and no load. At startup, this IC starts the operation from operation mode 1. Table 1. Operation Modes Operation Mode Load Status Range of LA/ZT pin high voltage 1 Normal Load >VZT2 2 Light Load VZT1 to VZT2 3 No Load VZT2 (continued tZTD ) Operation Mode 2 FB pin voltage > VFBDET (Light load operation) (continued tFB ON) LA/ZT pin high voltage < VZT1 (continued tZTD ) LA/ZT pin high voltage ≥ VZT1 (continued tZTD ) Operation Mode 3 (No load operation) Figure 6. Transition of Operation Mode www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4.3 Switch Function of Operation Modes – continued The operation modes are switched by detecting the LA/ZT pin voltage shown as Figure 6. When the FB pin voltage > VFBDET in operation mode 1, however, the operation modes are not switched even if the status of the LA/ZT pin voltage ≤ VZT2 continues for tZTD. In addition, when the status of the FB pin voltage > VFBDET continues for tFBON in operation mode 2 and 3, the IC interprets the load status is changed and the operation mode shifts to 1. 4.3.1 Setting of the LA/ZT Pin Voltage VZT1 is calculated by the formula below. Set the LA/ZT pin voltage using the output voltage VOUT by adjusting the resistor value of RZT1 and RZT2. 𝑉𝑎 = 𝑁𝑑 ÷ 𝑁𝑠 × (𝑉𝑂𝑈𝑇 − 𝑉𝑓) 𝑉𝑍𝑇1 = 𝑅𝑍𝑇2 ÷ (𝑅𝑍𝑇1 + 𝑅𝑍𝑇2 ) × 𝑉𝑎 𝑉𝑎 𝑁𝑠 𝑁𝑑 𝑉𝑓 𝑅𝑍𝑇1 𝑅𝑍𝑇2 [V] is the voltage of auxiliary winding. is the number of wind in the secondary side. is the number of wind in the auxiliary winding. is the forward voltage of secondary diode. is the upper resistor value of auxiliary winding. is the lower resistor value of auxiliary winding. Vf VOUT Ns Va Nd VH LA/ZT FB VCC OUT CS GND RZT1 RZT2 Figure 7. Items Positions Used in Setting Output Voltage 4.3.2 Setting of Operation Modes Each operation mode works as shown the table below. In operation mode 3, it is achieved to reduce the maximum electric power consumption by the increase of primary peak current and reduction of IC’s current consumption. Table 2. States of Each Operation Modes Operation Mode 1 Operation Mode 2 Over Current Detected Voltage Operation Mode 3 VOCP1 to VOCP2 VOCP1 to VOCP2 VOCP3 Current Consumption Normal Normal Power Save Voltage Gain (FB pin / CS pin) Burst Operation AVCS Normal AVCS/Ka Normal AVCS/Ka Power Save tMIN1 tMIN2 tMIN1 Minimum ON Width www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4.3 Switch Function of Operation Modes – continued 4.3.3 Burst Mode at Each Operation Mode 4.3.3.1 Operation Mode 1 When the FB pin voltage becomes less than VBST1, the switching operation stops. When the FB pin voltage becomes more than VBST2, the switching operation restarts. 4.3.3.2 Operation Mode 2 The FB pin voltage becomes less than < VBST1, the switching operation stops. When the FB pin voltage becomes more than VBST2, the switching operation restarts. In operation mode 2, the IC lowers the voltage gain and increases the primary peak current by 1.33 times. And the minimum ON width is switched to tMIN2. These functions reduce the number of switching and burst frequency and cut down the switching loss. 4.3.3.3 Operation Mode 3 In operation mode 3, the IC lowers the voltage gain and increases the primary peak current by 1.33 times. These functions reduce the number of switching and burst frequency and cut down the switching loss. Load status No load Heavy load 1 3 Operation mode Output Voltage (Note) VOUT1 VOUT3 FB pin voltage VFBDET VBST2 VBST1 tFBON tREC tREC tFBOFF Switching A tFBOFF BC D E F (Note) VOUT1 and VOUT3 means the output voltage at Operation Mode 1 and Operation Mode 3. Figure 8. In Case of Load Increase at Operation Mode 3 A: B: C: D: E: F: When the FB pin voltage becomes less than VBST1, the switching operation is stopped. For tFBOFF from this stop, the IC’s current consumption is restricted to ISAVE by the power save function. After tFBOFF from A, the timer of burst release recovery time starts to operate. After tREC from B, when the FB pin voltage become more than VBST2, the switching operation restarts. The setting of the output voltage is switched VOUT3 to VOUT1 in the secondary side. After restarting the switching operation, when the FB pin voltage becomes more than VFBDET, the operation mode switching detection timer 2 starts to work. The status of the FB pin voltage > VFBDET lasts more than tFBON, the operation mode shifts to 1. (The timer is reset if the FB pin voltage becomes VFBDET or less within tFBON, and the switching operation stops again for tFBOFF if the FB pin voltage becomes less than VBST1) www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 10/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4 DC/DC Driver Block – continued 4.4 Soft Start Function At startup, this function controls the over current detection voltage in order to prevent any excessive voltage or current rising. This IC enables the soft start operation by changing the over current detection voltage with time. CS pin voltage SS1 SS2 VOCP1 to VOCP3 VOCP1 to VOCP3 x 0.640 VOCP1 to V OCP3 x 0.375 Time tSS1 tSS2 [ms] Figure 9. Soft Start Function 4.5 FB OLP (Overload Protection) This IC is latched off when status that the FB pin voltage > VFBOLP1 lasts for tFBOLP. When the FB pin voltage becomes less than VFBOLP2, the detection timer tFBOLP is released. CS pin voltage (Note) VOCP Output Voltage FB pin voltage VFBOLP1 VFBOLP2 tFBOLP FB overload detectecd Switching Latched off (Note) VOCP means VOCP1 to VOCP3 and this depends on AC voltage compensation function or operation modes. Figure 10. FB Overload Protection Function www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4 DC/DC Driver Block – continued 4.6 CS Pin Protection Function This IC has a built-in CS OLP and CS OCP in the CS pin. Function Table 3. Operation Status of CS Pin Protection Functions Load Status at Operation to Protect Detection Voltage CS pin peak voltage > VCSOLP1 to VCSOLP5 (for tCSOLP) Over the rated load (Without lowing of the output voltage) CS OLP Operation to Protect IC is latched off (set by the external resistor at the CS pin) CS pin peak voltage > VOCP1 to VOCP3 Over the peak load (Lowing the output voltage) CS OCP (Changed by AC voltage compensation function at operation mode 1 and 2) Turned off by pulse 4.6.1 CS OLP (Overload Protection) This IC has a built-in overload protection function correspond to rated load. When the status of the CS pin peak voltage > VCSOLP1 to VCSOLP5 lasts for tCSOLP, this IC is latched off. It is not turned off by pulse per pulse. In addition, the overload detection voltage can be switched by the value of the external resistor RCSS at the CS pin. This IC monitors the voltage occurred in the CS pin after tSET from the release of VCC UVLO and switches the VCSOLP1 to VCSOLP5 as shown in Table 4. For tSET, the CS pin is pulled up by RCS2 in the internal reference voltage. Table 4. Detection Voltage Detection Voltage VCSOLP1 VCSOLP2 VCSOLP3 VCSOLP4 VCSOLP5 RCSS (kΩ) VCC OUT VH 0.0 to 1.0 2.0 to 2.4 4.7 to 5.6 10.0 to 12.0 20.0 or above LA/ZT FB CS GND RCSS Figure 11. Position of RCSS CS pin voltage (Note) VCSOLP tCSOLP CS overload detectecd Switching Latched off (Note) VCSOLP means VCSOLP1 to VCSOLP5 and this depends on Value of RCSS. Figure 12. CS Pin Overload Protection www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 12/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4.6 CS Pin Protection Function – continued 4.6.2 CS OCP (Over Current Protection) This IC has a built-in over current protection function per switching cycles. This function stops the switching operation if the CS pin peak voltage becomes more than VOCP1 to VOCP3. It also has a built-in AC voltage compensation function. This function compensates the dependent on AC voltage by making VOCP1 to VOCP3 increase with time. VOCP1 to VOCP3 is also changed by the operation modes. fSW1 fSW1 ON Switching (AC100 V) ON Switching (AC100 V) OFF OFF ON Switching (AC240 V) OFF OFF ON Switching (AC240 V) OFF OFF OFF OFF IPEAK (AC) VDC = 240 V IPEAK (AC) VDC = 240 V VDC = 100 V VDC = 100 V (Note) VOCP compensated (Note) constant VOCP Primary Peak Current Primary Peak Current tDELAY tDELAY tDELAY tDELAY (Note) VOCP means VOCP1 to VOCP3 and this depends on AC voltage compensation function or operation modes. Figure 13. Without the Compensation Function 4.6.2.1 Figure 14. With the Compensation Function AC Voltage Compensation Function The dependent on AC voltage of primary peak current is compensated by changing the over current detection voltage of the CS pin with time. The primary peak current entering overload mode is calculated using the formula below. 𝐼𝑃𝐸𝐴𝐾 = 𝑉𝑂𝐶𝑃1 ÷ 𝑅𝑠 + 𝑉𝐷𝐶 ÷ 𝐿𝑝 × 𝑡𝐷𝐸𝐿𝐴𝑌 𝐼𝑃𝐸𝐴𝐾 𝑉𝑂𝐶𝑃1 𝑅𝑠 𝑉𝐷𝐶 𝐿𝑝 𝑡𝐷𝐸𝐿𝐴𝑌 [A] is the primary peak current. is the over current detection voltage VOCP1. is the current detection resistor. is the input DC voltage. is the value of primary coil inductor. is the delay time after the over current detection. The over current detection voltage is set by t ON in the range of VOCP1 to VOCP2. Calculated the over current detection voltage with the approximation below. 𝑉𝑂𝐶𝑃 = −0.0104 × 𝑡𝑂𝑁 2 + 0.1032 × 𝑡𝑂𝑁 + 0.36[V] 𝑉𝑂𝐶𝑃 : 𝑡𝑂𝑁 is the over current detection voltage set by 𝑡𝑂𝑁 is the ON time. CS pin voltage VOCP2 VOCP1 10.0 0.0 ON Time [µs] Figure 15. State Transition of Over Current Detection Voltage by Time www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ 4.6 CS Pin Protection Function – continued 4.6.3 Leading Edge Blanking Function Normally, when the MOSFET for switching is turned ON, surge current is generated at each capacitor component and drive current and so on. At this time, detection errors may occur in the over current protection function because the CS pin voltage rises temporary. To prevent these errors, Leading Edge Blanking function is built in this IC. This function masks the CS pin voltage for t LEB from the switch of the OUT pin voltage low to high. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks – continued 5 ZT OVP (Over Voltage Protection) The LA/ZT pin has two built-in latch type over voltage protection function which are the pulse detection and DC detection. 5.1 DC Detection When the status that the LA/ZT pin voltage > VZTL lasts for more than tLATCH, the switching operation is latched off. VZTL Pulse LA/ZT pin voltage Pulse ≤tLATCH >tLATCH ZT over voltage detectecd Latched off Switching A B C D Figure 16. LA/ZT Pin Over Voltage Protection (DC Detection) A: B: C: D: 5.2 When the LA/ZT pin voltage becomes more than VZTL, ZT OVP detection timer tLATCH starts to operate. The timer is reset because the LA/ZT pin voltage becomes VZTL or less within tLATCH. When the LA/ZT pin voltage becomes more than VZTL, ZT OVP detection timer tLATCH starts to operate. When the status of the LA/ZT pin voltage > VZTL lasts for more than tLATCH, the switching operation is latched off. Pulse Detection This IC is latched off when it passes from the three consecutive detections of the LA/ZT pin voltage pulse > VZTL for tLATCH. The IC does not detect the LA/ZT pin voltage for this term because it has a built-in ZT OVP detection mask timer tZTMK corresponding the surge at the turn on of the LA/ZT pin voltage. OUT pin voltage VZTL LA/ZT pin voltage tZTMK tZTMK ZT over voltage comparator 1 2 3 tLATCH ZT over voltage detectecd Latched off Switching A B C D Figure 17. LA/ZT Pin Over Voltage Protection (Pulse Detection) A: B: C: D: When the OUT pin is turned OFF, the LA/ZT pin becomes high voltage. The LA/ZT pin voltage becomes more than VZTL momentary, however, ZT OVP is not detected because it is within tZTMK from reaching high voltage. When the LA/ZT pin voltage > VZTL is detected after tZTMK from reaching high voltage, ZT OVP is detected. When the three consecutive voltage pulse of the LA/ZT pin voltage > VZTL is detected, ZT OVP detection timer tLATCH starts to operate. When it passes from C for tLATCH, the switching operation is latched off. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks – continued 6 OUT Pin Gate Clamp Circuit The high level of the OUT pin is clamped to VOUTH to prevent the gate voltage of external MOSFET from being damaged. The OUT pin is pulled down by RPDOUT in the inside. VCC High Voltage Clamp PRE Driver MOSFET P OUT OUT RPDOUT NOUT LA/ZT FB CS Figure 18. Positions of External MOSFET and RPDOUT www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Description of Blocks – continued 7 Operation Mode of Protection Functions The operation modes of each protection function are shown in Table 5 Table 5. Operation Modes of Protection Functions AC UVLO VCC UVLO FB OLP Detection Conditions VH pin peak voltage ≤ VINLVP VCC pin voltage < VUVLO2 (at voltage falling) FB pin voltage > VFOLP1 (at voltage rising) Release Conditions VH pin peak voltage > VINLVP VCC pin voltage > VUVLO1 (at voltage rising) VCC pin voltage < VLATCH tINLVP (VH pin peak voltage > VINLVP) – tFBOLP (FB pin voltage < VFOLP2) – – – Auto Recovery Auto Recovery Latch CS OLP ZT OVP Detection Conditions CS pin peak voltage > VCSOLP (VCSOLP is set by RCSS) ZT pin peak voltage > VZTL Release Conditions VCC pin voltage < VLATCH VCC pin voltage < VLATCH tCSOLP (CS pin peak voltage ≤ VCSOLP) tLATCH (ZT pin peak voltage < VZTL) – – Latch Latch Detection Timer (Reset Conditions) Release Timer (Reset Conditions) Auto Recovery or Latch Detection Timer (Reset Conditions) Release Timer (Reset Conditions) Auto Recovery or Latch www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 17/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Condition Maximum Applied Voltage 1 VMAX1 to +6.5 V LA/ZT pin (Note 1) Maximum Applied Voltage 2 VMAX2 -0.3 to +6.5 V FB pin Maximum Applied Voltage 3 VMAX3 -0.3 to +6.5 V CS pin Maximum Applied Voltage 4 VMAX4 -0.3 to +15 V OUT pin Maximum Applied Voltage 5 VMAX5 -0.3 to +58 V VCC pin Maximum Applied Voltage 6 VMAX6 -0.3 to +650 V VH pin LA/ZT Pin Maximum Source Current ISZT1 +1.0 mA LA/ZT Pin Maximum Sink Current ISZT2 -4.0 mA OUT Pin Maximum Source Current ISOOUT 0.20 A OUT Pin Maximum Sink Current ISKOUT 1.00 A Pd 0.68 W Tjmax 150 °C Tstg -55 to +150 °C Power Dissipation Maximum Junction Temperature Storage Temperature Range Caution 1: Caution 2: (Note 1) (Note 2) (Note 2) Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Need to use the LA/ZT pin voltage within the range of LA/ZT Pin Maximum Source Current and LA/ZT Pin Maximum Sink Current. At mounted on a glass epoxy single layer PCB (114.3 mm x 76.2 mm x 1.57 mm). Derate by 5.4 mW/°C if the IC is used in the ambient temperature Ta 25 °C or above. Thermal Dissipation Make the thermal design so that the IC operates in the following conditions. (Because the following temperature is guarantee value, it is necessary to consider margin.) 1. The ambient temperature Ta must be 105 °C or less. 2. The IC’s loss must be the power dissipation Pd or less. The thermal abatement characteristic is as follows. (At mounting on a glass epoxy single layer PCB which size is 114.3 mm x 76.2 mm x 1.57 mm) 1.0 0.8 Pd [W] 0.6 0.4 0.2 0.0 0 25 50 75 100 125 150 Ta [ºC] Figure 19. SOP-J7S Thermal Dissipation Characteristic www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Recommended Operating Condition Parameter Symbol Min Typ VCC Pin Power Supply Range VCC 9.3 VH Pin Power Supply Range VH - CVCC VCC Pin Capacitor Max Unit - 55.0 V - 300 (Note 2) V 4.7 - - µF VH Pin Resistor RVH - - 2.0 kΩ Operating Temperature Topr -40 - +105 °C (Note 2) The recommendation maximum operating voltage shows AC 300 V which is the input AC voltage in the application. Apply the input AC voltage which is full-wave-rectified to the VH pin. Electrical Characteristics (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Condition ION1 0.20 0.70 1.30 mA FB pin voltage = 2.0 V Current at Burst Operation ION2 0.20 0.35 0.50 mA FB pin voltage = 0.3 V Current at Power Save Operation ISAVE 0.04 0.11 0.16 mA Operation Mode 3 Current at Latched Stop ILATCH 0.10 0.22 0.35 mA 8.0 15.0 25.0 mA VCC = 10 V, VH = 100 V VH = 100 V Circuit Current Current at Switching Operation Startup Circuit Block and VH Pin Protection Function Startup Current ISTART1 VH Pin OFF Current ISTART2 5 12 20 µA AC UVLO Detection Voltage VINLVP 83 99 115 V AC UVLO Stop Timer tINLVP 105 150 195 ms VCC UVLO Release Voltage VUVLO1 12.50 13.50 14.50 V At VCC pin voltage rising VCC UVLO Detection Voltage VUVLO2 7.90 8.60 9.30 V At VCC pin voltage falling VCC UVLO Hysteresis VUVLO3 - 4.90 - V VUVLO3 = VUVLO1 - VUVLO2 VCC Recharge Start Voltage VCHG1 8.60 9.30 10.00 V VCC Recharge Stop Voltage VCHG2 9.40 10.20 11.00 V - VUVLO2 – 1.0 - V VCC Pin Protection Function Latch Release Voltage www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 VLATCH 19/32 VCC pin voltage TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Electrical Characteristics – continued (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Condition Switching Frequency 1 fSW1 111 130 149 kHz Switching Frequency 2 fSW2 90 100 110 kHz Switching Frequency 3 fSW3 18 28 38 kHz Voltage Gain (FB Pin / CS Pin) AVCS - 4.0 - V/V Operation Mode 1 Operation Mode 2, 3 DC/DC Driver Block Voltage Gain Shift Factor Ka - 1.33 - V/V Maximum Duty DMAX 67 75 83 % FB Pin Burst Voltage 1 VBST1 0.350 0.400 0.450 V At the FB pin voltage falling FB Pin Burst Voltage 2 VBST2 - 0.450 - V At the FB pin voltage rising Frequency Reduction Start FB Pin Voltage VFBSW1 1.15 1.35 1.55 V Frequency Reduction Stop FB Pin Voltage VFBSW2 0.95 1.15 1.35 V Peak Load Frequency Rising Start Voltage VFBPK1 2.8 3.0 3.2 V Peak Load Frequency Rising Stop Voltage VFBPK2 3.0 3.2 3.4 V CS Pin Leading Edge Blanking Time tLEB - 0.300 - µs CS Pin Pulled up Resistor 1 RCS1 0.7 1.0 1.3 MΩ At Normal Operation CS Pin Pulled up Resistor 2 RCS2 14 20 26 kΩ At Startup FB Pin Pulled up Resistor RFB 24 30 36 kΩ Minimum ON Width 1 tMIN1 - 0.40 - µs Operation Mode 1, 3 Minimum ON Width 2 tMIN2 1.5 2.0 2.5 µs Operation Mode 2 DC/DC Driver Block (Switch Function of Operation Modes) Switching Operation Mode LA/ZT Pin Voltage 1 VZT1 0.60 0.70 0.80 V Switching Operation Mode LA/ZT Pin Voltage 2 VZT2 1.80 2.00 2.20 V Switching Operation Mode FB Pin Voltage VFBDET 0.64 0.70 0.76 V Switching Operation Mode Detection Timer 1 tZTD 3.15 4.50 5.85 ms LA/ZT pin voltage Switching Operation Mode Detection Timer 2 tFBON 1.72 2.30 2.88 ms FB pin voltage Stop Timer at Burst Operation tFBOFF 8.0 10.0 12.0 ms tREC 50 100 200 µs Soft Start Time 1 tSS1 0.66 1.10 1.54 ms Soft Start Time 2 tSS1 2.76 4.60 6.40 ms Recovery Timer at Burst Operation Released DC/ DC Driver Block (Soft Start Function) DC/ DC Driver Block (FB Pin Overload Protection Function) FB OLP Detection Voltage VFBOLP1 3.20 3.40 3.60 V FB OLP Release Voltage VFBOLP2 3.00 3.20 3.40 V FB OLP Detection Timer tFBOLP 234 300 366 ms www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 20/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Electrical Characteristics – continued (Unless otherwise noted, Ta = 25 °C, VCC = 15 V) Parameter Symbol Min Typ Max Unit Condition DC/ DC Driver Block (CS Pin Overload Protection Function) CS OLP Detection Voltage 1 VCSOLP1 0.320 0.350 0.380 V RCSS = 0 to 1.0 kΩ CS OLP Detection Voltage 2 VCSOLP2 0.370 0.400 0.430 V RCSS = 2.0 to 2.4 kΩ CS OLP Detection Voltage 3 VCSOLP3 0.415 0.450 0.485 V RCSS = 4.7 to 5.6 kΩ CS OLP Detection Voltage 4 VCSOLP4 0.460 0.500 0.540 V RCSS = 10 to 12 kΩ CS OLP Detection Voltage 5 VCSOLP5 0.510 0.550 0.590 V RCSS = 20 kΩ or more tCSOLP 1063 1450 1836 ms tSET 150 300 450 µs CS OLP Detection Timer CS OLP Detection Voltage Setting Time DC/ DC Driver Block (CS Pin Over Current Protection Function) CS OCP Detection Voltage 1 VOCP1 0.330 0.350 0.370 V tON = 0 µs (Operation Mode1, 2) CS OCP Detection Voltage 2 VOCP2 - 0.620 - V tON = 10 µs (Operation Mode 1, 2) CS OCP Detection Voltage 3 VOCP3 0.180 0.200 0.220 V Operation Mode 3 ZT OVP Detection Voltage VZTL 4.50 4.70 4.90 V ZT OVP Detection Timer tLATCH 75 150 250 µs ZT OVP Detection Mask Timer tZTMK - 0.40 - µs OUT Pin Clamp Voltage VOUTH 10.50 12.50 14.50 V OUT Pin Nch MOS RON RNOUT - 4.8 8.0 Ω OUT Pin Pulled down Resistor RPDOUT 70 100 130 kΩ LA/ZT Pin Protection Function Block OUT Pin Gate Clamp Circuit Block www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 21/32 VCC = 15 V TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Typical Performance Curves (Reference Data) 0.6 1.40 Current at Burst Operation: ION2 [mA] Current at Switching Operation: ION1 [mA] 1.60 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0.5 0.4 0.3 0.2 0.1 0.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 20. Current at Switching Operation vs Temperature Figure 21. Current at Burst Operation vs Temperature 0.20 250 AC UVLO Stop Timer: tINLVP [ms] Current at Power Save Operation: ISAVE [mA] 0 0.15 0.10 0.05 0.00 200 150 100 50 0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 22. Current at Power Save Operation vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 22/32 Figure 23. AC UVLO Stop Timer vs Temperature TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Typical Performance Curves – continued (Reference Data) 12.0 VCC UVLO Release Voltage: VUVLO2 [V] VCC UVLO Detection Voltage: VUVLO1 [V] 18.0 17.0 11.0 16.0 10.0 15.0 14.0 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 5.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 24. VCC UVLO Detection Voltage vs Temperature Figure 25. VCC UVLO Release Voltage vs Temperature 150 120.0 Switching Frequency 2: fSW2 [kHz] Switching Frequency 1: fSW1 [kHz] 0 140 130 120 110 100 110.0 100.0 90.0 80.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 26. Switching Frequency 1 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 27. Switching Frequency 2 vs Temperature 23/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Typical Performance Curves – continued (Reference Data) 90 Maximum Duty: D MAX [%] Switching Frequency 3: fSW3 [kHz] 50.0 40.0 30.0 20.0 10.0 85 80 75 70 65 60 -40 -20 0 20 40 60 80 100 120 -40 -20 0 Temperature [°C] Temperature [°C] Figure 28. Switching Frequency 3 vs Temperature Figure 29. Maximum Duty vs Temperature 0.50 1.6 Frequenacy Reduction Start FB Pin Voltage: VFBSW1 [V] FB Pin Burst Voltage 1: VBST1 [V] 20 40 60 80 100 120 0.45 0.40 0.35 0.30 1.5 1.4 1.3 1.2 1.1 1.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 30. FB Pin Burst Voltage 1 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 31. Frequency Reduction Start FB Pin Voltage vs Temperature 24/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Typical Performance Curves – continued 1.40 1.0 1.35 0.9 Minimum ON Width1: tMIN1 [μs] Frequency Reduction Stop FB Pin Voltage: VFBSW2 [V] (Reference Data) 1.30 1.25 1.20 1.15 1.10 1.05 1.00 -40 -20 0 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 32. Frequency Reduction Stop FB Pin Voltage vs Temperature Figure 33. Minimum ON Width 1 vs Temperature 2.5 14.0 Stop Timer at Burst Operation: tFBOFF [ms] Minimum ON Width 2: tMIN2 [μs] 0 2.4 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 13.0 12.0 11.0 10.0 9.0 8.0 7.0 6.0 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 20 40 60 80 100 120 Temperature [°C] Figure 34. Minimum ON Width 2 vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 0 Figure 35. Stop Timer at Burst Operation vs Temperature 25/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Typical Performance Curves – continued (Reference Data) 0.40 CS OCP Detection Voltage 1: VOCP1 [V] CS OLP Detection Voltage 1: VCSOLP1 [V] 0.40 0.39 0.38 0.37 0.36 0.35 0.34 0.33 0.32 0.31 0.30 0.38 0.37 0.36 0.35 0.34 0.33 0.32 0.31 0.30 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature [°C] 0 20 40 60 80 100 120 Temperature [°C] Figure 36. CS OLP Detection Voltage 1 vs Temperature OUT Pin Clamp Voltage: VOUTH [V] 0.39 Figure 37. CS OCP Detection Voltage 1 vs Temperature 15.0 14.5 14.0 13.5 13.0 12.5 12.0 11.5 11.0 10.5 10.0 -40 -20 0 20 40 60 80 100 120 Temperature [°C] Figure 38. OUT Pin Clamp Voltage vs Temperature www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 26/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ I/O Equivalence Circuit 7 VH - - 6 VCC 5 OUT VCC VCC VH Starter Voltage Detect 1 OUT - GND LA/ZT GND 2 FB 3 Internal Ref. CS GND CS FB LA/ZT www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4 Internal Ref. Internal Ref. GND GND GND GND GND 27/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 28/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Operational Notes – continued 10. Regarding the Input Pin of the IC This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements Parasitic Elements GND GND N Region close-by Figure 39. Example of IC Structure 11. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 12. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 13. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 29/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Ordering Information B M 1 P 1 0 C F J - E2 Packing and forming specification E2: Embossed tape and reel Marking Diagram SOP-J7S (TOP VIEW) Part Number Marking 1 P 1 0 C LOT Number Pin 1 Mark www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 30/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Physical Dimension and Packing Information Package Name www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 SOP-J7S 31/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 BM1P10CFJ Revision History Date Rev. 03.Feb.2020 001 Changes New Release www.rohm.com © 2018 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 32/32 TSZ02201-0F1F0A200590-1-2 03.Feb.2020 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001