Datasheet
AC/DC Drivers
PWM type DC/DC converter IC
Included a Switching MOSFET
BM2P015-Z BM2P016-Z
General Description
Basic specifications
The PWM type DC/DC converter BM2P015-Z
and BM2P016-Z for AC/DC provides an optimal system
for all products that include an electrical outlet.
This IC supports both isolated and non
-isolated devices, enabling simpler design of various
types of low-power electrical converters.
The built-in 650V HV starter circuit contributes
to low-power consumption.
A higher degree of design freedom can be
achieved with current detection resistors as external
devices. Current is restricted in each cycle and
excellent performance is demonstrated in bandwidth
and transient response since current mode control is
utilized. The switching frequency is 65 kHz. At light
load, the switching frequency is reduced and high
efficiency is achieved. A frequency hopping function
that contributes to low EMI is also included on chip.
Design can be easily implemented because
includes a 650V switching MOSFET.
◼ Operating Power Supply Voltage Range:
VCC:
8.9V to 26.0V
DRAIN:
to 650V
■ Normal Operating Current:
0.950mA (Typ.)
■Burst Operating Current:
0.30mA(Typ.)
◼ Oscillation Frequency:
65kHz(Typ.)
◼ Operating Ambient Temperature:
- 40C to +105C
◼ MOSFET ON Resistance:
1.4Ω (Typ.)
Package
W (Typ) x D (Typ) x H (Max)
DIP7K
9.27 mm x 6.35 mm x 8.63 mm
pitch 2.54 mm
9.35mm x 6.35mm x 8.10mm
Pitch 2.54mm
DIP7WF
Features
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
PWM frequency : 65kHz
PWM current mode control
Burst operation when load is light
Frequency reduction function
Built-in 650V starter circuit
Built-in 650V switching MOSFET
VCC pin Under-Voltage protection
VCC pin Over-Voltage protection
SOURCE pin Open Protection
SOURCE pin Short Protection
SOURCE pin Leading Edge Blanking function
Per-cycle Over-Current Protection Circuit
Soft start
Secondary Over-Current Protection Circuit
Application Circuit
Applications
For AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
Lineup
Product name
BM2P015-Z
BM2P016-Z
VCC OVP
Latch
Auto Restart
+FUSE
AC
85–265Vac
Filter
Diode
Bridge
7
6
5
DRAIN DRAIN
SOURCE
1
〇Product structure : Silicon integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
FADJ
2
VCC
GND
FB
3
4
ERROR
AMP
〇This product has no designed protection against radioactive rays.
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BM2P015-Z BM2P016-Z
Absolute Maximum Ratings (Ta=25C)
Parameter
Maximum applied voltage 1
Maximum applied voltage 2
Maximum applied voltage 3
Drain current pulse
Allowable dissipation
Operating ambient
temperature range
MAX junction temperature
Storage
temperature range
Symbol
Vmax1
Vmax2
Vmax3
IDP
Pd
-0.3 to 32.0
-0.3 to 6.5
650
10.40
1.00
Rating
Unit
Topr
-40 to +105
oC
Tjmax
150
oC
Tstr
-55 to +150
V
V
V
A
W
Conditions
VCC
SOURCE, FB, FADJ
DRAIN
PW=10us, Duty cycle=1%
When implemented
oC
(Note1): When mounted (on 74.2 mm × 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 8 mW/C when Ta = 25C or above.
Operating Conditions (Ta=25C)
Parameter
Symbol
Power supply voltage range 1
Power supply voltage range 2
Rating
VCC
VDRAIN
Unit
8.9 to 26.0
650
V
V
Conditions
VCC pin voltage
DRAIN pin voltage
Electrical Characteristics of MOSFET (unless otherwise noted, Ta = 25C, VCC = 15V)
Parameter
Min
Specifications
Typ
Max
V(BR)DDS
650
-
-
V
IDSS
RDS(ON)
-
1.4
100
2.0
uA
Ω
Symbol
Unit
Conditions
[MOSFET Block]
Between drain and
source voltage
Drain leak current
On resistance
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TSZ22111 • 15 • 001
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ID=1mA / VGS=0V
VDS=650V / VGS=0V
ID=0.25A / VGS=10V
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BM2P015-Z BM2P016-Z
Electrical Characteristics (unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter
Symbol
Min
Specifications
Typ
Max
Unit
Conditions
[Circuit Current]
Circuit current (ON) 1
ION1
700
950
1200
μA
FB=2.0(at pulse operation)
Circuit current (ON) 2
ION2
200
300
400
μA
FB=0.0V(at burst operation)
VUVLO1
VUVLO2
VUVLO3
VOVP1
VOVP2
VOVP3
VLATCH
VCHG1
VCHG2
tLATCH
TSD1
TSD2
12.50
7.50
26.0
22.0
7.0
7.70
12.00
50
120
90
13.50
8.20
5.30
27.5
23.5
4.0
7.7
8.70
13.00
100
145
115
14.50
8.90
29.0
25.0
8.4
9.70
14.00
150
170
140
V
V
V
V
V
V
V
V
V
us
C
C
VCC rise
VCC fall
VUVLO3= VUVLO1- VUVLO2
VCC rise
BM2P016-Z VCC fall
BM2P016-Z
FSW1
FSW2
FDEL1
FCH
IBST
VBST
FBST
tSS1
tSS2
tSS3
tSS4
Dmax
Tmin
RFB
Gain
VBST1
VBST2
VBST3
60
20
75
0.80
1.13
0.30
0.60
1.20
4.80
68.0
150
23
0.220
0.260
-
65
25
4.0
125
1.00
1.20
0.833
0.50
1.00
2.00
8.00
75.0
400
30
4.00
0.280
0.320
0.040
70
30
175
1.20
1.27
0.70
1.40
2.80
11.20
82.0
650
37
0.340
0.380
-
KHz
KHz
KHz
Hz
uA
V
KHz
ms
ms
ms
ms
%
ns
kΩ
V/V
V
V
V
[VCC Protection Function]
VCC UVLO voltage 1
VCC UVLO voltage 2
VCC UVLO hysteresis
VCC OVP voltage 1
VCC OVP voltage 2
VCC OVP hysteresis
Latch released VCC voltage
VCC recharge start voltage
VCC recharge stop voltage
Latch mask time
Thermal shut down temperature1
Thermal shut down temperature2
Control IC, temp rise
Control IC, temp fall
[PWM Type DCDC Driver Block]
Oscillation frequency 1
Oscillation frequency 2
Frequency hopping width 1
Hopping fluctuation frequency
FADJ source current
FADJ comparator voltage
FADJ max burst frequency
Soft start time 1
Soft start time 2
Soft start time 3
Soft start time 4
Maximum duty
Minimum ON time
FB pin pull-up resistance
ΔFB / ΔSOURCE gain
FB burst voltage 1
FB burst voltage 2
FB burst hysteresis
FB voltage of
starting frequency reduction mode
FB OLP voltage 1a
FB OLP voltage 1b
VDLT
1.100
1.250
1.400
V
VFOLP1A
VFOLP1B
2.60
2.40
2.80
2.60
3.00
2.80
V
V
FB OLP ON time
TFOLP1
80
128
176
ms
FB OLP OFF time
TFOLP2
332
512
692
ms
VSOURCE
0.375
0.400
0.425
V
Over-current detection voltage SS1
VS_SS1
0.050
0.100
0.150
V
Over-current detection voltage SS2
VS_SS2
0.080
0.150
0.220
V
TSS1 [ms] to TSS2 [ms]
Over-current detection voltage SS3
VS_SS3
0.130
0.200
0.270
V
TSS2 [ms] to TSS3 [ms]
Over-current detection voltage SS4
VS_SS4
0.230
0.300
0.370
V
TSS3 [ms] to TSS4 [ms]
tLEB
(120)
250
(380)
ns
Design assurance
KSOURCE
12
20
28
mV/us
VSHT
0.020
0.050
0.080
V
TSOURCESHT
1.80
3.00
4.20
us
[Over Current Detection Block]
Over-current detection voltage
Leading edge blanking time
Over current detection AC voltage
compensation factor
SOURCE pin short protection voltage
SOURCE pin short protection time
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TSZ22111 • 15 • 001
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FB=2.00V
FB=0.30V
FB=2.0V
FADJ=0.0V
CFADJ=1000pF
FB fall
FB rise
VBST3= VBST2- VBST1
Overload is detected (FB rise)
Overload is detected (FB fall)
Ton=0us
0[ms] to Tss1 [ms]
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Parameter
Symbol
Min
Specifications
Typ
Max
Unit
Conditions
[Circuit Current]
Start current 1
ISTART1
0.100
0.500
1.000
mA
VCC= 0V
Start current 2
ISTART2
1.000
3.000
6.000
mA
VCC=10V
OFF current
ISTART3
-
10
20
uA
VSC
0.800
1.500
2.100
V
Start current switching voltage
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TSZ22111 • 15 • 001
4/21
Inflow current from Drain pin after
UVLO is released and when
MOSFET is OFF
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Pin Descriptions
Table 1. Pin Description
NO.
Pin Name
I/O
1
2
3
4
5
6
7
SOURCE
FADJ
GND
FB
VCC
DRAIN
DRAIN
I/O
I
I/O
I
I
I/O
I/O
ESD Diode
VCC
GND
✔
✔
✔
✔
✔
✔
✔
✔
-
Function
MOSFET SOURCE pin
MAX Burst Frequency setting pin
GND pin
Feedback signal input pin
Power supply input pin
MOSFET DRAIN pin
MOSFET DRAIN pin
I/O Equivalent Circuit Diagram
SOURCE
1
FB
4
GND
FADJ
SOURCE
VCC
-
-
6
R FB
FB
GND
7
DRAIN
DRAIN
DRAIN
VCC
-
Internal
Circuit
Internal MOSFET
SOURCE
5/21
DRAIN
Internal
Circuit
Internal MOSFET
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TSZ22111 • 15 • 001
Internal Reg
VCC
VREF
VREF
5
3
FADJ
2
SOURCE
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Block Diagram
FUSE
AC
Diode
Bridge
Filter
VCC
DRAIN
5
13 . 5V
/ 8 .2V
VCC OVP
VCC UVLO
+
-
Starter
4. 0V
Line Reg
100us
Filter
+
-
6,7
12V Clamp
Circuit
27 . 5V
10uA
Internal Block
FADJ
2
Burst
Frequency
Control
S
R
Q
DRIVER
PWM Control
+
Burst Control
4 .0 V
4. 0V
30k
FB
4
OLP
+
128 ms/
512ms
Timer
1M
Current
Limiter
+
-
Burst
Comparator
+
+
1
SOURCE
Rs
AC Input
Compensation
Soft Start
PWM
Comparator
+
Leading Edge
Blanking
(typ =250 ns)
MAX
DUTY
OSC
(65kHz )
3
Frequency
Hopping
GND
Slope
Compensation
FeedBack
With
Isolation
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BM2P015-Z BM2P016-Z
Block Description
(1) Start circuit (DRAIN: Pin 6,7)
This IC has a built-in start circuit. It enables low standby mode electricity and high speed start.
After start up, consumption power is determined by idling current I START3 (Typ=10uA) only.
Reference values of starting time are shown in Figure 3. When Cvcc=10uF it can start in less than 0.1 sec.
+
FUS E
AC
85- 265 Vac
Diode
Br di ge
-
DR AIN
Starter
SW1
VCC
Cvc c
+
VCCU VLO
Figure 1. Block Diagram of Start Circuit
1.0
0.9
ISTART2
Start Up Current [mA]
0.8
Start time[sec]
0.7
0.6
[sec]
起 動時間
0.5
0.4
0.3
0.2
0.1
0.0
ISTART1
ISTART3
0
0 Vsc
10V
5
10
15
20
25
30
35
40
45
50
Cvcc [uF]
V UVLO1
VCC Voltage[V]
Figure 2. Start Current vs VCC Voltage
Figure 3. Start Time (reference value)
* Start current flows from the DRAIN pin
Ex) Consumption power of start circuit only when Vac=100V
PVH=100V*√2*10uA=1.41mW
Ex) Consumption power of start circuit only when Vac=240V
PVH=240V*√2*10uA=3.38mW
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BM2P015-Z BM2P016-Z
(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 4. See the sections below for detailed descriptions.
VH
VCC=13.5V
VCC(1pin)
VCC=8.2V
Within
128ms
Internal REF
Pull Up
Within
128ms
Within
128ms
FB(8pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switching
stop
Switching
Soft Start
A
BC
D
E
F
GH
I J
K
Figure 4. Start Sequences Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
K:
Input voltage VH is applied.
This IC starts operating when VCC > VUVLO1 (13.5 V Typ).
Switching function starts when other protection functions are judged as normal.
When the secondary output voltage becomes constant, VCC pin current causes the VCC voltage to drop. As a result, IC
should be set to start switching until VCCVFOLP1A(2.8V Typ), it overloads.
When the FB pin voltage keeps VFOLP1A (= 2.8V Typ) at or goes above T FOLP (128ms Typ), the overload protection function is
triggered and the switching stops. During the TFOLP period (128ms Typ), if the FB pin voltage becomes VOVP (Typ=27.5V).
This function has a built-in mask time TLATCH(Typ=100us). Through this function, the IC is protected from pin
generated surge, etc. Figure 5 is showed about VCC OVP auto recovery type.
VH
Vovp1=27.5Vtyp
Vovp1=23.5Vtyp
VCC
VCCuvlo1=13.5Vtyp
Vchg1=13.0Vtyp
Vchg2= 8.7Vtyp
VCCuvlo2 8.2Vtyp
Time
ON
ON
OFF
VCC UVLO
ON
VCC OVP
OFF
OFF
ON
ON
VCC Charge
Function
OFF
ON
OUT
Switching
OFF
OFF
Time
A
B C
D
E F
G
H
I
J
A
Figure 5. VCC UVLO / OVP Timing Chart
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
DRAIN voltage input, VCC pin voltage starts rising.
VCC>Vuvlo1, DC/DC operation starts.
VCC< VCHG1, VCC charge function operates and the VCC voltage rises.
VCC > VCHG2, VCC charge function stops.
VCC > VOVP1, TLATCH (Typ =100us) continues, switching is stopped by the VCCOVP function.
VCC < VOVP2, DC/DC operation restarts by auto recovery.
VH is OPEN. VCC Voltage falls.
Same as C
Same as D
VCCVUVLO1 and when the DC/DC operation starts. The VCC pin
voltage then drops to VCHG2. The operation is shown in figure 6.
VH
VUVLO1
VCHG2
VCC VCHG1
VUVLO2
Switching
VH charge
charge
charge charge charge
OUTPUT
voltage
A
B C D E
F G H
Figure 6. VCC Pin Charge Operation
A:
B:
C:
D:
E:
F:
G:
H:
DRAIN pin voltage rises, charges VCC pin through the VCC charge function.
VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
When the DC/DC operation starts, the VCC voltage drops.
VCC < VCHG1, VCC recharge function operates.
VCC > VCHG2, VCC recharge function stops.
VCC < VCHG1, VCC recharge function operates.
VCC > VCHG2, VCC recharge function stops.
After the output voltage is finished rising, VCC is charged by the auxiliary winding, and VCC pin stabilizes.
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TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
This IC has a current mode PWM control.
An internal oscillator sets a fixed switching frequency (65 kHz Typ).
This IC has an integrated switching frequency hopping function, which causes the switching frequency to fluctuate as
shown in Figure 7 below.
The fluctuation cycle is 125 Hz (Typ).
Switching Frequency
[kHz]
500us
69
68
67
66
65
64
63
62
61
125 Hz(8ms)
Time
Figure 7. Frequency Hopping Function
Maximum duty cycle is fixed at 75% (Typ) and minimum pulse width is fixed at 400 ns (Typ).
In current mode control, sub-harmonic oscillation may occur when the duty cycle exceeds 50%.
As a countermeasure, this IC has built-in slope compensation circuits.
This IC has built-in burst mode and frequency reduction circuits to achieve lower power consumption when the load is
light. FB pin is pulled up by RFB (30 kΩ Typ). FB pin voltage is changed by secondary output voltage (secondary load
power).FB pin is monitored, burst mode operation and frequency detection start.
Figure 8 shows the FB voltage, and the DCDC switching frequency operation.
mode1 : Burst operation
mode2 : Frequency reduction operation (operates at max frequency)
mode3 : Fixed frequency operation (operates at max frequency)
mode4 : Overload operation (detects the overload state and stops the pulse operation)
Y
mode2
mode1
mode3
Switching
Frequency
[kHz]
mode4
65kHz
Y
mode2
mode1
mode3
mod
65kHz
Pulse OFF
25kHz
25kHz
Pulse OFF
0.30V
1.25V
2.00V
2.80V FB [V]
X
0.30V
1.25V
2.00V
Figure 8. Switching Operation State Changes by FB Pin Voltage
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TSZ22111 • 15 • 001
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TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
2.80V FB
BM2P015-Z BM2P016-Z
(4-1) MAX Burst frequency setting
This IC can reduce a burst sound to fix a burst frequency.
This IC has two clocks, so this IC can fix the burst frequency.
Frequency
[kHz]
Burst
Mode
Frequency
Reduction Mode
Frequency
[kHz]
Normal
Mode
65kHz
Burst
Mode
Frequency
Reduction Mode
Normal
Mode
65kHz
Switching
frequency
Switching
frequency
25kHz
25kHz
[Region of sound]
[Region of sound]
FADJ
Burst frequency
Burst frequency
Output Power[W]
Output Power[W]
Figure 9-1. No setting
Figure 9-2. setting
Setting external capacitor of FADJ pin, the burst frequency is fixed.
It is showed an example of max burst frequency setting using FADJ pin
This frequency is decided by FADJ source current, FADJ comparator voltage and external capacitor.
100000
Burst Frequency [Hz]
10000
1000
100
10
10
100
1000
10000
C_FADJ[pF]
Figure 10. Example of max burst frequency setting using FADJ pin
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BM2P015-Z BM2P016-Z
(5) Over Current limiter
This IC has a built-in over current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching stops. It
also has a built-in AC voltage compensation function. With this function, the over current limiter level is high until the
time the AC voltage is compensated.
Shown in figure-11, 12, and 13.
65kHz(15.3us)
65kHz(15.3us)
ON
[DC/DC]
@AC100V
ON
[DC/DC]
@AC100V
OFF
OFF
[DC/DC]
@AC240V
OFF
OFF
ON
ON
OFF
[DC/DC]
@AC100V
OFF
OFF
OFF
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=240V
Iepak(AC)@Vin=100V
Iepak(AC)@Vin=100V
Iepak(DC)= included conpensation
Iepak(DC)＝Constant
Tdelay
Tdelay
Tdelay
Primary Peak Current
Tdelay
Primary Peak Current
Figure 11. No AC Voltage Compensation Function
Figure12. Built-in AC Compensation Voltage
Primary peak current is calculated using the formula below.
𝑰𝒑𝒆𝒂𝒌 =
𝑽𝑺𝑶𝑼𝑹𝑪𝑬 𝑽𝒅𝒄
+
× 𝒕𝒅𝒆𝒍𝒂𝒚
𝑹𝒔
𝑳𝒑
Where:
𝑽𝑺𝑶𝑼𝑹𝑪𝑬 is the over current limiter voltage (internal).
𝑹𝒔 is the current detection resistance.
𝑽𝒅𝒄 is the input DC voltage.
𝑳𝒑 is the primary inductance.
𝒕𝒅𝒆𝒍𝒂𝒚 is the delay time after detection of over current limiter.
Y
CS Limitter[V]
0.704V
+20mV/us
0.552V
0.400V
0.0
X
7.6us
15.3us
Time [us]
Figure 13. Over Current Limiter Voltage
(6) L. E. B. Blanking Period
When the MOSFET driver is turned ON, surge current flows through each capacitor component and drive current is
generated. Therefore, when the SOURCE pin voltage rises temporarily, detection errors may occur in the over current
limiter circuit. To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for
250ns by the on-chip LEB (Leading Edge Blanking) function.
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BM2P015-Z BM2P016-Z
(7) SOURCE pin (pin 1) short protection function
When the SOURCE pin (pin 1) is shorted, this IC overheats.
This IC has a built-in short protection function to prevent destruction.
(8) SOURCE pin (pin 1) open protection
If the SOURCE pin becomes OPEN, this IC may be damaged.
To prevent it from being damaged, this IC has a built-in OPEN protection circuit (auto recovery protection).
(9) Output over load protection function (FB OLP Comparator)
The output overload protection function monitors the secondary output load status at the FB pin and stops switching
whenever overload occurs. When there is an overload, the output voltage is reduced and current no longer flows to
the photo coupler, so the FB pin voltage rises.
When the FB pin voltage > VFOLP1A (2.8 V Typ) continuously for the period TFOLP (128ms Typ), it is judged as an overload
and switching stops.
When the FB pin > VFOLP1A (2.8 V Typ), if the voltage goes lower than VFOLP1B (2.6V Typ) during the period TFOLP (128ms
Typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP (128ms Typ).
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of V FOLP1A (2.8 V Typ)
or above. Therefore, at startup the FB voltage must be set to V FOLP1B (2.6 V Typ) or below during the period TFOLP
(128ms Typ), and the secondary output voltage’s start time must be set within the period T FOLP (128ms Typ) following
startup of the IC.
Recovery is after the period TFOLP2(512 ms Typ), from the detection of FBOLP.
Operation mode of protection circuit
Operation mode of protection functions are shown in Table 2.
Table 2. Operation Mode of Protection Circuit
Function
VCC Under Voltage Locked Out
VCC Over Voltage Protection
TSD
FB Over Limited Protection
SOURCE Short Protection
SOURCE Open Protection
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Operation mode
Auto recovery
BM2P015-Z: Latch(with 100us timer)
BM2P016-Z: Auto recovery
Auto recovery
Auto recovery (with 128ms timer)
Auto recovery
Auto recovery
14/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105C or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 74.2 mm × 74.2mm × 1.6 mm, mounted on glass epoxy on single-layer substrate)
1.4
1.2
1.0
Pd[W ]
0.8
0.6
0.4
0.2
0.0
0
25
50
75
100
125
150
Ta[℃]
Figure 14. Thermal Abatement Characteristics
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TSZ22111 • 15 • 001
15/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Ordering Information
B
M
2
P
0
1
x
-
VCC OVP
5: Latch
6: Auto Restart
x
Outsourced Package
Z: DIP7K
ZA: DIP7WF
Making Diagram
DIP7K (TOP VIEW)
Part Number Marking
LOT Number
DIP7WF (TOP VIEW)
Part Number Marking
LOT Number
Part Number Marking
Product Name
VCC OVP
BM2P015
BM2P016
BM2P015-Z
BM2P016-Z
Latch
Auto Restart
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Physical Dimension and Packing Information
Package Name
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DIP7K
17/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Physical Dimension and Packing Information
Package Name
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
DIP7WF
18/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Operational Notes
1.
Reverse Connection of Power Suppl
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
8.
9.
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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TSZ22111 • 15 • 001
19/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
Pin A
N
P+
N
P
N
P+
N
Parasitic
Elements
N
P+
GND
E
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Parasitic
Elements
Pin B
B
Parasitic
Elements
GND
GND
Figure 15. Example of monolithic IC structure
N Region
close-by
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation
should always be within the IC’s power dissipation rating. If however the rating is exceeded for a
continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn
OFF all output pins. The IC should be powered down and turned ON again to resume normal operation
because the TSD circuit keeps the outputs at the OFF state even if the TJ falls below the TSD
threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
20/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
BM2P015-Z BM2P016-Z
Revision History
Date
Rev.
Changes
01.Dec.2013
001
New Release
18.Mar.2019
002
P1
P16
13.Dec.2019
003
13.Jul.2020
004
26.Oct.2021
005
Modify the size of package
Modify the physical dimension and packing information
Revise Japanese datasheet.
P.2
Modify the I/O Equivalent Circuit Diagram
P.9
Modify the sentence from latch to auto recovery
P.13
Modify the Numerical formula format and description of the Lp
P1 Add the package variation
P16 Add the package variation
P18 Add the physical dimension
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
21/21
TSZ02201-0F1F0A200070-1-2
26.Oct.2021 Rev.005
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
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