BU1523KV

Image Correction ICs Image Correction IC for Panel BU1523KV No.11060EAT05 ●Description BU1523KV is an image quality adjustment IC for in-vehicle displays. It can control brightness, contrast, hue, intensity, sharpness, etc. It is equipped with both RGB and YCbCr as input/output interfaces. It also incorporates LVDS output capability with an embedded LVDS transmitter. ●Features 1) RGB input data format Width of data bus 24bit Vertical/horizontal synchronizing and data enable signal 2) RGB output data format It is the same as the entry format 3) YCbCr input data format ITU-R BT.656-4 or synchronization signal YCbCr Width of data bus 8bit Vertical/horizontal synchronizing and data field signal Date range conform ITU-R BT.601 or full range 4) YCbCr output data format The same as the entry format Capable of processing BT.656 input to generate and output synchronization signal from SAV/EAV 5) RGB IF Image quality adjustment Contrast, Brightness, Hue, Chroma and Sharpness Independent RGB gamma correction 6) YCbCr Image quality adjustment Contrast, Brightness, Hue, Chroma and Sharpness 7) LVDS Transmitter Built-in LVDS transmitter Converts RGB24 bit, vertical/horizontal synchronization signal and data enable inputs into 4ch LVDS data streams 8) 2-line serial interface slave function The register in BU1523KV can be set 9) Package VQFP100 ●Applications In-vehicle display etc. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 1/22 2011.02 - Rev.A BU1523KV ●Absolute maximum ratings [Table 1] Parameter Supply voltage 1 Supply voltage 2 Supply voltage 3 Supply voltage 4 Supply voltage 5 Input voltage range Storage temperature range Power dissipation *1 *2 *3 * * Technical Note Symbol VDDIO VDDI2C PVDD LVDD VDD VIN Tstg PD Ratings -0.3～+4.0 -0.3～+4.0 -0.3～+4.0 -0.3～+4.0 -0.3～+2.1 -0.3～IO_LVL+0.3 *1 -40～+125 1000 *2, 1499 *3 Unit V V V V V V ℃ mW IO_LVL is a generic name of VDDIO, VDDI2C IC only. In the case exceeding 25℃, 10mW should be reduced at the rating 1℃. When packaging a glass epoxy board of 70x70x1.6mm. If exceeding 25℃, 14.99mW should be reduced at the rating 1℃ Has not been designed to withstand radiation. Operation is not guaranteed at absolute maximum ratings. ●Operating conditions [Table 2] Parameter Supply voltage1(IO) Supply voltage2(IO) Supply voltage3(PLL) Supply voltage4(LVDS) Supply voltage5(CORE) Input voltage range Operating temperature range Symbol VDDIO VDDI2C PVDD LVDD VDD VIN Topr Ratings Min. 3.0 3.0 3.0 3.0 1.65 0.0 -40 Typ. 3.3 3.3 3.3 3.3 1.8 Max. 3.6 3.6 3.6 3.6 1.95 IO_LVL*1 +85 Unit V V V V V V ℃ *1 IO_LVL is a generic name of VDDIO, VDDI2C. * Please supply power source in order of VDD→ (VDDIO, VDDI2C, PVDD,LVDD). www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 2/22 2011.02 - Rev.A BU1523KV ●Block Diagram Technical Note LPDNB RGBMUTE MIR_EN RDI0~RDI7 GDI0~GDI7 BDI0~BDI7 RGBCKI RGBHSI RGBVSI RGBDEI CbCr Y RGB/ YCbCr Convert Hue Adjust Chroma Adjust YCbCr/ RGB Convert RGB RGB Gamma O utput Data Convert LVDS Transmitter TAP/TAN TBP/TBN TCP/TCN TDP/TDN Contrast Adjust Brightness Adjust Sharpnes Adjust PLL TCKP/TCKN R GB IF Image quality adjustment part YDI0~YDI7 YCKI YHSI YVSI YFLDI SAV/EAV Detect CbCr Y Hue Adjust Chroma Adjust Output Data Convert YDO0~YDO7 YCKO YHSO YVSO YFLDO Contrast Adjust Brightness Adjust Sharpnes Adjust YCbCr IF Image quality adjustment part SCL SDA I2CDEV RESETB TEST0 TEST1 I2C IF (slave) Register The LVDS data output mode LPDNB RGBMUTE MIR_EN RDI0~RDI7 GDI0~GDI7 BDI0~BDI7 RGBCKI RGBHSI RGBVSI RGBDEI CbCr Y RGB/ YCbCr conversion Hue Adjust Chroma Adjust YCbCr/ RGB Convert RGB Gamma RGB O utput Data Convert LVDS Transmitter TAP/TAN TBP/TBN TCP/TCN TDP/TDN Contrast Adjust Brightness Adjust Sharpnes Adjust PLL TCKP/TCKN RDO0~RDO7 GDO0~GDO7 BDO0~BDO7 RGBCKO RGBHSO RGBVSO RGBDEO RGB IF Image quality adjustment part SCL SDA I2CDEV I2C IF (slave) Register RESETB TEST0 TEST1 The RGB data output mode (YCbCr interface cannot be used.) Terminal selection from register *Change their modes with register setting. Fig. 1 Block diagram www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 3/22 2011.02 - Rev.A BU1523KV ●Terminal Functions・Equivalent circuit diagram [Table 3 Terminal Functions (1/4)] PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 * *1) *2) *4) *6) Technical Note PIN Name BDI4 BDI5 BDI6 BDI7 RGBHSI RGBVSI RGBDEI GND RGBCKI VDDIO I2CVDD SDA SCL GND VDDIO VDD YDO7/RGBDEO YDO6/RGBVSO YDO5/RGBHSO YDO4/BDO7 YDO3/BDO6 YDO2/BDO5 YDO1/BDO4 YDO0/BDO3 YFLDO/BDO2 In/Out (*1) Init (*2) Function Description RGB B Data [4] input RGB B Data [5] input RGB B Data [6] input RGB B Data [7] input RGB H Sync input RGB V Sync input RGB Data Enable input Ground RGB Clock input IO power source 2-line serial interface IO power source 2-line serial interface data input / output (*6) 2-line serial interface clock input Ground IO power source CORE power source BT601 YcbCr data [7] / RGB data output BT601 YcbCr data [6] / RGB V Sync output BT601 YcbCr data [5] / RGB H Sync output BT601 YcbCr data [4] / RGB B data [7] output BT601 YcbCr data [3] / RGB B data [6] output BT601 YcbCr data [2] / RGB B data [5] output BT601 YcbCr data [1] / RGB B data [4] output BT601 YcbCr data [0] / RGB B data [3] output BT601 Field output / RGB B data [2] output PowerSupply System (*4) I/O Type A A A A A A A B G H D D D D D D D D D I I I I I I I G I P P I/O I G P P O O O O O O O O O In Low Low Low Low Low Low Low Low Low a a a a a a a a,b a a b b b a,b a a a a a a a a a a Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) . “I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND. “PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output. "a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD. “SDA” is output at "L" level when usually using it or is in the state of high impedance, and "H" level is not output. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4/22 2011.02 - Rev.A BU1523KV [Table 3 Terminal Functions (2/4) ] PIN No. 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 * *1) *2) *4) *5) Technical Note PIN Name YVSO/BDO1 YHSO/BDO0 GND YCKO/RGBCKO VDDIO GDO7 GDO6 GDO5 GDO4 VDDIO YCKI/GDO3 GND YHSI/GDO2 YVSI/GDO1 YFLDI/GDO0 VDD YDI0/RDO7 YDI1/RDO6 YDI2/RDO5 VDDIO YDI3/RDO4 YDI4/RDO3 YDI5/RDO2 YDI6/RDO1 YDI7/RDO0 In/Out (*1) Init (*2) Function Description BT601 YcbCr data [1] / RGB V Sync output BT601 YcbCr data [0] / RGB H Sync output Ground BT601 Clock output / RGB Clock output IO power source RGB G data [7] output RGB G data [6] output RGB G data [5] output RGB G data [4] output IO power source BT656 Clock input / RGB G data [3] output Ground BT656 H Sync input / RGB G data [2] output (*5) (*5) Power Supply System (*4) I/O Type D D D D D D D F E E E E E E E E E E E O O G O P O O O O P I/O G I/O I/O I/O P I/O I/O I/O P I/O I/O I/O I/O I/O Low Low Low Low Low Low Low In In In In In In In In In In In In a a a,b a a a a a a a a a,b a a a a a a a (*5) BT656 V Sync input / RGB G data [1] output (*5) BT601 Field input / RGB G data [0] output CORE power source BT656 Y data [0] input / RGB R data [7] output (*5) BT656 Y data [1] input / RGB R data [6] output (*5) BT656 Y data [2] input / RGB R data [5] output (*5) IO power source BT656 Y data [3] input / RGB R data [4] output a a a a a BT656 Y data [4] input / RGB R data [3] output (*5) BT656 Y data [5] input / RGB R data [2] output (*5) BT656 Y data [6] input / RGB R data [7] output (*5) BT656 Y data [7] input / RGB R data [0] output (*5) Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) . “I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND. “PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output. "a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD. 36-50 pins direction depends on the modes. the RGB data output mode: output the LVDS data output mode: input www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 5/22 2011.02 - Rev.A BU1523KV [Table 3 Terminal Functions (3/4) ] PIN No. 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 * *1) *2) *3) *4) Technical Note PIN Name GND I2CDEV RGBMUTE MIR_EN TEST0 TEST1 RESETB LPDNB VDDIO PGND PVDD LGND TDP TDN TCKP TCKN TCP TCN LGND LVDD TBP TBN TAP TAN LGND In/Out (*1) Init (*2) Function Description Ground 2 I C device address setting Power Supply System (*4) I/O Type A B A C C B B I I I I I I I I I I - G I I I I I I I P G P G O O O O O O G P O O O O G PD PD - a,b a a a a a a a a d d c c c c c c c c c c c c c c MUTE signal : High active LVDS data mirror enable : High active Test pin 0 Test pin 1 (*3) (Connect to GND) (Connect to GND) (*3) Logic reset signal: Low active LVDS reset signal: Low active IO power source PLL ground PLL ground LVDS ground LVDS data output D ch P LVDS data output D ch N LVDS clock output P LVDS clock output N LVDS data output C ch P LVDS data output C ch N LVDS ground LVDS power source LVDS data output B ch P LVDS data output B ch N LVDS data output A ch P LVDS data output A ch N LVDS ground Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) . “I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND. “PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output. Fix TEST0 and TEST1 to GND (The opening is a prohibition of use) "a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 6/22 2011.02 - Rev.A BU1523KV [Table 3 Terminal Functions (4/4) ] PIN No. 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 * *1) *2) *4) Technical Note PIN Name GND RDI0 RDI1 RDI2 RDI3 RDI4 RDI5 RDI6 RDI7 VDDIO GDI0 GDI1 GND GDI2 GDI3 GDI4 GDI5 GDI6 GDI7 VDD BDI0 BDI1 BDI2 BDI3 VDDIO In/Out (*1) Init (*2) Function Description Ground RGB R data [0] input RGB R data [1] input RGB R data [2] input RGB R data [3] input RGB R data [4] input RGB R data [5] input RGB R data [6] input RGB R data [7] input IO power source RGB G data [0] input RGB G data [1] input GND RGB G data [2] input RGB G data [3] input RGB G data [4] input RGB G data [5] input RGB G data [6] input RGB G data [7] input CORE power source RGB B data [0] input RGB B data [1] input RGB B data [2] input RGB B data [3] input IO power source Power Supply System (*4) I/O Type A A A A A A A A A A A A A A A A A A A A - G I I I I I I I I P I I G I I I I I I P I I I I P - a,b a a a a a a a a a a a a,b a a a a a a a a a a a Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) . “I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND. “PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output. "a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 7/22 2011.02 - Rev.A BU1523KV [Table 4 (1/2)] Type Equivalent circuit configuration VDDIO VDDIO VDDIO Technical Note Type Equivalent circuit configuration To internal A To internal B GND GND GND Input terminal Input terminal with schmitt VDDIO VDDIO VDDIO VDDIO Internal signal To internal Internal signal C D GND GND GND GND GND Input terminal with pull down VDDIO VDDIO VDDIO To internal GND Internal signal Output terminal VDDIO VDDIO VDDIO To internal Internal signal E Internal signal F Internal signal GND GND Internal signal GND GND Internal signal Input/Output terminal I2CVDD I2CVDD To internal GND I2CVDD Input/Output terminal with schmitt I2CVDD Internal signal To internal G Internal signal H GND GND Internal signal GND Input/Output terminal (2-line serial I/F) Input terminal with schmitt (2-line serial I/F) www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 8/22 2011.02 - Rev.A BU1523KV [Table 4 (2/2)] Type Equivalent circuit configuration LVDD LVDD Internal signal Technical Note Internal signal Internal signal I T*P T*N Internal signal Internal signal GND GND Internal signal Output terminal (LVDS) ●Pin configurations [53] RGBMUTE [57] RESETB [54] MIR_EN [52] I2CDEV [58] LPDNB [59] VDDIO [56] TEST1 [55] TEST0 [60] PGND [75] LGND [69] LGND [62] LGND [61] PVDD [66] TCKN [65 ]TCKP [70] LVDD [51] GND [68] TCN [54] TDN [67] TCP GND [76] RDI0 [77] RDI1 [78] RDI2 [79] RDI3 [80] RDI4 [81] RDI5 [82] RDI6 [83] RDI7 [84] VDDIO [85] GDI0 V [86] GDI1 [87] GND [88] GDI2 [89] GDI3 [90] GDI4 [91] GDI5 [92] GDI6 [93] GDI7 [94] VDD [95] BDI0 [96] BDI1 [97] BDI2 [98] BDI3 [99] VDDIO [100] [63] TDP [74] TAN [72] TBN [73] TAP [71] TBP [50] YDI7/RDO0 [49] YDI6/RDO1 [48] YDI5/RDO2 [47] YDI4/RDO3 [46] YDI3/RDO4 [45] YDDIO [44] YDI2/RDO5 [43] YDI1/RDO6 [42] YDI0/RDO7 [41] YDD [40] YFLDI/GDO0 [39] YVSI/GDO1 [38] YHSI/GDO2 [37] GND [36] YCKI/GDO3 [35] YDDIO [34] GDO4 [33] GDO5 [32] GDO6 [31] GDO7 [30] VDDIO [29] YCKO/RGBCKO [28] GND 1PIN MARK [27] YHSO/BDO0 [26] YVSO/BDO1 RGBHSI [5] RGBDEI [7] RGBCKI [9] YDO6/RGBVSO [18] RGBVSI [6] SDA [12] BDI4 [1] BDI5 [2] BDI6 [3] BDI7 [4] GND [14] YDO4/BDO7 [20] YDO3/BDO6 [21] YDO2/BDO0 [22] YDO1/BDO4 [23] YDO7/RGBDEO [17] YDO5/RGBHSO [19] YDO0/BDO3 [24] GND [8] VDDIO [10] VDDIO [15] I2CVDD [11] VDD [16] YFLDO/BDO2 [25] SCL [13] [Pin No.] Pin Name Fig.2 Pin configurations www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 9/22 2011.02 - Rev.A BU1523KV Technical Note ●Electrical characteristics (DC) [Table 5] Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃, fIN=36MHz Limits Parameter Symbol Unit Condition Min. Typ. Max. Input frequency 1 Input frequency 2 Input clock duty Operational current LVDS supply current LVDS supply current Leakage current Input ”H” current Input ”L” current Pull-down current Input ”H” voltage 1 Input ”L” voltage 1 Input ”H” voltage 2 Input ”L” voltage 2 Output ”H” voltage Output ”L” voltage LVDS Transmitter 250 Differential output voltage Change in VOD between complementary output states Common mode voltage Change in VOC between complementary output states Output short circuit current Output TRI-STATE current VOD 120 ΔVOD VOC ΔVOC IOS IOZ 1.125 200 1.25 300 35 1.375 35 -24 ±10 mV mV V mV mA μA VOUT(*2)=0V, RL=100Ω LPDNB=GND VOUT(*2)=GND to LVDD RL=100Ω 350 450 mV RL=100Ω Normal Swing LVDS_RS(*1) = 1 Reduced Swing (*1) LVDS_RS = 0 FIN1 FIN2 DCKI IDD1 ILVDD1 ILVDD2 IDDst1 IIH IIL IPD VIH1 VIL1 VIH2 VIL2 VOH VOL 8.0 8.0 45 -10 -10 25 IO_LVL x0.8 -0.3 IO_LVL x0.85 -0.3 IO_LVL -0.4 0.0 50 16 55 38 50 36.0 55.0 55 50 10 10 100 IO_LVL +0.3 IO_LVL x 0.2 IO_LVL +0.3 IO_LVL x 0.15 IO_LVL 0.4 MHz MHz % mA mA mA μA μA μA μA V V V V V V RGBCKI YCKI RGBCKI, YCKI 36MHz (VDD) 36MHz, LVDS_RS = 1 (LVDD, PVDD) Input toggle pattern (Fig.4) 36MHz, LVDS_RS = 0 (LVDD, PVDD) Input toggle pattern (Fig.4) Release reset , input pin =GND (VDD) VIH=IO_LVL VIL=GND VIH=IO_LVL Normal input (Including input mode of I/O terminal) Normal input (Including input mode of I/O terminal) Hysteresis input (RESETB, RGBCKI, YCKI, LPDNB, SCL, RGBMUTE) Hysteresis input (RESETB, RGBCKI, YCKI, LPDNB, SCL, RGBMUTE) IOH=-1.0mA(DC) (including output mode of I/O terminal) IOL=1.0mA(DC) (including output mode of I/O terminal) * IO_LVL is a generic name of VDDIO, VDDI2C. (*1) LVDS_RS is a register name controlled with 2-line serial interface. (*2) VOUT=TAN/P, TBN/P, TCN/P, TDN/P, TCKN/P www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 10/22 2011.02 - Rev.A BU1523KV Technical Note RL RL Fig.3 LVDS Transmitter characteristic diagram CLKIN Tx0 Tx1 Tx2 Tx3 Tx4 Tx5 Tx6 X=A,B,C,D ※Input waveform to the LVDS transmitter block ※Tx0-7 are the data before being serialized by the LVDS transmitter. Refer to Fig.8 for the serialized data sequence. Fig.4 Input toggle pattern www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 11/22 2011.02 - Rev.A BU1523KV ●Electric Characteristics (AC) 1. Image quality adjustment data input interface timing RGB(Y)VSI / RGB(Y)HSI RGBDEI / YFLDI R(G,B,Y)DI[7:0] Technical Note RGB(Y)CKI (RGB(Y)CK_POL=1) RGB(Y)CKI (RGB(Y)CK_POL=0) ｔCKI ｔCMS ｔCMH Fig.5 Data input interface timing [Table 6] Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃ Symbol tCKI1 tCKI2 dCKI tCMS tCMH RGBCKI Clock Cycle YCKI Clock Cycle RGB(Y)CKI Clock Duty RGB(Y)CKI Rise / Fall set-up Time RGB(Y)CKI Rise / Fall Hold Time Description Min. 27.7 18.1 45 6 5 Typ. 50 Max. 125 125 55 Unit ns ns % ns ns * RGB(Y)CK_POL is an internal register of BU1523KV to determine the polarity of RGB(Y)CKI. * Ensure to make the total number of 1 line input pixels to YCbCr interface to be even (multiple of 4, in case of cycles). 2. Image quality adjustment data output interface timing ｔCKO RGB(Y)CKO (R(Y) CK_POL=1) ｔOHH ｔOHL RGB(Y)VSO / RGB(Y)HSO RENO / YFLDO ｔODV R(G,B,Y)DO Fig.6 Data output interface timing [Table 7] Unless otherwise specified, VDD=1.80V, VDDIO=I2CVDD=PVDD=LVDD=3.3V, GND=0.0V, Ta=25℃ Symbol tCKO1 tCKO2 dCKO1 dCKO2 tODV tOHL, tOHH RGBCKO Clock Cycle YCKO Clock Cycle RGBCKO Clock Duty YCKO Clock Duty Output delay R(G, B,Y)DO Output delay RGB(Y)VSO, RGB(Y)HSO, RENO/YFLDO Description Min. 27.7 18.1 40 35 Typ. 50 50 Max. 125 125 60 65 5 5 Unit ns ns % % ns ns * The above figure shows the waveform when RGB(Y)CK_POL= “1” is set. When RGB(Y)CK_POL= “0” is set, RGB(Y)VSO, RGB(Y)HSO and RGB(Y)DO are output at the falling edge of RGB(Y)CKO. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 12/22 2011.02 - Rev.A BU1523KV Technical Note 3. LVDS transmitter switching characteristic [Table 8] Unless otherwise specified, VDD=1.80V, VDDIO=I2CVDD=PVDD=LVDD=3.3V, GND=0.0V, Ta=25℃, fIN=36MHz Symbol tLVT tTOP1 tTOP0 tTOP6 Description LDVS Transition Time Output Data Position 0 Output Data Position 1 Output Data Position 2 2 MIN -1.2 tCKI -1.2 7 TYP 0.6 0.0 tCKI 7 MAX 1.5 +1.2 tCKI +1.2 7 Unit ns ns ns tCKI -1.2 7 tCKI -1.2 7 tCKI -1.2 7 2 3 4 5 6 tCKI 7 tCKI 7 tCKI 7 2 3 4 5 6 tCKI +1.2 7 tCKI +1.2 7 tCKI +1.2 7 ns ns ns ns ns ms tTOP5 tTOP4 tTOP3 tTOP2 tPLL Output Data Position 3 Output Data Position 4 Output Data Position 5 Output Data Position 6 Phase Locked Loop Set Time 3 4 5 6 tCKI -1.2 7 tCKI -1.2 7 tCKI 7 tCKI 7 tCKI +1.2 7 tCKI +1.2 7 - - 10.0 LVDS Output Vdiff=(TxP)-(TxN) TxP CL TxN LVDS Output Load RL Vdiff 80% 20% 80% 20% tLVT tLVT Fig.7 LVDS Output AC Timing diagram 1 www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 13/22 2011.02 - Rev.A BU1523KV Technical Note TCKP/N OUT (Differential) TAP/N TBP/N TCP/N TDP/N TA6 TA5 TA4 TA3 TA2 TA1 TA0 TB6 TB5 TB4 TB3 TB2 TB1 TB0 TC6 TC5 TC4 TC3 TC2 TC1 TC0 TD6 TD5 TD4 TD3 TD2 TD1 TD0 Previous Cycle tTOP1 tTOP0 tTOP6 tTOP5 tTOP4 tTOP3 tTOP2 Next Cycle Fig.8 LVDS Output AC Timing diagram 2 LPDNB POWER tPLL CLKIN TCKP/N * POWER shows VDDIO, I2CVDD, VDD, LVDD, PVDD * CLKIN is a clock input to the LVDS transmitter. Fig.9 LVDS Phase Locked Loop Set Time www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 14/22 2011.02 - Rev.A BU1523KV 4. 2-line serial interface timing Technical Note SDA t SU;DAT t LOW t HD;ST A t BUF SCL t HD;STA t HD;DAT t HIGH t SU;STA t SU;STO Fig.10 2-line serial interface timing [Table 9] Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃ Symbol fSCL tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tSU;STO tBUF SDL clock frequency Holding time(Repetition) ”START” Condition After this period, the first clock pulse is generated. Low period of SDL clock High period of SDL clock Setup time of repetition ”START” condition Data hold time Data setup time Setup time of 'STOP' condition 'Bus free time between STOP' condition and 'START' condition Description MIN 0 0.6 1.3 0.6 0.6 0 100 0.6 1.3 TYP MAX 400 Unit kHz µs µs µs µs µs ns µs µs www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 15/22 2011.02 - Rev.A BU1523KV ●Operation explanation of each block Technical Note 1. Image quality adjustment of RGB interface It adjusts image quality input through 24-bit RGB interface. The supported I/O interface consists of 24-bit data, vertical synchronization signal, horizontal synchronization signal and data enable signal. It converts 24-bit RGB into YCbCr444 and makes adjustment on the contrast, brightness, sharpness, hue and intensity in the YCbCr space. The contrast, brightness and sharpness are adjusted against the luminance (Y) component and the hue and intensity are adjusted against the color difference (CbCr) component. In addition to the image quality adjustment in the YCbCr space, it is also equipped with the RGB independent gamma correction capability in the RGB space. Converting YCbCr444 to 24-bit RGB, gamma correction is made to each of the RGB components. 16 gamma curve points can be set and the intervals between those set points are linearly interpolated. When the RGBMUTE terminal is set to “High” level, the RGB output data will be all “0” from the next frame. 2. Image quality adjustment of YUV It adjusts image quality input through YCbCr422 interface. The supported I/O interfaces are ITU-R BT.656-4 and YCbCr with synchronization signal (complied with ITU-R BT.601). When the input is ITU-R BT.656-4, the output can be selected from ITU-R BT.656-4 and YCbCr with synchronization signal. However, when the input is YCbCr with synchronization signal, the output can only be YCbCr with synchronization signal. It makes adjustment on the contrast, brightness, sharpness, hue and intensity in the YCbCr space. The contrast, brightness and sharpness are adjusted against the luminance (Y) component and the hue and intensity are adjusted against the color difference (CbCr) component. 3. LVDS transmitter It outputs high-speed serial data for image quality adjustment of RGB interface in LVDS format. The data mapping to be output in the LVDS format can be changed by the register setting. When the LPDNB terminal is set to “Low” level, the LVDS transmitter part will go into power down mode. The LVDS output will become Hi-Z status. 4. 2-line serial interface 2-line serial interface slave function is embedded. The registers are accessed through this interface. The slave address is 46h (in 7-bit notation) when I2CDEV=0 and 47h (in 7-bit notation) when I2CDEV=1. The sub address is automatically incremented when consecutively accessed twice or more in read or write operation. * Slave address of 46h and 47h are in hexadecimal. * Fig.11 depicts the status when I2CDEV=0. SDA SCL S START condition 1-7 Slave address 8 R/W 9 ACK 1-7 8 9 ACK 1-7 Data 8 9 ACK P STOP condition Sub address Data sending and receiving waveform W rite sequence S Slave address (46h) W (0) A(S) Sub address A(S) Write data A(S) Write data A(S) Write data A(S)/ P A(S) Read sequence S Slave address (46h) W (0) A(S) Sub address A(S) S Slave address (46h) R (1) A(S) Read data A(M) Read data A(M)/ P A(M) S = START condition P = STOP condition A(S) = acknowledge by slave A(M) = acknowledge by master A(S) = not acknowledge by slave A(M) = not acknowledge by master Fig.11 2-line serial interface format www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 16/22 2011.02 - Rev.A BU1523KV ●Example of application circuit VDD (1.8V System) VDD (3.3V System) F.Bead*1 F.Bead*1 Technical Note VDD (3.3V System) VDDIO LVDD 0.1uF 0.01uF I2CVDD 0.1uF 0.01uF VDD 0.1uF 0.01uF Main CPU (Graphic LSI) GND [RGB Data] RGBCKI, RGBVSI, RGBHSI, RGBDEI, RDI0～7, GDI0～7, BDI0～7 TAN TAP TBN [BT.601 Data] YCKO,YFLDO, YVSO, YHSO, YDO0～7 LVDD 0.1uF 0.01uF 0.1uF 0.01uF LGND VDD GND 0.1uF 0.01uF LGND PVDD PGND 0.1uF 0.01uF 0.1uF 0.01uF PVDD PGND RARA+ RBRB+ RCRC+ RCLKRCLK+ RDRD+ BU16002KVT TBP TCN TCP BU1523KV VDD (3.3V System) TCLK TCLK SDA SCL TDN TDP LPDB RMUTE [BT.656 Data] YCKI,YFLDI, YVSI, YHSI, RCKO BDO4 BDO3 BDO2 open open open open 100Otwist Pair Cable or PCB trace CLKOUT RA0 RA1 RA2 RA3 RA4 RA5 RA6 RB0 RB1 RB2 RB3 RB4 RB5 RB6 RC0 RC1 RC2 RC3 RC4 RC5 RC6 RD0 RD1 RD2 RD3 RD4 RD5 RD6 RE0 RE1 RE2 RE3 RE4 RE5 RE6 CLKOUT R4 R5 R6 R7 R8 R9 G4 G5 G6 G7 G8 G9 B4 B5 B6 B7 B8 B9 TC4 TC5 TC6 TD0 TD1 TD2 TD3 TD4 TD5 OPEN R0 R1 G0 G1 B0 B1 OPEN DVD, Digital TV Encoder, Camera etc. YDI0～7 PD PD OE DK R/F Reset IC RESETB I2CDEV TEST0,1,2 PCB(Transmitter) *1: Recommended Parts: F.Bead: BLM18A-Series (Murata Manufacturing) *2: If LVDS_RS is tied to “1”, LVDS swing is 350m V. If LVDS_RS is tied to “0”, LVDS swing is 200m V. PCB(Receiver) Fig.12 BU1523KV System connection Diagram The above figure is an example of system connection for reference only and not intended to guarantee operation. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 17/22 2011.02 - Rev.A BU1523KV ●Procedure for turning on power supply Technical Note Follow the power-on sequence of VDD→(VDDIO, I2CVDD, PVDD, LVDD) as depicted in Fig.13. The timing for power-on sequence is shown in Table 10 however, it is recommended to make the intervals of tPWUV2, tPWUV and tPWUVL as short as possible. Until after voltage is applied to all the power sources, the levels of all the input pins are fixed and the low level is input onto RESETB, the internal status and pins remain unstable. Remove the reset after inputting the clock (RGBCKI, YCKI). When the clock (RGBCKI, YCKI) is to be temporarily halted during the operation, apply the reset after the clock (RGBCKI, YCKI) stopped to fix the operation, then follow the power-on sequence and remove the reset after inputting the clock (RGBCKI, YCKI). 2-line serial interface is enabled for communication after the reset (RESETB) is removed. However, racing may be caused if the rising edge of the reset (RESETB) signal and the signal change of 2-line serial interface occur at the same time. Ensure not to allow the rising edge of the reset (RESETB) signal and the signal change of 2-line serial interface to occur at the same time. Design the system to avoid racing and system malfunction when the internal status and pins are unstable. * The reset is also possible by the software reset (SRST_R_IP, SRST_Y_IP, SRST_LVDS). Min Level Voltage VDD Min Level Voltage I2CVDD tPWUV2 Min Level Voltage VDDIO tPWUV Min Level Voltage PVDD LVDD ※Use PVDD and LVDD together. tPWUVL Clock Input Clock Stop Clock Input RGBCKI YCKI Reset after the clock stops. RESETB LPDNB I2CVDD All input terminals of group VDDIO All input terminals of group tUNCV Regulations from start of I2CVDD tCR Release reset after inputting the clock. tCR Release reset after inputting the clock. tUNCV2 Regulations from start of I2CVDD tRR Reset State tRR Reset State The state of the terminal is invalid. Fig.13 Power supply input procedure (Min level is power-supply voltage lower bound of recommended range.) [Table 10 Recommended value at time to turn on power supply] Item tPWUV2 tPWUV tPWUVL tUNCV2 tUNCV tRR tCR Min. 0 0 0 0 0 1 0.1 Max. 50 50 50 1 1 Unit ms ms ms ms ms ms ms www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 18/22 2011.02 - Rev.A BU1523KV Technical Note The power-off sequence is reverse of the power-on sequence, in the order of (VDDIO, I2CVDD, PVDD, LVDD)→VDD as depicted in Fig.14. The timing for power-off sequence is shown in Table 11, however, it is recommended to make the intervals of tPWDV2m, tPWDV and tPWDVL as short as possible. Note that turning off from the VDD (Power to the internal CORE) makes the internal status and pin status unstable. Min Level Voltage VDD Min Level Voltage I2CVDD tPWDV Min Level Voltage VDDIO tPWD Min Level Voltage PVDD LVDD ※Use PVDD and LVDD together. tPWDV Operation State Operation Stop Fig.14 Power-off procedure (Min level is power-supply voltage lower bound of recommended range of motion.) [Table 11 Power-off time recommended value] Item tPWDV2 tPWDV tPWDVL Min. 0 0 0 Max. 50 50 50 Unit ms ms ms www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 19/22 2011.02 - Rev.A BU1523KV Technical Note ●PCB Design Guideline for LVDS ・Interconnecting media between Transmitter and Receiver ( i.e.PCB trace, connector, and cable) should be well balanced. (Keep all these differential impedance and the length of media as same as possible.). ・Locate by –pass capacitors adjacent to the device pins as close as possible. ・Minimize the distance between traces of a pair. (S1) to maximize common mode rejection. See following figure. ・Place adjacent LVDS trace pair at least twice (>2 x S1) as far away. ・Avoid 90 degree bends. ・Minimize the number of VIA on LVDS traces. ・Match impedance of PCB trace, connector, media (cable) and termination to minimize reflections (emissions) for cabled applications (typically 100Ω Differential mode characteristic impedance). GND +Signal S1 -Signal >2 x S1 GND + Driver Driver + Driver Driver 100Ω + Receiver 100Ω + Receiver + +Receiver - - Receiver + Receiver + - Receiver Point-to-point configuration Multi-drop configuration Good No Good Monitor Pad Stub Layer1 Signal Via Layer2 GND GND GND Via Fig.15 PCB Design Guideline for LVDS www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 20/22 2011.02 - Rev.A BU1523KV Technical Note ●Notes for use (1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Recommended Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. (11) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (12) Rush current For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of wiring. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 21/22 2011.02 - Rev.A BU1523KV ●Ordering part number Technical Note B U 1 Part No. 5 2 3 K V - E 2 Part No. Package KV:VQFP100 Packaging and forming specification E2: Embossed tape and reel VQFP100 16.0±0.2 14.0±0.1 75 76 51 50 Tape Quantity Direction of feed 0.5±0.15 1.0±0.2 1.0 Embossed carrier tape (with dry pack) 500pcs E2 direction the at left when you ( The on the leftishand1pin of product is thethe upperthe right hand hold ) reel and you pull out tape on 16.0±0.2 14.0±0.1 100 1 25 26 1.0 1.6MAX 1PIN MARK +6° 4°−4° 0.08 S +0.05 0.2 -0.04 0.5±0.1 0.08 M +0.05 0.145 -0.03 1.4±0.05 0.1±0.05 1pin (Unit : mm) Reel Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 22/22 2011.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. R1120A