Datasheet
10 channel in QFN Small Package
10 bit D/A Converters
BU22210MUV
General Description
Key Specifications
BU22210MUV includes 10 channels D/A converters
which is high performance 10bit R-2R-type. It is most
suitable for applications which have many adjustment
items, because it is small size and has many D/A
converter channels.
Input is serial data transfer system with the DI, CLK and
CSB terminal, and output is DO terminal enabling a
cascade connection.
A built-in Initial-Zero-Hold function ensures that the
output voltage of all channels are Low during power up,
so that it is able to reduce parts for measure against
malfunction. And wide supply voltage range from 2.7V 5.5V has flexibility to specification change.
Operating Supply Voltage Range:
2.7V to 5.5V
Current Consumption:
1.2mA(Typ)
Differential Non Linearity Error:
±0.5LSB
Integral Non Linearity Error:
±2.0LSB
Output Current Capability:
±1.0mA
Data Transfer Frequency:
10MHz(Max)
Operating Temperature Range:
-20°C to +85°C
Package
VQFN016V3030
W(Typ) x D(Typ) x H(Max)
3.00mm x 3.00mm x 1.00mm
Features
Built-in 10-channel 10bit D/A converters.
Built-in Rail-to-rail output buffer.
3-wire serial interface (16 bit data).
Cascade Connection is available.
Built-in Initial-Zero-Hold function.
QFN Small package (0.5mm pitch).
Applications
The various types of consumer (ex. Printer, DSC and
more).
Typical Application Circuit
Examples of the application circuit diagram
DAC
CLK
3-wire serial
interface
DI
CSB
DAC
I/F
.
DAC
DO
DAC
DAC
Logic
DAC
POR
DAC
DAC
VCC
.
DAC
0.1μF
GND
〇Product structure : Silicon monolithic integrated circuit
.www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 14 • 001
DAC
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
〇This product has no designed protection against radioactive rays
1/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications........................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 5
Electrical Characteristics................................................................................................................................................................. 5
Typical Performance Curves ........................................................................................................................................................... 6
Figure 1. Supply Current vs Supply Voltage ................................................................................................................................ 6
Figure 2. Supply Current vs Temperature.................................................................................................................................... 6
Figure 3. Supply Current vs Supply Voltage ................................................................................................................................ 6
Figure 4. Supply Current vs Temperature.................................................................................................................................... 6
Figure 5. DNL vs Digital Input Code ............................................................................................................................................ 7
Figure 6. INL vs Digital Input Code .............................................................................................................................................. 7
Figure 7. Max absolute value of DNL vs Supply Voltage ............................................................................................................. 7
Figure 8. Max absolute value of INL vs Supply Voltage .............................................................................................................. 7
Figure 9. Max absolute value of DNL vs Temperature ................................................................................................................. 8
Figure 10. Max absolute value of INL vs Temperature ................................................................................................................ 8
Timing Chart ................................................................................................................................................................................... 9
Communication Format................................................................................................................................................................. 10
Register Map ................................................................................................................................................................................ 10
Cascade Connection .................................................................................................................................................................... 12
Power supply power-up sequence ................................................................................................................................................ 13
I/O Equivalent Circuits .................................................................................................................................................................. 14
Operational Notes ......................................................................................................................................................................... 15
Ordering Information ..................................................................................................................................................................... 17
Marking Diagrams ......................................................................................................................................................................... 17
Physical Dimension, Tape and Reel Information ........................................................................................................................... 18
Revision History ............................................................................................................................................................................ 19
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
2/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Pin Configuration
9
10
11
12
TOP VIEW
(Pads not visible)
15
6
16
5
4
7
3
14
2
8
1
13
Pin Descriptions
Pin No.
Pin Name
1
AO10
Analog output ch10
Function
2
GND
Ground
3
VCC
Power Supply
4
AO1
Analog output ch1
5
AO2
Analog output ch2
6
AO3
Analog output ch3
7
AO4
Analog output ch4
8
AO5
Analog output ch5
9
DO
Serial output (DO outputs DI signal with 16 clock cycle delay)
10
CLK
Serial clock input
11
DI
Serial data input
12
CSB
Chip select input
13
AO6
Analog output ch6
14
AO7
Analog output ch7
15
AO8
Analog output ch8
16
AO9
Analog output ch9
(Note 1)
(Note 1) Please implement the bypass condenser near ICs.
Block Diagram
CLK
DI
CSB
I/F
.
DO
DAC
AO1
DAC
AO2
DAC
AO3
DAC
AO4
DAC
AO5
DAC
AO6
DAC
AO7
DAC
AO8
DAC
AO9
DAC
AO10
Logic
POR
VCC
.
GND
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
V
Terminal Voltage
VIN
Tstg
+7
-0.3 to +(VCC +0.3) or +7
Whichever is less
-40 to +125
°C
Tjmax
125
°C
Storage Temperature Range
Maximum Junction Temperature
V
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the
maximum junction temperature rating.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
1s
(Note 4)
(Note 5)
2s2p
Unit
VQFN016V3030
Junction to Ambient
Junction to Top Characterization Parameter
(Note 3)
θJA
189.0
57.5
°C/W
ΨJT
23
10
°C/W
(Note 2)Based on JESD51-2A(Still-Air).
(Note 3)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Single
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
(Note 5)Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
4 Layers
(Note 6)
Material
Board Size
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Thermal Via
Pitch
Diameter
1.20mm
Φ0.30mm
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
(Note 6) This thermal via connects with the copper pattern of all layers.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
4/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Recommended Operating Conditions
Parameter
Power Source Voltage
Terminal Input Voltage Range
Analog Output Current
(Note 7)
(Note 8)
Serial Clock Frequency
(Note 9)
(Note 8)
Symbol
Min
Typ
Max
Unit
VCC
2.7
-
5.5
V
VIN
0
-
VCC
V
IOUT
-1.0
-
+1.0
mA
fCLK
-
1.0
10.0
MHz
Load Capacitance Limit
CL
-
-
1500
pF
Operating Temperature
Topr
-20
+25
+85
°C
(Note 7) CLK, DI, CSB.
(Note 8) AO1, AO2, AO3, AO4, AO5, AO6, AO7, AO8, AO9, AO10.
(Note 9) CLK.
Electrical Characteristics (Unless otherwise specified VCC=3.0V Ta=25°C)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Current Consumption
ICC
-
1.2
2.5
mA
Logic input : GND or VCC
Power Down Current
IPD
-
2
10
µA
Power Down mode
GND
-
0.6
V
VCC=2.7V to 3.6V
GND
-
0.8
V
VCC=4.5V to 5.5V
2.1
-
VCC
V
VCC=2.7V to 3.6V
2.4
-
VCC
V
VCC=4.5V to 5.5V
-10
-
+10
µA
L input Voltage
VIL
H input Voltage
VIH
Input Current
IIN
Low output Voltage
VOL
GND
-
0.2*VCC
V
ISINK=1mA
High output Voltage
VOH
0.8*VCC
-
VCC
V
ISOURCE=1mA
Output Load Current
IOL
-1.0
-
+1.0
mA
VZS1
GND
-
0.1
V
000h setting, no load
VZS2
GND
-
0.3
V
000h setting, ISINK=1.0mA
VFS1
VCC-0.1
-
VCC
V
3FFh setting, no load
VFS2
VCC-0.3
-
VCC
V
3FFh setting, ISOURCE =1.0mA
Differential Non Linearity Error
DNL
-0.5
-
+0.5
LSB
Input code 008h to 3F7h
Integral Non Linearity Error
INL
-2.0
-
+2.0
LSB
Input code 008h to 3F7h
Output Zero Scale Voltage
Output Full Scale Voltage
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
5/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Typical Performance Curves
3
Supply Current : ICC [mA]
Supply Current : ICC [mA]
3
2
1
0
1
0
2
3
4
5
Supply Voltage : VCC [V]
6
-40
Figure 1. Supply Current vs Supply Voltage
(“Active Current Consumption”, Ta=25℃,Code=200h)
-20
0
20
40
60
Temperature : Ta [℃]
80
100
Figure 2. Supply Current vs Temperature
(“Active Current Consumption”, VCC=3.0V, Code=200h)
6
6
5
5
Supply Current : ISD [μA]
Supply Current : ISD [μA]
2
4
3
2
1
4
3
2
1
0
0
2
3
4
5
Supply Current : ISD [μA]
6
-40
Figure 3. Supply Current vs Supply Voltage
(“Power-down Current”, Ta=25℃)
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
-20
0
20
40
60
Temperature : Ta [℃]
80
100
Figure 4. Supply Current vs Temperature
(“Power-down Current”, VCC=3.0V)
6/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
- continued
0.5
2.0
0.4
Integral Nonlinearity Error : INL [LSB]
Differential Nonlinearity Error : DNL [LSB]
Typical Performance Curves
0.3
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-0.5
0
128
256 384
512
640
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
768 896 1024
0
256 384
512
640
768 896 1024
Digital Input Code [Dec]
Figure 5. DNL vs Digital Input Code
(“Differential Nonlinearity Error”, VCC=3.0V,Ta=25℃)
Figure 6. INL vs Digital Input Code
(“Integral Nonlinearity Error ”, VCC=3.0V,Ta=25℃)
0.5
2.0
Max absolute value of INL [LSB]
Max absolute value of DNL [LSB]
Digital Input Code [Dec]
128
0.4
0.3
0.2
0.1
0.0
1.5
1.0
0.5
0.0
2
3
4
5
Supply Voltage : VCC [V]
6
2
Figure 7. Max absolute value of DNL vs Supply Voltage
(“Differential Nonlinearity Error”, Ta=25℃)
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
3
4
5
Supply Voltage : VCC [V]
6
Figure 8. Max absolute value of INL vs Supply Voltage
(“Integral Nonlinearity Error”, Ta=25℃)
7/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Typical Performance Curves
- continued
2.0
Max absolute value of INL [LSB]
Max absolute value of DNL [LSB]
0.5
0.4
0.3
0.2
0.1
0.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Temperature : Ta [℃]
80
100
-40
Figure 9. Max absolute value of DNL vs Temperature
(“Differential Nonlinearity Error”, VCC=3.0V)
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
-20
0
20
40
60
Temperature : Ta [℃]
80
100
Figure 10. Max absolute value of INL vs Temperature
(“Integral Nonlinearity Error”, VCC=3.0V)
8/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Timing Chart
(Unless otherwise specified VCC=3.0V, RL=OPEN, CL=0pF, Ta=25°C)
Parameter
Symbol
tCLK_L
tCLK_H
tS_DI
tH_DI
tS_CSB
tH_CSB
tCSB_H
CLK L Level Period
CLK H Level Period
DI Setup Time
DI Hold Time
CSB Setup Time
CSB Hold Time
CSB H Level Period
Limit
Typ
-
Min
50
50
20
40
50
50
50
Unit
Max
-
ns
ns
ns
ns
ns
ns
ns
VIH
CSB
Conditions
VIH
VIL
VIH
VIL
tCSB_H
tH_CSB
tH_CSB
CLK
tCLK_H
tS_CSB
VIH
VIL
tS_DI
DI
VIH
VIL
VIL
tCLK_L
tH_CSB
tS_CSB
tH_CSB
VIH
VIL
VIL
VIL
VIL
VIL
tH_DI
VIH
VIH
VIL
VIL
Figure 11. Timing chart
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
9/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Communication Format
The Serial Control Interface is 3-wire serial interface 1) CSB, 2) CLK and 3) DI.
Every command is composed of 16 bits data sent through DI line (MSB first).
DI data is read every rising edge of the CLK while CSB is LOW.
Last 16 bits of data are latched when CSB goes HIGH.
The DO outputs the data of the most significant bit at a falling edge of CLK after 16 clocks delay.
CSB
1
2
3
4
MSB
A3
A2
A1
A0
5
6
7
8
9
10
11
12
13
14
15
16
D9
D8
D7
D6
D5
D4
D3
D2
D1
LSB
D0
CLK
DI
D11 D10
DO
A3
Figure 12. Communication Format
Register Map (Note 10)
Register
Address
Register Name
R/W
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0x1
CH1 D/A
W
CH1 D/A DATA[9:0]
0
0
0x2
CH2 D/A
W
CH2 D/A DATA[9:0]
0
0
0x3
CH3 D/A
W
CH3 D/A DATA[9:0]
0
0
0x4
CH4 D/A
W
CH4 D/A DATA[9:0]
0
0
0x5
CH5 D/A
W
CH5 D/A DATA[9:0]
0
0
0x6
CH6 D/A
W
CH6 D/A DATA[9:0]
0
0
0x7
CH7 D/A
W
CH7 D/A DATA[9:0]
0
0
0x8
CH8 D/A
W
CH8 D/A DATA[9:0]
0
0
0x9
CH9 D/A
W
CH9 D/A DATA[9:0]
0
0
0xA
CH10 D/A
W
CH10 D/A DATA[9:0]
0
0
0xB
PD ENABLE
W
0
0
POWER DOWN ENABLE[9:0]
(Note 10) Do not write any commands to other addresses except above. Do not write ‘1’ to the fields in which value is ‘0’ in above table.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
10/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
( 0x1 to 0xA ) CHx D/A
Fields
Function
CH1 D/A DATA [9:0]
D/A Code Setting of AO1
CH2 D/A DATA [9:0]
D/A Code Setting of AO2
CH3 D/A DATA [9:0]
D/A Code Setting of AO3
CH4 D/A DATA [9:0]
D/A Code Setting of AO4
CH5 D/A DATA [9:0]
D/A Code Setting of AO5
CH6 D/A DATA [9:0]
D/A Code Setting of AO6
CH7 D/A DATA [9:0]
D/A Code Setting of AO7
CH8 D/A DATA [9:0]
D/A Code Setting of AO8
CH9 D/A DATA [9:0]
D/A Code Setting of AO9
CH10 D/A DATA [9:0]
D/A Code Setting of AO10
D/A Code Setting of each channel
0x000 : Vcc / 1024 x 0
0x001 : Vcc / 1024 x 1
:
0x3FE : Vcc / 1024 x 1022
0x3FF : Vcc / 1024 x 1023
default value 0x000
( 0xB ) PD ENABLE
Fields
POWER DOWN ENABLE [9:0]
Function
Turn a selected channel off.
[0]:CH1, [1]:CH2, [2]:CH3, [3]:CH4, [4]:CH5,
[5]:CH6, [6]:CH7, [7]:CH8, [8]:CH9, [9]:CH10
0 : Active
1 : Power Down
default value 0x000
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
11/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Cascade Connection
This IC can control multiple BU22210MUVs with one serial interface line by connecting a DO pin to the data input pin (DI) of
the next IC. The example of three BU22210MUVs cascade connection is shown in Figure 13, and the communication
format in Figure 14.
CLK and CSB are commonly connected to all ICs. And about data line, connect the DO of #1 to the DI of #2, and connect
the DO of #2 to the DI of #3.
Regarding command, make CSB Low, and send 16bit x 3 data from the data for #3, then make CSB High.
CLK
MCU
DI
CLK
DO
DI
CSB
BU22210MUV(#1)
CLK
DO
DI
CSB
DO
CSB
BU22210MUV(#2)
BU22210MUV(#3)
Figure 13. Example configuration of three BU22210MUVs cascade connection
BU22210MUV(#1)
The data retrieved by #1
CSB
1
16 17
32 33
48
CLK
DI
Dn[47]~Dn[32]
Dn[31]~Dn[16]
Dn[15]~Dn[0]
DO
Dn-1[15]~Dn-1[0]
Dn[47]~Dn[32]
Dn[31]~Dn[16]
Dn[15]
BU22210MUV(#2)
The data retrieved by #2
CSB
1
16 17
32 33
48
CLK
DI
Dn-1[15]~Dn-1[0]
Dn[47]~Dn[32]
Dn[31]~Dn[16]
DO
Dn-1[31]~Dn-1[16]
Dn-1[15]~Dn-1[0]
Dn[47]~Dn[32]
Dn[31]
BU22210MUV(#3)
The data retrieved by #3
CSB
1
16 17
32 33
48
CLK
DI
Dn-1[31]~Dn-1[16]
Dn-1[15]~Dn-1[0]
Dn[47]~Dn[32]
DO
Dn-1[47]~Dn-1[32]
Dn-1[31]~Dn-1[16]
Dn-1[15]~Dn-1[0]
Dn[47]
Figure 14. Communication Format of three BU22210MUVs cascade connection
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
12/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Power supply power-up sequence (Unless otherwise specified
VCC=3.0V, Ta=25°C)
tPSL
VCC
VCC(Min)
0.4V
VCC(Min)
VCC(Min)
Undefined Behavior
0.4V
0.4V
tPSC
Command Acceptable
tPSC
Undefined Behavior
Parameter
Symbol
Min
Typ
Max
Unit
Command input wait time after power-up
tPSC
100
-
-
µs
Power-off time
tPSL
1
-
-
ms
Command Acceptable
Conditions
Command input is available “tPSC“ after VCC is supplied.
When VCC is below a recommended operating voltage range, the IC becomes undefined behavior state. In such case,
power off, and power up again.
VCC voltage should keep being less than 0.4V for more than tPSL, before supplying power to VCC.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
13/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
I/O Equivalent Circuits
Pin Name
Equivalent Circuit Diagram
CLK
DI
CSB
AO1
AO2
AO3
AO4
AO5
AO6
AO7
AO8
AO9
AO10
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
VCC
VCC
Pin Name
DO
Equivalent Circuit Diagram
VCC VCC
VCC VCC
14/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
8.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
15/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Operational Notes – continued
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
11. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input pins have voltages within the values specified in the electrical characteristics of this IC.
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
16/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Ordering Information
B
U
2
2
2
1
Part Number
0
M
U
V
-
Package
MUV: VQFN016V3030
E2
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
VQFN016V3030(TOP VIEW)
U
2
2
2
1
0
Part Number Marking
LOT Number
1PIN MARK
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
17/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Physical Dimension, Tape and Reel Information
Package Name
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
VQFN016V3030
18/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
BU22210MUV
Revision History
Date
Revision
31.Mar.2017
001
Changes
New Release
www.rohm.com
© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
19/19
TSZ02201-0M2M0GZ16110-1-2
31.Mar.2017 Rev.001
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
工商网监
湘ICP备2023018690号
