BU24033GW

1/3 ◇Structure ◇Product Series ◇Type Silicon monolithic integrated circuit Lens control LSI BU24033GW ◇Applications ◇Functions Digital still cameras ・Built-in 6 channels Driver block : 1-5ch Voltage control type H-bridge(Adaptable to STM 2systems) : 6ch Current control type H-Bridge ・Built-in 2 channels PI driving circuit ・Built-in 3 channels Waveforming circuit ・Built-in FLL digital servo circuit ・Built-in PLL circuit ◇Absolute maximum ratings (Ta  25C) Parameter Symbol DVDDIO DVDD Power supply voltage MVCC Input voltage VIN Limits -0.3～4.5 -0.3～7.0 Unit V V V mA mA mA C C mW Remark MVCC12,MVCC34, MVCC5,VDDAMP MVCC12,MVCC34,RNF6 MVCC5 by PIOUT pin -0.3～supply voltage+0.3 ±500 Input/output current *1 IIN ±600 ＋50 Storage temperature range TSTG -55～125 Operating temperature range TOPE -20～85 Permissible dissipation 2 PD 1000 This product is not designed for anti-radiation applications. *1 Must not exceed PD. *2 To use at a temperature higher than Ta=25 C, derate 10mW per 1 C (At mounting 50mm x 58mm x 1.75mm glass epoxy board. ) ◇Operating conditions (Ta  25C) Parameter Symbol I/O power supply voltage DVDDIO DVDD Digital power supply voltage Driver power supply voltage clock operating frequency MVCC FCLK Limits 1.62～3.6 2.7～3.6 2.7～5.5 1～28 Unit Ｖ Ｖ V MHz Remark ＤVDD≦MVCC MVCC12,MVCC34, MVCC5,VDDAMP Reference clock REV. A 2/3 ◇Block Diagram REV. A 3/3 ◇Pin functions Land Matrix No. E6 D6 F6 A6 E2 F4 F3 F2 D2 B5 B4 G1 E7 G7 B3 B2 D7 F7 F5 C2 A2 A4 A1 B1 A3 A5 G5 F1 G6 G4 G3 G2 D1 C1 E1 C6 A7,B6 C7 B7 Pin name DVDD DVDDIO DVSS FCLK CSB SCLK SDATA SOUT IN6 / IN5A STATE1 STATE2 TEST PIOUT1 PIOUT2 SI1 SO1 SI2 SO2 SI3 / IN5B SO3 MVCC12 MGND126 OUT1A OUT1B OUT2A OUT2B MVCC34 MGND345 OUT3A OUT3B OUT4A OUT4B MVCC5 OUT5A OUT5B VDDAMP RNF6 OUT6A OUT6B Power supply DVDDIO DVDDIO DVDDIO DVDDIO DVDDIO DVDDIO DVDDIO DVDDIO DVDDIO DVDD DVDD DVDD DVDD DVDD DVDD DVDD DVDD MVCC12 MVCC12 MVCC12 MVCC12 MVCC34 MVCC34 MVCC34 MVCC34 MVCC5 MVCC5 RNF6 RNF6 Function Digital power supply I/O power supply ground FCLK logic input CSB logic input SCLK logic input SDATA logic input SOUT logic output IN6 / IN5A logic input STATE1 logic input/output STATE2 logic input/output TEST logic output PI driving output 1 PI driving output 2 Waveforming input1 Waveforming output1 Waveforming input2 Waveforming output2 Waveforming input3 / IN5B logic input Waveforming output3 1ch, 2ch Driver power supply 1ch, 2ch, 6ch Driver ground 1ch Driver A output 1ch Driver B output 2ch Driver A output 2ch Driver B output 3ch, 4ch Driver power supply 3ch, 4ch, 5ch Driver ground 3ch Driver A output 3ch Driver B output 4ch Driver A output 4ch Driver B output 5ch Driver power supply 5ch Driver A output 5ch Driver B output 6ch Power supply of current driver control 6ch Driver power supply 6ch Driver A output 6ch Driver B output ◇Outline dimensions/Marking figure Ｕ24033 Lot No. UCSP75M3 ◇Pin assignment diagram (bottom view) G TEST OUT4B OUT4A OUT3B MVCC34 OUT3A PIOUT2 F MGND345 SOUT SDATA SCLK SI3/IN5B DVSS SO2 E OUT5B CSB DVDD PIOUT1 D MVCC5 IN6/IN5A DVDDIO SI2 C OUT5A SO3 VDDAMP OUT6A B OUT1B SO1 SI1 STATE2 STATE1 RNF6 OUT6B A OUT1A MVCC12 OUT2A MGND126 OUT2B FCLK RNF6 ◇Cautions on use 1 2 3 4 5 6 7 (1)Absolute maximum ratings If applied voltage, operating temperature range, or other absolute maximum ratings are exceeded, the LSI may be damaged. Do not apply voltages or temperatures that exceed the absolute maximum ratings. If you expect that any voltage or temperature could be exceeding the absolute maximum ratings, take physical safety measures such as fuses to prevent any conditions exceeding the absolute maximum ratings from being applied to the LSI. (2)GND potential Maintain the GND pin at the minimum voltage even under any operating conditions. Actually check to be sure that none of the pins have voltage lower than that of GND pin, including transient phenomena. (3)Thermal design With consideration given to the permissible dissipation under actual use conditions, perform thermal design so that adequate margins will be provided. (4)Short circuit between pins and malfunctions To mount the LSI on a board, pay utmost attention to the orientation and displacement of the LSI. Faulty mounting to apply a voltage to the LSI may cause damage to the LSI. Furthermore, the LSI may also be damaged if any foreign matters enter between pins, between pin and power supply, or between pin and GND of the LSI. (5)Operation in strong magnetic field Make a thorough evaluation on use of the LSI in a strong magnetic field. Not doing so may malfunction the LSI. REV. A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. 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