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BU4216

BU4216

  • 厂商:

    ROHM(罗姆)

  • 封装:

  • 描述:

    BU4216 - Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series - Rohm

  • 数据手册
  • 价格&库存
BU4216 数据手册
Voltage Detector IC Series Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series No.09006ECT02 ●Description ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. ●Features 1) Detection voltage from 0.9V to 4.8V in 0.1V increments 2) Highly accurate detection voltage: ±1.0% 3) Ultra-low current consumption 4) Nch open drain output (BU42□□G/F/FVE)and CMOS output (BU43□□G/F/FVE) 5) Small surface package SSOP5: BU42□□G,BU43□□G SOP4: BU42□□F,BU43□□F VSOF5: BU42□□FVE,BU43□□FVE ●Applications All electronics devices that use microcontrollers and logic circuits. ●Selection Guide No. Specifications Output Circuit Format Detection Voltage Package Description 2:Open Drain Output, 3:CMOS Output Example VDET: Represented as 0.1V steps in the range from 0.9V to 4.8V (Displayed as 0.9 in the case of 0.9V) G:SSOP5(SMP5C2)/ F :SOP4/ FVE:VSOF5(EMP5) Part Number : BU4 1 2 3 ① ② ③ ● Lineup Making ZR ZQ ZP ZN ZM ZL ZK ZJ ZH ZG ZF ZE ZD ZC ZB ZA YZ YY YX YW Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4248 BU4247 BU4246 BU4245 BU4244 BU4243 BU4242 BU4241 BU4240 BU4239 BU4238 BU4237 BU4236 BU4235 BU4234 BU4233 BU4232 BU4231 BU4230 BU4229 Making YV YU YT YS YR YQ YP YN YM YL YK YJ YH YG YF YE YD YC YB YA Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V Part Number BU4228 BU4227 BU4226 BU4225 BU4224 BU4223 BU4222 BU4221 BU4220 BU4219 BU4218 BU4217 BU4216 BU4215 BU4214 BU4213 BU4212 BU4211 BU4210 BU4209 Making 1H 1G 1F 1E 1D 1C 1B 1A 0Z 0Y 0X 0W 0V 0U 0T 0S 0R 0Q 0P 0N Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4348 BU4347 BU4346 BU4345 BU4344 BU4343 BU4342 BU4341 BU4340 BU4339 BU4338 BU4337 BU4336 BU4335 BU4334 BU4333 BU4332 BU4331 BU4330 BU4329 Making 0M 0L 0K 0J 0H 0G 0F 0E 0D 0C 0B 0A ZZ ZY ZX ZW ZV ZU ZT ZS Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V Part Number BU4328 BU4327 BU4326 BU4325 BU4324 BU4323 BU4322 BU4321 BU4320 BU4319 BU4318 BU4317 BU4316 BU4315 BU4314 BU4313 BU4312 BU4311 BU4310 BU4309 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series ●Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*4 SSOP5 Power *2*4 SOP4 Dissipation *3*4 VSOF5 Operating Temperature Ambient Storage Temperature *1 *2 *3 *4 Technical Note Symbol VDD-GND VOUT Pd Topr Tstg Limits -0.3 ~ +7 GND-0.3 ~ +7 GND-0.3 ~ VDD+0.3 540 400 210 -40 ~ +125 -55 ~ +125 Unit V V mW °C °C When used at temperatures higher than Ta=25°C, the power is reduced by 5.4mW per 1°C above 25°C. When used at temperatures higher than Ta=25°C, the power is reduced by 4.0mW per 1°C above 25°C. When used at temperatures higher than Ta=25°C, the power is reduced by 2.1mW per 1°C above 25°C. When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted. ●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Detection Voltage Symbol VDET Condition VDD=HL, Ta=25°C, RL=470kΩ VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V VDD=VDET-0.2V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VDET =0.9-1.3V VDET =1.4-2.1V VDET =2.2-2.7V VDD=VDET+2.0V VDET =2.8-3.3V VDET =3.4-4.2V VDET =4.3-4.8V VOL≤0.4V, Ta=25~125°C, RL=470kΩ VOL≤0.4V, Ta=-40~25°C, RL=470kΩ VDS=0.5V VDD=6.0V VDET=4.0-4.8V VDS=0.05V VDD=0.85V VDS=0.5V VDD=1.5V VDET=1.7-4.8V VDS=0.5V VDD=2.4V VDET=2.7-4.8V VDD=VDS=7V Ta=-40~85°C VDD=VDS=7V Ta=85~125°C VDS=0.5V VDD=4.8V VDET=0.9-3.9V VDS=0.5V VDD=6.0V VDET=4.0-4.8V VDD=VDET×1.1, VDET=0.9-2.5V Ta=25°C RL=470kΩ VDD=VDET×1.1, VDET=2.6-4.8V Ta=25°C RL=470kΩ VDD=VDET×1.1 VCT=0.5V Ta=25°C VCT=0.1V VDD=0.85V VCT=0.5V VDD=1.5V VDET=1.7-4.8V Min. Vdet(T) ×0.99 0.70 0.90 2.0 20 1.0 3.6 1.7 2.0 Vdd ×0.35 Vdd ×0.40 9 5 200 VDET≤1.0V VDET≥1.1V Vdet ×0.03 Vdet ×0.03 Limit Typ. Vdet(T) 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 4.0 100 3.3 6.5 0 0 3.4 4.0 Vdd ×0.45 Vdd ×0.50 10 40 400 ±30 Vdet ×0.05 Vdet ×0.05 Max. Vdet(T) ×1.01 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.1 1 Vdd ×0.55 Vdd ×0.60 11 Vdet ×0.08 Vdet ×0.07 Unit V Circuit Current when ON Idd1 µA Circuit Current when OFF Idd2 µA Operating Voltage Range ‘High’ Output Current (Pch) ‘Low’ Output Current (Nch) Leak Current when OFF ‘High’ Output Current (Pch) Vopl IOH Iol Ileak Ioh V mA µA mA µA mA CT pin Threshold Voltage Output Delay Resistance CT pin Output Current Detection Voltage Temperature coefficient Vcth Rct Ict V MΩ µA ppm/°C *1 Vdet/∆T Ta=-40°C ~125°C VDD=LHL Ta=-40~125°C RL=470kΩ Hysteresis Voltage ∆VDET V *1: Designed guarantee. (Outgoing inspection is not done all products.) VDET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series ●Block Diagrams BU42□□G/F/FVE VDD Technical Note BU43□□G/F/FVE VDD VOUT VOUT Vref Vref GND CT GND CT Fig.1 TOP VIEW TOP VIEW Fig.2 TOP VIEW SSOP5 PIN No. 1 2 3 4 5 Symbol VOUT VDD GND N.C. CT Function Reset output Power supply voltage GND Unconnected terminal Capacitor connection terminal for output delay time 4 VOUT PIN No. 1 2 3 Symbol GND VDD CT SOP4 Function GND Power supply voltage Capacitor connection terminal for output delay time Reset output PIN No. 1 2 3 4 5 Symbol VOUT SUB CT VDD GND VSOF5 Function Reset output Substrate* Capacitor connection terminal for output delay time Power supply voltage GND *Connect the substrate to VDD www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series ●Reference Data (Unless specified otherwise, Ta=25°C) 0.6 CIRCUIT CURRENT : IDD [μA] 0.5 0.4 0.3 0.2 0.1 0.0 0 1 2 3 4 5 6 7 VDD SUPPLY VOLTAGE :VDD [V] 5 【BU4216F】 4 3 2 1 0 0.0 VDD =1.2V 25 Technical Note "LOW" OUTPUT CURRENT : IOL [mA] "HIGH" OUTPUT CURRENT : IOH [mA] 【BU4318G】 20 15 VDD =4.8V 10 5 0 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE : VDS[V] VDD =6.0V 0.5 1.0 1.5 2.0 2.5 DRAIN-SOURCE VOLTAGE : VDS[V] Fig.3 Circuit Current Fig.4 “LOW” Output Current Fig.5 “High” Output Current 7  : OUTPUT VOLTAGE VOUT [V] 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 VDD SUPPLY VOLTAGE :VDD [V]  : OUTPUT VOLTAGE VOUT [V] 【BU4216F】 1.0 CT OUTPUT CURRENT : ICT [μA] 【BU4216F】 0.8 0.6 0.4 0.2 0.0 0.0 700 600 500 400 300 200 100 0 0 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE : VDD [V] 【BU4216F】 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE : VDD [V] Fig.6 I/O Characteristics Fig.7 Operating Limit Voltage Fig.8 Ct Terminal Current  : DETECTION VOLTAGE VDET[V] Low to high(VDET+ ΔVDET) 【BU4216F】 0.4 0.3 0.2 0.1 0.0 -40 CIRCUIT CURRENT WHEN OFF : IDD2 [μA] 2.0 CIRCUIT CURRENT WHEN ON : IDD1 [μA] 0.5 1.0 【BU4216F】 0.8 0.6 0.4 0.2 0.0 -40 1.5 High to low(VDET) 【BU4216F】 1.0 -40 0 40 80 120 0 40 80 120 0 40 80 120 TEMPERATURE : Ta[℃] TEMPERATURE : Ta[℃] TEMPERATURE : Ta[℃] Fig.9 Detecting Voltage Release Voltage 1.0 MINIMUM OPERATING VOLTAGE : V OPL[V] Fig.10 Circuit Current when ON Fig.11 Circuit Current when OFF 18 RESISTANCE OF CT : RCT [MΩ] 10000 【BU4216F】 DELAY TIME : TPLH [ms] 1000 100 10 1 0.1 0.01 0.001 0.0001 【BU4216F】 【BU4216F】 16 14 12 10 8 6 4 2 0 -40 0 40 0.5 0.0 -40 0 40 80 120 80 120 0.001 0.01 0.1 TEMPERATURE : Ta[℃] TEMPERATURE : Ta[℃] CAPACITANCE OF CT : CCT[μ F] Fig.12 Operating Limit Voltage Fig.13 Ct Terminal Circuit Resistance Fig.14 Delay Time (TPLH) and CT Terminal External Capacitance www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series Technical Note ●Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD TPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+∆VDET) TPLH=-1×CCT×RCT×ln CCT: RCT: VDD-VCTH VDD VCTH: CT pin Threshold Voltage(P.2 VCTH refer.) Natural Logarithm CT pin Externally Attached Capacitance CT pin Internal Impedance(P.2 RCT refer.) Ln: ●Reference Data of Falling Time (TPHL) Output Examples of Falling Time (TPHL) Output Part Number TPHL [µs] BU4245G 275.7 BU4345G 359.3 * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. ●Explanation of Operation For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the Vdd pins reaches the applicable threshold voltage, the Vout terminal voltage switches from either “High” to “Low” or from “Low” to “High”. BU42□□G/F/FVE and BU43□□G/F/FVE have delay time function which set TPLH (Output “Low””High”) using an external capacitor (CCT). Because the BU42□□G/F/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD R1 Vref VOUT R2 Q3 R3 GND CT Q1 RESET VDD R1 Vref R2 Q3 R3 GND CT Q1 VDD RESET VOUT Q2 Fig.15 (BU42□□ type internal block diagram) Fig.16 (BU43□□ type internal block diagram) ●Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). ① When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until TPHL. There fore it is VDET+ΔVDET possible that the reset signal is not outputted when the rise time of ⑤ VDET VDD is faster than TPHL. VDD VOPL ② When VDD is greater than VOPL but less than the reset release 0V voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. 1/2 VDD ③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT VCT switches from L to H (with a delay to the CT terminal). ④ If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, TPLH TPHL TPLH VOUT switches to L (with a delay of TPHL). TPHL VOUT ⑤ The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system ①② ③④ is designed such that the output does not flip-flop with power supply Fig.17 fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series ●Circuit Applications 1) Examples of a common power supply detection reset circuit Technical Note VDD1 RL Microcontroller VDD2 Application examples of BU42□□G/F/FVE series (Open Drain output type) and BU43□□G/F/FVE series (CMOS output type) are shown below. CASE1:The power supply of the microcontroller (Vdd2) differs from the power supply of the reset detection (Vdd1). Use the Open Drain Output Type (BU42□□G/FVE) attached a load resistance (RL) between the output and Vdd2. (As shown Fig.18) CASE2:The power supply of the microcontroller (Vdd1) is same as the power supply of the reset detection (Vdd1). Use CMOS output type (BU43□□G/FVE) or Open Drain Output Type (BU42□□G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.19) When a capacitance CL for noise filtering is connected to the Vout pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (Vout). BU42□□□ CIN CT CL RST (Capacitor for noise filtering) GND Fig.18 Open collector Output type VDD1 Microcontroller BU43□□□ CIN CT RST CL (Capacitor for noise filtering) GND Fig.19 CMOS Output type www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series Technical Note 2) Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 IDD R2 I1 VDD Through Current R1 CIN BU42□□ BU43□□ CL GND VOUT 0 Fig.20 VDET VDD A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. Consider the use of BU42□□ when the power supply input it with resistor dividers. VDD - IDD Peak Current Ta=25°C 10 BU43xx BU42xx BD52xx BD53xx IDD peak Current[mA] Temp - IDD(BU42xx) 2.5 2.0 1.5 1.0 0.5 0.0 3 4 5 6 7 VDD[V] 8 9 10 -50 -30 -10 10 30 50 Temp 70 90 110 130 VDD3V VDD6V VDD7V VDD4V 1 IDD-peak[mA] 0.1 0.01 0.001 Fig.21 Current Consumption vs. Power Supply Voltage * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series Technical Note ●Notes for use 1. Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7 . The VDD line inpedance might cause oscillation because of the detection current. 8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. Case of needless Delay time, recommended to insert more 470kΩ resister between VDD and CT. Recommended value of RL Resistar is over 50kΩ (VDET=1.5~4.8V),over 100kΩ (VDET=0.9~1.4V). 12. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by τ × RCT × CCT changes. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series Technical Note 13. Delay time (tPLH) tPLH = τ × RCT × CCT (sec) τ: time constant RCT : 10MΩ (typ.) (built-in resistor) CCT : capacitor connected CT pin. Recommended value of CCT capacitor is over 100pF. The reference value 6 (τ × RCT) ×10 VDET = 0.9 to 2.5V 6 6 6 Ta = 25°C (min. = 5.1 × 10 typ.= 6.0 × 10 max = 6.9 × 10 ) 6 6 6 Ta = -25 to 125°C (min. = 3.3 × 10 typ. = 6.0 × 10 max = 8.7 × 10 ) VDET = 2.6 to 4.8V 6 6 6 Ta = 25°C (min. = 5.9 × 10 typ.= 6.9 × 10 max = 7.9 × 10 ) 6 6 6 Ta = -25 to 125°C (min. = 3.8 × 10 typ.= 6.9 × 10 max = 10.0 × 10 ) 14. External parameters The recommended parameter range for CT is 100pF~0.1µF. For RL, the recommended range is 50kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 15. CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 16. Power on reset operation Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation. 17. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 18. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series ●Part Number Selection Technical Note B U 4 2 0 9 G - T R BU42: Adjustable Delay Time CMOS Reset IC Open Drain Type Output Type BU43: Adjustable Delay Time CMOS Reset IC CMOS Output Type Detection voltage 09 : 0.9V (0.1V step) 48 : 4.8V Package G: SSOP5 F: SOP4 FVE: VSOF5 Taping Specifications TR: Embossed tape and reel SSOP5 2.9±0.2 5 4 +6° 4° −4° Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold +0.2 1.6 −0.1 2.8±0.2 1 2 3 0.2Min. ( reel on the left hand and you pull out the tape on the right hand 1pin ) +0.05 0.13 −0.03 1.25Max. 1.1±0.05 0.05±0.05 +0.05 0.42 −0.04 0.95 0.1 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. SOP4 +0.2 1.25 –0.1 2.0±0.2 1.3 4 3 +6° 4° –4° Tape Quantity 0.27±0.15 Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold 2.1±0.2 Direction of feed ( reel on the left hand and you pull out the tape on the right hand 1pin ) 0.9±0.05 1 2 0.05 +0.05 0.13 –0.03 S 1.05Max. 0.05±0.05 +0.05 0.42 –0.04 0.1 +0.05 0.32 –0.04 S Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 10/11 2009.11 - Rev.C BU42□□G series, BU42□□F series, BU42□□FVE series, BU43□□G series, BU43□□F series, BU43□□FVE series Technical Note VSOF5 0.2MAX 1.6 ± 0.05 1.0 ± 0.05 5 4 Tape Quantity Direction of feed Embossed carrier tape 3000pcs TR The direction is the 1pin of product is at the upper right when you hold (MAX 1.28 include BURR) 1.6 ± 0.05 1.2 ± 0.05 ( reel on the left hand and you pull out the tape on the right hand 1pin ) 1 2 3 0.13 ± 0.05 0.6MAX 0.5 0.22 ± 0.05 Direction of feed (Unit : mm) Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 11/11 2009.11 - Rev.C Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A
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