Datasheet
Comparator
Input Full Swing Push-pull Output
High Speed CMOS Comparators
BU7251G
BU7251SG BU7252xxx
BU7252Sxxx
Key Specifications
Operating Supply Voltage
+1.8V to +5.5V
(Single Supply):
(Split Supply):
j
±0.9V to ±2.75V
Supply Current (VDD=3V, TA=25°C):
BU7251G, BU7251SG
15μA
35μA
BU7252xxx, BU7252Sxxx
Input Bias Current (TA=25°C):
1pA
Operating Temperature Range:
BU7251G, BU7252xxx
-40°C to 85°C
-40°C to 105°C
BU7251SG, BU7252Sxxx
General Description
BU7251G/BU7252xxx are input full swing and push pull
output comparators. BU7251SG/BU7252Sxxx have an
expanded operating temperature range. These features
low operating supply voltage of +1.8V to +5.5V(single
supply) with low supply current and extremely low input
bias current.
Features
Low Operating Supply Voltage
Low supply current
Input Full Swing
Push-pull Output
Wide Operating Temperature Range
Package
SSOP5
SOP8
MSOP8
W(Typ) xD(Typ) xH(Max)
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
2.90mm x 4.00mm x 0.90mm
Applications
Battery Monitor
Limit Comparator
Mobile Equipments
Current Detection Circuit
Consumer Electronics
Pin Configuration
BU7251G, BU7251SG: SSOP5
INVSS
5
1
2
VDD
+
IN+ 3
4
OUT
Pin No.
Pin Name
1
IN-
2
VSS
3
IN+
4
OUT
5
VDD
Pin No.
Pin Name
1
OUT1
2
IN1-
3
IN1+
4
VSS
5
IN2+
6
IN2-
7
OUT2
8
VDD
BU7252F, BU7252SF: SOP8
BU7252FVM, BU7252SFVM: MSOP8
OUT1 1
IN1- 2
IN1+ 3
8 VDD
CH1
- +
+
7 OUT2
CH2
+ -
VSS 4
6 IN25 IN2+
○Product structure：Silicon monolithic integrated circuit
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TSZ02201-0RFR0G200410-1-2
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Package
SSOP5
SOP8
MSOP8
BU7251G
BU7251SG
BU7252F
BU7252SF
BU7252FVM
BU7252SFVM
Ordering Information
B
U
7
2
5
x
Part Number
BU7251G
BU7251SG
BU7252xxx
BU7252Sxxx
x
x
-
Package
G
: SSOP5
F
: SOP8
FVM : MSOP8
x
x
Packaging and Forming Specification
TR: Embossed Tape and Reel
(SSOP5/MSOP8)
E2: Embossed tape and reel
(SOP8)
Line-up
Topr
Channels
1ch
-40°C to +85°C
SSOP5
2ch
1ch
-40°C to +105°C
Package
2ch
Orderable Part Number
Reel of 3000
BU7251G-TR
SOP8
Reel of 2500
BU7252F-E2
MSOP8
Reel of 3000
BU7252FVM-TR
SSOP5
Reel of 3000
BU7251SG-TR
SOP8
Reel of 2500
BU7252SF-E2
MSOP8
Reel of 3000
BU7252SFVM-TR
Absolute Maximum Ratings (TA=25°C)
Parameter
Supply Voltage
Symbol
BU7252xxx
VDD-VSS
SSOP5
Power Dissipation
Rating
BU7251G
PD
SOP8
MSOP8
BU7251SG
BU7252Sxxx
+7
0.54
(Note 1,4)
0.55 (Note 2,4)
-
(Note 3,4)
0.47
V
0.54
-
Unit
(Note 1,3)
-
-
0.55 (Note 2,4)
-
(Note 3,4)
0.47
W
Differential Input
Voltage (Note 5)
VID
VDD - VSS
V
Input Common-mode
Voltage Range
VICM
(VSS - 0.3) to (VDD + 0.3)
V
II
±10
mA
Vopr
+1.8 to +5.5
±0.9 to ±2.75
V
Input Current (Note 6)
Operating Supply
Voltage
Operating
Temperature
Storage Temperature
Maximum Junction
Temperature
Topr
-40 to +85
-40 to +105
°C
Tstg
-55 to +125
°C
TJmax
+125
°C
(Note 1)
(Note 2)
(Note 3)
(Note 4)
(Note 5)
To use at temperature above TA=25C reduce 5.4mW/C.
To use at temperature above TA=25C reduce 5.5mW/C.
To use at temperature above TA=25C reduce 4.7mW/C.
Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%).
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input pin voltage is set to more than VSS.
(Note 6) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case
the IC is operated over the absolute maximum ratings.
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Electrical Characteristics
○BU7251G, BU7251SG (Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C)
Limit
Symbol
Temperature
Range
Min
Typ
Max
Input Offset Voltage (Note 7)
VIO
25°C
-
1
Input Offset Current (Note 7)
IIO
25°C
-
Input Bias Current (Note 7)
IB
25°C
Supply Current (Note 8)
IDD
Maximum Output Voltage (High)
Parameter
Unit
Condition
11
mV
-
1
-
pA
-
-
1
-
pA
-
25°C
-
15
35
Full Range
-
-
50
VOH
25°C
VDD-0.1
-
Maximum Output Voltage (Low)
VOL
25°C
-
Large Single Voltage Gain
AV
25°C
Input Common-mode Voltage
Range
VICM
Common-mode Rejection Ratio
μA
RL=∞
-
V
RL=10kΩ to VDD/2
-
VSS+0.1
V
RL=10kΩ to VDD/2
-
90
-
dB
RL=10kΩ to VDD/2
25°C
0
-
3
V
VSS to VDD
CMRR
25°C
-
80
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
-
80
-
dB
-
Output Source Current (Note 9)
ISOURCE
25°C
1
2
-
mA
OUT=VDD-0.4V
ISINK
25°C
3
6
-
mA
OUT=VSS+0.4V
Output Rise Time
tR
25°C
-
50
-
ns
CL=15pF
100mV Overdrive
Output Fall Time
tF
25°C
-
20
-
ns
CL=15pF
100mV Overdrive
Rising Propagation Delay
tPLH
25°C
-
0.55
-
μs
CL=15pF
100mV Overdrive
Falling Propagation Delay
tPHL
25°C
-
0.25
-
mV
CL=15pF
100mV Overdrive
Output Sink Current (Note 9)
(Note 7) Absolute value.
(Note 8) Full range: BU7251G: TA=-40°C to +85°C BU7251SG: TA=-40°C to +105°C.
(Note 9) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
:
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Electrical Characteristics - continued
○BU7252xxx, BU7252Sxxx (Unless otherwise specified VDD=+3V, VSS=0V, TA=25°C)
Limit
Symbol
Temperature
Range
Min
Typ
Max
Input Offset Voltage (Note 10)
VIO
25°C
-
1
Input Offset Current (Note 10)
IIO
25°C
-
Input Bias Current (Note 10)
IB
25°C
Supply Current (Note 11)
IDD
Maximum Output Voltage (High)
Parameter
Unit
Condition
11
mV
-
1
-
pA
-
-
1
-
pA
-
25°C
-
35
65
Full Range
-
-
80
VOH
25°C
VDD-0.1
-
Maximum Output Voltage (Low)
VOL
25°C
-
Large Single Voltage Gain
AV
25°C
Input Common-mode Voltage
Range
VICM
Common-mode Rejection Ratio
μA
RL=∞, All Comparators
-
V
RL=10kΩ to VDD/2
-
VSS+0.1
V
RL=10kΩ to VDD/2
-
90
-
dB
RL=10kΩ to VDD/2
25°C
0
-
3
V
VSS to VDD
CMRR
25°C
-
80
-
dB
-
Power Supply Rejection Ratio
PSRR
25°C
-
80
-
dB
-
Output Source Current (Note 12)
ISOURCE
25°C
1
2
-
mA
OUT=VDD-0.4V
ISINK
25°C
3
6
-
mA
OUT=VSS+0.4V
Output Rise Time
tR
25°C
-
50
-
ns
CL=15pF
100mV over drive
Output Fall Time
tF
25°C
-
20
-
ns
CL=15pF
100mV over drive
Propagation Delay L to H
tPLH
25°C
-
0.55
-
μs
CL=15pF
100mV over drive
Propagation Delay H to L
tPHL
25°C
-
0.25
-
mV
CL=15pF
100mV over drive
Output Sink Current (Note 12)
(Note 10) Absolute value.
(Note 11) Full range: BU7252xxx: TA=-40°C to +85°C BU7252Sxxx: TA=-40°C to +105°C.
(Note 12) Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
:
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TSZ02201-0RFR0G200410-1-2
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BU7251G
BU7251SG
BU7252xxx
BU7252Sxxx
Datasheet
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute Maximum Ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Power Dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25°C
(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical Characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
(4) Supply Current (IDD)
Indicates the current that flows within the IC under specified no-load conditions.
(5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
(6) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output voltage) / (Differential Input voltage)
(7) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(8) Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
(9) Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR = (Change of power supply voltage)/(Input offset fluctuation)
(10) Output Source Current/Output Sink Current (ISOURCE / ISINK)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
(11) Output Rise Time/Output Fall Time (tR / tF)
Indicates the time required for an output voltage step to change from 10% to 90% of its final value.
(12) Rising Propagation Delay Time/Falling Propagation Delay Time (tPLH / tPHL)
Indicates the time to reach 50% of the output voltage after the step voltage is applied at the input pin.
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
0.8
0.8
0.6
0.6
Power Dissipation [W]
Power Dissipation [W]
Typical Performance Curves
○BU7251G, BU7251SG
BU7251G
0.4
BU7251SG
0.4
0.2
0.2
0.0
0.0
85
0
25
50
75
100
Ambient Temperature [°C]
105
0
125
25
50
75
100
Ambient Temperature [°C]
Figure 2.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 1.
Power Dissipation vs Ambient Temperature
(Derating Curve)
50
50
40
40
105°C
5.5V
Supply Current [μA]
Supply Current [μA]
125
85°C
30
25°C
20
-40°C
10
30
3V
20
1.8V
10
0
0
1
2
3
4
5
6
-50
-25
0
25
50
75
100
Supply Voltage [V]
Ambient Temperature [°C]
Figure 3.
Supply Current vs Supply Voltage
Figure 4.
Supply Current vs Ambient Temperature
125
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
7
7
6
6
Maximum Output Voltage (High) [V]
Maximum Output Voltage (High) [V]
Typical Performance Curves - continued
○BU7251G, BU7251SG
5
105°C
4
25°C
85°C
3
-40°C
2
1
0
5
4
3V
3
1.8V
2
1
0
1
2
3
4
Supply Voltage [V]
5
6
-50
Figure 5.
Maximum Output Voltage (High) vs Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 6.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=10kΩ)
50
Maximum Output Voltage (Low) [mV]
50
Maximum Output Voltage (Low) [mV]
5.5V
40
30
105°C
85°C
20
25°C
10
-40°C
2
3
4
Supply Voltage [V]
5
30
5.5V
20
6
Figure 7.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=10kΩ)
1.8V
10
0
-50
0
1
40
3V
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 8.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=10kΩ)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7251G, BU7251SG
8
4
Output Source Current [mA]
5
Output Source Current [mA]
10
-40°C
6
25°C
4
85°C
105°C
5.5V
3
3V
2
1.8V
2
1
0
0
-50
0
0.5
1
1.5
2
Output Voltage [V]
2.5
3
Figure 9.
Output Source Current vs Output Voltage
(VDD=3V)
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 10.
Output Source Current vs Ambient Temperature
(OUT=VDD-0.4V)
30
20
Output Sink Current [mA]
-40°C
25
Output Sink Current [mA]
-25
25°C
20
15
85°C
105°C
10
15
5.5V
10
3V
1.8V
5
5
0
0.0
0.5
1.0
1.5
2.0
Output Voltage [V]
2.5
0
-50
3.0
Figure 11.
Output Sink Current vs Output Voltage
(VDD=3V)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 12.
Output Sink Current vs Ambient Temperature
(OUT=VSS+0.4V)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7251G, BU7251SG
10.0
1.5
7.5
2.5
25°C
0.0
85°C
Input Offset Voltage [mV]
Input Offset Voltage [mV]
1.2
5.0
-40°C
105°C
-2.5
-5.0
0.9
3V
0.6
5.5V
0.3
1.8V
-7.5
-10.0
0.0
1
2
3
4
Supply Voltage [V]
5
6
-50
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 14.
Input Offset Voltage vs Ambient Temperature
(VICM=VDD, EK=-0.1V)
Figure 13.
Input Offset Voltage vs Supply Voltage
(VICM=VDD, EK=-0.1V)
160
15
Large Signal Voltage Gain [dB]
10
Input Offset Voltage [mV]
-25
5
-40°C
25°C
85°C
105°C
0
-5
140
120
-40°C
25°C
100
-10
85°C
-105°C
80
60
-15
-1
0
1
2
Input Voltage [V]
3
1
4
2
3
4
Supply Voltage [V]
5
6
Figure 16.
Large Signal Voltage Gain vs Supply Voltage
Figure15.
Input Offset Voltage vs Input Voltage
(VDD=3V)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7251G, BU7251SG
120
Common-mode Rejection Ratio [dB]
Large Signal Voltage Gain [dB]
160
140
120
1.8V
100
3V
5.5V
80
100
80
105°C
60
-40°C
40
20
0
60
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
1
125
Figure 17.
Large Signal Voltage Gain vs Ambient Temperature
2
3
4
Supply Voltage [V]
5
6
Figure 18.
Common-mode Rejection Ratio vs Supply Voltage
(VDD=3V)
120
120
100
5.5V
Power Supply Rejection Ratio [dB]
Common-mode Rejection Ratio [dB]
25°C
85°C
3V
80
1.8V
60
40
20
100
-25
0
25
50
75
Ambient Temperature [°C]
100
60
40
20
0
-50
0
-50
80
125
Figure 19.
Common-mode Rejection Ratio vs Ambient Temperature
(VDD=3V)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 20.
Power Supply Rejection Ratio vs Ambient Temperature
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7251G, BU7251SG
0.8
Falling Propagation Delay [μs]
Rising Propagation Delay [μs]
2
1.5
1.8V
1
5.5V
0.5
3V
0.6
0.4
1.8V
5.5V
0.2
3V
0
0
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
125
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
125
Figure 22.
Falling Propagation Delay vs Ambient Temperature
(CL=15pF, 100mV Overdrive)
Figure 21.
Rising Propagation Delay vs Ambient Temperature
(CL=15pF, 100mV Overdrive)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7251G: -40°C to +85°C BU7251SG: -40°C to +105°C
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BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
0.8
0.8
0.6
BU7252F
Power Dissipation [W]
Power Dissipation [W]
0.6
BU7252FVM
0.4
0.2
BU7252SF
BU7252SFVM
0.4
0.2
0.0
0.0
85
0
25
50
75
100
Ambient Temperature [°C]
125
105
0
50
75
100
Ambient Temperature [°C]
125
Figure 24.
Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 23.
Power Dissipation vs Ambient Temperature
(Derating Curve)
150
Supply Current [μA]
150
Supply Current [μA]
25
100
105°C
85°C
50
25°C
100
5.5V
3V
50
1.8V
-40°C
0
0
1
2
3
4
5
6
-50
-25
Supply Voltage [V]
0
25
50
75
100
125
Ambient Temperature [°C]
Figure 25.
Supply Current vs Supply Voltage
Figure 26.
Supply Current vs Ambient Temperature
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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BU7252xxx
Datasheet
BU7252Sxxx
7
7
6
6
Maximum Output Voltage (High) [V]
Maximum Output Voltage (High) [V]
Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
5
105°C
4
25°C
85°C
3
-40°C
2
1
0
5
4
3V
3
1.8V
2
1
0
1
2
3
4
Supply Voltage [V]
5
6
-50
Figure 27.
Maximum Output Voltage (High) vs Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 28.
Maximum Output Voltage (High) vs Ambient Temperature
(RL=10kΩ)
50
Maximum Output Voltage (Low) [mV]
50
Maximum Output Voltage (Low) [mV]
5.5V
40
30
105°C
85°C
20
10
25°C
-40°C
2
3
4
Supply Voltage [V]
5
30
6
Figure 29.
Maximum Output Voltage (Low) vs Supply Voltage
(RL=10kΩ)
5.5V
1.8V
20
10
3V
0
-50
0
1
40
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 30.
Maximum Output Voltage (Low) vs Ambient Temperature
(RL=10kΩ)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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BU7252xxx
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BU7252Sxxx
Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
8
4
Output Source Current [mA]
5
Output Source Current [mA]
10
-40°C
6
25°C
4
85°C
105°C
5.5V
3
3V
2
1.8V
2
1
0
0
-50
0
0.5
1
1.5
2
Output Voltage [V]
2.5
3
Figure 31.
Output Source Current vs Output Voltage
(VDD=3V)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 32.
Output Source Current vs Ambient Temperature
(OUT=VDD-0.4V)
30
20
-40°C
Output Sink Current [mA]
Output Sink Current [mA]
25
25°C
20
15
85°C
105°C
10
15
5.5V
10
3V
1.8V
5
5
0
0.0
0.5
1.0
1.5
2.0
Output Voltage [V]
2.5
0
-50
3.0
Figure 33.
Output Sink Current vs Output Voltage
(VDD=3V)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 34.
Output Sink Current vs Ambient Temperature
(OUT=VSS+0.4V)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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BU7252Sxxx
Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
7.5
7.5
5.0
5.0
2.5
Input Offset Voltage [mV]
10.0
Input Offset Voltage [mV]
10.0
-40°C
25°C
0.0
-2.5
85°C 105°C
-5.0
2.5
1.8V
0.0
-2.5
3V
-5.0
-7.5
-7.5
-10.0
-10.0
1
2
3
4
Supply Voltage [V]
5
6
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 36.
Input Offset Voltage vs Ambient Temperature
(VICM=VDD, EK=-0.1V)
Figure 35.
Input Offset Voltage vs Supply Voltage
(VICM=VDD, EK=-0.1V)
15
160
Large Signal Voltage Gain [dB]
10
Input Offset Voltage [mV]
5.5V
5
-40°C
25°C
0
105°C
-5
85°C
-10
-15
140
120
-40°C
25°C
100
85°C
105°C
80
60
-1
0
1
2
Input Voltage [V]
3
4
1
2
3
4
Supply Voltage [V]
5
6
Figure 38.
Large Signal Voltage Gain vs Supply Voltage
Figure 37.
Input Offset Voltage vs Input Voltage
(VDD=3V)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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BU7252xxx
Datasheet
BU7252Sxxx
Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
120
Common-mode Rejection Ratio [dB]
Large Signal Voltage Gain [dB]
160
140
120
1.8V
100
3V
5.5V
80
100
80
105°C
85°C
60
25°C
-40°C
40
20
0
60
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
1
125
120
120
100
100
5.5V
80
3V
60
40
1.8V
20
-25
0
25
50
75
Ambient Temperature [°C]
100
5
6
80
60
40
20
0
-50
0
-50
3
4
Supply Voltage [V]
Figure 40.
Common-mode Rejection Ratio vs Supply Voltage
(VDD=3V)
Power Supply Rejection Ratio [dB]
Common-mode Rejection Ratio [dB]
Figure 39.
Large Signal Voltage Gain vs Ambient Temperature
2
125
Figure 41.
Common -mode Rejection Ratio vs Ambient Temperature
(VDD=3V)
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 42.
Power Supply Rejection Ratio vs Ambient Temperature
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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Typical Performance Curves - continued
○BU7252xxx, BU7252Sxxx
0.8
Falling Propagation Delay [μs]
Rising Propagation Delay [μs]
2
1.5
5.5V
1
1.8V
0.5
3V
0.6
0.4
1.8V
3V
5.5V
0.2
0
0
-50
-25
0
25
50
75
100
Ambient Temperature [°C]
125
-50
-25
0
25
50
75
Ambient Temperature [°C]
100
125
Figure 44.
Falling Propagation Delay vs Ambient Temperature
(CL=15pF, 100mV Overdrive)
Figure 43.
Rising Propagation Delay vs Ambient Temperature
(CL=15pF, 100mV Overdrive)
(*) The above characteristics are measurements of typical sample, they are not guaranteed.
BU7252xxx: -40°C to +85°C BU7252Sxxx: -40°C to +105°C
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Datasheet
BU7252Sxxx
Application Information
NULL Method Conditions for Test Circuit 1
VDD, VSS, EK, VICM Unit: V
Parameter
Input Offset Voltage
VF
SW1
SW2 SW3
VF1
ON
ON
ON
ON
VDD
VSS
EK
VICM
Calculation
OFF
3
0
-0.1
0.3
1
ON
3
0
0.3
2
VF2
-0.3
Large Signal Voltage Gain
VF3
-2.7
VF4
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
0
ON
ON
OFF
3
0
-0.1
VF5
VF6
1.8
Power Supply Rejection Ratio
ON
ON
OFF
VF7
- Calculation 1. Input Offset Voltage (VIO)
0
-0.1
0.3
4
5.5
|VF1|
1 + RF/RS
VIO =
[V]
EK × (1+RF/RS)
|VF2 - VF3|
Av = 20Log
2. Large Signal Voltage Gain (AV)
3
3
[dB]
CMRR = 20Log
VICM × (1+RF/RS)
|VF5 - VF4|
PSRR = 20Log
VDD × (1+ RF/RS)
|VF7 - VF6|
3. Common-mode Rejection Ration (CMRR)
[dB]
[dB]
4. Power Supply Rejection Ratio (PSRR)
0.47μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
VDD
15V
EK
RI=1MΩ
0.01μF
Vo
500kΩ
0.1μF
0.1μF
DUT
SW3
RS=50Ω
RI=1MΩ
NULL
RL
VICM
50kΩ
SW2
V VF
VRL
-15V
VSS
Figure 45. Test Circuit 1 (one channel only)
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Application Information – continued
Switch Conditions for Test Circuit 2
SW1
SW2
SW3
SW4
SW5
SW6
SW7
SW8
Supply Current
OFF
ON
ON
OFF
OFF
OFF
OFF
OFF
Maximum Output Voltage (RL=10kΩ)
OFF
ON
ON
ON
OFF
OFF
ON
OFF
Output Current
OFF
OFF
OFF
OFF
OFF
ON
OFF
OFF
Response Time
ON
OFF
ON
OFF
ON
OFF
OFF
ON
SW No.
VDD
＋
SW1
SW2
－
SW3
SW4
SW5
RL
CL
SW6
SW7
SW8
VIN
VSS
IN-
IN+
OUT
Figure 46. Test Circuit 2 (each channel)
Input Voltage
Input Voltage
1.6V
1.6V
1.5V
1.5V
100mV Overdrive
Vre
100mV Overdrive
1.4V
1.4V
t
Output Voltage (L-H)
t
Input Wave
Input Wave
Output Voltage (H-L)
tPLH
3V
tF
3V
90%
50%
1.5V
90%
50%
1.5V
10%
10%
0V
0V
tR
Output Wave
t
tPHL
Output Wave
t
Figure 47. Response Time Input and Output Wave
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 49(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W
The Derating curve in Figure 49(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 49(c) to (f) shows an example of the derating curve for BU7251G,
BU7251SG, BU7252xxxx, and BU7252Sxxx.
Power dissipation of IC
Power dissipation of LSI [W]
PDmax
θJA=(TJmax-TA)/ PD °C/W
Ambient temperature TA [ °C ]
P2
TJmax
θJA1
25
50
75
100
125
Chip surface temperature TJ [ °C ]
Ambient temperature TA [ °C ]
(a) Thermal Resistance
(b) Derating Curve
0.8
0.8
0.6
0.6
Power Dissipation [W]
Power Dissipation [W]
θJA2
P1
0
BU7251G (Note 13)
0.4
0.2
0.0
25
50
75
100
Ambient Temperature [°C]
(c) BU7251G
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0.4
0.2
105
0
125
150
BU7251SG (Note 13)
0.0
85
0
θJA2 < θJA1
25
50
75
100
Ambient Temperature [°C]
125
(d) BU7251SG
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BU7251G
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0.8
0.8
0.6
Power Dissipation [W]
Power Dissipation [W]
Datasheet
BU7252Sxxx
BU7252F (Note 14)
BU7252FVM
(Note 15)
0.4
0.2
0.0
BU7252SF (Note 14)
BU7252SFVM (Note 15)
0.4
0.2
0.0
85
0
0.6
25
50
75
100
Ambient Temperature [°C]
105
0
125
25
50
75
100
Ambient Temperature [°C]
(e) BU7252xxx
125
(f) BU7252Sxxx
Figure 48. Thermal Resistance and Derating Curve
(Note 13)
(Note 14)
(Note 15)
Unit
5.4
5.5
4.7
mW/°C
When using the unit above TA =25°C, subtract the value above per Celsius degree. Power dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3%) is mounted.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the PD rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Datasheet
Operational Notes – continued
12.
Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when
no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins
have voltages within the values specified in the electrical characteristics of this IC.
13.
Unused circuits
When there are unused comparators, it is recommended that they are
connected as in Figure 49, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (VICM).
14.
Input Voltage
Applying VDD +0.3V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit
operation. Please note that the circuit operates normally only when the
input voltage is within the common mode input voltage range of the
electric characteristics.
VDD
VSS
Figure 49. Example of Application Circuit
for Unused Comparator
15.
Power Supply(single/dual)
The voltage comparator operates when the voltage supplied is between VDD and VSS. Therefore, the single supply
voltage comparator can be used as dual supply voltage comparator as well.
16.
Output capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into
the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1µF between output pin and VSS pin.
17.
Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
18.
Latch Up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
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Datasheet
Physical Dimensions Tape and Reel Information
Package Name
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Physical Dimensions Tape and Reel Information – continued
Package Name
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Physical Dimensions Tape and Reel Information - continued
Package Name
MSOP8
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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26/28
TSZ02201-0RFR0G200410-1-2
20.Feb.2014 Rev.001
BU7251G
BU7251SG
BU7252xxx
Datasheet
BU7252Sxxx
Marking Diagram
SSOP5(TOP VIEW)
Part Number Marking
LOT Number
SOP8(TOP VIEW)
MSOP8(TOP VIEW)
G
BU7251S
LOT Number
1PIN MARK
1PIN MARK
AZ
7252
MSOP8
F
SOP8
FVM
Marking
AJ
SOP8
FVM
BU7252S
LOT Number
SSOP5
F
BU7252
Part Number Marking
Package Type
Product Name
BU7251
Part Number Marking
7252S
MSOP8
Land Pattern Data
All dimensions in mm
Land pitch
e
Land space
MIE
Land length
≧ℓ 2
SSOP5
0.95
2.4
1.0
0.6
SOP8
1.27
4.60
1.10
0.76
MSOP8
0.65
2.62
0.99
0.35
Package
SSOP5
e
Land width
b2
SOP8, MSOP8
e
e
ℓ 2
MIE
MIE
b2
?
b2
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TSZ02201-0RFR0G200410-1-2
20.Feb.2014 Rev.001
BU7251G
BU7251SG
Revision History
Date
20.Feb.2014
BU7252xxx
Revision
001
Datasheet
BU7252Sxxx
Changes
New Release
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TSZ02201-0RFR0G200410-1-2
20.Feb.2014 Rev.001
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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