BU7275SHFV-TR

Datasheet Operational Amplifiers Input/Output Full Swing Low Voltage Operating CMOS Operational Amplifiers BU7261G BU7261SG BU7262xxx BU7262Sxxx General Description Key Specifications BU7261G,BU7262xxx,BU7264xx are CMOS operational amplifier of the input/output full swing low voltage operation. Also, BU7261SG,BU7262Sxxx,BU7264Sxx which expanded the operating temperature range perform a lineup. It is most suitable for a sensor amplifier and a battery-powered equipment to have a high slew rate, the characteristic of the low input bias current. Features ◼ ◼ ◼ ◼ ◼ Operable with Low Voltage Input-Output Full Swing High Slew Rate Wide Temperature Range Low Input Bias Current ◼ Operating Supply Voltage Range(Single Supply): +1.8V to +5.5V ◼ Operating Temperature Range: BU7261G, BU7262xxx, BU7264xx: -40°C to +85°C BU7261SG, BU7262Sxxx, BU7264Sxx: -40°C to +105°C ◼ Slew Rate: 1.1 V/µs(Typ) ◼ Input Offset Current: 1pA (Typ) ◼ Input Bias Current: 1pA (Typ) Packages SSOP5 SOP8 MSOP8 VSON008X2030 SOP14 SSOP-B14 Applications ◼ ◼ ◼ ◼ BU7264xx BU7264Sxx Sensor Amplifier Battery-powered Equipment Portable Equipment Consumer Equipment W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 2.90mm x 4.00mm x 0.90mm 2.00mm x 3.00mm x 0.60mm 8.70mm x 6.20mm x 1.71mm 5.00mm x 6.40mm x 1.35mm Simplified Schematic VDD Vbias IN+ Class AB control OUT IN- Vbias VSS Figure 1. Simplified Schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 1/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Pin Configuration BU7261G, BU7261SG Pin No. Pin Name 1 IN+ ＋ 2 VSS － 3 IN- 4 OUT 5 VDD Pin No. Pin Name 1 OUT1 IN+ 1 VSS 2 IN- 3 : SSOP5 5 VDD 4 OUT BU7262F, BU7262SF : SOP8 BU7262FVM, BU7262SFVM : MSOP8 BU7262NUX, BU7262SNUX : VSON008X2030 OUT1 IN1- 2 CH1 + ＋ － IN1+ 3 CH2 ＋ － VSS 4 7 OUT2 6 IN2- 5 IN2+ BU7264F, BU7264SF BU7264FV, BU7264SFV IN1+ 4 VSS 5 IN2+ 6 IN2- 7 OUT2 8 VDD Pin No. Pin Name 1 OUT1 14 OUT4 CH1 － - ＋ + CH4 ＋ + － 12 IN4+ VDD 4 11 VSS IN2+ 5 10 IN3+ - ＋ + － CH2 ＋ + － CH3 OUT2 7 SSOP5 BU7261G BU7261SG 9 BU7262F BU7262SF www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 IN1- 3 IN1+ 4 VDD 5 IN2+ 6 IN2- 7 OUT2 8 OUT3 9 IN3- 10 IN3+ IN3- 8 OUT3 SOP8 2 13 IN4- IN1+ 3 IN2- 6 IN1- 3 : SOP14 : SSOP-B14 OUT1 1 IN1- 2 2 8 VDD 1 11 VSS 12 IN4+ 13 IN4- 14 OUT4 Package VSON008X2030 MSOP8 BU7262NUX BU7262SNUX SOP14 BU7262FVM BU7264F BU7262SFVM BU7264SF 2/44 SSOP-B14 BU7264FV BU7264SFV TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Ordering Information B U 7 2 6 x Part Number BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx x x x x Package G : SSOP5 F : SOP8, SOP14 FV : SSOP-B14 FVM : MSOP8 NUX : VSON008X2030 - x x Packaging and forming specification E2: Embossed tape and reel (SOP8/SOP14/SSOP-B14) TR: Embossed tape and reel (SSOP5/MSOP8/VSON008X2030) Line-up Topr Channels 1ch -40°C to +85°C 2ch 4ch 1ch -40°C to +105°C 2ch 4ch www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Package Orderable Part Number SSOP5 Reel of 3000 BU7261G-TR SOP8 Reel of 2500 BU7262F-E2 MSOP8 Reel of 3000 BU7262FVM-TR VSON008X2030 Reel of 4000 BU7262NUX-TR SOP14 Reel of 2500 BU7264F-E2 SSOP-B14 Reel of 2500 BU7264FV-E2 SSOP5 Reel of 3000 BU7261SG-TR SOP8 Reel of 2500 BU7262SF-E2 MSOP8 Reel of 3000 BU7262SFVM-TR VSON008X2030 Reel of 4000 BU7262SNUX-TR SOP14 Reel of 2500 BU7264SF-E2 SSOP-B14 Reel of 2500 BU7264SFV-E2 3/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx Absolute Maximum Ratings BU7262Sxxx BU7264xx BU7264Sxx Datasheet (TA=25℃) ○BU7261G, BU7262xxx, BU7264xx Parameter Supply Voltage Power Dissipation Rating Symbol BU7261G VDD-VSS PD BU7262xxx +7 Storage Temperature Maximum Junction Temperature Unit V SSOP5 0.54(Note 1,7) - - SOP8 - 0.55(Note 2,7) - MSOP8 - 0.47(Note 3,7) - VSON008X2030 - 0.41(Note 4,7) - SOP14 - - 0.45(Note 5,7) W 0.70(Note 6,7) SSOP-B14 Differential Input Voltage (Note 8) Input Common-mode Voltage Range Input Current (Note 9) Operating Supply Voltage Operating Temperature BU7264xx VID VDD - VSS V VICM (VSS - 0.3) to (VDD + 0.3) V II ±10 mA Vopr +1.8 to +5.5 V Topr -40 to +85 °C Tstg -55 to +125 °C TJmax +125 °C (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) To use at temperature above TA=25C reduce 5.4mW/°C. To use at temperature above TA=25C reduce 5.5mW/°C. To use at temperature above TA=25C reduce 4.7mW/°C. To use at temperature above TA=25C reduce 4.1mW/°C. To use at temperature above TA=25C reduce 4.5mW/°C. To use at temperature above TA=25C reduce 7.0mW/°C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 9) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Absolute Maximum Ratings (TA=25℃)- continued ○BU7261SG, BU7262Sxxx, BU7264Sxx Parameter Supply Voltage Power Dissipation Rating Symbol BU7261SG VDD-VSS PD BU7262Sxxx +7 SSOP5 - - SOP8 - 0.55(Note 11,16) - - 0.47(Note 12,16) - VSON008X2030 - 0.41(Note 13,16) - SOP14 - - 0.45(Note 14,16) MSOP8 Storage Temperature Maximum Junction Temperature Unit V 0.54(Note 10,16) W 0.70(Note 15,16) SSOP-B14 Differential Input Voltage (Note 17) Input Common-mode Voltage Range Input Current (Note 18) Operating Supply Voltage Operating Temperature BU7264Sxx VID VDD - VSS V VICM (VSS - 0.3) to (VDD + 0.3) V II ±10 mA Vopr +1.8 to +5.5 V Topr -40 to +105 °C Tstg -55 to +125 °C TJmax +125 °C (Note 10) (Note 11) (Note 12) (Note 13) (Note 14) (Note 15) (Note 16) (Note 17) To use at temperature above TA=25C reduce 5.4mW/°C. To use at temperature above TA=25C reduce 5.5mW/°C. To use at temperature above TA=25C reduce 4.7mW/°C. To use at temperature above TA=25C reduce 4.1mW/°C. To use at temperature above TA=25C reduce 4.5mW/°C. To use at temperature above TA=25C reduce 7.0mW/°C. Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 18) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Electrical Characteristics ○BU7261G, BU7261SG (Unless otherwise specified VDD=+3V, VSS=0V, TA=25℃) Limit Temperature Symbol Parameter Range Min Typ Max Unit Conditions mV VDD=1.8 to 5.5V 25℃ - 1 9 Full range - - 10 IIO 25℃ - 1 - pA - Input Bias Current (Note 19) IB 25℃ - 1 - pA - Supply Current (Note 20) IDD 25℃ - 250 550 Full range - - 600 Maximum Output Voltage(High) VOH 25℃ VDD-0.1 - Maximum Output Voltage(Low) VOL 25℃ - Large Signal Voltage Gain AV 25℃ VICM Common-mode Rejection Ratio Input Offset Voltage (Note 19, 20) VIO Input Offset Current (Note 19) μA RL=∞ AV=0dB, IN+=1.5V - V RL=10kΩ - VSS+0.1 V RL=10kΩ 70 95 - dB RL=10kΩ 25℃ 0 - 3 V VSS - VDD CMRR 25℃ 45 60 - dB - Power Supply Rejection Ratio PSRR 25℃ 60 80 - dB - Output Source Current (Note 21) ISOURCE 25℃ 4 10 - mA OUT=VDD-0.4V Output Sink Current (Note 21) ISINK 25℃ 5 12 - mA OUT=VSS+0.4V Slew Rate SR 25℃ - 1.1 - V/μs CL=25pF GBW 25℃ - 2 - MHz CL=25pF, AV=40dB θ 25℃ - 50 - deg THD+N 25℃ - 0.05 - % Input Common-mode Voltage Range Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise CL=25pF, AV=40dB OUT=0.8VP-P, f=1kHz (Note 19) Absolute value (Note 20) Full range: BU7261: TA=-40℃ to +85℃ BU7261S: TA=-40℃ to +105℃ (Note 21) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Electrical Characteristics - continued ○BU7262xxx, BU7262Sxxx (Unless otherwise specified Parameter VDD=+3V, VSS=0V, TA=25℃) Limit Temperature Symbol Range Min Typ Max Unit Conditions mV VDD=1.8 to 5.5V 25℃ - 1 9 Full range - - 10 IIO 25℃ - 1 - pA - Input Bias Current (Note 22) IB 25℃ - 1 - pA - Supply Current (Note 23) IDD 25℃ - 550 1100 Full range - - 1200 Maximum Output Voltage(High) VOH 25℃ VDD-0.1 - Maximum Output Voltage(Low) VOL 25℃ - Large Signal Voltage Gain AV 25℃ VICM Common-mode Rejection Ratio Input Offset Voltage (Note 22, 23) VIO Input Offset Current (Note 22) μA RL=∞, All Op-Amps AV=0dB, IN+=1.5V - V RL=10kΩ - VSS+0.1 V RL=10kΩ 70 95 - dB RL=10kΩ 25℃ 0 - 3 V VSS - VDD CMRR 25℃ 45 60 - dB - Power Supply Rejection Ratio PSRR 25℃ 60 80 - dB - Output Source Current (Note 24) ISOURCE 25℃ 4 10 - mA OUT=VDD-0.4V Output Sink Current (Note 24) ISINK 25℃ 5 12 - mA OUT=VSS+0.4V Slew Rate SR 25℃ - 1.1 - V/μs CL=25pF GBW 25℃ - 2 - MHz CL=25pF, AV=40dB θ 25℃ - 50 - deg CL=25pF, AV=40dB THD+N 25℃ - 0.05 - % OUT=0.8VP-P, f=1kHz CS 25℃ - 100 - dB AV=40dB, OUT=1Vrms Input Common-mode Voltage Range Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation (Note 22) Absolute value (Note 23) Full range: BU7262: TA=-40℃ to +85℃ BU7262S: TA=-40℃ to +105℃ (Note 24) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Electrical Characteristics - continued ○BU7264xx, BU7264Sxx (Unless otherwise specified VDD=+3V, VSS=0V, TA=25℃) Limit Temperature Symbol Parameter Range Min Typ Max Unit Conditions mV VDD=1.8 to 5.5V 25℃ - 1 9 Full range - - 10 IIO 25℃ - 1 - pA - Input Bias Current (Note 25) IB 25℃ - 1 - pA - Supply Current (Note 26) IDD 25℃ - 1100 2300 Full range - - 2800 Maximum Output Voltage(High) VOH 25℃ VDD-0.1 - Maximum Output Voltage(Low) VOL 25℃ - Large Signal Voltage Gain AV 25℃ VICM Common-mode Rejection Ratio Input Offset Voltage (Note 25, 26) VIO Input Offset Current (Note 25) μA RL=∞, All Op-Amps AV=0dB, IN+=1.5V - V RL=10kΩ - VSS+0.1 V RL=10kΩ 70 95 - dB RL=10kΩ 25℃ 0 - 3 V VSS - VDD CMRR 25℃ 45 60 - dB - Power Supply Rejection Ratio PSRR 25℃ 60 80 - dB - Output Source Current (Note 27) ISOURCE 25℃ 4 10 - mA OUT=VDD-0.4V Output Sink Current (Note 27) ISINK 25℃ 5 12 - mA OUT=VSS+0.4V Slew Rate SR 25℃ - 1.1 - V/μs CL=25pF GBW 25℃ - 2 - MHz CL=25pF, AV=40dB θ 25℃ - 50 - deg THD+N 25℃ - 0.05 - % OUT=0.8VP-P, f=1kHz CS 25℃ - 100 - dB AV=40dB, OUT=1Vrms Input Common-mode Voltage Range Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation CL=25pF, AV=40dB (Note 25) Absolute value (Note 26) Full range: BU7264: TA=-40℃ to +85℃ BU7264S: TA=-40℃ to +105℃ (Note 27) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Description of electrical characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Power Dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃ (normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (IIO) Indicates the difference of input bias current between the non-inverting and inverting terminals. (3) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) Supply Current (IDD) Indicates the current that flows within the IC under specified no-load conditions. (5) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output voltage high and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (6) Large Signal Voltage Gain (AV) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (7) Input Common-mode Voltage Range (VICM) Indicates the input voltage range where IC normally operates. (8) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (9) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR = (Change of power supply voltage)/(Input offset fluctuation) (10) Output Source Current / Output Sink Current (ISOURCE/ISINK) The maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. The output source current indicates the current flowing out of the IC, and the output sink current the current flowing into the IC. (11) Slew Rate (SR) Indicates the ratio of the change in output voltage with time when a step input signal is applied. (12) Gain Bandwidth (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet (13) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (14) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (15) Channel Separation (CS) Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] ○BU7261G, BU7261SG BU7261G 0.4 BU7261SG 0.4 0.2 0.2 0.0 0.0 0 25 85 50 75 100 Ambient Temperature [°C] 0 125 105 50 75 100 Ambient Temperature [°C] 125 Figure 3. Power Dissipation vs Ambient Temperature (Derating Curve) Figure 2. Power Dissipation vs Ambient Temperature (Derating Curve) 1000 1000 800 800 Supply Current [μA] Supply Current [μA] 25 600 105°C 85°C 400 600 5.5V 3.0V 400 1.8V 25°C 200 200 -40°C 0 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 125 Ambient Temperature [°C] Supply Voltage [V] Figure 4. Supply Current vs Supply Voltage Figure 5. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves - Continued ○BU7261G, BU7261SG 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 105°C 4 85°C 10 25°C 3 -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 6. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 7. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) 20 Maximum Output Voltage (Low) [mV] 20 Maximum Output Voltage (Low) [mV] 5.5V 5 105°C 15 85°C 10 25°C 5 -40°C 0 1 2 3 4 Supply Voltage [V] 5 6 Figure 8. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) 15 5.5V 3.0V 10 1.8V 5 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 9. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves - Continued ○BU7261G, BU7261SG 20 5.5V 40 -40°C Output Source Current [mA] Output Source Current [mA] 50 25°C 30 20 85°C 105°C 15 3.0V 10 1.8V 5 10 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 10. Output Source Current vs Output Voltage (VDD=3V) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 11. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 80 40 Output Sink Current [mA] Output Sink Current [mA] -40°C 60 25°C 40 85°C 105°C 20 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 3.0 Figure 12. Output Sink Current vs Output Voltage (VDD=3V) 30 5.5V 3.0V 20 1.8V 10 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 13. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves - Continued ○BU7261G, BU7261SG 7.5 7.5 5.0 5.0 Input Offset Voltage [mV] 10.0 Input Offset Voltage [mV] 10.0 25°C 2.5 -40°C 0.0 105°C 85°C -2.5 -5.0 2.5 5.5V 0.0 3.0V 1.8V -2.5 -5.0 -7.5 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 -50 6 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 15. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) Figure 14. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) 10.0 160 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 2.5 0.0 105°C 85°C -2.5 25°C -5.0 -40°C 140 40°C 25°C 120 105°C 85°C 100 80 -7.5 -10.0 60 -1 0 1 2 Input Voltage [V] 3 4 1 2 3 4 Supply Voltage [V] 5 6 Figure 17. Large Signal Voltage Gain vs Supply Voltage Figure16. Input Offset Voltage vs Input Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves - Continued ○BU7261G, BU7261SG 120 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 160 140 1.8V 120 3.0V 5.5V 100 80 60 100 80 60 -40°C 105°C 25°C 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 1 Figure 18. Large Signal Voltage Gain vs Ambient Temperature 120 140 100 120 5.5V 80 60 3.0V 1.8V 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 20. Common Mode Rejection Ratio vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 19. Common Mode Rejection Ratio vs Supply Voltage Power Supply Rejection Ratio [dB] Common Mode Rejection Ratio [dB] 85°C 100 80 60 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 21. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves - Continued 6 3.0 5 2.5 Slew Rate H-L [V/μs] Slew Rate L-H [V/μs] ○BU7261G, BU7261SG 4 5.5V 3 2 3.0V 2.0 5.5V 1.5 3.0V 1.0 1.8V 1.8V 0.5 1 0 0.0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 23. Slew Rate H-L vs Ambient Temperature Figure 22. Slew Rate L-H vs Ambient Temperature 100 200 80 160 60 120 Gain 40 80 20 40 0 Phase [deg] Voltage Gain [dB] Phase 0 102 103 104 105 106 107 108 Frequency [Hz] Figure 24. Voltage Gain・Phase vs Frequency (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7261G: -40℃ to +85℃ BU7261SG: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] ○BU7262xxx, BU7262Sxxx BU7262F BU7262FVM 0.4 BU7262NUX BU7262SF BU7262SFVM 0.4 BU7262SNUX 0.2 0.2 0.0 0.0 85 0 25 50 75 100 Ambient Temperature [°C] 105 0 125 2000 1500 1600 1200 105°C 1200 50 75 100 Ambient Temperature [°C] 125 Figure 26. Power Dissipation vs Ambient Temperature (Derating Curve) Supply Current [μA] Supply Current [μA] Figure 25. Power Dissipation vs Ambient Temperature (Derating Curve) 25 85°C 800 25°C 400 5.5V 900 3.0V 600 1.8V 300 -40°C 0 0 1 2 3 4 Supply Voltage [V] 5 6 Figure 27. Supply Current vs Supply Voltage -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 28. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7262xxx, BU7262Sxxx 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105°C 10 85°C 25°C 3 -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 29. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 30. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) 20 20 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 105°C 15 85°C 10 25°C 5 -40°C 0 1 2 3 4 Supply Voltage [V] 5 6 Figure 31. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) 15 5.5V 10 3.0V 5 0 -50 1.8V -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 32. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7262xxx, BU7262Sxxx 50 20 Output Source Current [mA] Output Source Current [mA] 5.5V 40 -40°C 25°C 30 20 85°C 105°C 10 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 15 3.0V 10 1.8V 5 0 -50 3.0 80 40 60 30 -40°C 25°C 40 85°C 105°C 20 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 34. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) Output Sink Current [mA] Output Sink Current [mA] Figure 33. Output Source Current vs Output Voltage (VDD=3V) -25 3.0 Figure 35. Output Sink Current vs Output Voltage (VDD=3V) 5.5V 3.0V 20 1.8V 10 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 36. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves – Continued 10.0 10.0 7.5 7.5 5.0 5.0 -40°C Input Offset Voltage [mV] Input Offset Voltage [mV] ○BU7262xxx, BU7262Sxxx 25°C 2.5 0.0 85°C 105°C -2.5 -5.0 -7.5 5.5V 2.5 3.0V 0.0 1.8V -2.5 -5.0 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 6 -50 Figure 37. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 38. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) 10.0 160 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 -40°C 2.5 25°C 0.0 105°C -2.5 85°C -5.0 140 105°C 85°C 120 25°C 40°C 100 80 -7.5 -10.0 60 -1 0 1 2 Input Voltage [V] 3 4 Figure 39. Input Offset Voltage vs Input Voltage (VDD=3V) 1 2 3 4 Supply Voltage [V] 5 6 Figure 40. Large Signal Voltage Gain vs Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves – Continued ○BU7262xxx, BU7262Sxxx 120 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 160 140 5.5V 120 3.0V 1.8V 100 80 60 100 -40°C 85°C 60 105°C 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 1 Figure 41. Large Signal Voltage Gain vs Ambient Temperature 2 3 4 Supply Voltage [V] 5 6 Figure 42. Common Mode Rejection Ratio vs Supply Voltage (VDD=3V) 140 120 100 Power Supply Rejection Ratio [dB] Common Mode Rejection Ratio [dB] 25°C 80 5.5V 80 60 1.8V 3.0V 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 43. Common Mode Rejection Ratio vs Ambient Temperature (VDD=3V) 120 100 80 60 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 44. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued 6 3.0 5 2.5 4 Slew Rate H-L [V/μs] Slew Rate L-H [V/μs] ○BU7262xxx, BU7262Sxxx 5.5V 3 3.0V 2 2.0 5.5V 1.5 3.0V 1.0 1.8V 1.8V 0.5 1 0.0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 125 Figure 45. Slew Rate L-H vs Ambient Temperature -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 46. Slew Rate H-L vs Ambient Temperature 100 200 80 160 60 120 Gain 40 80 20 40 0 Phase [deg] Voltage Gain [dB] Phase 0 102 103 104 105 106 107 108 Frequency [Hz] Figure 47. Voltage Gain・Phase vs Frequency (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7262xxx: -40℃ to +85℃ BU7262Sxxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7264xx, BU7264Sxx 0.8 0.8 0.6 Power Dissipation [W] Power Dissipation [W] 0.6 BU7264FV BU7264F 0.4 BU7264SFV BU7264SF 0.4 0.2 0.2 0.0 0.0 85 0 25 50 75 100 Ambient Temperature [°C] 105 0 125 Figure 48. Power Dissipation vs Ambient Temperature (Derating Curve) 25 50 75 100 Ambient Temperature [°C] 125 Figure 49. Power Dissipation vs Ambient Temperature (Derating Curve) 3000 3000 2500 2500 105°C Supply Current [μA] Supply Current [μA] 85°C 2000 1500 25°C 1000 2000 5.5V 1500 3.0V 1000 1.8V -40°C 500 500 0 0 0 1 2 3 4 Supply Voltage [V] 5 6 Figure 50. Supply Current vs Supply Voltage -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 51. Supply Current vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7264xx, BU7264Sxx 6 Maximum Output Voltage (High) [V] Maximum Output Voltage (High) [V] 6 5 4 105°C 10 85°C 3 25°C -40°C 2 1 4 3.0V 3 1.8V 2 1 0 0 1 2 3 4 Supply Voltage [V] 5 -50 6 Figure 52. Maximum Output Voltage (High) vs Supply Voltage (RL=10kΩ) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 53. Maximum Output Voltage (High) vs Ambient Temperature (RL=10kΩ) 20 20 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (Low) [mV] 5.5V 5 15 10 105°C 85°C 5 -40°C 2 10 5.5V 3.0V 5 1.8V 25°C 0 1 15 3 4 Supply Voltage [V] 5 6 Figure 54. Maximum Output Voltage (Low) vs Supply Voltage (RL=10kΩ) 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 55. Maximum Output Voltage (Low) vs Ambient Temperature (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7264xx, BU7264Sxx 50 20 -40°C Output Source Current [mA] Output Source Current [mA] 5.5V 40 25°C 30 85°C 20 105°C 15 3.0V 10 1.8V 5 10 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 0 -50 3.0 Figure 56. Output Source Current vs Output Voltage (VDD=3V) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 57. Output Source Current vs Ambient Temperature (OUT=VDD-0.4V) 80 40 60 Output Sink Current [mA] Output Sink Current [mA] -40°C 25°C 85°C 40 105°C 20 0 0.0 0.5 1.0 1.5 2.0 Output Voltage [V] 2.5 3.0 Figure 58. Output Sink Current vs Output Voltage (VDD=3V) 30 5.5V 3.0V 20 1.8V 10 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 59. Output Sink Current vs Ambient Temperature (OUT=VSS+0.4V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves – Continued 10.0 10.0 7.5 7.5 5.0 5.0 Input Offset Voltage [mV] Input Offset Voltage [mV] ○BU7264xx, BU7264Sxx 2.5 105°C 85°C 0.0 -2.5 25°C -40°C -5.0 -7.5 2.5 5.5V 0.0 -2.5 3.0V 1.8V -5.0 -7.5 -10.0 -10.0 1 2 3 4 Supply Voltage [V] 5 6 -50 Figure 60. Input Offset Voltage vs Supply Voltage (VICM=VDD, EK=-VDD/2) -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 61. Input Offset Voltage vs Ambient Temperature (VICM=VDD, EK=-VDD/2) 160 10.0 Large Signal Voltage Gain [dB] Input Offset Voltage [mV] 7.5 5.0 2.5 85°C 105°C 0.0 25°C -2.5 -40°C -5.0 140 25°C 40°C 120 85°C 105°C 100 80 -7.5 60 -10.0 -1 0 1 2 Input Voltage [V] 3 4 1 2 3 4 Supply Voltage [V] 5 6 Figure 63. Large Signal Voltage Gain vs Supply Voltage Figure 62. Input Offset Voltage vs Input Voltage (VDD=3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Typical Performance Curves – Continued ○BU7264xx, BU7264Sxx 120 Common Mode Rejection Ratio [dB] Large Signal Voltage Gain [dB] 160 140 5.5V 120 3.0V 1.8V 100 80 100 60 -40°C 85°C 60 105°C 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 1 Figure 64. Large Signal Voltage Gain vs Ambient Temperature 120 120 100 100 5.5V 80 60 1.8V 3.0V 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 66. Common Mode Rejection Ratio vs Ambient Temperature (VDD=3V) 2 3 4 Supply Voltage [V] 5 6 Figure 65. Common Mode Rejection Ratio vs Supply Voltage (VDD=3V) Power Supply Rejection Ratio [dB] Common Mode Rejection Ratio [dB] 25°C 80 80 60 40 20 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 67. Power Supply Rejection Ratio vs Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Typical Performance Curves – Continued ○BU7264xx, BU7264Sxx 6 3.0 5 2.5 Slew Rate H-L [V/μs] Slew Rate L-H [V/μs] 5.5V 4 5.5V 3 2 3.0V 1.8V 1 2.0 1.5 3.0V 1.8V 1.0 0.5 0.0 0 -50 -25 0 25 50 75 Ambient Temperature [°C] 100 -50 125 Figure 68. Slew Rate L-H vs Ambient Temperature -25 0 25 50 75 Ambient Temperature [°C] 100 125 Figure 69. Slew Rate H-L vs Ambient Temperature 100 200 80 160 60 120 Gain 40 80 20 40 0 Phase [deg] Voltage Gain [dB] Phase 0 102 103 104 105 106 107 108 Frequency [Hz] Figure 70. Voltage Gain・Phase vs Frequency (*)The above characteristics are measurements of typical sample, they are not guaranteed. BU7264xx: -40℃ to +85℃ BU7264Sxx: -40℃ to +105℃ www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Application Information NULL method condition for Test Circuit 1 VDD, VSS, EK, VICM Unit: V Parameter Input Offset Voltage VF S1 S2 S3 VDD VSS EK VF1 ON ON OFF 3 0 -1.5 ON ON ON 3 0 ON ON OFF 3 0 -1.5 ON ON OFF 0 -0.9 VF2 Large Signal Voltage Gain VF3 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) VF5 VF6 Power Supply Rejection Ratio VF7 1.8 5.5 -0.5 -2.5 VICM Calculation 3 1 LOT Number 1.5 2 0 3 3 1PIN MARK 0 4 - Calculation |VF1| 1. Input Offset Voltage (VIO) VIO = 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR= 20Log ΔVICM × (1+RF/RS) |VF4 - VF5| [dB] PSRR = 20Log ΔVDD × (1+ RF/RS) |VF6 - VF7| [dB] 4. Power Supply Rejection Ratio (PSRR) [V] 1+RF/RS ΔEK × (1+RF/RS) |VF2-VF3| [dB] 0.1μF RF=50kΩ SW1 RS=50Ω 500kΩ VDD 15V EK RI=1MΩ 0.01μF Vo 500kΩ 0.015μF 0.015μF DUT SW3 RS=50Ω 1000pF RI=1MΩ RL VICM 50kΩ NULL SW2 VRL VSS V VF -15V Figure 71. Test Circuit 1 (One Channel Only) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx Datasheet BU7264xx BU7264Sxx Application Information - continued Switch Condition for Test Circuit 2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 SW No. Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Gain Bandwidth ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON SW3 R2=100kΩ SW4 ● VDD － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1=1kΩ VSS IN- IN+ Vo Figure 72. Test Circuit 2 (each channel) Output Voltage Input Voltage SR = Δ V / Δ t 3V 3V 90% ΔV 3 V P- P 10% 0V 0V t t Δt Input Wave Output Wave Figure 73. Slew Rate Input and Output Wave R2=100kΩ R2=100kΩ VDD R1=1kΩ VDD R1=1kΩ OUT1 R1//R2 IN OUT2 R1//R2 VSS VSS 100×OUT1 CS=20Log OUT2 Figure 74. Test Circuit 3 (Channel Separation) www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Examples of Circuit ○Voltage Follower VDD Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Computation for output voltage (OUT) is shown below. OUT IN VSS OUT=IN Figure 75. Voltage Follower Circuit ○Inverting Amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression VDD R1 IN OUT OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. VSS Figure 76. Inverting Amplifier Circuit ○Non-inverting Amplifier R1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. VDD OUT=(1 + R2/R1)・IN OUT Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. IN VSS Figure 77. Non-inverting Amplifier Circuit www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 78(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (PD). θJA = (TJmax－TA) / PD °C/W The Derating curve in Figure 78 (b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 78(c) to 78(h) shows an example of the derating curve for BU7261G, BU7261SG, BU7262xxx, BU7262Sxxx, BU7264xx, BU7264Sxx. Power dissipation of LSI [W] PDmax Power dissipation of IC θJA=(TJmax-TA)/ PD °C/W Ambient temperature TA [ °C ] P2 θJA2 < θJA1 P1 θJA2 TJmax θJA1 Chip surface temperature TJ [ °C ] 0 25 50 75 100 125 Ambient temperature TA[C] (b) Derating Curve Thermal 0.8 0.8 0.6 0.6 Power Dissipation [W] Power Dissipation [W] (a) resistance BU7261G(Note 28) 0.4 0.2 0.0 25 50 75 100 Ambient Temperature [°C] 125 (c)BU7261G www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.4 0.2 0.0 85 0 BU7261SG(Note 28) 105 0 25 50 75 100 Ambient Temperature [°C] 125 (d)BU7261SG 32/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx 0.8 0.8 0.6 0.6 Datasheet BU7264xx BU7264Sxx Power Dissipation [W] Power Dissipation [W] BU7262SF(Note 29) BU7262F(Note 29) BU7262FVM(Note 30) 0.4 BU7262NUX(Note 31) 0.2 0.0 0 BU7262SFVM(Note 30) 0.4 BU7262SNUX(Note 31) 0.2 0.0 85 25 50 75 100 Ambient Temperature [°C] 105 0 125 25 50 75 100 Ambient Temperature [°C] (e)BU7262F/FVM/NUX (f)BU7262SF/SFVM/SNUX 0.8 0.8 0.6 Power Dissipation [W] Power Dissipation [W] 125 BU7262FV(Note 33) BU7262F(Note 32) 0.4 0.2 0.0 0 0.6 0.4 0.2 0.0 85 25 50 75 100 Ambient Temperature [°C] 125 105 0 (g)BU7264F/FV (Note 28) 5.4 (Note 29) 5.5 BU7262SFV(Note 33) BU7262SF(Note 32) 25 50 75 100 Ambient Temperature [°C] 125 (h)BU7264SF/SFV (Note 30) 4.7 (Note 31) 4.1 (Note 32) 4.5 (Note 33) 7.0 Unit mW/℃ When using the unit above TA=25℃, subtract the value above per Celsius degree. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area less than 3％) is mounted. Figure 78. Thermal Resistance and Derating Curve www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 33/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the P D stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the P D rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 34/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Unused Circuits When there are unused op-amps, it is recommended that they are connected as in Figure 79, setting the non-inverting input terminal to a potential within the input common mode voltage range (VICM). Keep this potential 14. Input Voltage Applying VDD+0.3V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. in VICM VDD VICM VSS Figure 79. Example of Application Circuit for Unused Op-amp 15. Power Supply(single/dual) The operational amplifier operates when the voltage supplied is between VDD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 16. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VDD pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1uF between output pin and VSS pin. 17. Oscillation by Output Capacitor Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop circuit with these ICs. 18. Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and protect the IC from abnormaly noise. 19. Decupling Capacitor Insert the decupling capacitance between VDD and VSS, for stable operation of operational amplifier. 20. Radiation Land The VSON008X2030 package has a radiation land in the center of the back. Please connect to VSS potenital or don't connect to other terminal. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 35/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Marking Diagrams SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number MSOP8(TOP VIEW) VSON008X2030 (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SOP14(TOP VIEW) Part Number Marking SSOP-B14(TOP VIEW) Part Number Marking LOT Number LOT Number 1PIN MARK Product Name BU7261 G BU7261S G BU7262 BU7262S BU7264 BU7264S 1PIN MARK Package Type AL SSOP5 AX F SOP8 FVM MSOP8 NUX VSON008X2030 F SOP8 FVM MSOP8 NUX VSON008X2030 F SOP14 FV SSOP-B14 F SOP14 FV SSOP-B14 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Marking 7262 7262S BU7264F 7264 BU7264SF 7264S 36/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 37/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information - continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 38/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name SOP14 (Max 9.05 (include.BURR)) (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 39/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP-B14 40/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information - continued Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 MSOP8 41/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VSON008X2030 42/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Land Pattern Data All dimensions in mm Land length Land width ≧ℓ 2 b2 Land pitch e Land space MIE SSOP5 0.95 2.4 1.0 0.6 SOP8 SOP14 1.27 4.60 1.10 0.76 SSOP-B14 0.65 4.60 1.20 0.35 MSOP8 0.65 2.62 0.99 0.35 VSON008X2030 0.50 2.20 0.70 0.27 PKG SSOP5 e SOP8, MSOP8, SOP14, SSOP-B14 e ℓ2 e MIE MIE b2 b2 ℓ 2 PKG Radiation Land Length D3 Radiation Land Width E3 Pitch Diameter VSON008X2030 1.2 1.6 - Φ0.3 Thermal Via D3 MIE MD1 ℓL2 2 VSON008X2030 E3 Thermal Via e www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 b2 43/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Revision History Date Revision Changes 25.Sep.2012 001 New Release 06.Mar.2014 002 Revision is updated only 18.Apr.2014 003 03.Dec.2014 004 11.Dec.2020 005 Addition of BU7264FV,BU7264SFV in the Pin Configuration(Page 2.) Correction of Figure 7, 9, 30, 32, 34, 53, 55. Correction of Note 29～33. Correction of Note31 Power Dissipation(Page 33) P.44-2, 44-3 Updated packages and part numbers. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 44/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Ordering Information B U Part Number BU7264 7 2 6 4 Package F: SOP14K F - Z Production site Z : Added E 2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram SOP14K (TOP VIEW) Part Number Marking BU7264F LOT Number Pin 1 Mark www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 44-2/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 BU7261G BU7261SG BU7262xxx BU7262Sxxx BU7264xx BU7264Sxx Datasheet Physical Dimension and Packing Information Package Name www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP14K 44-3/44 TSZ02201-0RAR0G200230-1-2 11.Dec.2020 Rev.005 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001