BU9972GU-E2

Digital Video Encorders CPU bus interface No.09067EAT01 BU9972GU ●Description BU9972GU is a digital video encoder IC for CPU bus interface. It allows captured images (e.g. downloaded or on mobile phones) to be viewed on a TV monitor. In addition, a digital filter is built in for high image quality, and both multifunction and simple types are available for greater compatibility. ●Features Video Format： NTSC-M, PAL-B/D/G/H/I standard compliant Input Image Data Format： YCbCr 4:2:2 8 bits/16 bits, RGB 16 bits (R: 5 bits/G: 6 bits/B: 5 bits) BUS I/F： Master / Slave mode Support 10-bit Video-DAC Built-in, PLL Built-in Image Expansion Function, Image Display Position Adjustment Function ● Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Ratings Unit Digital supply voltage PLL supply voltage DVDD PVDD -0.2 ～ 2.5 -0.2 ～ 2.5 V V DAC supply voltage AVDD -0.2 ～ 4.5 V I/O supply voltage IOVDD -0.2 ～ 4.5 V Power dissipation (*1) Pd 570 mW Storage temperature range Tstg -25 ～ ＋125 ℃ (*1) A measured value at mounting on a board （ Size: 114.3mm x 76.2mm x 1.6mm, 4-layer ） implemented A measured value at mounting on a board （Size: 114.3mm x 76.2mm x 1.6mm, 4-layer） implemented in relation to SEMI. In the case of exceeding Ta=25℃, 5.7mW should be reduced per 1℃. * The radiation-resistance design is not carried out. * Operation is not guaranteed. ●Operating Conditions (Ta= -20～＋70℃) Parameter Symbol Min. Typ. Max. Unit Digital supply voltage DVDD 1.7 1.8 1.9 V PLL supply voltage PVDD 1.7 1.8 1.9 V DAC supply voltage AVDD 2.7 2.85 3.0 V 1.7 1.8 1.9 I/O supply voltage (*1) IOVDD V 2.7 2.85 3.0 V (*1) Usage limitation: IOVDD = 1.8V±0.1V or 2.85V±0.15V www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/5 2009.03 - Rev.A Technical Note BU9972GU ●Electrical characteristics （Unless otherwise noted, Ta=25℃、DVDD=PVDD=1.8V、IOVDD=2.85V、AVDD=2.85V、DVSS=PVSS=IOVSS=AVSS=GND=0V） Parameter Digital Operating Current I/O Operating Current Digital Static Current Symbol IDDCO IDDIO ISTDCO Mi. - Typ. 40 5 10 Max. 60 10 25 I/O Static Current ISTDIO - 5 15 H Input Voltage VIH IOVDD *0.8 - L Input Voltage VIL -0.2 - H/L Input Leak Current H Input Current IIL IIHT H Output Voltage VOH L Output Voltage Video DAC Resolution Video DAC Operating Current Video DAC Static Current PLL Operating Current PLL Static Current VOL RES IDDV ISTV IDDP ISTP -3 10 IOVDD -0.4 IOVSS - (*1) Unit Conditions mA Ta=25℃ (*1) mA Ta=25℃ (*1) μA RESETB=GND、Ta=25℃ RESETB=GND、Ta=25℃ μA Fix input terminals to GND. - IOVDD +0.2 IOVDD *0.2 3 200 μA μA - IOVDD V IOH=2mA 38 1 0.5 1 0.4 10 45 5 1.5 5 V Bits mA μA mA μA IOL=2mA V V VIN=IOVDD/GND VIN=IOVDD RL=37.5Ω、RIREF=1.2kΩ RESETB=GND、Ta=25℃ RESETB=GND、Ta=25℃ A measured value at QVGA color-bar image output in expand mode. ●Block diagram DATA[15:0] Line Memory CS VS Color-bar Generator Memory Control REQ_HS Host I/F FIELD Y PIXCLK_WE Gamma Correction Interpolation x2 Cb x1 XIN TRAP ×2 Over10-bit over sampling DAC sampling LPF Cr Clock Generator LPF VOUT LPF IREF XOUT Subcarrier Generator PLL MCLKO Serial I/F RESETB PWCTL SCLK SDI TEST[6:0] www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/5 2009.03 - Rev.A Technical Note BU9972GU ●Terminal functions Term i l Terminal Description ft i l 1 TEST0 Test pin. 2 N.C. 3 Term i l Terminal Description ft i l 23 DATA14 Pixel data input. No Connection. 24 DATA13 TEST1 Test pin. 25 4 TEST2 Test pin. 5 GND 6 Term i l Terminal Description ft i l 45 GND Connect to ground. Pixel data input. 46 REQ_HS Data request / Horizontal synchronizing signal. DATA12 Pixel data input. 47 GND Connect to ground. 26 DATA11 Pixel data input. 48 VS Vertical synchronizing signal. Connect to ground. 27 GND Connect to ground. 49 DVDD Digital power supply. SCLK Serial clock. 28 DATA10 Pixel data input. 50 GND Connect to ground. 7 SDI Serial data. 29 DATA9 Pixel data input. 51 DVSS Connect to ground. 8 TEST3 Test pin. 30 DATA8 Pixel data input. 52 GND Connect to ground. 9 GND Connect to ground. 31 GND Connect to ground. 53 CS Identify whether input pixel data is valid or not. 10 PVSS PLL ground. 32 DATA7 Pixel data input. 54 FIELD Field identification signal. 11 GND Connect to ground. 33 DVSS Connect to ground. 55 PWCTL Power down control input. 12 DVDD Digital power supply. 34 GND Connect to ground. 56 TEST4 Test pin. 13 PVDD PLL power supply. 35 DVDD Digital power supply. 57 TEST5 Test pin. 14 MCLKO System clock signal output. 36 DATA6 Pixel data input. 58 TEST6 Test pin. 15 XIN PLL reference clock output / connect to oscillator. 37 DATA5 Pixel data input. 59 AVSS DAC ground. 16 XOUT Oscillator output. 38 DATA4 Pixel data input. 60 IREF Reference voltage output for DAC. 17 IOVDD I/O power supply. 39 DATA3 Pixel data input. 61 AVDD DAC power supply. 18 GND Connect to ground. 40 DATA2 Pixel data input. 62 GND Connect to ground. 19 IOVSS Connect to ground. 41 GND Connect to ground. 63 VOUT Analog composite video 20 GND Connect to ground. 42 DATA1 Pixel data input. 64 GND i l t t Connect to ground. 21 RESETB System reset input. 43 DATA0 Pixel data input. 22 DATA15 Pixel data input. 44 PIXCLK_WE Pixel clock input. ●Package outline ●Ball assignment H BU9972 G F Lot No. E D C 17 18 22 24 27 29 31 33 IOVDD GND DATA15 DATA13 GND DATA9 GND DVSS 15 16 20 21 25 30 32 34 XIN XOUT GND RESETB DATA12 DATA8 DATA7 GND 26 35 36 38 DATA11 DVDD 13 14 19 23 PVDD MCLKO IOVSS DATA14 VBGA063T050 (Unit：mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. DATA6 DATA4 11 9 10 12 28 39 37 40 GND GND PVSS DVDD DATA10 DATA3 DATA5 DATA2 8 5 7 60 44 42 41 43 TEST3 GND SDI IREF PIXCLK_WE DATA1 GND DATA0 6 4 3 58 55 51 46 45 SCLK TEST2 TEST1 TEST6 PWCTL DVSS REQ_HS GND B A （Bottom View） 64 62 57 53 52 48 47 GND GND TEST5 CS GND VS GND 1 63 61 59 56 54 50 49 TEST0 VOUT AVDD AVSS TEST4 FIELD GND DVDD 1 2 3 4 5 6 7 8 3/5 2009.03 - Rev.A Technical Note BU9972GU ●Cautions on use （１）Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. （２）Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. （３）Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. （４）Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. （５）GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. （６）Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. （７）Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. （８）Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. （９）Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. （１０）Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. （１１）External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/5 2009.03 - Rev.A Technical Note BU9972GU ●Ordering part number B U 9 Part No. 9 7 2 G Part No. U - E Package GU VBGA063T050 2 Packaging and forming specification E2: Embossed tape and reel VBGA063T050 5.0 ± 0.1 5.0±0.1 0.08 S 63- φ 0.3±0.05 φ 0.05 M S AB P=0.5×7 0.5 0.23 1.2MAX 1PIN MARK Tape Embossed carrier tape (with dry pack) Quantity 2500pcs Direction of feed S E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 0.75±0.1 12345678 0.75± 0.1 0.5 B P=0.5× 7 A H G F E D C B A www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1pin Reel (Unit : mm) 5/5 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.03 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. 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If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A