LMR822FVM-GTR

Datasheet Operational Amplifiers Low Supply Current Output Full Swing Operational Amplifiers LMR821G LMR822xxx LMR824xxx General Description Key Specifications  Operating Supply Voltage (Single Supply): +2.5V to +5.5V  Voltage Gain (RL=600Ω): 105dB (Typ)  Temperature Range: -40°C to +85°C  Slew Rate: 2.0V/μs (Typ)  Input Offset Voltage: LMR821G 3.5mV (Max) LMR822xxx 5mV (Max) LMR824xxx 5mV (Max)  Input Bias Current: 30nA (Typ) LMR821G, LMR822xxx, and LMR824xxx are low-voltage low-current full-swing operational amplifiers. These products exhibit high voltage gain and high slew rate, making them suitable for mobile equipment, low voltage application and active filters. Features      Low Operating Supply Voltage Output Full Swing High Large Signal Voltage Gain High Slew Rate Low Supply Current Packages SSOP5 SOP8 SOP-J8 SSOP-B8 TSSOP-B8 MSOP8 TSSOP-B8J SOP14 SOP-J14 TSSOP-B14J Applications      Mobile Equipment Low Voltage Application Active Filter Buffer Consumer Electronics W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 5.00mm x 6.20mm x 1.71mm 4.90mm x 6.00mm x 1.65mm 3.00mm x 6.40mm x 1.35mm 3.00mm x 6.40mm x 1.20mm 2.90mm x 4.00mm x 0.90mm 3.00mm x 4.90mm x 1.10mm 8.70mm x 6.20mm x 1.71mm 8.65mm x 6.00mm x 1.65mm 5.00mm x 6.40mm x 1.20mm Pin Configuration LMR821G : SSOP5 Pin No. +IN 1 VSS 2 -IN 3 LMR822F LMR822FJ LMR822FV LMR822FVT LMR822FVM LMR822FVJ 5 VDD 1 +IN + 2 VSS - 3 -IN 4 OUT 5 VDD Pin No. Pin Name 1 OUT1 2 -IN1 3 +IN1 4 VSS 5 +IN2 6 -IN2 7 OUT2 8 VDD 4 OUT : SOP8 : SOP-J8 : SSOP-B8 : TSSOP-B8 : MSOP8 : TSSOP-B8J OUT1 1 -IN1 2 +IN1 3 8 VDD 7 OUT2 CH1+ - + CH2 + - VSS 4 6 -IN2 5 +IN2 ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 Pin Name ○This product has no designed protection against radioactive rays. 1/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824F LMR824FJ LMR824FVJ LMR824xxx Datasheet : SOP14 : SOP-J14 : TSSOP-B14J OUT1 1 -IN1 2 Pin Name 1 OUT1 2 -IN1 3 +IN1 14 OUT4 CH1 - + CH4 + - 12 +IN4 VDD 4 11 VSS +IN2 5 10 +IN3 + CH3 - + CH2 OUT2 7 4 VDD 5 +IN2 6 -IN2 7 OUT2 8 OUT3 9 -IN3 10 +IN3 13 -IN4 +IN1 3 -IN2 6 Pin No. 9 -IN3 8 OUT3 11 VSS 12 +IN4 13 -IN4 14 OUT4 Ordering Information L M R 8 2 Part Number LMR821G LMR822F LMR822FJ LMR822FV LMR822FVT LMR822FVM LMR822FVJ LMR824F LMR824FJ LMR824FVJ www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 x x x x Package G : SSOP5 F : SOP8 : SOP14 FJ : SOP-J8 : SOP-J14 FV : SSOP-B8 FVT : TSSOP-B8 FVM : MSOP8 FVJ : TSSOP-B8J : TSSOP-B14J 2/49 - x x Packaging and forming specification TR: Embossed tape and reel (SSOP5/MSOP8) E2: Embossed tape and reel (SOP8/SOP-J8/SSOP-B8/TSSOP-B8/ TSSOP-B8J/SOP14/SOP-J14/TSSOP-B14J) TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Line-up Topr Channels 1ch 2ch -40°C to +85°C 4ch Orderable Part Number Package SSOP5 Reel of 3000 LMR821G-TR SOP8 Reel of 2500 LMR822F-E2 SOP-J8 Reel of 2500 LMR822FJ-E2 SSOP-B8 Reel of 2500 LMR822FV-E2 TSSOP-B8 Reel of 3000 LMR822FVT-E2 MSOP8 Reel of 3000 LMR822FVM-TR TSSOP-B8J Reel of 2500 LMR822FVJ-E2 SOP14 Reel of 2500 LMR824F-E2 SOP-J14 Reel of 2500 LMR824FJ-E2 TSSOP-B14J Reel of 2500 LMR824FVJ-E2 LMR821G Ratings LMR822xxx LMR824xxx Absolute Maximum Ratings (TA=25°C) Parameter Symbol Supply Voltage VDD-VSS SSOP5 +7 0.67 SOP8 Power Dissipation Differential Input Voltage Input Common-mode Voltage Range (Note 10) Input Current Pd (Note 9) (Note 1,8) - V - - 0.68 (Note 2,8) - SOP-J8 - 0.67 (Note 1,8) SSOP-B8 - 0.62 (Note 3,8) - 0.62 (Note 3,8) - TSSOP-B8 - Unit MSOP8 - 0.58 (Note 4,8) TSSOP-B8J - 0.58 (Note 4,8) W - SOP14 - - 0.56 (Note 5,8) SOP-J14 - - 1.02 (Note 6,8) TSSOP-B14J - - 0.84 (Note 7,8) VID VDD – VSS V VICM (VSS - 0.3) to (VDD + 0.3) V II ±10 mA Operating Supply Voltage Vopr +2.5 to +5.5 V Operating Temperature Storage Temperature Maximum Junction Temperature Topr - 40 to +85 °C Tstg - 55 to +150 °C +150 °C Tjmax (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) (Note 9) Pd is reduced by 5.4mW/°C above TA= 25°C. Pd is reduced by 5.5mW/°C above TA= 25°C. Pd is reduced by 5.0mW/°C above TA= 25°C. Pd is reduced by 4.7mW/°C above TA= 25°C. Pd is reduced by 4.5mW/°C above TA= 25°C. Pd is reduced by 8.2mW/°C above TA= 25°C. Pd is reduced by 6.8mW/°C above TA= 25°C. Mounted on an FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). Differential Input Voltage is the voltage difference between the inverting and non-inverting inputs. The input pin voltage is set to more than VSS. (Note 10) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics ○LMR821G (Unless otherwise specified VDD=+2.5V, VSS=0V) Parameter Input Offset Voltage Symbol (Note 11) VIO Limits Temperature Range Min Typ Max 25°C - 1 3.5 Full Range - - 4 2.30 2.37 - 2.40 2.46 - - 130 200 - 80 120 Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C Unit Conditions mV VDD=2.5V to 5.5V V mV RL=600Ω RL=2kΩ (Note 12) RL=600Ω RL=2kΩ (Note 12) (Note 12) (Note 12) (Note 11) Absolute value (Note 12) Output load resistance connects to a half of VDD. ○LMR821G (Unless otherwise specified VDD=+2.7V, VSS=0V) Parameter Input Offset Voltage Symbol (Note 13,14) Input Offset Voltage Drift Input Offset Current Input Bias Current Supply Current (Note 13) (Note 13) (Note 14) Min Typ Max Unit Conditions mV VDD=2.5V to 5.5V 25°C - 1 3.5 Full Range - - 4 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 30 90 nA - 25°C - 280 340 Full Range - - 500 2.50 2.58 - VIO IDD Maximum Output Voltage(High) Limits Temperature Range VOH 25°C μA RL=600Ω V 2.60 2.66 - - 130 200 - 80 120 - 100 - 95 100 - RL=2kΩ Maximum Output Voltage(Low) VOL 25°C Large Signal Voltage Gain AV 25°C VICM 25°C 0 - 1.8 V CMRR 25°C 70 85 - dB Input Common-mode Voltage Range Common-mode Rejection Ratio AV=0dB, V+IN=1.35V mV dB (Note 16) RL=600Ω RL=2kΩ (Note 16) (Note 16) RL=600Ω RL=2kΩ (Note 16) (Note 16) (Note 16) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V VOUT=0V Short Circuit Current VOUT=2.7V Short Circuit Current Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 15) ISOURCE 25°C 12 16 - mA ISINK 25°C 12 26 - mA SR 25°C - 2.0 - V/μs CL=25pF GBW 25°C - 5.0 - MHz CL=25pF, AV=40dB f=1MHz θ 25°C - 50 - deg CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % Output Source Current Output Sink Current (Note 15) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise f=1kHz VOUT=2.2VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO (Note 13) Absolute value (Note 14) Full Range: TA=-40°C to +85°C (Note 15) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 16) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics - continued ○LMR821G (Unless otherwise specified VDD=+5.0V, VSS=0V) Parameter Input Offset Voltage (Note 17,18) Input Offset Voltage Drift Input Offset Current Input Bias Current Supply Current (Note 17) (Note 17) (Note 18) Min Typ Max 25°C - 1 3.5 Full Range - - 4 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 40 100 nA - 25°C - 325 425 Full Range - - 600 4.75 4.84 - VIO IDD Maximum Output Voltage(High) Maximum Output Voltage(Low) Large Signal Voltage Gain Limits Temperature Range Symbol VOH VOL 25°C Unit Conditions mV VDD=2.5V to 5.5V μA AV=0dB, V+IN=2.5V RL=600Ω V 4.85 4.90 - - 170 250 25°C RL=2kΩ mV - 100 150 - 105 - 95 105 - (Note 20) RL=600Ω RL=2kΩ (Note 20) (Note 20) RL=600Ω (Note 20) AV 25°C VICM 25°C 0 - 4.1 Common-mode Rejection Ratio CMRR 25°C 72 90 - Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 19) ISOURCE 25°C 20 45 - mA ISINK 25°C 20 40 - mA SR 25°C - 2.0 - V/μs CL=25pF GBW 25°C - 5.5 - MHz CL=25pF, AV=40dB f=1MHz θ 25°C - 50 - deg CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % Input Common-mode Voltage Range Output Source Current Output Sink Current (Note 19) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise dB (Note 20) RL=2kΩ V (Note 20) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V VOUT=0V Short Circuit Current VOUT=5V Short Circuit Current f=1kHz VOUT=4.1VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO (Note 17) Absolute value (Note 18) Full Range: TA=-40°C to +85°C (Note 19) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 20) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics - continued ○LMR822xxx (Unless otherwise specified VDD=+2.5V, VSS=0V) Parameter Input Offset Voltage Symbol (Note 21) VIO Limits Temperature Range Min Typ Max 25°C - 1 5 Full Range - - 5 2.30 2.37 - 2.40 2.46 - - 130 200 Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C - 80 120 Unit Conditions mV VDD=2.5V to 5.5V V mV RL=600Ω RL=2kΩ (Note 22) RL=600Ω RL=2kΩ (Note 22) (Note 22) (Note 22) (Note 21) Absolute value (Note 22) Output load resistance connects to a half of VDD. ○LMR822xxx (Unless otherwise specified VDD=+2.7V, VSS=0V) Parameter Input Offset Voltage Symbol (Note 23,24) Input Offset Voltage Drift Input Offset Current Input Bias Current Supply Current (Note 23) (Note 23) (Note 24) Min Typ Max Unit Conditions mV VDD=2.5V to 5.5V 25°C - 1 5 Full Range - - 5 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 30 90 nA - 25°C - 560 680 Full Range - - 1000 2.50 2.58 - 2.60 2.66 - - 130 200 - 80 120 - 100 - 95 100 - VIO IDD Maximum Output Voltage(High) Limits Temperature Range VOH 25°C μA V RL=600Ω RL=2kΩ (Note 26) (Note 26) RL=600Ω (Note 26) Maximum Output Voltage(Low) VOL 25°C Large Signal Voltage Gain AV 25°C VICM 25°C 0 - 1.8 V Common-mode Rejection Ratio CMRR 25°C 70 85 - dB Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 25) ISOURCE 25°C 12 16 - mA ISINK 25°C 12 26 - mA SR 25°C - 2.0 - V/μs CL=25pF GBW 25°C - 5.0 - MHz CL=25pF, AV=40dB f=1MHz θ 25°C - 50 - deg CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % VOUT=2.2VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO CS 25°C - 100 - dB AV=40dB, VOUT=0.5Vrms Input Common-mode Voltage Range Output Source Current Output Sink Current (Note 25) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation mV AV=0dB, V+IN=1.35V dB RL=2kΩ (Note 26) RL=600Ω RL=2kΩ (Note 26) (Note 26) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V VOUT=0V Short Circuit Current VOUT=2.7V Short Circuit Current f=1kHz (Note 23) Absolute value (Note 24) Full Range: TA=-40°C to +85°C (Note 25) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 26) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics - continued ○LMR822xxx (Unless otherwise specified VDD=+5.0V, VSS=0V) Parameter Input Offset Voltage (Note 27,28) Input Offset Voltage Drift Input Offset Current Input Bias Current Supply Current (Note 27) (Note 27) (Note 28) Limits Temperature Range Min Typ Max 25°C - 1 5 Full Range - - 5 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 40 100 nA - 25°C - 650 850 Full Range - - 1200 4.75 4.84 - Symbol VIO IDD Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio Unit Conditions mV VDD=2.5V to 5.5V μA V AV=0dB, V+IN=2.5V RL=600Ω 4.85 4.90 - - 170 250 - 100 150 - 105 - 95 105 - 25°C 0 - 4.1 V CMRR 25°C 72 90 - dB Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 29) ISOURCE 25°C 20 45 - mA ISINK 25°C 20 40 - mA SR 25°C - 2.0 - V/μs CL=25pF GBW 25°C - 5.5 - MHz CL=25pF, AV=40dB f=1MHz θ 25°C - 50 - deg CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % VOUT=4.1VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO CS 25°C - 100 - dB AV=40dB, VOUT=0.5Vrms Input Common-mode Voltage Range Output Source Current Output Sink Current (Note 29) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation mV dB RL=2kΩ (Note 30) (Note 30) RL=600Ω RL=2kΩ (Note 30) RL=600Ω RL=2kΩ (Note 30) (Note 30) (Note 30) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V VOUT=0V Short Circuit Current VOUT=5V Short Circuit Current f=1kHz (Note 27) Absolute value (Note 28) Full Range: TA=-40°C to +85°C (Note 29) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 30) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics - continued ○LMR824xxx (Unless otherwise specified VDD=+2.5V, VSS=0V) Parameter Input Offset Voltage Symbol (Note 31) Maximum Output Voltage(High) Maximum Output Voltage(Low) VIO VOH VOL Limits Temperature Range Min. Typ. Max. 25°C - 1 5 Full Range - - 5 2.30 2.37 - 25°C 25°C 2.40 2.46 - - 130 200 - 80 120 Unit Condition mV VDD=2.5V to 5.5V V mV RL=600Ω RL=2kΩ RL=600Ω RL=2kΩ (Note 32) (Note 32) (Note 32) (Note 32) (Note 31) Absolute value (Note 32) Output load resistance connects to a half of VDD. ○LMR824xxx (Unless otherwise specified VDD=+2.7V, VSS=0V) Parameter Input Offset Voltage (Note 33,34) Input Offset Voltage Drift Input Offset Current Input Bias Current Supply Current (Note 33) (Note 33) (Note 34) Limits Temperature Range Min. Typ. Max. 25°C - 1 5 Full Range - - 5 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 30 90 nA - 25°C - 1120 1360 Full Range - - 2000 2.50 2.58 - 2.60 2.66 - - 130 200 - 80 120 90 100 - Symbol VIO IDD Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio Unit Condition mV VDD=2.5V to 5.5V μA V mV dB 95 100 - 25°C 0 - 1.8 V CMRR 25°C 70 85 - dB Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 35) ISOURCE 25°C 12 16 - mA ISINK 25°C 12 26 - mA SR 25°C - 2.0 - V/μs GBW 25°C - 5.0 - MHz Input Common-mode Voltage Range AV=0dB, V+IN=1.35V RL=600Ω RL=2kΩ (Note 36) RL=600Ω RL=2kΩ (Note 36) (Note 36) RL=600Ω RL=2kΩ (Note 36) (Note 36) (Note 36) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V θ 25°C - 50 - deg VOUT=0V Short Circuit Current VOUT=2.7V Short Circuit Current CL=25pF CL=25pF, AV=40dB f=1MHz CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % CS 25°C - 100 - dB Output Source Current Output Sink Current (Note 35) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation f=1kHz VOUT=2.2VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO AV=40dB, VOUT=0.5Vrms (Note 33) Absolute value (Note 34) Full Range: TA=-40°C to +85°C (Note 35) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 36) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Electrical Characteristics - continued ○LMR824xxx (Unless otherwise specified VDD=+5V, VSS=0V) Parameter Input Offset Voltage Input Offset Current Input Bias Current Supply Current Min. Typ. Max. 25°C - 1 5 Full Range - - 5 ΔVIO/ΔT 25°C - 1 - μV/°C - IIO 25°C - 0.5 30 nA - IB 25°C - 40 100 nA - 25°C - 1130 1700 Full Range - - 2400 4.75 4.84 - 4.85 4.90 - - 170 250 (Note 37,38) Input Offset Voltage Drift Limits Temperature Range Symbol VIO (Note 37) (Note 37) (Note 38) IDD Maximum Output Voltage(High) VOH 25°C Maximum Output Voltage(Low) VOL 25°C Large Signal Voltage Gain AV 25°C VICM Common-mode Rejection Ratio Unit Condition mV VDD=2.5V to 5.5V μA V mV AV=0dB, V+IN=2.5V RL=600Ω RL=2kΩ (Note 40) RL=600Ω (Note 40) (Note 40) - 100 150 - 105 - 95 105 - 25°C 0 - 4.1 V CMRR 25°C 72 90 - dB Power Supply Rejection Ratio PSRR 25°C 75 85 - dB (Note 39) ISOURCE 25°C 20 45 - mA ISINK 25°C 20 40 - mA SR 25°C 1.4 2.0 - V/μs GBW 25°C - 5.5 - MHz θ 25°C - 50 - deg VOUT=0V Short Circuit Current VOUT=5V Short Circuit Current CL=25pF CL=25pF, AV=40dB f=1MHz CL=25pF, AV=40dB Gain Margin GM 25°C - 4.5 - dB CL=25pF, AV=40dB Input Referred Noise Voltage VN 25°C - 30 - nV/ Hz THD+N 25°C - 0.01 - % CS 25°C - 100 - dB Input Common-mode Voltage Range Output Source Current Output Sink Current (Note 39) Slew Rate Gain Bandwidth Phase Margin Total Harmonic Distortion + Noise Channel Separation dB RL=2kΩ (Note 40) RL=600Ω RL=2kΩ (Note 40) (Note 40) VSS to (VDD-0.9V) VDD=2.7V to 5.5V VICM=1V f=1kHz VOUT=4.1VP-P, f=1kHz RL=10kΩ AV=0dB, DIN-AUDIO AV=40dB, VOUT=0.5Vrms (Note 37) Absolute value (Note 38) Full Range: TA=-40°C to +85°C (Note 39) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. (Note 40) Output load resistance connects to a half of VDD. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Description of Electrical Characteristics Described below are the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that the item names, symbols, and their meanings may differ from those of another manufacturer’s document or a general document. 1. Absolute Maximum Ratings Absolute maximum rating items indicate the conditions which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without deterioration of characteristics of internal circuit. (2) Differential Input Voltage (VID) Indicates the maximum voltage that can be applied between the non-inverting terminal and inverting terminal without damaging the IC. (3) Input Common-mode Voltage Range (VICM) Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration of electrical characteristics. The input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range. (4) Power Dissipation (Pd) Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature (normal temperature), 25°C. As for the packaged product, Pd is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and thermal resistance of the package. 2. Electrical Characteristics (1) Input Offset Voltage (VIO) Indicates the voltage difference between the non-inverting terminal and inverting terminal. It can be translated to the input voltage difference required for setting the output voltage to 0 V. (2) Input Offset Voltage Drift (△VIO/△T) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. (3) Input Offset Current (IIO) Indicates the difference of input bias current between non-inverting and inverting terminals. (4) Input Bias Current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at the non-inverting and inverting terminals. (5) Supply Current (IDD) Indicates the current that that is consumed by the IC under specified no-load conditions. (6) Maximum Output Voltage (High) / Maximum Output Voltage (Low) (VOH/VOL) Indicates the output voltage range under a specified load condition. It can be differentiated to maximum output voltage high and low. Maximum output voltage high indicates the upper limit of the output voltage, and maximum output voltage low indicates the lower limit. (7) Large Signal Voltage Gain (AV) Indicates the amplification rate (gain) of output voltage against the voltage difference between the non-inverting and inverting terminal. It is normally the amplification rate (gain) in reference to DC voltage. AV = (Output voltage) / (Differential Input voltage) (8) Input Common-mode Voltage Range (VICM) Indicates the input voltage range at which the IC operates normally. (9) Common-mode Rejection Ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage to the change of common-mode input voltage. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) (10) Power Supply Rejection Ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage to the change in supply voltage. PSRR= (Change of power supply voltage)/(Input offset fluctuation) (11) Output Source Current/ Output Sink Current (ISOURCE / ISINK) The maximum current that the IC can output under specific conditions. The output source current indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC. (12) Slew Rate (SR) Indicates the rate of the change in output voltage with time when a step input signal is applied. (13) Gain Band Width (GBW) The product of the open-loop voltage gain and the frequency at which the voltage gain decreases by 6dB/octave. (14) Phase Margin (θ) Indicates the margin of phase from 180° phase lag at unity gain frequency. (15) :Gain Margin (GM) Indicates the difference between 0dB and gain where the operational amplifier has 180° phase delay. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet (16) Total Harmonic Distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. (17) Input Referred Noise Voltage (VN) Indicates the noise voltage generated inside the operational amplifier equivalent to an ideal voltage source connected in series with input terminal. (18) Channel Separation (CS) Indicates the fluctuation of the output voltage of the driven channel with reference to the change of output voltage of the channel which is not driven. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves ○LMR821G 400 0.6 350 LMR821G G Supply Current [uA] Power Dissipation [W] 0.8 0.4 85°C 300 25°C -40°C 250 0.2 0.0 0 25 50 75 85 200 100 125 2 150 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 1. Power Dissipation vs Ambient Temperature (Derating Curve) Figure 2. Supply Current vs Supply Voltage 6 6 Maximum Output Voltage (High) [V] 400 350 Supply Current [μA] 3 5.0V 300 2.7V 250 5 85°C 25°C 4 3 -40°C 2 1 0 200 -50 -25 0 25 50 75 100 2 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 3. Supply Current vs Ambient Temperature Figure 4. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) 6 (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR821G 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5 5.0V 4 3 2.7V 2 1 90 80 70 85°C 60 25°C 50 -40°C 40 30 20 10 0 0 -50 -25 0 25 50 75 100 2 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 5. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) Figure 6. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) 6 30 100 25 80 Output Source Current [mA] Maximum Output Voltage (Low) [mV] 90 5.0V 70 60 50 2.7V 40 30 20 -40°C 20 25°C 15 85°C 10 5 10 0 0 -50 -25 0 25 50 75 100 0 1 2 Ambient Temperature [°C] Output Voltage [V] Figure 7. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) Figure 8. Output Source Current vs Output Voltage (VDD=2.7V) 3 (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR821G 40 100 35 80 70 Output Sink Current [mA] Output Source Current [mA] 90 5.0V 60 50 40 30 2.7V 30 25°C 85°C 25 20 -40°C 15 10 20 5 10 0 0 -50 -25 0 25 50 75 0 100 1 2 Ambient Temperature [°C] Output Voltage [V] Figure 9. Output Source Current vs Ambient Temperature Figure 10. Output Sink Current vs Output Voltage (VDD=2.7V) 100 3 4 90 3 Input Offset Voltage [mV] Output Sink Current [mA] 80 70 60 50 5.0V 40 30 20 2 1 85°C 25°C 0 -40°C -1 -2 2.7V -3 10 0 -4 -50 -25 0 25 50 75 100 2 Ambient Temperature [°C] Figure 11. Output Sink Current vs Ambient Temperature 3 4 5 Supply Voltage [V] 6 Figure 12. Input Offset Voltage vs Supply Voltage (VICM=VDD/2, EK=-VDD/2) (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued 4 4 3 3 Input Offset Voltage [mV] Input Offset Voltage [mV] ○LMR821G 2 1 5.0V 0 2.7V -1 -2 2 1 0 -40°C -1 -2 -3 -3 -4 -4 -50 -25 0 25 50 75 100 -1 0 1 Ambient Temperature [°C] 2 3 Input Voltage [V] Figure 13. Input Offset Voltage vs Ambient Temperature (VICM=VDD/2, EK=-VDD/2) Figure 14. Input Offset Voltage vs Input Voltage (VDD=2.7V) 140 140 130 130 Large Signal Voltage Gain [dB] Large Signal Voltage Gain [dB] 85°C 25°C 120 85°C 110 -40°C 25°C 100 120 5.0V 110 2.7V 100 90 90 80 80 2 3 4 5 6 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 15. Large Signal Voltage Gain vs Supply Voltage Figure 16. Large Signal Voltage Gain vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR821G 140 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 140 130 120 -40°C 25°C 110 85°C 100 90 80 120 5.0V 110 2.7V 100 90 80 2 3 4 5 6 -50 -25 0 25 50 75 Supply Voltage [V] Ambient Temperature [°C] Figure 17. Common-mode Rejection Ratio vs Supply Voltage (VDD=2.7V) Figure 18. Common-mode Rejection Ratio vs Ambient Temperature 140 3.0 130 2.5 100 5.0V Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 130 120 110 100 90 2.0 2.7V 1.5 1.0 0.5 80 0.0 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 Ambient Temperature [°C] Ambient Temperature [°C] Figure 19. Power Supply Rejection Ratio vs Ambient Temperature (VDD=2.7V to 5.0V) Figure 20. Slew Rate L-H vs Ambient Temperature 100 (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR821G 3.0 100 200 Phase 5.0V 2.5 80 2.0 2.7V 1.5 60 100 Gain 40 1.0 50 20 0.5 0.0 -50 -25 0 25 50 75 100 0 1.E+00 103 1.E+01 104 1.E+02 105 1.E+03 106 1.E+04 107 0 1.E+05 108 Ambient Temperature [°C] Frequency [Hz] Figure 21. Slew Rate H-L vs Ambient Temperature Figure 22. Voltage Gain・Phase vs Frequency (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 Phase [deg] Voltage Gain [dB] Slew Rate H-L [V/μs] 150 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR822xxx 0.8 800 750 LMR822F 0.6 700 LMR822FV LMR822FVT Supply Current [uA] Power Dissipation [W] LMR822FJ LMR822FVM LMR822FVJ 0.4 25°C 650 85°C 600 -40°C 550 500 0.2 450 0.0 0 25 50 75 85 400 100 125 2 150 3 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 23. Power Dissipation vs Ambient Temperature (Derating Curve) Figure 24. Supply Current vs Supply Voltage 800 Maximum Output Voltage (High) [V] 6 700 Supply Current [μA] 4 5.0V 600 2.7V 500 400 5 85°C 25°C 4 -40°C 3 2 -50 -25 0 25 50 75 100 2 3 4 5 Ambient Temperature [°C] Supply Voltage [V] Figure 25. Supply Current vs Ambient Temperature Figure 26. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) 6 (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR822xxx 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) [V] 6 5 5.0V 4 3 2.7V 2 1 90 80 70 85°C 60 25°C 50 -40°C 40 30 20 10 0 0 -50 -25 0 25 50 75 2 100 3 Ambient Temperature [°C] 5 6 Supply Voltage [V] Figure 27. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) Figure 28. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) 30 100 90 25 80 Output Source Current [mA] Maximum Output Voltage (Low) [mV] 4 5.0V 70 60 50 2.7V 40 30 20 -40°C 20 25°C 15 10 85°C 5 10 0 0 -50 -25 0 25 50 75 100 0 1 Ambient Temperature [°C] 2 3 Output Voltage [V] Figure 29. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) Figure 30. Output Source Current vs Output Voltage (VDD=2.7V) (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR822xxx 100 40 35 80 70 Output Sink Current [mA] Output Source Current [mA] 90 5.0V 60 50 40 30 2.7V 30 85°C 25°C 25 20 -40°C 15 10 20 5 10 0 0 -50 -25 0 25 50 75 0 100 1 2 3 Ambient Temperature [°C] Output Voltage [V] Figure 31. Output Source Current vs Ambient Temperature Figure 32. Output Sink Current vs Output Voltage (VDD=2.7V) 100 4 90 3 Input Offset Voltage [mV] Output Sink Current [mA] 80 70 60 5.0V 50 40 2.7V 30 2 1 85°C 0 -40°C -1 25°C -2 20 -3 10 0 -4 -50 -25 0 25 50 75 100 2 Ambient Temperature [°C] 3 4 5 6 Supply Voltage [V] Figure 34. Input Offset Voltage vs Supply Voltage (VICM=VDD/2, EK=-VDD/2) Figure 33. Output Sink Current vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued 4 4 3 3 Input Offset Voltage [mV] Input Offset Voltage [mV] ○LMR822xxx 2 1 5.0V 2.7V 0 -1 -2 2 1 0 -40°C -1 -2 -3 -3 -4 -4 -50 -25 0 25 50 75 100 -1 1 2 3 Input Voltage [V] Figure 35. Input Offset Voltage vs Ambient Temperature (VICM=VDD/2, EK=-VDD/2) Figure 36. Input Offset Voltage vs Input Voltage (VDD=2.7V) 140 140 130 130 85°C 25°C 120 0 Ambient Temperature [°C] Large Signal Voltage Gain [dB] Large Signal Voltage Gain [dB] 85°C 25°C -40°C 110 100 5.0V 120 2.7V 110 100 90 90 80 80 2 3 4 5 -50 6 -25 0 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 37. Large Signal Voltage Gain vs Supply Voltage Figure 38. Large Signal Voltage Gain vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR822xxx 140 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 140 130 120 110 85°C 100 -40°C 25°C 90 130 120 110 100 80 90 80 2 3 4 5 6 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Supply Voltage [V] Figure 39. Common-mode Rejection Ratio vs Supply Voltage (VDD=2.7V) Figure 40. Common-mode Rejection Ratio vs Ambient Temperature 140 3.0 130 2.5 Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 5.0V 2.7V 120 110 100 5.0V 2.0 2.7V 1.5 1.0 0.5 90 0.0 80 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Ambient Temperature [°C] Figure 41. Power Supply Rejection Ratio vs Ambient Temperature (VDD=2.7V to 5.0V) Figure 42. Slew Rate L-H vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR822xxx 3.0 100 200 Phase 2.5 5.0V 80 2.7V 1.5 1.0 60 100 Gain 40 50 20 0.5 0.0 -50 -25 0 25 50 75 100 0 1.E+00 103 1.E+01 104 1.E+02 105 1.E+03 106 1.E+04 107 0 1.E+05 108 Ambient Temperature [°C] Frequency [Hz] Figure 43. Slew Rate H-L vs Ambient Temperature Figure 44. Voltage Gain・Phase vs Frequency (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 23/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 Phase [deg] 2.0 Voltage Gain [dB] Slew Rate H-L [V/μs] 150 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR824xxx 1.2 1600 LMR824FJ 1500 Supply Current [uA] Power Dissipation [W] 1400 LMR824FVJ 0.8 0.4 LMR824F 1300 1200 85°C 25°C 1100 -40°C 1000 900 0.0 0 25 50 75 85 800 100 125 2 150 3 6 Figure 46. Supply Current vs Supply Voltage Figure 45. Power Dissipation vs Ambient Temperature (Derating Curve) 6 1500 5.5 Maximum Output Voltage (High) [V] 1600 1400 Supply Current [μA] 5 Supply Voltage [V] Ambient Temperature [°C] 1300 1200 5.0V 1100 2.7V 1000 4 5 -40°C 4.5 25°C 4 85°C 3.5 3 2.5 900 2 800 -50 -25 0 25 50 75 2 100 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 47. Supply Current vs Ambient Temperature Figure 48. Maximum Output Voltage (High) vs Supply Voltage (RL=2kΩ) (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 24/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR824xxx 100 Maximum Output Voltage (Low) [mV] Maximum Output Voltage (High) 6 5 5.0V 4 3 2.7V 2 1 0 80 85°C 25°C 60 -40°C 40 20 0 -50 -25 0 25 50 75 100 2 3 Ambient Temperature [°C] 5 6 Supply Voltage [V] Figure 49. Maximum Output Voltage (High) vs Ambient Temperature (RL=2kΩ) Figure 50. Maximum Output Voltage (Low) vs Supply Voltage (RL=2kΩ) 120 30 100 25 Output Source Current [mA] Maximum Output Voltage (Low) [mV] 4 80 5.0V 60 2.7V 40 20 -40°C 25°C 20 85°C 15 10 5 0 0 -50 -25 0 25 50 75 100 0 1 2 Ambient Temperature [°C] Output Voltage [V] Figure 51. Maximum Output Voltage (Low) vs Ambient Temperature (RL=2kΩ) Figure 52. Output Source Current vs Output Voltage (VDD=2.7V) 3 (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR824xxx 40 100 35 85°C 80 Output Sink Current [mA] Output Source Current [mA] 90 5.0V 70 60 50 40 30 2.7V 30 25°C 25 20 15 -40°C 10 20 5 10 0 0 -50 -25 0 25 50 75 0 100 1 Ambient Temperature [°C] 2 3 Output Voltage [V] Figure 53. Output Source Current vs Ambient Temperature Figure 54. Output Sink Current vs Output Voltage (VDD=2.7V) 100 4 90 3 Input Offset Voltage [mV] Output Sink Current [mA] 80 70 60 5.0V 50 40 30 2 1 85°C 0 25°C -40°C -1 -2 20 2.7V -3 10 -4 0 -50 -25 0 25 50 75 100 2 3 4 5 6 Supply Voltage [V] Ambient Temperature [°C] Figure 55. Output Sink Current vs Ambient Temperature Figure 56. Input Offset Voltage vs Supply Voltage (VICM=VDD/2, EK=-VDD/2) (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 26/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued 4 4 3 3 Input Offset Voltage [mV] Input Offset Voltage [mV] ○LMR824xxx 2 1 5.0V 2.7V 0 -1 -2 2 1 85°C 0 -40°C -1 -2 -3 -3 -4 -4 -50 -25 0 25 50 75 100 -1 0 1 Ambient Temperature [°C] 130 130 Large Signal Voltage Gain [dB] 140 85°C 25°C -40°C 110 3 Figure 58. Input Offset Voltage vs Input Voltage (VDD=2.7V) 140 120 2 Input Voltage [V] Figure 57. Input Offset Voltage vs Ambient Temperature (VICM=VDD/2, EK=-VDD/2) Large Signal Voltage Gain [dB] 25°C 100 2.7V 120 5.0V 110 100 90 90 80 80 2 3 4 5 6 -50 Supply Voltage [V] -25 0 25 50 75 100 Ambient Temperature [°C] Figure 59. Large Signal Voltage Gain vs Supply Voltage Figure 60. Large Signal Voltage Gain vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 27/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR824xxx 140 Common-mode Rejection Ratio [dB] Common-mode Rejection Ratio [dB] 140 130 120 85°C 110 25°C 100 -40°C 90 130 120 5.0V 110 100 80 2.7V 90 80 2 3 4 5 6 -50 -25 Supply Voltage [V] 0 25 50 75 100 Ambient Temperature [°C] Figure 61. Common-mode Rejection Ratio vs Supply Voltage (VDD=2.7V) Figure 62. Common-mode Rejection Ratio vs Ambient Temperature 200 3.0 5.0V 2.5 160 Slew Rate L-H [V/μs] Power Supply Rejection Ratio [dB] 180 140 120 100 80 60 40 2.0 2.7V 1.5 1.0 0.5 20 0 0.0 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 Ambient Temperature [°C] Ambient Temperature [°C] Figure 63. Power Supply Rejection Ratio vs Ambient Temperature (VDD=2.7V to 5.0V) Figure 64. Slew Rate L-H vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 28/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Typical Performance Curves – continued ○LMR824xxx 3.0 100 200 Phase 80 2.0 5.0V 2.7V 1.5 1.0 60 100 40 Gain 50 20 0.5 0.0 -50 -25 0 25 50 75 100 0 103 1.E+00 Ambient Temperature [°C] 104 1.E+01 105 106 1.E+02 1.E+03 Frequency [Hz] 107 1.E+04 0 108 1.E+05 Figure 66. Voltage Gain・Phase vs Frequency Figure 65. Slew Rate H-L vs Ambient Temperature (*)The data above are measurement values of a typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 29/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 Phase [deg] 150 Voltage Gain [dB] Slew Rate H-L [V/μs] 2.5 LMR821G LMR822xxx LMR824xxx Datasheet Application Information NULL method condition for Test Circuit 1 VDD, VSS, EK, VICM Unit:V Parameter Input Offset Voltage VF S1 S2 S3 VDD VSS EK VICM Calculation VF1 ON ON OFF 5 0 -2.5 2.5 1 ON ON ON 2.7 0 1.35 2 VF2 -0.5 Large Signal Voltage Gain VF3 -2.1 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) 0 ON ON OFF 2.7 0 -1.35 VF5 3 1.8 VF6 2.5 Power Supply Rejection Ratio ON ON OFF VF7 0 -1.2 0 4 5.0 － Calculation－ 1. Input Offset Voltage (VIO) |VF1| VIO = [V] 1+RF/RS ΔEK × (1+RF/RS) 2. Large Signal Voltage Gain (AV) Av = 20Log 3. Common-mode Rejection Ratio (CMRR) CMRR= 20Log ΔVICM × (1+RF/RS) |VF4 - VF5| [dB] 4. Power Supply Rejection Ratio (PSRR) PSRR = 20Log ΔVDD × (1+ RF/RS) |VF6 - VF7| [dB] |VF2-VF3| [dB] 0.1µF RF=50kΩ 0.01µF 500kΩ SW1 VDD EK RS=50Ω RI=10kΩ 15V Vout 500kΩ 0.1µF 0.1µF DUT NULL SW3 RS=50Ω RI=10kΩ 1000pF VF RL VICM SW2 50kΩ VSS VRL -15V Figure 67. Test Circuit1 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 30/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Application Information - continued Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unity Gain Frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON Input Voltage VH SW3 R2=100kΩ SW4 ● VDD=3V VL t － SW1 Input Wave Output Voltage SW2 ＋ SW5 SW6 SW8 SW7 SW9 SW10 SW11 SW12 90% SR=ΔV/Δt VH R1= 1kΩ VSS ΔV -IN RL 10% CL +IN VL Vo Δt t Output Wave Figure 68. Test Circuit 2 Figure 69. Slew Rate Input and Output Wave R2=100kΩ R2=100kΩ VDD VDD R1=1kΩ R1=1kΩ OUT1=0.5Vrms IN OUT2 R1//R2 R1//R2 VSS VSS 100×OUT1 CS=20Log OUT2 Figure 70. Test Circuit 3 (Channel Separation) www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 31/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Application Example ○Voltage Follower Voltage gain is 0dB. VDD Using this circuit, the output voltage (VOUT) is configured to be equal to the input voltage (VIN). This circuit also stabilizes the output voltage (VOUT) due to high input impedance and low output impedance. Computation for output voltage (VOUT) is shown below. VOUT VIN VOUT=VIN VSS Figure 71. Voltage Follower ○Inverting Amplifier R2 VDD VIN For inverting amplifier, input voltage (VIN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression R1 VOUT VOUT=-(R2/R1)・VIN This circuit has input impedance equal to R1. R1// R2 VSS Figure 72. Inverting Amplifier Circuit ○Non-inverting Amplifier R1 R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the expression below: VDD VOUT=(1 + R2/R1)・VIN VOUT VIN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. VSS Figure 73. Non-inverting Amplifier Circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 32/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to rise above the ambient temperature. There is an allowable temperature that the IC can handle, and this depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 74(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation (Pd). θJA = (TJmax－TA) / Pd °C/W The derating curve in Figure 74(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by thermal resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figures 74(c), 74(d), and 74(e) show the example of the derating curves for LMR821G, LMR822xxx, and LMR824xxx. Power Dissipation of LSI [W] θJA=(Tjmax-TA)/ Pd °C/W Power Dissipation of IC Pdmax Ambient Temperature, TA [ °C ] P2 θJA2 < θJA1 θJA2 P1 TJmax θJA1 Chip Surface Temperature, TJ [ °C ] 0 25 50 75 100 125 150 Ambient Temperature, TA [ °C ] (b) Derating Curve (a) Thermal Resistance 0.8 0.8 LMR821G Power Dissipation [W] Power Dissipation [W] LMR822F (Note 42) (Note 41) 0.6 0.4 0.2 0.0 0 25 50 75 85 LMR822FV (Note 43) LMR822FVT (Note 43) LMR822FVM (Note 44) 0.4 LMR822FVJ (Note 44) 0.2 0.0 100 125 150 0 Ambient Temperature [°C] 25 50 75 85 100 125 150 Ambient Temperature [°C] (d) LMR822xxx (c) LMR821G www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 LMR822FJ (Note 41) 0.6 33/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet 1.2 Power Dissipation [W] LMR824FVJ (Note 47) 0.8 LMR824FJ (Note 46) 0.4 LMR824F (Note 45) 0.0 0 25 50 75 85 100 125 150 Ambient Temperature [°C] (e) LMR824xxx Figure 74. Thermal Resistance and Derating Curve (Note 41) (Note 42) (Note 43) (Note 44) (Note 45) (Note 46) (Note 47) Unit 5.4 5.5 5.0 4.7 4.5 8.2 6.8 mW/°C When using the unit above TA=25°C, subtract the value above per °C. Power dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 34/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration A rise in temperature that causes the chip to exceed its power dissipation rating may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case the absolute maximum rating is exceeded, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. In-rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result to IC damage. Avoid adjacent pins from being shorted to each other, especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in a very humid environment), and unintentional solder bridge deposited in between pins during assembly. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 35/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Operational Notes – continued 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When VSS > Pin A and VSS > Pin B, the P-N junction operates as a parasitic diode. When VSS > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the VSS voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 75. Example of Monolithic IC Structure 12. 13. 14. Unused Circuits When there are unused op-amps, it is recommended that they are connected as in Figure 76, setting the non-inverting input terminal to a potential within the –IN phase input voltage range (VICM). VDD Keep this potential in VICM VICM Input Voltage Applying VSS-0.3V to VDD+0.3V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. VSS Figure 76. Example of Application Circuit for Unused Op-Amp Power Supply (Single/Dual) The operational amplifiers operate as long as voltage is supplied between VDD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 15. Output Capacitor If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 0.1µF between output pin and VSS pin. 16. Oscillation by Output Capacitor Pay attention to the oscillation by caused by the output capacitor and in designing an application of negative feedback loop circuit with these ICs. 17. Latch-up Be careful not to set the input voltage higher than VDD or lower than VSS because a peculiar latch-up state in CMOS device might occur. In addition, protect the IC from any abormal noise. 18. Decoupling Capacitor Insert a decoupling capacitor between VDD and VSS. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 36/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 37/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name SOP8 (Max 5.35 (include.BURR)) (UNIT : mm) PKG : SOP8 Drawing No. : EX112-5001-1 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 38/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J8 39/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP-B8 40/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B8 41/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 MSOP8 42/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B8J 43/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name SOP14 (UNIT : mm) PKG : SOP14 Drawing No. : EX113-5001 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 44/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SOP-J14 45/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 TSSOP-B14J 46/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Marking Diagram SSOP5(TOP VIEW) SOP8(TOP VIEW) Part Number Marking Part Number Marking LOT Number 1PIN MARK LOT Number SSOP-B8(TOP VIEW) SOP-J8(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8(TOP VIEW) Part Number Marking MSOP8(TOP VIEW) Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8J(TOP VIEW) SOP14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK SOP-J14(TOP VIEW) TSSOP-B14J (TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 1PIN MARK 47/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Marking Diagram - continued Product Name LMR821 Package Type Marking SSOP5 L3 G LMR822 F SOP8 L822 FJ SOP-J8 R822 FV SSOP-B8 R822 FVT TSSOP-B8 R822 FVM MSOP8 R822 FVJ TSSOP-B8J R822 F SOP14 LMR824F FJ SOP-J14 LMR824FJ FVJ TSSOP-B14J R824 LMR824 Land Pattern Data All dimensions in mm Land length Land width ≥ℓ 2 b2 PKG Land pitch e Land space MIE SSOP5 0.95 2.4 1.0 0.6 1.27 4.60 1.10 0.76 1.27 3.90 1.35 0.76 SSOP-B8 TSSOP-B8 TSSOP-B14J 0.65 4.60 1.20 0.35 MSOP8 0.65 2.62 0.99 0.35 TSSOP-B8J 0.65 3.20 1.15 0.35 SOP8 SOP14 SOP-J8 SOP-J14 SOP8, SOP-J8, SSOP-B8, MSOP8, TSSOP-B8, TSSOP-B8J, SOP14, SOP-J14, TSSOP-B14J SSOP5 e e e ℓ2 MIE MIE ? b2 b2 ℓ2 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 48/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 LMR821G LMR822xxx LMR824xxx Datasheet Revision History Date Revision 18.Jan.2013 2.Aug.2013 15.Oct.2013 3.Dec.2013 10.Oct.2014 11.May.2015 001 002 003 004 005 006 Changes New Release LMR822F is added. The Limit value change of LMR822F (MAX value change in Input Offset Voltage.) LMR822FJ, LMR822FV, LMR822FVT, LMR822FVM, and LMR822FVJ added LMR824F is added. LMR824FJ, and LMR824FVJ are added. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 49/49 TSZ02201-0RAR0G200490-1-2 11.May.2015 Rev.006 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001