SML522BUWT86

SML-52 Series Datasheet Features Outline • 2-color type LED • Abundant 2 color variations Size Color Type 1315 (0605) 1.3×1.5mm (t=0.6mm) B U M U M D M Y Recommended Solder Pattern Dimensions SML-5228W series / SML522BUW SML-522MUW (unit : mm) (Note) Tolerance is 0.1mm, unless otherwise specified. (unit : mm) Specifications Absolute Maximum Ratings (Ta=25ºC) Part No. Power Forward Emitting InGaN Blue 66 AIGaInP Red 50 Color SML-522MD8W SML-522MY8W AIGaInP AIGaInP AIGaInP Peak Forward Forward Voltag VF Reverse Current IR Typ. (V) Max. (mA) (A) VR (V) 476 9 22 617 624 629 10 21 Yellowish Green 569 Red 617 572 575 16 40 620 623 25 63 569 572 575 10 25 Orange 602 605 608 40 100 Yellowish Green 569 572 575 16 40 587 590 593 40 63 Yellowish Green 5 40～85 100*2 10 5 1.9 20 54 5 40～100 4 2.2 20 100 4 Yellow Part No. Chip Structure SML-522MUW AIGaInP Dominant Wavelength D Luminous Intensity IV IF IF Min. Typ. (nm) (nm) (nm) (mA) (mcd) (mcd) (mA) Min.*3 Typ. Max.*3 470 60* 2 2.9 IF 465 SML522BU1W SML-522MU8W Electrical and Optical Characteristics (Ta=25ºC) Reverse Operating Temp. Storage Temp. Dissipation Current Current Voltage PD(mW) IF(mA) IFP(mA) VR(V) Topr(ºC) Tstg(ºC) Chip Structure Emitting Color Absolute Maximum Ratings (Ta=25ºC) Power Forward Peak Forward Reverse Operating Temp. Storage Temp. Dissipation Current Current Voltage PD(mW) IF(mA) IFP(mA) VR(V) Topr(ºC) Tstg(ºC) Yellowish Green 52 Red 50 20 60*1 4 30～85 40～85 Forward Voltag VF Typ. (V) 2.1 1.9 IF 5 20 5 20 Electrical and Optical Characteristics (Ta=25ºC) Reverse Current IR Luminous Intensity IV Peak Wavelength λp VR (mA) Max. (A) (V) 20 100 4 Min. (nm) Typ. (nm) IF IF Max. Min. Typ. (nm) (mA) (mcd) (mcd) (mA) - 570 - - 630 - 20 14 40 22 63 20 1:Duty1/5, 1ms　2:Duty1/10, 1kHz　3: Tolerance　±1nm www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 1/9 2016.09 - Rev.I Data Sheet SML-52 Series Electrical Characteristics Curves Fig.2 Luminous Intensity Atmosphere Temperature Fig.1 Forward Current - Forward Voltages SML522BU1W (U) SML522BU1W (B) RELATIVE LUMINOUS INTENSITY [a.u.] FORWARD CURRENT : IF [mA] 100 Ta=25ºC 10 1 1.4 1.8 2.2 2.6 3.0 MAXIMUM FORWARD CURRENT : IF [mA] RELATIVE LUMINOUS INTENSITY [a.u.] Ta=25ºC 2.0 1.0 0.0 12 16 0.6 　 SML522BU1W (U) SML522BU1W (B) 0.2 -20 0 20 40 60 80 100 Fig.4 Derating 3.0 8 1 ATMOSPHERE TEMPERATURE : Ta [ºC] 4.0 4 1.4 -40 Fig.3 Luminous Intensity - Forward Current 0 IF=5mA 3.4 FORWARD VOLTAGE : VF [V] SML522BU1W (U) SML522BU1W (B) 1.8 20 30 SML522BU1W (U) SML522BU1W (B) 20 10 0 -40 FORWARD CURRENT : IF [mA] -20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta [ºC] (Note) In case of lighting a single color. The value is based on the die destruction endurance; optical characteristics are NOT considered.. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 2/9 2016.09 - Rev.I Data Sheet SML-52 Series Electrical Characteristics Curves Fig.2 Luminous Intensity Atmosphere Temperature Fig.1 Forward Current - Forward Voltages SML-522MUW (U) SML-522MUW (M) RELATIVE LUMINOUS INTENSITY [a.u.] FORWARD CURRENT : IF [mA] 100 Ta=25ºC 10 1 1.4 1.6 1.8 2.0 2.2 1.6 IF=20mA 1.4 1.2 1 0.8 　0.6 SML-522MUW (U) SML-522MUW (M) 0.4 -40 2.4 FORWARD VOLTAGE : VF [V] MAXIMUM FORWARD CURRENT : IF [mA] RELATIVE LUMINOUS INTENSITY [a.u.] Ta=25ºC 1.0 0.8 0.6 0.4 0.2 0.0 4 8 12 16 40 60 80 100 30 SML-522MUW (U) SML-522MUW (M) 20 10 0 -40 20 FORWARD CURRENT : IF [mA] www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 20 Fig.4 Derating 1.2 0 0 ATMOSPHERE TEMPERATURE : Ta [ºC] Fig.3 Luminous Intensity - Forward Current SML-522MUW (U) SML-522MUW (M) -20 -20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta [ºC] 3/9 2016.09 - Rev.I Data Sheet SML-52 Series Electrical Characteristics Curves Fig.2 Luminous Intensity Atmosphere Temperature Fig.1 Forward Current - Forward Voltages SML-522MU8W SML-522MD8W SML-522MY8W SML-522MU8W SML-522MD8W SML-522MY8W (U) (D) (Y) (M) (M) (M) RELATIVE LUMINOUS INTENSITY [a.u.] FORWARD CURRENT : IF [mA] 100 Ta=25ºC 10 1 1.6 1.8 2.0 2.2 2.4 1.6 IF=20mA 1.4 1.2 1 0.8 　0.6 0.4 2.6 -40 FORWARD VOLTAGE : VF [V] MAXIMUM FORWARD CURRENT : IF [mA] RELATIVE LUMINOUS INTENSITY [a.u.] 1.0 Ta=25ºC 0.8 0.6 0.4 0.2 0.0 0 4 8 12 16 20 40 60 80 100 30 SML-522MU8W SML-522MD8W SML-522MY8W SML-522MU8W SML-522MD8W SML-522MY8W (U) (D) (Y) (M) (M) (M) 20 10 0 -40 20 FORWARD CURRENT : IF [mA] www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 0 Fig.4 Derating 1.2 (U) (D) (Y) (M) (M) (M) -20 (U) (D) (Y) (M) (M) (M) ATMOSPHERE TEMPERATURE : Ta [ºC] Fig.3 Luminous Intensity - Forward Current SML-522MU8W SML-522MD8W SML-522MY8W SML-522MU8W SML-522MD8W SML-522MY8W SML-522MU8W SML-522MD8W SML-522MY8W SML-522MU8W SML-522MD8W SML-522MY8W -20 0 20 40 60 80 100 AMBIENT TEMPERATURE : Ta [ºC] 4/9 2016.09 - Rev.I Data Sheet SML-52 Series Viewing Angle SML522BU1W (U/B) SML-522MUW (U/M) SCANNING ANGLE (deg) X-Y M/B U 20° 10° 0° 10° 20° 30° 30° 20° 50° 30° 40° 60° 70° 80° 80° 90° 100 50 50° 70° 80° 80° 90° 100 50 RELATIVE INTENSITY 0 90° 100 50 RELATIVE INTENSITY SML-522xx8W SCANNING SCANNING ANGLE ANGLE (deg) (deg) X-Y 20° 60° 70° 70° 0 10° 50° 60° 60° 50 0° 40° 50° 90° 100 10° 30° 40° 40° SML522BU1W (U) SML-522MUW (U) SML522BU1W (B) SML-522MUW (M) SCANNING ANGLE (deg) X’ - Y’ M/B U SML-522xx28W (U/D/Y) SML-522xx8W (M) SCANNING ANGLE (deg) M U/D 20° 10° 0° 10° X’ - Y’ M U/D 20° 30° 30° 10° 20° 30° 40° 60° 70° 70° 80° 80° 80° 80° 90° 100 50 50° 60° 70° 70° 0 0° 50° 60° 60° 50 10° 40° 50° 50° 90° 100 20° 30° 40° 40° 90° 100 RELATIVE RELATIVE INTENSITY INTENSITY 50 0 50 90° 100 RELATIVE INTENSITY Rank Reference of Brightness (Ta=25ºC, IF＝20mA) Part No. SML-522MUW SML-522MU8W SML-522MD8W SML-522MY 8W Rank Iv (mcd) Red K L M N P Q R S T U 4.0～6.3 6.3～10 10～16 16～25 25～40 40～63 63～100 100～160 160～250 250～400 U M Yellowish Green Red U M Yellowish Green Orange D M Yellowish Green Y ellow Y M Yellowish Green (Ta=25ºC, IF＝5mA) Part No. SML522BU1W Rank Iv (mcd) Red Blue K L M N P Q R S T U 3.6～5.6 5.6～9 9～14 14～22 22～36 36～56 56～90 90～140 140～220 220～360 U B Measurement tolerance ±10% www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 5/9 2016.09 - Rev.I Data Sheet ＋0.1 0 5.5 0～0.5 1.95 8 φ1.5 1.75 4 ±0.1 2 ±0.05 3.5 Taping [T86] ±0.1 SML-52 Series 1.65 0.8 +0.1 -0.07 +1 0 0 -3 φ60 φ180 φ13 11.4 ±1 Packing quantity 4000pcs/reel Pull direction （Unit : mm) (note) Tolerance is within ±0.2mm unless otherwise specified Part No. Construction Packing Specification ROHM LED products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request. Please contact the nearest sales office or distributer if necessary. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 6/9 2016.09 - Rev.I SML-52 Series Data Sheet lPrecaution (Surface Mount Device) 1.Storage If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions: • Using Conditions Classification Temperature Humidity 1 Before using 5 to 30ºC 30 to 70%RH 2 After opening package 5 to 30ºC Below 70%RH Expiration Date Remark Within 1 year Storage with waterproof package from Receiving Within168h Please storing in the airtight container with our desiccant (silica gel) • Baking Bake the product in case of below: 1 The expiration date is passed. 2 The color of indicator (silica gel) turned from blue to colorless or from green to pink. (Even if the product is within the expiration date.) • Baking Conditions Temperature 60±3ºC Remark Time 12 to 24h Humidity Below 20%RH • Bake products in reel. • Reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. • Recommend bake once. 2.Application Methods 2-1. Precaution for Drive System and Off Mode Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the products with the Ag-paste used in the die bonding, there’s high possibility to cause electro migration and result in function failure. 2-2. Derating The Derating Characteristics are based on the lifetime of luminous intensity and assumption of degradation & color change of sealing resin or reflector. About its reliability, please evaluate its using conditions and environment and use it after confirmed there is no problem. 2-3. Operation Life Span There’s possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases), please call our Sales staffs for inquiries about the concerned application below. 1 Longtime intensity of light life 2 On mode all the time 2-4.Applied Stress on Product The top of the LED is very soft, which the silicon resin is used as sealing resin. Therefore, please pay attention to the overstress on it which may influence its reliability. 2-5.Usage The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier, Switching and so on. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 7/9 2016.09 - Rev.I SML-52 Series Data Sheet 3. Others 3-1. Surrounding Gas Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (Ag-paste) materials. All of the above will cause function failure of the products. Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 3-2. Electrostatic Damage The product is part of semiconductor and electrostatic sensitive, there’s high possibility to be damaged by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. The resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries. 3-3. Electromagnetic Wave Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED, please refrain from it. Otherwise, there is no guarantee for product quality. 4.Mounting 4-1. Soldering • No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product’s reliability. • The product is not for flow soldering. • Do not expose the product in the environment of high temperature (over 100ºC) or rapid temperature shift (within 3ºC of temperature gradient) during the flow soldering of surrounding parts. • Please set appropriate reflow temperature based on our product usage conditions and specification. • The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. • Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. • For our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its reliability. Therefore, please be informed, concerning it before using it. 4-2. Automatic Mounting 4-2-1.Silicon Resin Sealing Product The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. 4-2-2.Mini Package (Smaller than 1608 size) Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. We recommend to • set magnet on parts feeder cassette of the mounter to control the product stabilization • set ionizer to prevent electrostatic charge 4-3. Mounting Location The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. Stress strength according to the mounting position: A>B>C>D www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 8/9 2016.09 - Rev.I SML-52 Series Data Sheet *The product has adopted the electrode structure that it should solder with back electrode of the product. Thus, please be informed that the shape of electrode pin of solder fillet formation is not guaranteed.The through hole on electrode surface is for conduction of front and rear electrodes but not for formation of solder fillet. 0.5mm 4-5. Soldering Pattern for Recommendation We recommend the soldering pattern that shows on the right. It will be different according to mounting situation of circuit board, therefore, please concern before designing. 0.6mm 2.45mm (Fig-1) 4-6. Reflow Profile For reflow profile, please refer to the conditions below:(*) • Meaning of marks, Conditions Mark Meanings Tsmax Maximum of pre-heating temperature Tsmin Minimum of pre-heating temperature Ts Time from Tsmin to Tsmax TL Reference temperature tL Retention time for TL TP Peak temperature tP Time for peak temperature ΔTR/Δt Temperature rising rate ΔTD/Δt Temperature decreasing rate 1.3mm 4-4. Mechanical Stress after Mounting The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on product. Conditions 180ºC 140ºC Over 60sec. 230 to 260ºC Within 40sec. 260ºC(Max) Within 10sec. Under 3ºC/sec. Over -3ºC/sec. *Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer’s own conditions. 4-7.Attention Points in Soldering Operation This product was developed as a surface mount LED especially suitable for reflow soldering. So reflow oldering is recommended. Incase of implementing manual soldering, please take care of following points. SOLDER USED Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu 2 HAND SOLDERING CONDITION LED products do not contain reinforcement material such as a glass fillers. So thermal stress by soldering greatly influence its reliability. Please keep following points for manual soldering. SOLDERING IRON ITEM RECOMMENDED CONDITION Fig-1 Condition ) Temp. of iron top less than 400℃ Heating a) within 3 sec. method Heating on PCB pattern, not direct to the LED. (Fig-1) Handling after Please handle after the part temp. b) soldering Goes down to room temp. 1 4-8. Cleaning after Soldering Please follow the conditions below if the cleaning is necessary after soldering. Solvent Temperature Ultrasonic Cleaning Drying SOLDERING LAND We recommend to use alcohols solvent such as, isopropyl alcohols Under 30ºC within 3 minutes 15W / Below 1 liter (capacity of tank) Under 100ºC within 3 minutes www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. 9/9 2016.09 - Rev.I Notice Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications : 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM. 4) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 5) The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. 6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 7) The Products specified in this document are not designed to be radiation tolerant. 8) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 9) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. 11) ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 12) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 13) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. R1102A