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CX1HGO.T.SM4

CX1HGO.T.SM4

  • 厂商:

    RSG

  • 封装:

  • 描述:

    CX1HGO.T.SM4 - 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal - RSG Electroni...

  • 数据手册
  • 价格&库存
CX1HGO.T.SM4 数据手册
CX1HGSM AT CRYSTAL 8 MHz to 250 MHz High Shock Miniature Surface Mount AT Quartz Crystal ™ Fundamental Mode: 8 MHz - 250 MHz Third Overtone Mode: 48 MHz - 160 MHz DESCRIPTION actual size STATEK’s miniature CX1HGSM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These rugged crystals are designed for applications requiring exceptional shock and vibration survival. FEATURES glass lid XX SXX ceramic lid side view High shock and vibration resistance Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques Low profile hermetically sealed ceramic package Available with glass or ceramic lid Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS PACKAGE DIMENSIONS D A TOP BOTTOM E D B E C Industrial Down-hole Data Recorder Process Control Environmental Control Engine Control Telemetry Ruggedized Instrumentation Automotive Control Military & Aerospace Smart Munitions Timing Devices (Fuzes) Surveillance Devices Missile Telemetry Ruggedized Communications Aviation Equipment SM1 SM2/SM4 SM3/SM5 DIM A B C D E TYPICAL inches 0.315 0.140 0.045 0.060 mm 8.00 3.56 1.14 1.52 MAXIMUM inches 0.330 0.155 0.055 0.070 mm 8.38 3.94 1.40 1.78 see below THICKNESS (DIM C) MAXIMUM GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.070 0.072 0.075 mm 1.78 1.83 1.90 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 10 MHz 32 MHz 155.52 MHz Motional Resistance R1 (Ω) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerance Load Capacitance2 Drive Level Frequency-Temperature Stability1,3 1 30 5.5 100 2.2 + _ 25 6.2 30 2.3 15 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) 260OC for 20 sec. 100 ppm, or tighter as required Max Process Temperature 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ SUGGESTED LAND PATTERN 0.070 (1.78) 50 ppm to 100 ppm to 100 ppm to + _ + _ + _ 10 ppm (Commercial) 20 ppm (Industrial) 30 ppm (Military) inches (mm) 0.160 (4.06) Aging, first year4 Shock, survival 5 10 ppm MAX 10,000 g, 0.2 ms, 1/2 sine 6 0.270 (6.86) Vibration, survival 50 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC. 260OC for 20 sec. O O EQUIVALENT CIRCUIT Operating Temp. Range C0 1 L1 C1 R1 2 Storage Temp. Range Max Process Temperature 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Up to 100,000 g. Contact factory. 6. Per MIL-STD-202G, Method 204D, Condition E. Random vibration testing also available. R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance PACKAGING OPTIONS • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) HOW TO ORDER CX1HGSM AT CRYSTALS CX1 “S” if special or custom design. Blank if Std. S HG O.T. = 3RD O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M , Frequency M = MHz 100 Calibration Tolerance @ 25OC (in ppm) / 100 / — / I Frequency Stability over Temp. Range (in ppm) SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified OR — — 200 Total Frequency Tolerance (in ppm) I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10108 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90
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