CX2SO.T.CSM3

CX2SM AT CRYSTAL 9.6 MHz to 250 MHz ™ Low Profile, Miniature Surface Mount AT Quartz Crystal Fundamental Mode: Third Overtone: 9.6 MHz - 250 MHz 48 MHz - 160 MHz DESCRIPTION actual size STATEK’s miniature CX2SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a small footprint. The CX2SM crystal is manufactured using the STATEK-developed photolithographic process, and was designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. FEATURES glass lid XX SXX ceramic lid side view PACKAGE DIMENSIONS B 1 2 I G 3 F H A Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques. Hermetically sealed ceramic package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA APPLICATIONS C D E TYPICAL DIM A B C D E F G H I inches 0.260 0.094 0.035 0.059 0.050 0.105 0.155 0.210 mm 6.60 2.39 0.89 1.50 1.27 2.67 3.94 5.33 MAXIMUM inches 0.275 0.108 0.045 0.069 0.060 0.115 0.165 0.220 mm 6.99 2.74 1.14 1.75 1.52 2.92 4.19 5.59 Medical Infusion Pumps Industrial, Computer & Communications Engine Control Down-hole Data Recorder Military & Aerospace Communications Smart Munitions Timing Devices (Fuzes) Surveillance Devices see below THICKNESS (DIM C) MAXIMUM GLASS LID inches SM1 SM2/SM4 SM3/SM5 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.075 0.077 0.080 mm 1.91 1.96 2.03 Note: Terminal 1 is electrically connected internally to terminal 3 10136 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90 SPECIFICATIONS TERMINATIONS O Specifications are typical at 25 C unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency Motional Resistance (R1) Motional Capacitance C1 (fF) Quality Factor Q (k) Shunt Capacitance C0 (pF) Calibration Tolerance1 Load Capacitance Drive Level Frequency-Temperature Stability1,3 2 10 MHz 60 2.8 95 1.4 + _ 32 MHz 155.52 MHz 25 6.2 30 2.3 10 4.0 30 2.3 Designation SM1 SM2 SM3 SM4 SM5 Termination Gold Plated (Lead Free) Solder Plated Solder Dipped Solder Plated (Lead Free) Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. PACKAGING OPTIONS 100 ppm, or tighter as required • Tray Pack • 16mm tape, 7” or 13” reels Per EIA 481 (see Tape and Reel data sheet 10109) SUGGESTED LAND PATTERN 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz + _ + _ + _ 50 ppm to 100 ppm to + _ + _ 10 ppm (Commercial) 20 ppm (Industrial) 0.070 (1.78) Aging, first year4 Shock, survival5 Vibration, survival 6 _ 100 ppm to + 30 ppm (Military) 5 ppm MAX (better than 1 ppm available) 3,000 g, 0.3 ms, 1/2 sine 20 g, 10-2,000 Hz swept sine -10 C to +70 C (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) -55OC to +125OC 260 C for 20 sec. EQUIVALENT CIRCUIT O O O Operating Temp. Range 0.1 14 (2.90) Storage Temp. Range Max Process Temperature 0.105 (2.67) 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Higher shock version available. 6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. C0 1 L1 C1 R1 2 R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance HOW TO ORDER CX2SM AT CRYSTALS CX2 “S” if special or custom design. Blank if Std. S O.T. = 3RD O.T. Mode Blank = Fundamental Mode C C = Ceramic Lid Blank = Glass Lid SM1 – 32.0M Frequency M = MHz , 100 Calibration Tolerance @ 25OC (in ppm) / 100 Frequency Stability over Temp. Range (in ppm) / — / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) OR — / — / 200 Total Frequency Tolerance (in ppm) / I Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified 10136 - Rev B S YS ERT T E M C IFIC T A RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de 01 Pb N IO IS O 90