CX2SSM3

CX2SM CRYSTAL 760 kHz to 1.35 MHz Low Profile Miniature ™ Surface Mount Quartz Crystal DESCRIPTION actual size The CX2SM quartz crystals are leadless devices designed for surface mounting on printed circuit boards or hybrid substrates. They are hermetically sealed in a rugged, miniature ceramic package. They are manufactured using the STATEK-developed photolithographic process, and were designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications. Maximum process temperature should not exceed 260O C. FEATURES side view Glass Lid Shown PACKAGE DIMENSIONS B 1 Extensional mode Ideal for use with microprocessors Designed for low power applications Compatible with hybrid or PC board Low aging Full military testing available Ideal for battery operated applications Designed and manufactured in the USA EQUIVALENT CIRCUIT C D E 3 F 2 I G H A TYP. DIM A B inches 0.260 0.094 0.035 0.059 0.050 0.105 0.155 0.210 mm 6.60 2.39 0.89 1.50 1.27 2.67 3.94 5.33 inches 0.275 0.108 0.045 0.069 0.060 0.115 0.165 0.220 MAX. mm 6.99 2.74 1.14 1.75 1.52 2.92 4.19 5.59 C0 1 L1 C1 R1 2 C D E F G H I see below R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance SUGGESTED LAND PATTERN DIM “C” 0.105 (2.67) GLASS LID inches 0.065 0.067 0.070 mm 1.65 1.70 1.78 CERAMIC LID inches 0.075 0.077 0.080 mm 1.91 1.96 2.03 MAX SM1 SM2 SM3 0.113 (2.87) 0.060 (1.52) inches (mm) GRID COURTYARD 1 2 0.060 (1.52) Note: Terminal 1 is electrically connected internally to terminal 3 10135 - Rev B S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01 SPECIFICATIONS TYPICAL APPLICATION FOR A PIERCE OSCILLATOR Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Frequency Range 760 kHz - 1.35 MHz Functional Mode Extensional + _ 500 ppm (0.05%) Calibration Tolerance* + _ 1000 ppm (0.1%) + _ 10000 ppm (1.0%) Load Capacitance 7 pF Motional Resistance (R1) 5 kΩ MAX Motional Capacitance (C1) 1.2fF Quality Factor (Q) 150 k Shunt Capacitance (C0) 1.0 pF Drive Level 3 µW MAX Turning Point (T0)** 35OC Temperature Coefficient (k) -0.035 ppm/OC2 Aging, first year 5 ppm MAX Shock, survival 1000 g peak, 0.3 ms,1/2 sine Vibration, survival 10 g RMS, 20-1,000 Hz random Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. Note: Frequency f at temperature T is related to frequency f0 at turning point temperature T0 by: f-f0 2 = k (T-T0) f0 * Tighter frequency calibration available. ** Other turning points available. The low profile CX miniature surface mount crystal is ideal for small, high density, battery operated portable products. The CX crystal designed in a Pierce oscillator (single inverter) circuit provides very low current consumption and high stability. A conventional CMOS Pierce oscillator circuit is shown below. The crystal is effectively inductive and in a PI-network circuit with CD and CG provides the additional phase shift necessary to sustain oscillation. The oscillation frequency (f0) is 15 to 150 ppm above the crystal’s series resonant frequency (fS). Drive Level RA is used to limit the crystal’s drive level by forming a voltage divider between RA and CD. RA also stabilizes the oscillator against changes in the amplifiers output resistance (R0). RA should be increased for higher voltage operation. Load Capacitance The CX crystal calibration tolerance is influenced by the effective circuit capacitances, specified as the load capacitance (CL). CL is approximately equal to: CL = CD x CG CD + CG + CS (1) NOTE: CD and CG include stray layout to ground and CS is the stray shunt capacitance between the crystal terminal. In practice, the effective value of CL will be less than that calculated from CD, CG and CS values because of the effect of the amplifier output resistance. CS should be minimized. The oscillation frequency (f0) is approximately equal to: f0 = fS 1 + Where f S C1 C0 [ C1 2(C0 + CL) ] (2) TERMINATIONS Designation SM1 SM2 SM3 Termination Gold Plated Solder Plated Solder Dipped = Series resonant frequency of the crystal = Motional Capacitance = Shunt Capacitance CONVENTIONAL CMOS PIERCE OSCILLATOR CIRCUIT PACKAGING OPTIONS Rf BUFFER OSC Freq (fO ) CX2SM - Tray Pack -16mm tape, 7” or 13” reels (Reference tape and reel data sheet 10109) HOW TO ORDER CX2SM CRYSTALS CX2 S C SM1 1.0M, Frequency K = kHz M = MHz Calibration Tolerance @ 25OC (in ppm) AMPLIFIER M RA 500 / Blank = Glass Lid C = Ceramic Lid “S” if special or custom design. Blank if Std. SM1 = Gold Plated SM2 = Solder Plated SM3 = Solder Dipped Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified CG CX2 CD 10135 - Rev B S YS ERT T E M C IFIC T A N IO RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de IS O 90 01