STM4460
S a mHop Microelectronics C orp.
Ver 1.0
N-Channel Enhancement Mode Field Effect Transistor
PRODUCT SUMMARY
V DSS
40V
FEATURES Super high dense cell design for low R DS(ON). Rugged and reliable. Suface Mount Package.
ID
7A
R DS(ON) (m Ω) Max
32 @ VGS=10V 45 @ VGS=4.5V
D D
5 6 7 8
4 3 2 1
G S S S
S O-8 1
D D
ABSOLUTE MAXIMUM RATINGS ( T A=25 °C unless otherwise noted ) Symbol VDS VGS ID IDM EAS PD TJ, TSTG Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous
b a
TA=25°C TA=70°C
d
Limit 40 ±20 7 5.6 28 9
Units V V A A A mJ W W °C
-Pulsed Single Pulse Avalanche Energy Maximum Power Dissipation
a
TA=25°C TA=70°C
2.5 1.6 -55 to 150
Operating Junction and Storage Temperature Range
THERMAL CHARACTERISTICS R JA Thermal Resistance, Junction-to-Ambient
a
50
°C/W
Details are subject to change without notice.
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STM4460
Ver 1.0
ELECTRICAL CHARACTERISTICS ( T A=25 °C unless otherwise noted )
Symbol Parameter Conditions
VGS=0V , ID=250uA VDS=32V , VGS=0V
Min 40
Typ
Max
Units V
OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS Zero Gate Voltage Drain Current IDSS Gate-Body Leakage Current IGSS ON CHARACTERISTICS Gate Threshold Voltage VGS(th) RDS(ON) gFS Drain-Source On-State Resistance Forward Transconductance
VGS= ±20V , VDS=0V
1 ±100
uA nA
VDS=VGS , ID=250uA VGS=10V , ID=7A VGS=4.5V , ID=6A VDS=10V , ID=7A
1
1.9 26 33 16
3 32 45
V m ohm m ohm S pF pF pF ns ns ns ns nC nC nC nC
DYNAMIC CHARACTERISTICS c Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS SWITCHING CHARACTERISTICS tD(ON) Turn-On Delay Time tr Rise Time tD(OFF) Turn-Off Delay Time tf Fall Time Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge
c
VDS=20V,VGS=0V f=1.0MHz
635 95 55 11 12 17 11 11 5.1 1.7 3 7 0.98 1.3
VDD=20V ID=7A VGS=10V RGEN=3.3 ohm VDS=20V,ID=7A,VGS=10V VDS=20V,ID=6A,VGS=4.5V VDS=20V,ID=7A, VGS=10V
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS Maximum Continuous Drain-Source Diode Forward Current IS VSD Diode Forward Voltage VGS=0V,IS=7A
A V
Notes
_ a.Surface Mounted on FR4 Board,t < 10sec. _ _ b.Pulse Test:Pulse Width < 300us, Duty Cycle < 2%. c.Guaranteed by design, not subject to production testing. d.Starting TJ=25°C,L=0.5mH,RG=25Ω,VDD=20V.(See Figure13)
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S TM4460
Ver 1.0
30 VGS=4.5V VGS=10V 20
I D, Drain Current(A)
I D, Drain Current(A)
24 VGS=4V 18 VGS=3.5V
15
10 25 C 5 Tj=125 C -55 C 0
12
VGS=3V
6 VGS=2.5V 0 0 0.5 1 1.5 2 2.5 3
0
0.8
1.6
2.4
3.2
4.0
4.8
V DS, Drain-to-Source Voltage(V)
VGS, Gate-to-Source Voltage(V)
Figure 1. Output Characteristics
60 50 40 30 VGS=10V 20 10 1
Figure 2. Transfer Characteristics
1.5 1.4
R DS(on), On-Resistance Normalized
1.3 1.2 1.1 1.0 0.0
RDS(on)(m Ω)
VGS=4.5V
VGS=4.5V ID=6A
VGS=10V ID=7A
1
6
12
18
24
30
0
25
50
75
100
125
150
T j ( °C )
ID, Drain Current(A)
Tj, Junction Temperature(° C )
Figure 3. On-Resistance vs. Drain Current and Gate Voltage
1.3
Figure 4. On-Resistance Variation with Drain Current and Temperature
BVDSS, Normalized Drain-Source Breakdown Voltage
1.3 ID=250uA 1.2 1.1 1.0 0.9 0.8 0.7 -50 -25 0 25 50 75 100 125 150
Vth, Normalized Gate-Source Threshold Voltage
1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75
VDS=VGS ID=250uA
100 125 150
Tj, Junction Temperature( ° C )
Tj, Junction Temperature(° C )
Figure 5. Gate Threshold Variation with Temperature 3
Figure 6. Breakdown Voltage Variation with Temperature
Jun,18,2008
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S TM4460
Ver 1.0
72 60 75 C
20.0
Is, Source-drain current(A)
ID=7A
10.0
25 C
R DS(on)(m Ω)
48 125 C 36 25 C 24 12 0
125 C 75 C
0
2
4
6
8
10
1.0
0.2
0.5
0.8
1.1
1.4
1.7
V GS, Gate-to-Source Voltage(V)
V SD, Body Diode Forward Voltage(V)
Figure 7. On-Resistance vs. Gate-Source Voltage
900
Figure 8. Body Diode Forward Voltage Variation with Source Current
10
V GS, Gate to Source Voltage(V)
750
C, Capacitance(pF)
Ciss 600 450 300 150 0 0 Crss 5 10 15 20 25 30 Coss
8 6 4 2 0 0
VDS=20V ID=7A
2
4
6
8
10
12
14 16
V DS, Drain-to-Source Voltage(V)
Qg, Total Gate Charge(nC)
Figure 9. Capacitance
Figure 10. Gate Charge
220
60
) ON Li m it
1m 10 m s
10
s
TD(off )
I D, Drain Current(A)
Switching Time(ns)
100 60 10
10
R
0u
DS
(
s
Tr
TD(on) Tf
1
V G S =10V S ingle P ulse T c=25 C
DC
1 1
VDS=20V,ID=7A VGS=10V
0.1 60 100 300 600 0.1
6 10
1
10
100
Rg, Gate Resistance(Ω)
VDS, Drain-Source Voltage(V)
Figure 11. switching characteristics
Figure 12. Maximum Safe Operating Area
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STM4460
Ver 1.0
15V
V ( BR )D S S
tp
VDS
L
D R IVE R
RG
20V
D .U .T
IA S tp
+ - VD D
A
0.0 1
IAS
Unclamped Inductive Test Circuit F igure 13a.
Unclamped Inductive Waveforms F igure 13b.
1
0.5
Normalized Transient Thermal Resistance
0.2
0.1
0.1 0.05 0.02 0.01 P DM
0.01
Single Pulse
1. 2. 3. 4.
t1 t2 R thJ A (t)=r (t) * R thJ A R thJ A =S ee Datas heet T J M-T A = P DM* R thJ A (t) Duty C ycle, D=t1/t2
0.001 0.0000 1
0.000 1
0.001
0.01
0. 1
1
10
100
1000
Square Wave Pulse Duration(sec)
Figure 14. Normalized Thermal Transient Impedance Curve
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S TM4460
Ver 1.0
PACKAGE OUTLINE DIMENSIONS SO-8
1 L
E D
0.015X45
A
e
0.05 TYP.
B
0.016 TYP.
A1
0.008 TYP.
C
H
MILLIME T E R S S Y MB OLS MIN A A1 D E H L 1 .35 0.10 4.80 3.81 5.79 0.41 0 MAX 1 .75 0.25 4.98 3.99 6.20 1.27 8 MIN 0.053 0.004 0.189 0.150 0.228 0.016 0
INC HE S MAX 0.069 0.010 0.196 0.157 0.244 0.050 8
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S TM4460
Ver 1.0
SO-8 Tape and Reel Data
SO-8 Carrier Tape
P1 D1 P2
A
E1 E2
B0
A0
D0
P0
A
TERMINAL NUMBER 1
T
SECTION A-A
K0
FEEDING DIRECTION
unit:
PACKAGE SOP 8N 150 A0
6.50 0.15
B0
5.25 0.10
K0
2.10 0.10
D0
1.5 (MIN)
D1
1.55 0.10
E
12.0 +0.3 - 0.1
E1
1.75 0.10
E2
5.5 0.10
E
P0
8.0 0.10
P1
4.0 0.10
P2
2.0 0.10
T
0.30 0.013
SO-8 Reel
W1
S G N
R H W
UNIT:
V
M
TAPE SIZE
12
REEL SIZE
330
M
330 1
N
62 1.5
W
12.4 + 0.2
W1
16.8 - 0.4
H
12.75 + 0.15
K
S
2.0 0.15
G
R
K V
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