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CIH05T7N5SNC

CIH05T7N5SNC

  • 厂商:

    SAMSUNG(三星)

  • 封装:

  • 描述:

    FIXD IND 7.5NH 300MA 370MOHM SMD

  • 数据手册
  • 价格&库存
CIH05T7N5SNC 数据手册
201310 Multilayer High Frequency inductor CIH05T Series (1005/ EIA 0402) APPLICATION Mobile communication systems, noise suppression at high frequency and Impedance matching. FEATURES RECOMMENDED LAND PATTERN  Lowest value of specific resistivity, good property of Q and high SRF.  Possible to use at range above 100MHz  Monolithic structure for high reliability.  Do not contain lead and support lead-free soldering.  RoHS compliant 0.45~ 0.45~0.55mm 0.55mm 1.25~1.55mm DIMENSION Type 05 Dimension [mm] L W t d 1.0±0.05 0.5±0.05 0.5±0.05. 0.25±0.1 DESCRIPTION Inductance Part No. Q (typical.) Q SRF (MHz) DC resistance Rated current (nH) (min) 500 800 @100MHz 100MHz MHz MHz CIH05T1N0□ 1.0±0.2nH,0.3nH 8 23 CIH05T1N2□ CIH05T1N5□ 1.2±0.2nH,0.3nH 8 1.5±0.2nH,0.3nH 8 CIH05T1N8□ 1.8±0.2nH,0.3nH 8 20 26 41 43 49 6000 0.14 300 CIH05T2N0□ CIH05T2N2□ 2.0±0.2nH,0.3nH 8 22 27 44 47 52 6000 0.16 300 2.2±0.2nH,0.3nH 8 22 27 44 47 52 6000 0.16 300 (Ω) Max. 1.8GHz 2.0GHz 2.4GHz 29 48 50 56 10000 23 29 48 50 56 10000 0.12 300 23 29 47 50 56 6000 0.13 300 Min 0.12 (mA) Max. 300 CIH05T2N4□ 2.4±0.2nH,0.3nH 8 22 27 44 47 52 6000 0.16 300 CIH05T2N7□ CIH05T3N0□ 2.7±0.2nH,0.3nH 8 22 27 43 45 50 6000 0.17 300 3.0± 0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 CIH05T3N3□ 3.3±0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 CIH05T3N6□ CIH05T3N9□ 3.6±0.2nH,0.3nH 8 24 30 46 48 53 6000 0.19 300 3.9±0.2nH,0.3nH 8 22 28 43 45 50 4000 0.22 300 CIH05T4N3□ 4.3±0.2nH,0.3nH 8 22 28 43 45 50 4000 0.24 300 CIH05T4N7□ CIH05T5N1□ 4.7±0.2nH,0.3nH 8 23 30 45 47 50 4000 0.24 300 5.1±0.2nH,0.3nH 8 22 28 42 43 45 4000 0.27 300 CIH05T5N6□ 5.6±0.2nH,0.3nH 8 22 28 42 43 45 4000 0.27 300 CIH05T6N2□ CIH05T6N8□ 6.2±0.2nH,0.3nH 8 22 28 40 41 41 3900 0.32 300 6.8±5%, 10% 8 22 28 40 41 41 3900 0.32 300 CIH05T7N5□ 7.5±5%, 10% 8 22 28 38 38 36 3600 0.37 300 CIH05T8N2□ CIH05T9N1□ 8.2±5%, 10% 8 22 28 38 38 36 3600 0.37 300 9.1±5%, 10% 8 22 28 37 36 31 3200 0.42 300 CIH05T10N□ 10.0±5%, 10% 8 22 28 37 36 31 3200 0.42 300 Ver 201310 Q (typical.) Inductance Q (nH) (min) 500 800 @100MHz 100MHz MHz MHz CIH05T12N□ CIH05T15N□ 12.0±5%, 10% 8 22 28 33 31 23 2700 0.5 300 15.0±5%, 10% 8 22 28 29 26 17 2300 0.55 300 CIH05T18N□ 18.0±5%, 10% 8 23 28 26 22 11 2100 0.65 250 CIH05T22N□ CIH05T27N□ 22.0±5%, 10% 8 22 27 21 14 2 1900 0.8 250 27.0±5%, 10% 8 20 23 10 3 - 1600 0.9 250 CIH05T33N□ 33.0±5%, 10% 8 20 23 3 - - 1300 1 250 CIH05T39N□ CIH05T47N□ 39.0±5%, 10% 8 20 21 - - - 1200 1.2 200 47.0±5%, 10% 8 19 20 - - - 1000 1.3 200 CIH05T56N□ 56.0±5%, 10% 8 19 18 - - - 750 1.4 180 CIH05T68N□ CIH05T82N□ 68.0±5%, 10% 8 17 15 - - - 750 1.4 180 82.0±5%, 10% 8 16 11 - - - 600 1.6 150 CIH05TR10□ 100.0±5%, 10% 8 15 9 - - - 600 1.6 130 Part No. SRF 1.8GHz 2.0GHz 2.4GHz (MHz) Min DC resistance (Ω) Max. Rated current (mA) Max. *Operating temperature range –55 to +125°C ※Tolerance (C :±0.2nH, S :±0.3nH, J :±5%, K :±10%) ※Measurement equipment & Jig: Agilent E4991A+16192A or Equivalent ※ The Rated Current is either the DC value at witch the internal Ls value is decreased within 5% with the application of DC_Current, or the value of current at which the temperature of the element is increased within 20℃ (Reference ambient temperature:20℃) PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) H (2) 05 (3) T (4) 10N (5) J (6) N (7) C (8) Chip Inductor (2) H:High frequency type Dimension (4) Material code(T:Dielectric material) Inductance(4N7:4.7nH, 10N:10nH, R10:100nH) (6) Tolerance(C:±0.2nH, S:±0.3nH, J:±5%, K:±10%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING Ver 201310 PACKAGING Packaging Style Quantity(pcs/reel) Card Board Taping 10,000 Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.
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