SPECIFICATION
(Reference sheet)
Samsung P/N : CL02A102KQ2NNNC
CAP, 1㎋, 6.3V, ±10%, X5R, 01005
Description :
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
① Series
② Size
CL
02
A
102
K
Q
2
N
N
N
C
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
Samsung Multi-layer Ceramic Capacitor
01005 (inch code)
L: 0.40 ± 0.02
③ Dielectric
④ Capacitance
⑤ Capacitance
tolerance
⑥ Rated Voltage
⑦ Thickness
X5R
1㎋
±10 %
6.3 V
0.20 ± 0.02 mm
mm
⑧ Inner electrode
Termination
Plating
⑨ Product
⑩ Special
⑪ Packaging
W:
0.20 ± 0.02 mm
Ni
Cu
Sn 100%
(Pb Free)
Normal
Reserved for future use
Cardboard type, 7" reel
B. Structure and dimension
Dimension(㎜)
Samsung P/N
CL02A102KQ2NNNC
L
W
T
BW
0.40±0.02
0.20±0.02
0.20±0.02
0.10±0.03
C. Samsung Reliability Test and Judgement condition
Performance
1㎑±10%
Capacitance
Tan δ (DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characteristics
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
0.1 max.
10,000Mohm or 100Mohm㎌
Whichever is smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
X5R
Test condition
1.0±0.2Vrms
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1 hour and maintained in
ambient air for 24±2 hours.
Rated Voltage
60~120 sec.
Visual inspection
250% of the rated voltage
(From -55℃ to 85℃, Capacitance change should be within ±15%)
No peeling shall be occur on the
100gF, for 10±1 sec.
terminal electrode
Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Vibration Test
Moisture
Resistance
High Temperature
Resistance
Temperature
Cycling
Capacitance change :
within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Tan δ, IR : initial spec.
Capacitance change :
Tan δ, IR : initial spec.
within ±5%
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours 3 direction (x, y, z)
within ±12.5% With rated voltage
Capacitance change :
Tan δ : 0.125 max
IR
: 500Mohm or 25Mohm ㎌
Whichever is smaller
Capacitance change : within ±12.5%
Tan δ : 0.125 max
IR
: 1,000Mohm or 50Mohm ㎌
Whichever is smaller
Capacitance change : within ±7.5%
Tan δ, IR : initial spec.
40±2℃, 90~95%RH, 500 +12/-0 hours
With 200% of the rated voltage
Max. operating temperature
1000+48/-0 hours
1 cycle condition
Min. operating temperature
→
→ Max. operating temperature →
5 cycles test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
25℃
25℃
- Disclaimer & Limitation of Use and Application The products listed in this Specification sheet are NOT designed and manufactured for any use
and applications set forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
We will NOT be liable for any damages resulting from any misuse of the products, specifically
including using the products for high reliability applications as listed below.
If you have any questions regarding this 'Limitation of Use and Application', you should first contact
our sales personnel or application engineers.
①
②
③
④
⑤
⑥
Aerospace/Aviation equipment
Automotive or Transportation equipment (vehicles, trains, ships, etc)
Medical equipment
Military equipment
Disaster prevention/crime prevention equipment
Any other applications with the same as or similar complexity or reliability to the applications
set forth above.
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