CL31B105KBH5PNE

Specification of Automotive MLCC • Samsung P/N : • Supplier : Samsung electro-mechanics • Product : Multi-layer Ceramic Capacitor CL31B105KBH5PNE CAP, 1㎌, 50V, ±10%, X7R, 1206 • Description : • AEC-Q 200 Specified A. Samsung Part Number ① Series ② Size ③ Dielectric ④ Capacitance ⑤ Capacitance tolerance ⑥ Rated Voltage ⑦ Thickness CL 31 B 105 K B H 5 P N E ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ Samsung Multi-layer Ceramic Capacitor 1206 (inch code) L: 3.2 ± 0.2 X7R 1㎌ ±10 % 50 V 1.6 ± 0.2 mm mm W: ⑧ Inner electrode Termination Plating ⑨ Product ⑩ Grade code ⑪ Packaging 1.6 ± 0.2 mm Ni , Open mode Cu , Ag-epoxy Sn 100% (Pb Free) Automotive Standard Embossed Type, 7" reel B. Reliablility Test and Judgement condition Performance Test condition High Temperature Appearance : No abnormal exterior appearance Unpowered, 1000hrs@T=150℃ Exposure Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion Tan δ : 0.03 max IR : More than 10,000㏁ or 500㏁×㎌ Whichever is Smaller Temperature Cycling Appearance : No abnormal exterior appearance 1000Cycles Capacitance Change : Within ±10% Measurement at 24±2hrs after test conclusion Tan δ : 0.03 max 1 cycle condition : IR : More than 10,000㏁ or 500㏁×㎌ Whichever is Smaller Destructive Physical No Defects or abnormalities -55+0/-3℃(15±3min) -> Room Temp(1min.) -> 125+3/-0℃(15±3min) -> Room Temp(1min.) Per EIA 469 Analysis Moisture Resistance Appearance : No abnormal exterior appearance 10Cycles, t=24hrs/cycle Capacitance Change : Within ±12.5% Heat (25~65℃) and humidity (80~98%), Unpowered Tan δ : 0.03 max measurement at 24±2hrs after test conclusion IR : More than 10,000㏁ or 500㏁×㎌ Whichever is Smaller Humidity Bias Appearance : No abnormal exterior appearance 1000hrs 85℃/85%RH, Rated Voltate and 1.3~1.5V, Capacitance Change : Within ±12.5% Add 100kohm resistor Tan δ : 0.035 max Measurement at 24±2hrs after test conclusion IR : More than 500㏁ or 25㏁×㎌ The charge/discharge current is less than 50mA. Whichever is Smaller High Temperature Appearance : No abnormal exterior appearance 1000hrs @ TA=125℃, 200% Rated Voltage, Operating Life Capacitance Change : Within ±12.5% Measurement at 24±2hrs after test conclusion Tan δ : 0.035 max The charge/discharge current is less than 50mA. IR : More than 1000㏁ or 50㏁×㎌ Whichever is Smaller Performance External Visual No abnormal exterior appearance Physical Dimensions Within the specified dimensions Mechanical Shock Microscope (´10) Using The calipers Appearance : No abnormal exterior appearance Three shocks in each direction should be applied along Capacitance Change : Within ±10% Tan δ, IR : initial spec. Vibration Test condition 3 mutually perpendicular axes of the test specimen (18 shocks) Peakvalue Duration Wave Velocity 1,500G 0.5ms Half sine 4.7m/sec. Appearance : No abnormal exterior appearance 5g's for 20min., 12cycles each of 3 orientations, Capacitance Change : Within ±10% Tan δ, IR : initial spec. Use 8"×5" PCB 0.031" Thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10~2000㎐. Resistance to Appearance : No abnormal exterior appearance Solder pot : 260±5℃, 10±1sec. Solder Heat Capacitance Change : Within ±10% Tan δ, IR : initial spec. Thermal Shock Appearance : No abnormal exterior appearance -55℃/+125℃. Capacitance Change : Within ±10% Note: Number of cycles required-300, Tan δ, IR : initial spec. Maximum transfer time-20 sec, Dwell time-15min. Air-Air Appearance : No abnormal exterior appearance AEC-Q200-002 ESD Capacitance Change : Within ±10% Tan δ, IR : initial spec. Solderability 95% of the terminations is to be soldered a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃ evenly and continuously b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃ c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃ solder : a solution ethanol and rosin Electrical Capacitance : Within specified tolerance The Capacitance /D.F. should be measured at 25℃, Characterization Tan δ (DF) : 0.025 max. 1㎑±10%, 1.0±0.2Vrms IR(25℃) : More than 10,000㏁ or 500㏁×㎌ I.R. should be measured with a DC voltage not exceeding IR(125℃) : More than1,000㏁ or 10㏁×㎌ Rated Voltage @25℃, @125℃ for 60~120 sec. Whichever is Smaller Dielectric Strength Board Flex Dielectric Strength : 250% of the rated voltage for 1~5 seconds Appearance : No abnormal exterior appearance Bending to the limit (2㎜) for 5 seconds Capacitance Change : Within ±10% Terminal Appearance : No abnormal exterior appearance 18N, for 60±1 sec. Strength(SMD) Capacitance Change : Within ±10% Beam Load Destruction value should not be exceed Beam speed Chip Length ≥ 3.2㎜ 2.5±0.25㎜/sec a) Chip Thickness < 1.25㎜ : 15N Temperature b) Chip Thickness ≥ 1.25㎜ : 54.5N X7R Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±15%) C. Recommended Soldering method : Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max ) Meet IPC/JEDEC J-STD-020 D Standard * For the more detail Specification, Please refer to the Samsung MLCC catalogue.