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K4C89363AF-GCF6

K4C89363AF-GCF6

  • 厂商:

    SAMSUNG(三星)

  • 封装:

  • 描述:

    K4C89363AF-GCF6 - 2,097,152-WORDS x 4 BANKS x 36-BITS DOUBLE DATA RATE Network-DRAM - Samsung semico...

  • 数据手册
  • 价格&库存
K4C89363AF-GCF6 数据手册
K4C89363AF N etwork-DRAM-II Specification Version 0.0 -1- REV. 0.0 Nov. 2002 K4C89363AF Revision History Version 0.0 (Nov. 2002) - First Release -2- REV. 0.0 Nov. 2002 K4C89363AF 2,097,152-WORDS x 4 BANKS x 36-BITS DOUBLE DATA RATE Network-DRAM DESCRIPTION K4C89363AF is a CMOS Double Data Rate Network-DRAM containing 301,989,888 memory cells. K4C89363AF is organized as 2,097,152-words x 4 banks x36 bits. K4C89363AF feature a fully synchronous operation referenced to clock edge whereby all operations are synchronized at a clock input which enables high performance and simple user interface coexistence. K4C89363AD can operate fast core cycle compared with regular DDR SDRAM. K4C89363AF is suitable for Server, Network and other applications where large memory density and low power consumption are required. The Output Driver for Network-DRAM is capable of high quality fast data transfer under light loading condition. FEATURES K4C89363AF Parameter F6 CL = 4 tC K C l o c k C y c l e T i m e ( m i n ) CL = 5 CL = 6 tRC R a n d o m R e a d / W r i t e C y c l e T i m e ( m i n ) tR A C R a n d o m A c c e s s T i m e ( m i n ) ID D 1 S O p e r a t i n g C u r r e n t ( s i n g l e b a n k ) ( m a x ) ID D 2 S P o w e r D o w n C u r r e n t ( m a x ) ID D 3 S S e l f - R e f r e s h C u r r e n t ( m a x ) • Fully Synchronous Operation - Double Data Rate (DDR) - Data input/output are synchronized with both edges of DS / QS. - Differential Clock (CLK and C L K ) inputs - C S, FN and all address input signals are sampled on the positive edge of CLK. - Output data (DQs and QS) is aligned to the crossings of CLK and CLK. • Fast clock cycle time of 3.0 ns minimum - Clock : 333 MHz maximum - Data : 666 Mbps/pin maximum • • • • • • • • • Quad Independent Banks operation Fast cycle and Short Latency Selectable Data Strobe(Uni/Bi-directional data strobe) Distributed Auto-Refresh cycle in 3.9us Self-Refresh Power Down Mode Variable Write Length Control Write Latency = C A S Latency-1 Programable C A S Latency and Burst Length - C A S Laatency = 4, 5, 6 - Burst Length = 2,4 • • • • • • • Organization : 2,097,152 words x 4 banks x 36 bits P o w e r S u p p l y V o l t a g e V DD : 2 . 5 V ± 0 . 1 2 5 V V DDQ : 1 . 8 V ± 0 . 1 V 1.8V CMOS I/O comply with SSTL - 1.8 (half strength driver) Package : 144Ball BGA, 1mm x 0.8mm Ball pitch JTAG(for x36) Notice : Network-DRAM is trademark of Samsung Electronics., Co LTD 4.0 ns 3.33 ns 3.0ns 20.0 ns 20.0 ns TBD TBD TBD FB 4.5 ns 3.75 ns 3.33 ns 22.5 ns 22.5 ns TBD TBD TBD F5 5.0 ns 4.5 ns 4.0 ns 25 ns 25 ns TBD TBD TBD -3- REV. 0.0 Nov. 2002 1 2 3 4 5 6 7 8 9 10 11 12 I nd ex Pin PD FN CS Pin Names DQ0 ~ DQ35 CLK, CLK A0 ~ A14 BA0, BA1 A VDD V SS V SS VDD V D DQ DQ 17 D Q1 6 V DD Q VDD VS S V SS VDD K4C89363AF ball pitch=1.0 x 0.8mm B Clock Input Chip Select VS S Q DQ 15 D Q1 4 V SS Q V DD Q D Q1 D Q0 VD D Q C V SS Q D Q3 D Q2 V SS Q Address Input Bank Address Function Control Data Input/Output D V D DQ DQ 13 D Q1 2 V DD Q VS S Q DQ 11 D Q1 0 V SS Q V DD Q D Q5 D Q4 VD D Q Name Power Down Control E V D DQ D Q9 LD S V DD Q V SS Q D Q7 D Q6 V SS Q PIN ASSIGNMENT (TOP VIEW) F VS S Q /C L K V R EF V SS Q V DD Q LQ S D Q8 VD D Q G V SS Q FN /CS VS S Q VDD V REF V SSQ -4VS S CLK /P D VS S VDD A 11 A 12 VDD VS S A8 A9 VS S VDD A6 A7 VDD V D DQ A4 A5 V DD Q VS S Q DQ 26 UDS V SS Q V D DQ DQ 24 D Q2 5 V DD Q VS S Q DQ 22 D Q2 3 V SS Q V D DQ DQ 20 D Q2 1 V DD Q VS S Q DQ 18 D Q1 9 V SS Q VDD V SS TC K TM S V DDQ H VSS VS S A1 4 A 13 VSS Pin NC J VDD B A0 BA 1 VDD Ground K VS S A1 0 A0 VSS Power (+2.5V) No Connection L VDD A1 A2 VDD Reference Voltage Name Ground(for I/O buffer) M V DD Q A3 NC VD D Q Power (+1.8V)(for I/O buffer) N V SS Q UQ S D Q2 7 V SS Q P V DD Q D Q 28 D Q2 9 VD D Q R V SS Q D Q 30 D Q3 1 V SS Q T V DD Q D Q 32 D Q3 3 VD D Q U V SS Q D Q 34 D Q3 5 V SS Q REV. 0.0 Nov. 2002 V TD 1 TD 0 V SS VDD K4C89363AF Block Diagram CLK CLK PD DLL CLOCK BUFFER To Each Block BANK #3 CS FN COMMAND DECODER CONTROL SIGNAL GENERATOR BANK #2 BANK #0 ROW DECODER MODE REGISTER A0 ~ A14 BA0, BA1 ADDRESS BUFFER UPPER ADDRESS LATCH MEMORY CELL ARRAY COLUMN DECODER REFRESH COUNTER LOWER ADDRESS LATCH BURST COUNTER WRITE ADDRESS LATCH ADDRESS COMPARATOR READ DATA BUFFER WRITE DATA BUFFER DS QS DQ BUFFER DQ0 ~ DQ35 Note : The K4C89363AD configuration is 4 Bank of 16384 x 128 x 36 of cell array with the DQ pins numbered DQ0~DQ35. -5- REV. 0.0 Nov. 2002 D AT A C O NT R O L A N D L A T C H C IR CU IT BANK #1 K4C89363AF Absolute Maximum Ratings Symbol V DD V DDQ V IN VOUT VREF TOPR T STG T SOLDER PD IO U T Parameter Power Supply Voltage Power Supply Voltage (for I/O buffer) Input Voltage DQ pin Voltage Input Reference Voltage Operating Temperature Storage Temperature Soldering Temperature(10s) Power Dissipation Short Circuit Output Current Rating -0.3 ~ 3.3 -0.3 ~ V DD + 0.3 -0.3 ~ V DD + 0.3 -0.3 ~ V DDQ + 0.3 -0.3 ~ V DDQ + 0.3 0 ~ 70 -55 ~ 150 260 2 ± 50 Units V V V V V O Notes C C C O O W mA Caution : Conditions outside the limits listed under "ABSOLUTE MAXIMUM RATINGS" may cause permanent damage to the device. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to "ABSOLUTE MAXIMUM RATINGS" conditions for extended periods may affect device reliability. Recommended DC,AC Operating Conditions (Notes : 1) Symbol VDD VDDQ VREF V IH ( D C ) V IL ( D C ) V ICK ( D C ) V ID ( D C ) V IH ( A C ) V IL ( A C ) V ID ( A C ) VX (AC) V ISO ( A C ) Power Supply Voltage Power Supply Voltage (for I/O Buffer) Input Reference Voltage Input DC high Voltage Input DC Low Voltage Differential Clock DC Input Voltage Input Differential Voltage. CLK and C L K Inputs (DC) Input AC High Voltage Input AC Low Voltage Input Differential Voltage. CLK and C L K Inputs (AC) Differential AC Input Cross Point Voltage Differential Clock AC Middle Level Parameter Min 2.375 1.7 V DDQ / 2 x 9 6 % V R E F+ 0 . 1 2 5 -0.1 -0.1 0.4 V R E F+ 0 . 2 -0.1 0.55 V DDQ / 2 - 0 . 1 2 5 V DDQ / 2 - 0 . 1 2 5 Typ 2.5 1.8 (Ta = 0 ~ 70 O C) Units V V V V V V V V V V V V 2 5 5 10 7,10 3,6 4,6 7,10 8,10 9,10 Notes Max 2.625 1.9 V DDQ / 2 x 1 0 5 % V DDQ +0.2 V R E F- 0 . 1 2 5 V DDQ +0.1 V DDQ +0.2 V DDQ +0.2 V REF-0.2 V DDQ +0.2 V DDQ /2+0.125 V DDQ /2+0.125 V D D Q /2 - -6- REV. 0.0 Nov. 2002 K4C89363AF Notes: 1. All voltages are referenced to Vss, VssQ. 2. V REF i s e x p e c t e d t o t r a c k v a r i a t i o n s i n V d d Q D C l e v e l o f t h e t r a n s m i t t i n g d e v i c e . P e a k t o p e a k A C n o i s e o n V REF m a y n o t e x c e e d ± 2 % o f V R E F ( D C ) . 3. Overshoot Iimit : V IH( m a x . ) = V d d Q + 0 . 7 V w i t h a p u l s e w i d t h < = 5 n s 4 . U n d e r s h o o t I i m i t : V I L( m i n . ) = - 0 . 7 V w i t h a p u l s e w i d t h < = 5 n s 5 . V I H ( D C ) a n d V IL ( D C ) a r e l e v e l s t o m a i n t a i n t h e c u r r e n t l o g i c s t a t e . 6 . V I H ( A C ) a n d V I L( A C ) a r e l e v e l s t o c h a n g e t o t h e n e w l o g i c s t a t e . 7. V ID i s m a g n i t u d e o f t h e d i f f e r e n c e b e t w e e n C L K i n p u t l e v e l a n d C L K input level. 8. The value of Vx(AC) is expected to equal VddQ/2 of the transmitting device. 9 . V I S O m e a n s [ V I C K( C L K ) + V I C K (C L K ) ] / 2 10. Refer to the figure below. CLK VX VX VX VX VX V ID ( A C ) CLK VI C K V ICK VI C K VI C K VSS V ID ( A C ) 0 V Differential V ISO V ISO(min) V I S O (max) VSS 1 1 . I n t h e c a s e o f e x t e r n a l t e r m i n a t i o n , V T T ( T e r m i n a t i o n V o l t a g e ) s h o u l d b e g o n e i n t h e r a n g e o f V R E F( D C ) ± 0 . 0 4 V . Pin Capacitance Symbol C IN C INC C I/O C NC (V DD = 2 . 5 V , V D D Q = 1 . 8 V , f = 1 M H z , T a = 2 5 C ) Parameter Min 1.5 1.5 2.5 Max 2.5 2.5 3.5 1.5 Delts 0.25 0.25 0.5 Units pF pF pF pF o Input Pin Capacitance Clock Pin (CLK, C L K ) Capacitance DQ, DS, QS Capacitance NC Pin Capacitance Note : These parameters are periodically sampled and not 100% tested. -7- REV. 0.0 Nov. 2002 K4C89363AF DC Characteristics and Operating Conditions Parameter Symbol F6 Operating Current t CK = m i n , I RC = m i n Read/Write command cycling O V < = V IN< = V IL(AC) ( m a x . ) V IH(AC) ( m i n . ) < = VIN < = V DDQ 1 bank operation, Burst Length = 4 A d d r e s s c h a n g e u p t o 2 t i m e s d u r i n g m i n i m u m IR C . Standby Current t CK = m i n , C S = V IH, P D = V IH , 0 V < = V IN< = V IL(AC) ( m a x . ) V IH(AC) ( m i n . ) < = V IH < = VDDQ All Banks : inactive state O t h e r i n p u t s i g n a l s a r e c h a n g e d o n e t i m e d u r i n g 4 * tC K Standby (Power Down) Current t CK = m i n , C S = V IH, P D = V IL ( P o w e r D o w n ) 0 V < = V IN< = V DDQ All Banks : inactive state Auto-Refresh Current t CK = m i n , I REFC = m i n , t REFI = m i n Auto-Refresh command cycling 0 V < = V IN< = V IL( A C ) ( m a x . ) , V IH( A C ) ( m i n . ) < = V IN < = V DDQ A d d r e s s c h a n g e u p t o 2 t i m e s d u r i n g m i n i m u m I R E F C. Self-Refresh Current self-Refresh mode P D = 0 . 2 V , O V < = V IN < = V DDQ I DD6 TBD TBD TBD I DD5 TBD TBD TBD 1 I DD2P TBD TBD TBD mA 1 ID D 2 N TBD TBD TBD 1 I DD1S TBD TBD TBD 1, 2 (Vdd = 2.5V ± 0.125V, VddQ = 1.8V ± 0.1V, Ta = 0~70 °C ) Max Units FB F5 Notes Parameter Input Leakage Current ( 0 V < = V IN< = V d d Q , A l l o t h e r p i n s n o t u n d e r t e s t = 0 V ) Output Leakage Current ( O u t p u t d i s a b l e d , 0 V < = VO U T < = V d d Q ) V REF C u r r e n t Output Source DC Current V d d Q = 1 . 7 V / V OH = 1 . 4 2 0 V Normal Output Driver Output Sink DC Current V d d Q = 1 . 7 V / V OL = 0 . 2 8 0 V Output Source DC Current V d d Q = 1 . 7 V / V OH = 1 . 4 2 0 V Strong Output Driver Output Sink DC Current V d d Q = 1 . 7 V / V OL = 0 . 2 8 0 V Output Source DC Current V d d Q = 1 . 7 V / V OH = 1 . 4 2 0 V Weak Output Driver Output Sink DC Current V d d Q = 1 . 7 V / V OL = 0 . 2 8 0 V Symbol ILI Min -5 Max 5 Unit uA Notes I LO I REF I O H( D C ) -5 5 uA -5 5 uA -5.6 - 3 IOL ( D C ) 5.6 - 3 I O H( D C ) -9.8 mA 3 IOL ( D C ) 9.8 - 3 I O H( D C ) -2.8 - 3 IOL ( D C ) 2.8 - 3 N o t e s : 1 . T h e s e p a r a m e t e r s d e p e n d o n t h e c y c l e r a t e a n d t h e s e v a l u e s a r e m e a s u r e d a t a c y c l e r a t e w i t h t h e m i n i m u m v a l u e s o f t C K, t RC a n d I RC . 2. These parameters depend on the output loading. The specified values are obtained with the output open. 3. Refer to output driver characteristics for the detail. Output Driver Strength is selected by Extended Mode Regis ter. -8- REV. 0.0 Nov. 2002 K4C89363AF AC Characteristics and Operating Conditions (Notes : 1, 2) F6 Symbol Parameter Min t RC Random Cycle Time CL = 4 t CK Clock Cycle Time CL = 5 CL = 6 t RAC t CH t CL t CKQS tQSQ t AC t OH t HP t QSP t QSQV t QHS t DQSS t DSPRE t DSPRES t DSPREH t DSP Random Access Time Clock High Time Clock Low Time QS Access Time from CLK Data Output Skew from QS Data Access Time from CLK Data Output Hold Time from CLK C L K h a l f p e r i o d ( m i n i u m o f A c t u a l tC H , t CL ) QS(Read) Pulse Width Data Output Valid Time from QS 20.0 4.0 3.33 3.0 0 . 4 5 * tC K 0 . 4 5 * tC K -0.45 -0.5 -0.5 m i n ( tC H , t CL ) t HP-t QHS t HP-t QHS 0.8*t C K 0.4*t C K 0 0.3*t C K 0 . 4 5 * tC K CL = 4 t DSS DS Input Falling Edge to Clock Setup Time CL = 5 CL = 6 t DSPST DS(Write) Postamble Pulse Width CL = 4 t DSPSTH DS(Write) Postamble Hold Time CL = 5 CL = 6 t DS t DH t IS t IH Data Input Setup Time from DS Data Input Hold Time from DS Command / Address Input Setup Time Command / Address Input Hold Time 0.9 0.9 0.9 0 . 4 5 * tC K 0.9 0.9 0.9 0.3 0.3 0.6 0.6 FB Max 7.5 7.5 7.5 20.0 0.45 0.2 0.5 0.5 0.055x t CK+ 0 . 1 7 1.2*t C K 0.55*t C K - F5 Units Notes Max 7.5 7.5 7.5 22.5 0.45 0.25 0.5 0.5 0.055x tC K+0.17 1.2*t C K 0.55*t C K - Min 22.5 4.5 3.75 3.33 0.45*tC K 0.45*tC K -0.45 -0.5 -0.5 min(tC H , tC L ) t H P-tQ H S t H P-tQ H S 0 . 8 * tC K 0 . 4 * tC K 0 0 . 3 * tC K 0.45*tC K 0.9 0.9 0.9 0.45*tC K 0.9 0.9 0.9 0.35 0.35 0.6 0.6 Min 25 5.0 4.5 4.0 0 . 4 5 * tC K 0 . 4 5 * tC K -0.5 -0.6 -0.6 m i n ( tC H , t CL ) t HP-t QHS t HP-t QHS 0.8*t C K 0.4*t C K 0 0.3*t C K 0 . 4 5 * tC K 1.0 1.0 1.0 0 . 4 5 * tC K Max 7.5 7.5 7.5 25 0.5 0.3 0.6 0.6 0.055x t CK+ 0 . 1 7 1.2*t C K 0.55*t C K ns 3 4 3 3 4 3, 4 3, 4 3, 4 4 3, 4 3, 4 3, 4 4 4 3 3 3 3 3 3 3 3 3 3, 8 4 3, 8 3, 8 3 4, 8 4, 8 DQ, QS Hold skew factor DS(Write) Low to High Setup Time DS(Write) Preamble Pulse Width DS First Input Setup Time DS First Low Input Hold Time DS High or Low Input Pulse Width - 1.0 1.0 1.0 0.4 0.4 0.7 0.7 -9- REV. 0.0 Nov. 2002 K4C89363AF AC Characteristics and Operating Conditions (Notes : 1, 2) (Continued) F6 Symbol tL Z tH Z tQPDH tPDEX tT tF P D L tR E F I tPAUSE FB Max 0.5 1 5 3.9 1 2 - F5 Units Notes Max 0.5 1 5 3.9 1 2 - Parameter Min Data-out Low Impedance Time from CLK Data-out High Impedance Time from CLK Last Output to P D H i g h H o l d T i m e Power Down Exit Time Input Transition Time P D L ow Input Window for Self-Refresh Entry Auto-Refresh Average Interval Pause Time after Power-up CL = 4 Random Read/Write Cycle Time -0.5 0 0.6 0.1 -0.5*t C K 0.4 200 5 6 7 1 CL = 4 4 5 6 2 BL = 2 BL = 4 2 3 1 CL = 4 7 7 7 1 CL = 4 19 23 25 19 23 25 I REFC 200 Min -0.5 0 0.6 0.1 - 0 . 5 * tC K 0.4 200 5 6 7 1 4 5 6 2 2 3 1 7 7 7 1 19 23 25 19 23 25 I REFC 200 Min -0.6 0 0.7 0.1 -0.5*t C K 0.4 200 5 6 7 1 4 5 6 2 2 3 1 7 7 7 1 19 23 25 19 23 25 IREFC 200 Max 0.6 1 5 3.9 us 1 2 3 5 3 3, 6, 8 3, 7, 8 IR C CL = 5 (Applicable to Same Bank) CL = 6 IRCD RDA/WRA to LAL Command Input Delay (Applicable to Same Bank) IRAS LAL to RDA/WRA Command Input Delay (Applicable to Same Bank) CL = 5 CL = 6 IRBD Random Bank Access Delay (Applicable to Other Bank) LAL following RDA to WRA Delay (Applicable to Other Bank) LAL following WRA to RDA Delay (Applicable to Other Bank) IRWD IWRD Cycle IRSC Mode Register Set Cycle Time CL = 5 CL = 6 IPD IP D A P D L ow to Inactive State of Input Buffer P D H igh to Active State of Input Buffer IP D V Power down mode valid from REF command CL = 5 CL = 6 CL = 4 IR E F C Auto-Refresh Cycle Time CL = 5 CL = 6 ICKD ILOCK REF Command to Clock Input Disable at Self-Refresh Entry DLL Lock-on Time (Applicable to RDA command) - 10 - REV. 0.0 Nov. 2002 K4C89363AF AC Test Conditions Symbol V IH ( m i n ) V IL ( m a x ) V REF V TT V SWING VR V ID ( A C ) SLEW V OTR Parameter Input high voltage (minimum) Input low voltage (maximum) Input reference voltage Termination voltage Input signal peak to peak swing Differential clock input reference level Input differential voltage Input signal minimum slew rate Output timing measurement reference voltage Value V REF + 0.2 V REF - 0.2 VddQ/2 VREF 0.7 V X(AC) 1.0 2.5 VddQ/2 Units V V V V V V V V/ns V V TT 50 Ω 9 Notes VddQ V IH min (AC) V SWING VREF Output V IL m a x (AC) 25 Ω Z=50Ω Z=50Ω Vss ∆T ∆T 50 Ω V TT S l e w = ( V I H m i n ( A C ) - V I L m a x ( A C ) ) /∆ T AC Test Load N o t e s : 1 . T r a n s i t i o n t i m e s a r e m e a s u r e d b e t w e e n V I H m i n ( D C ) a n d V IL m a x ( D C ) . Transition (rise and fall) of input signals have a fixed slope. 2. If the result of nominal calculation with regard to tCK contains more than one decimal place, the result is rounded up to the nearest decimal place. (i.e., tD Q S S = 0 . 8 * t C K , tC K = 3 . 3 n s , 0 . 8 * 3 . 3 n s = 2 . 6 4 n s i s r o u n d e d u p t o 2 . 7 n s . ) 3. These parameters are measured from the differential clock (CLK and C LK) AC cross point. 4 . T h e s e p a r a m e t e r s a r e m e a s u r e d f r o m s i g n a l t r a n s i t i o n p o i n t o f D S c r o s s i n g V R E F level. 5. The t REFI(MAX.) applies to equally distributed refresh method. The t REFI(MIN.) applies to both burst refresh method and distributed refresh method. In such case, the average interval of eight consecutive Auto-Refresh commands has to be more than 400ns always. In other words, the number of Auto- Refresh cycles which can be performed within 3.2us (8X400ns) is to 8 times in the maximum. 6. Low Impedance State is speified at VddQ/2± 0.2V from steady state. 7. High Impedance State is specified where output buffer is no longer driven. 8. These parameters depend on the clock jitter. These parameters are measured at stable clock. 9. Output timing is measured by using Normal driver strength. - 11 - REV. 0.0 Nov. 2002 K4C89363AF Power Up Sequence 1. As for PD , being maintained by the low state ( I d l e a f t e r I REFC Illegal L L X H H H L L X H H H L L X X L H H X L H L X H L L H L X H L L H L X X X H L X X X X X X H L X X X X H L X X X X X X X X X X X X X BA, UA BA, UA X X X X BA, UA BA, UA X X X X X X X X X PDEN DESL RDA WRA PDEN DESL RDA WRA PDEN RDEX Illegal Illegal Invalid N O P - > I d l e a f t e r I REFC Illegal Illegal Self-Refresh entry Illegal Refer to Self-Refreshing state N o p - > I d l e a f t e r IRSC Illegal Illegal Illegal Illegal Invalid Invalid Maintain Power Down Mode E x i t P o w e r D o w n M o d e - > I d l e a f t e r t PDEX Illegal Invalid Maintain Self-Refresh 12 L L X H H H H L X H L L X X X X H L X X X X BA, UA BA, UA PDEN DESL RDA WRA Illegal Illegal Invalid Data write & continue burst write to end Illegal Illegal 11 11 L L X H H L L X H H L L X H H H H L X H L H L X H L H L X H L L X X X X X X X X X X X X X X H L X X X LA Op-Code X X X LA X X X X X BA, UA BA, UA PDEN LAL MRS/EMRS PDEN MRS/EMRS LAL REF PDEN REF (Self) DESL RDA WRA Power Down Entry Illegal Refer to Power Down state Begin read Access to Mode Register Illegal Illegal Invalid Begin Write Auto-Refresh Illegal Self-Refresh entry Invalid Continue burst read to end Illegal Illegal 11 11 10 n H H H H L L X H L X BA, UA BA, UA DESL RDA WRA NOP Row activate for Read Row activate for Write CS FN Address Command Action Notes - 20 - REV. 0.0 Nov. 2002 K4C89363AF Mode Register Table Regular Mode Register (Notes : 1) Address Register B A 1 *1 0 B A 0 *1 0 A14-A8 0 A 7 *3 TM A6-A4 CL A3 BT A2-A0 BL A7 0 1 Test Mode (TM) Regular (Default) Test Mode Entry A3 0 1 Burst Type (BT) Sequential Interleave A6 0 0 0 1 1 1 1 A5 0 1 1 0 0 1 1 A4 X 0 1 0 1 0 1 C A S Latency (CL) Reserved *2 Reserved *2 A2 0 0 0 0 1 A1 0 0 1 1 X A0 0 1 0 1 Burst Length (BL) Reserved *2 2 4 Reserved *2 4 5 6 Reserved *2 Reserved *2 X Extended Mode Register (Notes : 4) Address Register B A 1 *4 0 B A 0 *4 1 A14-A7 0 A6~A5 SS A4-A3 DIC(QS) A2~A1 DIC(DQ) A 0 *5 DS A6 0 0 1 1 A5 0 1 0 1 Strobe Select Reserved *2 QS A4 0 0 1 1 A3 0 1 0 1 A2 0 0 1 1 DQ A1 0 1 0 1 Output Driver Impedance Control (DIC) Normal Output Driver Strong Output Driver Weak Output Driver Reserved Reserved*2 Unidirectional DS/QS Unidirectional DS/Free Running QS Note : 1. Regular Mode Register Is Chosen Using the combination of BA0 = 0 and BA1 = 0. 2. "Reserved" places in Regular Mode Register should not be set. 3. A7 in Regular Mode Register must be set to "0"(Low state). Because Test Mode is specific mode for supplier. 4. Extended Mode Register is chosen using the Combination of BA0 = 1 and BA1 = 0. 5. A0 in Extended Mode Register must be set to "0" to enable DLL for normal operation. A0 0 1 DLL Switch (DS) DLL Enable DLL Disable - 21 - REV. 0.0 Nov. 2002 K4C89363AF State Diagram Self Refresh SELFX (PD = H ) Power Down PDEX (P D = H ) PDEN PD = L Standby (Idle) (P D = L ) PD = H AutoRefresh WRA Mode Register RDA REF MRS Active (Restore) Active LAL LAL Write (Buffer) Read Command Input Automatic Return The second command at Active state must be issued 1clock after RDA or WRA command input - 22 - REV. 0.0 Nov. 2002 K4C89363AF Timing Diagrams Single Bank Read Timing (CL=4) 0 CLK CLK l R C =5cycles l RC = 5 c y c l e s lR C = 5 c y c l e s 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command RDA LAL DESL lR A S = 4 c y c l e s RDA LAL DESL l R A S =4cycles RDA LAL DESL l R A S= 4 c y c l e s RDA lR C D =1cycle Address UA LA l R C D =1cycle UA LA l R C D =1cycle UA LA UA Bank Add. #0 #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=4 CL=4 CL=4 DQ (Output) Hi-Z Q0 Q1 Q0 Q1 Q0 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=4 CL=4 CL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q3 Q0 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q0 Q1 Q0 Q1 Q0 CL=4 CL=4 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q1 Q2 Q3 Q0 CL=4 CL=4 - 23 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Read Timing (CL=5) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 l R C =6cycles l RC = 6 c y c l e s Command RDA LAL DESL l R A S= 5 c y c l e s RDA LAL DESL lR A S= 5 c y c l e s RDA lR C D =1cycle LAL DESL l R C D =1cycle l R C D =1cycle Address UA LA UA LA UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=5 CL=5 DQ (Output) Hi-Z Q0 Q1 Q0 Q1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=5 CL=5 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q 1 Q2 Q3 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=5 Hi-Z Q0 Q1 Q0 Q1 CL=5 DQ (Output) BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=5 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q 1 Q2 Q3 CL=5 - 24 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Read Timing (CL=6) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR C = 7 c y c l e s l R C =7cycles Command RDA LAL DESL l R A S= 6 c y c l e s RDA LAL DESL l R A S= 6 c y c l e s RDA LAL l R C D =1cycle l R C D =1cycle l R C D =1cycle Address UA LA UA LA UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=6 CL=6 DQ (Output) Hi-Z Q0 Q1 Q0 Q1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=6 CL=6 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q1 Q2 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q0 Q1 Q0 Q1 CL=6 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Q0 Q1 Q2 CL=6 - 25 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Write Timing (CL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 l R C =5cycles l RC = 5 c y c l e s lR C = 5 c y c l e s Command WRA LAL DESL lR A S = 4 c y c l e s WRA LAL DESL l R A S =4cycles WRA LAL DESL l R A S= 4 c y c l e s WRA lR C D =1cycle Address UA LA l R C D =1cycle UA LA l R C D =1cycle UA LA UA Bank Add. #0 #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low WL=3 WL=3 WL=3 DQ (Output) D0 D1 D0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low WL=3 WL=3 WL=3 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) D0 D1 D2 D3 D0 D1 D2 D3 D0 D1 D2 D3 LQS/UQS (Output) WL=3 DQ (Output) WL=3 WL=3 D0 D1 D0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=3 DQ (Output) WL=3 WL=3 D0 D1 D2 D3 D0 D1 D2 D3 D0 D1 D2 D3 - 26 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Write Timing (CL=5) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR C = 6 c y c l e s l R C =6cycles Command WRA LAL DESL l R A S= 5 c y c l e s WRA LAL DESL lR A S = 5 c y c l e s WRA LAL DESL lR C D =1cycle Address UA LA l R C D =1cycle UA LA l R C D =1cycle UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low WL=4 WL=4 DQ (Output) D 0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low WL=4 WL=4 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) D0 D1 D2 D3 D0 D1 D2 D3 LQS/UQS (Output) WL=4 DQ (Output) WL=4 D 0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=4 DQ (Output) WL=4 D0 D1 D2 D3 D0 D1 D2 D3 - 27 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Write Timing (CL=6) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR C = 7 c y c l e s WRA LAL DESL l R A S= 6 c y c l e s WRA LAL l R C =7cycles DESL lR A S = 6 c y c l e s WRA LAL Command lR C D =1cycle Address UA LA l R C D =1cycle UA LA lR C D = 1 c y c l e UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low WL=5 WL=5 DQ (Output) D0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low WL=5 WL=5 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) D0 D1 D2 D3 D0 D1 D2 D3 LQS/UQS (Output) WL=5 DQ (Output) WL=5 D0 D1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=5 DQ (Output) WL=5 D0 D1 D2 D3 D0 D1 D2 D3 - 28 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Read-Write Timing (CL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 l R C =5cycles l RC = 5 c y c l e s lR C = 5 c y c l e s Command RDA LAL DESL WRA LAL DESL RDA LAL DESL WRA Address UA LA UA LA UA LA UA Bank Add. #0 #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=4 WL=3 CL=4 DQ (Output) Hi-Z Q0 Q1 D 0 D1 Q0 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=4 WL=3 CL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 Q0 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q0 Q1 D 0 D1 Q0 WL=3 CL=4 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 Q0 WL=3 CL=4 - 29 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Read-Write Timing (CL=5) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR C = 6 c y c l e s l R C =6cycles Command RDA LAL DESL WRA LAL DESL RDA LAL DESL Address UA LA UA LA UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=5 WL=4 DQ (Output) Hi-Z Q0 Q1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=5 WL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=5 DQ (Output) Hi-Z Q0 Q1 D0 D1 WL=4 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=5 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 WL=4 Read data Write data - 30 - REV. 0.0 Sep. 2002 K4C89363AF Single Bank Read-Write Timing (CL=6) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR C = 7 c y c l e s RDA LAL DESL WRA LAL l R C =7cycles DESL RDA LAL Command Address UA LA UA LA UA LA Bank Add. #0 #0 #0 Unidirectional DS/QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) Low CL=6 WL=5 DQ (Output) Hi-Z Q0 Q1 D0 D1 BL =4 LDS/UDS (Input) LQS/UQS (Output) Low CL=6 WL=5 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q0 Q1 D0 D1 WL=5 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 D0 D1 D2 D3 WL=5 Read data Write data - 31 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Read Timing (CL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles RDA LAL RDA LAL DESL RDA lR B D= 2 c y c l e s LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D= 2 c y c l e s LAL RDA LAL RDA Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA LA UA Bank Add. Bank "a" Bank "b" l RC (Bank"a")=5cycles Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" Bank "b" l R C (Bank"a")=5cycles Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q a 0 Qa1 Q b 0 Qb1 Qa0 Q a 1 Qb0 Q b 1 Qc0 Q c 1 CL=4 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q a 0 Qa1 Q a 2 Qa3 Q b 0 Q b 1 Qb2 Q b 3 Qa0 Q a 1 Q a 2 Q a 3 Q b 0 Q b 1 Q b 2 Q b 3 Qc0 Q c 1 Qc2 CL=4 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z CL=4 Q a 0 Qa1 Q b 0 Qb1 Qa0 Q a 1 Qb0 Q b 1 Qc0 Q c 1 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=4 DQ (Output) Hi-Z CL=4 Q a 0 Qa1 Q a 2 Qa3 Q b 0 Q b 1 Qb2 Q b 3 Qa0 Q a 1 Q a 2 Q a 3 Q b 0 Q b 1 Q b 2 Q b 3 Qc0 Q c 1 Qc2 Note : l R C t o the same bank must be satisfied - 32 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Read Timing (CL=5) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles RDA LAL RDA LAL DESL RDA lR B D =2cycles LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D =2cycles LAL RDA LAL Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA LA Bank Add. Bank "a" Bank "b" lR C ( B a n k " a " ) = 6 c y c l e s Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" lR C ( B a n k " a " ) = 6 c y c l e s Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) CL=5 DQ (Output) Hi-Z Q a 0 Qa1 Qb0 Q b 1 Q a 0 Qa1 Qb0 Q b 1 CL=5 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) CL=5 DQ (Output) Hi-Z Q a 0 Qa1 Q a 2 Q a 3 Qb0 Q b 1 Qb2 Q b 3 Q a 0 Q a 1 Q a 2 Q a 3 Qb0 Q b 1 Q b 2 CL=5 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=5 DQ (Output) Hi-Z CL=5 Q a 0 Qa1 Qb0 Q b 1 Q a 0 Qa1 Qb0 Q b 1 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=5 DQ (Output) Hi-Z CL=5 Q a 0 Qa1 Q a 2 Q a 3 Qb0 Q b 1 Qb2 Q b 3 Q a 0 Q a 1 Q a 2 Q a 3 Qb0 Q b 1 Q b 2 - 33 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Read Timing (CL=6) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles RDA LAL RDA LAL DESL RDA lR B D= 2 c y c l e s LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D = 2 c y c l e s LAL RDA lR B D= 2 c y c l e s LAL RDA Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA Bank Add. Bank "a" Bank "b" lR C ( B a n k " a " ) = 7 c y c l e s lR C ( B a n k " a " ) = 7 c y c l e s Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q a 0 Qa1 Qb0 Q b 1 Q a 0 Qa1 CL=6 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) CL=6 DQ (Output) Hi-Z Q a 0 Q a 1 Qa2 Q a 3 Qb0 Q b 1 Q b 2 Q b 3 Q a 0 Qa1 Q a 2 CL=6 Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z CL=6 Q a 0 Qa1 Qb0 Q b 1 Q a 0 Qa1 BL =4 LDS/UDS (Input) LQS/UQS (Output) CL=6 DQ (Output) Hi-Z CL=6 Q a 0 Q a 1 Qa2 Q a 3 Qb0 Q b 1 Q b 2 Q b 3 Q a 0 Qa1 Q a 2 - 34 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Write Timing (CL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles WRA LAL WRA LAL DESL WRA lR B D= 2 c y c l e s LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D= 2 c y c l e s LAL WRA LAL WRA Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA LA UA Bank Add. Bank "a" Bank "b" l RC (Bank"a")=5cycles Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" Bank "b" l R C (Bank"b")=5cycles Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) WL=3 DQ (Output) WL=3 D a 0 Da1 D b 0 Db1 Da0 Da1 Db0 Db1 Dc0 Dc1 Dd0 Dd1 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) WL=3 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) WL=3 D a 0 Da1 D a 2 D a 3 Db0 D b 1 Db2 D b 3 D a 0 D a 1 D a 2 Da3 D b 0 Db1 D b 2 Db3 Dc0 Dc1 Dc2 Dc3 D d 0 D d 1 LQS/UQS (Output) WL=3 DQ (Output) WL=3 D a 0 Da1 D b 0 Db1 Da0 Da1 Db0 Db1 Dc0 Dc1 Dd0 Dd1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=3 DQ (Output) WL=3 D a 0 Da1 D a 2 D a 3 Db0 D b 1 Db2 D b 3 D a 0 D a 1 D a 2 Da3 D b 0 Db1 D b 2 Db3 Dc0 Dc1 Dc2 Dc3 D d 0 D d 1 - 35 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Write Timing (CL=5) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles WRA LAL WRA LAL DESL WRA lR B D =2cycles LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D =2cycles LAL WRA LAL Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA LA Bank Add. Bank "a" Bank "b" lR C ( B a n k " a " ) = 6 c y c l e s Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" lR C ( B a n k " b " ) = 6 c y c l e s Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) WL=4 DQ (Output) WL=4 D a 0 Da1 D b 0 Db1 Da0 Da1 Db0 Db1 Dc0 Dc1 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) WL=4 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) WL=4 D a 0 D a 1 Da2 D a 3 Db0 D b 1 D b 2 D b 3 D a 0 D a 1 D a 2 Da3 D b 0 Db1 D b 2 Db3 Dc0 Dc1 LQS/UQS (Output) WL=4 DQ (Output) WL=4 D a 0 Da1 D b 0 Db1 Da0 Da1 Db0 Db1 Dc0 Dc1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=4 DQ (Output) N o t e : IR C t o t h e s a m e b a n k m u s t b e s a t i s f i e d . WL=4 D a 0 D a 1 Da2 D a 3 Db0 D b 1 D b 2 D b 3 D a 0 D a 1 D a 2 Da3 D b 0 Db1 D b 2 Db3 Dc0 Dc1 - 36 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Write Timing (CL=6) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles WRA LAL WRA LAL DESL WRA lR B D= 2 c y c l e s LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D = 2 c y c l e s LAL WRA lR B D= 2 c y c l e s LAL WRA Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA Bank Add. Bank "a" Bank "b" lR C ( B a n k " a " ) = 7 c y c l e s lR C ( B a n k " a " ) = 7 c y c l e s Bank "a" Bank "b" Bank "c" Bank "d" Bank "a" Unidirectional DS/QS mode BL =2 LDS/UDS (Input) Low LQS/UQS (Output) WL=5 DQ (Output) WL=5 D a 0 Da1 D b 0 Db1 Da0 D a 1 Db0 Db1 BL =4 LDS/UDS (Input) Low LQS/UQS (Output) WL=5 DQ (Output) Unidirectional DS/Free Running QS mode BL =2 LDS/UDS (Input) WL=5 D a 0 D a 1 Da2 D a 3 Db0 D b 1 D b 2 D b 3 D a 0 D a 1 D a 2 D a 3 D b 0 Db1 LQS/UQS (Output) WL=5 DQ (Output) WL=5 D a 0 Da1 D b 0 Db1 Da0 D a 1 Db0 Db1 BL =4 LDS/UDS (Input) LQS/UQS (Output) WL=5 DQ (Output) N o t e : IR C t o t h e s a m e b a n k m u s t b e s a t i s f i e d . WL=5 D a 0 D a 1 Da2 D a 3 Db0 D b 1 D b 2 D b 3 D a 0 D a 1 D a 2 D a 3 D b 0 Db1 - 37 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Read-Write Timing (BL=2) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles WRA LAL RDA LAL DESL WRA LAL RDA LAL DESL WRA LAL RDA LAL DESL WRA Command Address UA LA UA LA UA LA UA LA UA LA UA LA UA Bank Add. Bank "a" Bank "b" Bank "c" l R C (Bank"a") Bank "d" Bank "a" Bank "b" Bank "c" l R C (Bank"a") Unidirectional DS/QS mode CL =4 LDS/UDS (Input) LQS/UQS (Output) Low WL=3 CL=4 D a 0 Da1 Q b 0 Qb1 Dc0 Dc1 Q d 0 Qd1 Da0 Da1 DQ (Output) CL =5 LDS/UDS (Input) Hi-Z LQS/UQS (Output) Low WL=4 CL=5 D a 0 Da1 Q b 0 Qb1 Dc0 Dc1 Q d 0 Qd1 Da0 Da1 DQ (Output) CL =6 LDS/UDS (Input) Hi-Z LQS/UQS (Output) Low WL=5 Hi-Z CL=6 D a 0 Da1 Q b 0 Qb1 Dc0 Dc1 Q d 0 Qd1 DQ (Output) Unidirectional DS/Free Running QS mode CL =4 LDS/UDS (Input) LQS/UQS (Output) WL=3 DQ (Output) CL =5 LDS/UDS (Input) CL=4 Da0 Qa1 Q b 0 Qb1 Dc0 Q c 1 Q d 0 Qd1 Da0 Da1 Hi-Z LQS/UQS (Output) WL=4 Hi-Z DQ (Output) CL =6 LDS/UDS (Input) CL=5 D a 0 Da1 Q b 0 Qb1 Dc0 Dc1 Q d 0 Qd1 Da0 Da1 LQS/UQS (Output) WL=5 Hi-Z DQ (Output) CL=6 D a 0 Da1 Q b 0 Qb1 Dc0 Dc1 Q d 0 Qd1 N o t e : IR C t o t h e s a m e b a n k m u s t b e s a t i s f i e d . - 38 - REV. 0.0 Sep. 2002 K4C89363AF Multiple Bank Read-Write Timing (BL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 lR B D =2cycles WRA LAL RDA LAL DESL lR W D = 3 c y c l e s LA UA Bank "c" l R C (Bank"a") l R C (Bank"a") Unidirectional DS/QS mode CL =4 LDS/UDS (Input) Command WRA LAL RDA LAL DESL l R W D =3cycles WRA LAL RDA LAL l W R D =1cycle Address Bank Add. UA Bank "a" LA UA Bank "b" l W R D =1cycle LA UA Bank "d" LA l W R D =1cycle UA Bank "a" LA UA Bank "b" LA LQS/UQS (Output) Low WL=3 CL=4 D a 0 Da1 D a 2 D a 3 Q b 0 Q b 1 Q b 2 Qb3 D a 0 Da1 D a 2 D a 3 Qb0 Q b 1 Qb2 Q b 3 DQ (Output) CL =5 LDS/UDS (Input) Hi-Z LQS/UQS (Output) Low WL=4 CL=5 D a 0 Da1 D a 2 D a 3 Q b 0 Qb1 Q b 2 Qb3 Da0 Da1 Da2 Da3 Qb0 Q b 1 Qb2 Q b 3 DQ (Output) CL =6 LDS/UDS (Input) Hi-Z LQS/UQS (Output) Low WL=5 CL=6 D a 0 Da1 D a 2 D a 3 Q b 0 Qb1 Q b 2 Qb3 Da0 Da1 Da2 Da3 Qb0 Q b 1 DQ (Output) Hi-Z Unidirectional DS/Free Running QS mode CL =4 LDS/UDS (Input) LQS/UQS (Output) WL=3 DQ (Output) CL =5 LDS/UDS (Input) CL=4 D a 0 Da1 D a 2 D a 3 Q b 0 Q b 1 Q b 2 Qb3 D a 0 Da1 D a 2 D a 3 Qb0 Q b 1 Qb2 Q b 3 Hi-Z LQS/UQS (Output) WL=4 DQ (Output) CL =6 LDS/UDS (Input) CL=5 D a 0 Da1 D a 2 D a 3 Q b 0 Qb1 Q b 2 Qb3 Da0 Da1 Da2 Da3 Qb0 Q b 1 Qb2 Q b 3 Hi-Z LQS/UQS (Output) WL=5 DQ (Output) CL=6 D a 0 Da1 D a 2 D a 3 Q b 0 Qb1 Q b 2 Qb3 Da0 Da1 Da2 Da3 Qb0 Q b 1 Hi-Z N o t e : IR C t o t h e s a m e b a n k m u s t b e s a t i s f i e d . - 39 - REV. 0.0 Sep. 2002 K4C89363AF Write with Variable Write Length (VW) Control(CL=4) 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 BL=2, SEQUENTIAL MODE Command WRA LAL DESL WRA LAL DESL Address UA LA=#3 VW=All UA LA=#1 VW=1 VW0 = Low VW1 = don’t care Bank Add. Bank "a" Bank "a" VW0 = High VW1 = don’t care LDS/UDS (Input) LQS/UQS (Input) D0 D1 D0 #1 (#0) Last one data is masked. Lower Address #3 #2 BL=4, SEQUENTIAL MODE Command WRA LAL DESL WRA LAL DESL WRA LAL DESL Address UA LA=#3 VW=All UA LA=#1 VW=1 UA LA=#2 VW=2 VW0 = High VW1 = Low Bank Add. Bank "a" Bank "a" VW0 = High VW1 = High Bank "a" VW0 = Low VW1 = High LDS/UDS (Input) LQS/UQS (Input) Lower Address D0 #3 D1 #0 D2 #1 D3 #2 D0 #1 (#2) (#3) (#0) Last three data are masked. D0 #2 D1 #3 (#0) (#1) Last two data are masked. Note : DS input must be continued till end of burst count even if some of laster data is masked. - 40 - REV. 0.0 Sep. 2002 K4C89363AF Power Down Timing (CL=4, BL=4) Read cycle to Power Down Mode 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 n-1 n n+1 n+2 n+3 ∼ ∼ BL=2, SEQUENTIAL MODE Command RDA LAL DESL ∼ ∼ ∼ ∼ DESL IP D A RDA or WRA Address UA LA tI S I P D =2 cycle UA t IH PD tQ P D H Unidirectional DS/QS mode IR C ( m i n ) , tR E F I ( m a x ) ∼ ∼ tPDEX ∼ ∼ LDS/UDS (Input) LQS/UQS (Output) Low CL=4 ∼ ∼ DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Hi-Z ∼ ∼ Unidirectional DS/Free Running QS mode ∼ ∼ LDS/UDS (Input) ∼ ∼ LQS/UQS (Output) CL=4 DQ (Output) Hi-Z Q0 Q1 Q2 Q3 Hi-Z ∼ ∼ Power Down Entry Power Down Exit Note : P D m ust be kept "High" level until end of Burst data output. P D s hould be brought to "High" within tR E F I (max.) to maintain the data written into cell. In Power Down Mode, P D "Low" and a stable clock signal must be maintained. W h e n PD i s brought to "High", a valid executable command may be applied I P D A c ycles later. - 41 - REV. 0.0 Sep. 2002 K4C89363AF Power Down Timing (CL=4, BL=4) Write cycle to Power Down Mode 0 CLK CLK 1 2 3 4 5 6 7 8 9 10 n-1 n n+1 n+2 n+3 ∼ ∼ IP D A ∼ ∼ Command WRA LAL DESL DESL RDA or WRA ∼ ∼ Address UA LA tI S I P D =2 cycle UA t IH PD ∼ ∼ tPDEX WL=3 IP D =2 cycle IR C ( m i n ) , tR E F I ( m a x ) Unidirectional DS/QS mode ∼ ∼ LDS/UDS (Input) LQS/UQS (Output) Low ∼ ∼ WL=3 ∼ ∼ DQ (Output) D0 D1 D2 D3 Unidirectional DS/Free Running QS mode ∼ ∼ LDS/UDS (Input) ∼ ∼ LQS/UQS (Output) WL=3 ∼ ∼ DQ (Output) D0 D1 D2 D3 Note : P D m ust be kept "High" level until end of Burst data output. P D s hould be brought to "High" within tR E F I (max.) to maintain the data written into cell. In Power Down Mode, P D "Low" and a stable clock signal must be maintained. W h e n PD i s brought to "High", a valid executable command may be applied I P D A c ycles later. - 42 - REV. 0.0 Sep. 2002 K4C89363AF Mode Register Set Timing (CL=4, BL=2) From Read operation to Mode Register Set operation 0 CLK CLK l R C =7cycles RDA LAL DESL RDA MRS DESL RDA or WRA LAL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command A14~A0 UA LA Valid (opcode) UA LA BA0, BA1 BA CL + BL/2 BA0="0" BA1="0" BA Unidirectional DS/QS mode LDS/UDS (Input) LQS/UQS (Output) Low DQ (Output) Q0 Q1 Unidirectional DS/Free Running QS mode LDS/UDS (Input) LQS/UQS (Output) DQ (Output) Q0 Q1 Note : Minimum delay from LAL following RDA to RDA of MRS operation is CL+BL/2. - 43 - REV. 0.0 Sep. 2002 K4C89363AF Mode Register Set Timing (CL=4, BL=4) From Write operation to Mode Register Set operation 0 CLK CLK l R C =7cycles WRA LAL DESL RDA MRS DESL RDA or WRA LAL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command A14~A0 UA LA Valid (opcode) UA LA BA0, BA1 BA WL + BL/2 BA0="0" BA1="0" BA Unidirectional DS/QS mode LDS/UDS (Input) LQS/UQS (Output) Low DQ (Output) D0 D1 D2 D3 Unidirectional DS/Free Running QS mode LDS/UDS (Input) LQS/UQS (Output) DQ (Output) D0 D1 D2 D3 Note : Minimum delay from LAL following WRA to RDA of MRS operation is WL+BL/2. - 44 - REV. 0.0 Sep. 2002 K4C89363AF Extended Mode Register Set Timing (CL=4, BL=2) From Read operation to Extended Mode Register Set operation 0 CLK CLK l R C =7cycles RDA LAL DESL RDA MRS DESL RDA or WRA LAL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command A14~A0 UA LA Valid (opcode) UA LA BA0, BA1 BA CL + BL/2 BA0="0" BA1="0" BA Unidirectional DS/QS mode LDS/UDS (Input) LQS/UQS (Output) Low DQ (Output) Q0 Q1 Unidirectional DS/Free Running QS mode LDS/UDS (Input) LQS/UQS (Output) DQ (Output) Q0 Q1 Note : M i n i m u m d e l a y f r o m L A L f o l l o w i n g R D A t o R D A o f E M R S o p e r a t i o n i s C L + B L / 2 . When DQ strobe mode is changed by EMRS, QS output is invalid for I R S C p e r i o d . DLL switch in Extended Mode Register must be set to enable mode for normal operation. DLL lock-on time is needed after initial EMRS operation. See Power Up Sequence. - 45 - REV. 0.0 Sep. 2002 K4C89363AF Extended Mode Register Set Timing (CL=4, BL=4) From Write operation to Extended Mode Register Set operation 0 CLK CLK l R C =7cycles WRA LAL DESL RDA MRS DESL RDA or WRA LAL 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Command A14~A0 UA LA Valid (opcode) UA LA BA0, BA1 BA WL + BL/2 BA0="0" BA1="0" BA Unidirectional DS/QS mode LDS/UDS (Input) LQS/UQS (Output) Low DQ (Output) D0 D1 D2 D3 Unidirectional DS/Free Running QS mode LDS/UDS (Input) LQS/UQS (Output) DQ (Output) D0 D1 D2 D3 Note : When DQ strobe mode is changed by EMRS, QS output is invalid for I R S C p e r i o d . DLL switch in Extended Mode Register must be set to enable mode for normal operation. DLL lock-on time is needed after initial EMRS operation. See Power Up Sequence. Minimum delay from LAL following WRA to RDA of EMRS operation is WL+BL/2. - 46 - REV. 0.0 Sep. 2002 K4C89363AF Auto-Refresh Timing (CL=4, BL=4) Unidirectional DS/QS mode 0 CLK CLK l R C =5cycles lR E F C = 1 9 c y c l e s 1 2 3 4 5 6 7 n-1 n n1 + n+2 ∼ ∼ Command RDA LAL DESL WRA REF DESL RDA or WRA LAL or MRS or REF ∼ ∼ Bank, Address Bank, UA LA l R C D =1cycle LQS/UQS (output) Low l R A S= 4 c y c l e s l R C D =1cycle Low ∼ ∼ CL=4 DQ (output) Hi-Z Q0 Q1 Q2 Q3 Hi-Z ∼ ∼ Unidirectional DS/Free Running QS mode CLK CLK l R C =5cycles lR E F C = 1 9 c y c l e s ∼ ∼ Command RDA LAL DESL WRA REF DESL RDA or WRA LAL or MRS or REF ∼ ∼ Bank, Address Bank, UA LA lR C D = 1 c y c l e s LQS/UQS (output) l R A S= 4 c y c l e s l R C D =1cycles ∼ ∼ CL=4 DQ (output) Hi-Z Q0 Q1 Q2 Q3 Hi-Z ∼ ∼ Note : In case of CL=4, IR E F C m ust be meet 19 clock cycles. When the Auto-Refresh operation is perfomed, the synthetic average interval of Auto-Refresh command specified by tR E F I m u s t b e s a t i s f i e d . tR E F I i s average interval time in 8 Refresh cycles that is sampled randomly. t1 t2 t3 t7 t8 ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ CLK W AR F R E W ARF R E W AR F R E W AR F R E W AR F R E 8 Refresh cycle t + t + t + t +t +t +t +t tR E F I = Total time of 8 Refresh cycle = 1 2 3 4 5 6 7 8 8 8 tR E F I i s specified to avoid partly concentrated current of Refresh operation that is acivated larger are than Read/Write operation. - 47 - REV. 0.0 Sep. 2002 K4C89363AF Self-Refresh Entry Timing Unidirectional DS/QS mode 0 CLK CLK lR C D = 1 c y c l e s lR E F C 1 2 3 4 5 6 7 8 9 10 11 ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ Command WRA tF P D L REF tFPDL DESL (min) (max) Auto Refresh ∼ ∼ ∼ ∼ PD Self Refresh Entry l P D V* 2 tQ P D H LQS/UQS (output) lC K D LOW Hi-Z ∼ ∼ ∼ ∼ DQ (output) Hi-Z Qx Note : 1. is don’t care. 2. P D m ust be brought to "Low" within the timing between t F P D L (min) and t F P D L (max) to Self R e f r e s h m o d e . W h e n PD i s brought to "Low" after I P D V , K 4 C 8 9 1 8 3 A D p erform Auto Refresh and enter Power down mode. 3. It is desirable that clock input is continued at least I C K D f r o m R E F c o m m a n d e v e n t h o u g h P D i s brought to "Low" for Self-Refresh Entry. ∼ ∼ ∼ ∼ Self-Refresh Exit Timing Unidirectional DS/QS mode 0 CLK CLK *2 1 3 m1 - m m1 + m2 + n-1 n n+1 p-1 p ∼ ∼ ∼ ∼ lR E F C *3 ∼ ∼ lR E F C C o m m a n d ( 1 s t ) *6 C o m m a n d ( 2 n d ) *6 ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ Command DESL WRA *5 REF *5 DESL RDA*7 L A L* 7 l P D A =2 c y c l e s *4 l R C D = 1cycle l R C D = 1cycle PD tP D E X lL O C K ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ LQS/UQS (output) Hi-Z LOW DQ (output) Hi-Z ∼ ∼ ∼ ∼ - 48 - ∼ ∼ ∼ ∼ Self-Refresh Exit Note : 1. is don’t care. 2. Clock should be stable prior to PD = " High" if clock input is suspended in Self-Refresh mode. 3 . D E S L c o m m a n d m u s t b e a s s e r t e d d u r i n g I R E F C a fter P D i s brought to "High" 4. l P D A i s defined from the first clock rising edge after PD i s brought to "High" 5. It is desirable that one Auto-Refresh command is issued just after Self-Refresh Exit before any other operation. 6. Any command (except Read command) can be issued after lR E F C . 7. Read command (RDA +LAL) can be issued after lL C O K . REV. 0.0 Sep. 2002 K4C89363AF Self-Refresh Entry Timing Unidirectional DS/Free Running QS mode 0 CLK CLK l R C D =1cycle lR E F C 1 2 3 4 5 m1 m m+1 ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ Command WRA tF P D L REF tFPDL DESL (min) (max) Auto Refresh ∼ ∼ ∼ ∼ PD Self Refresh Entry l P D V* 2 tQ P D H lC K D LQS/UQS (output) ∼ ∼ Hi-Z DQ (output) Hi-Z ∼ ∼ ∼ ∼ Qx Note : 1. is don’t care. 2. P D m ust be brought to "Low" within the timing between t F P D L (min) and t F P D L (max) to Self R e f r e s h m o d e . W h e n P D i s brought to "Low" after IP D V , K 4 C 8 9 1 8 3 A D p e r f o r m A u t o R e f r e s h a n d e n t e r Power down mode. 3. It is desirable that clock input is continued at least I C K D f r o m R E F c o m m a n d e v e n t h o u g h P D i s brought to "Low" for Self-Refresh Entry. Self-Refresh Exit Timing Unidirectional DS/Free Running QS mode 0 CLK CLK 1 3 m1 m m1 + m2 + n-1 n n+1 p-1 p ∼ ∼ ∼ ∼ lR E F C lR E F C ∼ ∼ C o m m a n d ( 1 s t ) *6 C o m m a n d ( 2 n d ) *6 ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ Command DESL WRA *5 REF *5 DESL RDA*7 L A L* 7 l P D A =2 c y c l e s *4 l R C D = 1cycle l R C D = 1cycle PD tP D E X lL O C K ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ ∼ LQS/UQS QS (output) DQ (output) Hi-Z ∼ ∼ ∼ ∼ - 49 - ∼ ∼ ∼ ∼ Self-Refresh Exit Note : 1. is don’t care. 2. Clock should be stable prior to PD = " High" if clock input is suspended in Self-Refresh mode. 3 . D E S L c o m m a n d m u s t b e a s s e r t e d d u r i n g I R E F C a fter P D i s brought to "High" 4. l P D A i s defined from the first clock rising edge after PD i s brought to "High" 5. It is desirable that one Auto-Refresh command is issued just after Self-Refresh Exit before any other operation. 6. Any command (except Read command) can be issued after lR E F C . 7 . R e a d c o m m a n d ( R D A + L A L ) c a n b e i s s u e d a f t e r l L O C K. 8. QS output is invalid until DLL lock from Self-Refresh exit. REV. 0.0 Sep. 2002 K4C89363AF Function Description Network - DRAM Network - DRAM is an acronym of Double Data Rate Network - DRAM. Network - DRAM is competent to perform fast random core access, low latency and high-speed data transfer. Pin Functions Clock Inputs : CLK & CLK The CLK and C L K inputs are used as the reference for synchronous operation. CLK is master clock input. The C S, FN and all address input signals are sampled on the crossing of the positive edge of CLK and the negative edge of CLK . The QS and DQ output data are aligned to the crossing point of CLK and C L K . The timing reference point for the differential clock is when the CLK and C L K signals cross during a transition. Power Down : PD T h e PD input controls the entry to the Power Down or Self-Refresh modes. The PD input does not have a Clock Suspend function like a CKE input of a standard SDRAMs, therefore it is illegal to bring PD pin into low state if any Read or Write operation is being performed. Chip Select & Function Control : C S & FN The C S and FN inputs are a control signal for forming the operation commands on Network-DRAM. Each operation mode is decided by the combination of the two consecutive operation commands using the C S and FN inputs. Bank Addresses : BA0 & BA1 The BA0 and BA1 inputs are latched at the time of assertion of the RDA or WRA command and are selected the bank to be used for the operation. BA0 and BA1 also define which mode register is loaded during the Mode Register Set command (MRS or EMRS). BA0 Bank #0 Bank #1 Bank #2 Bank #3 0 1 0 1 BA1 0 0 1 1 Address Inputs : A0 to A14 A d d r e s s i n p u t s a r e u s e d t o a c c e s s t h e a r b i t r a r y a d d r e s s o f t h e m e m o r y c e l l a r r a y w i t h i n e a c h b a n k . T h e U p p e r A d d r e s s e s w i t h B an k address are latched at the RDA or WRA command and the Lower Addresses are latched at the LAL command. The A0 to A14 inputs are also used for setting the data in the Regular or Extended Mode Register set cycle. Upper Address K4C89363AF A0 to A14 Lower Address A0 to A6 - 50 - REV. 0.0 Nov. 2002 K4C89363AF Functional Description (Continued) Data Input/Output : DQ0 ~ DQ35 The input data of DQ0 to DQ35 are taken in synchronizing with the both edges of LDS/UDS input signal. The output data of DQ0 to DQ35 are outputted synchronizing with the both edges of LQS/UQS output signal. Data Strobe : DS(LDS/UDS) or QS(LQS/UQS) Method of data strobe is chosen by Extended mode register. (1) Unidirectional DS/QS mode DS is input signal and QS is output signal. Both edges of DS are used to sample all DQs at Write operation. Both edges of QS are used for trigger signal of all DQs at Read operation. During Write, Auto-Refresh and NOP cycle, QS assert always "Low" level. QS is Hi-Z in Self-Refresh mode. (2) Unidirectional DS/Free running QS mode DS is input signal and QS is output signal. Both edges of DS are used to sample all DQs at Write operation. Both edges of QS are used for trigger signal of all DQs at Read operation. QS assert always toggle signal except Self-Refresh mode. This strobe type is easy to use for pin to pin connect application. P o w e r S u p p l y : V D D , V D D Q , V SS , V S S Q V D D a n d V SS a r e s u p p l y p i n s f o r m e m o r y c o r e a n d p e r i p h e r a l c i r c u i t s . V DDQ a n d V S S Q a r e p o w e r s u p p l y p i n s f o r t h e o u t p u t b u f f e r . Reference Voltage : V REF V REF is reference voltage for all input signals. - 51 - REV. 0.0 Nov. 2002 K4C89363AF Command Functions and Operations K4C89363AF is introduced the two consecutive command input method. Therefore, except for Power Down mode, each operation mode decided by the combination of the first command and the second command from stand-by states of the bank to be accessed. Read Operation (1st command + 2nd command = RDA + LAL) Issuing the RDA command with Bank Addresses and Upper Addresses to the idle bank puts the bank designated by Bank Address in a read mode. When the LAL command with Lower Addresses is issued at the next clock of the RDA command, the data is read out sequentially synchronizing with the both edges of QS output signal (Burst Read Operation). The initial valid read data appears a fter C A S latency, the burst length of read data and the burst type must be set in the Mode Register beforehand. The read operated bank g o e s b a c k a u t o m a t i c a l l y t o t h e i d l e s t a t e a f t e r I RC. Write Operation (1st command + 2nd command = WRA + LAL) Issuing the WRA command with Bank Addresses and Upper Addresses to the idle bank puts the bank designated by Bank Address in a write mode. When the LAL command with Lower Addresses is issued at the next clock of the WRA command, the input data is latched sequentially synchronizing with the both edges of DS input signal (Burst Write Operation). The data and DS inputs have to be asserted in keeping with clock input after C A S latency-1 from the issuing of the LAL command. The DS have to be provided for a burst length. The C A S latency and the burst type must be set in the Mode Register beforehand. The write operated bank goes back automatically to the idle state after IRC. W r i t e B u r s t L e n g t h i s c o n t r o l l e d b y V W 0 a n d V W 1 i n p u t s w i t h L A L c o m m a n d . S e e V W t r u t h t a b l e . Auto-Refresh Operation (1st command + 2nd command = WRA + REF) K4C89363AF is required to refresh like a standard SDRAM. The Auto-Refresh operation is begun with the REF command following to the WRA command. The Auto-Refresh mode can be effective only when all banks are in the idle state and all DQ are in Hi-Z states. In a point to notice, the write mode started with the WRA command is canceled by the REF command having gone into the next clock of the WRA command instead of the LAL command. The minimum period between the Auto-Refresh command and the next command is specified by IREFC. H o w e v e r , a b o u t a s y n t h e t i c a v e r a g e i n t e r v a l o f A u t o - R e f r e s h c o m m a n d , i t m u s t b e c a r e f u l . I n c a s e o f e q u a l l y d i s tributed refresh, Auto-Refresh command has to be issued within once for every 3.9 us by the maximum In case of burst refresh or random distributed refresh, the average interval of eight consecutive Auto-Refresh command has to be more than 400ns always. In oth er words, the number of Auto-Refresh cycles which can be performed within 3.2 us (8x400ns) is to 8 times in the maximum. Self-Refresh Operation (1st command + 2nd command = WRA + REF with PD ="L") It is the function of Self-Refresh operation that refresh operation can be performed automatically by using an internal timer. When all banks are in the idle state and all outputs are in Hi-z states, the K4C89363AF become Self-Refresh mode by issuing the Self-Refresh c o m m a n d . P D h a s t o b e b r o u g h t t o " L o w " w i t h i n t FPDL f r o m t h e R E F c o m m a n d f o l l o w i n g t o t h e W R A c o m m a n d f o r a S e l f - R e f r e s h m o d e entry. In order to satisfy the refresh period, the Self-Refresh entry command should be asserted within 3.9us after the latest AutoR e f r e s h c o m m a n d . O n c e t h e d e v i c e e n t e r s S e l f - R e f r e s h m o d e , t h e D E S L c o m m a n d m u s t b e c o n t i n u e d f o r I REFC period. In addition, it is desirable that clock input is kept in ICKD period. The device is in Self-Refresh mode as long as P D held "Low". During Self-Refresh mode, all input and output buffers except for PD are disabled, therefore the power dissipation lowers. Regarding a Self-Refresh mode exit, P D h a s t o b e c h a n g e d o v e r f r o m " L o w " t o " H i g h " a l o n g w i t h t h e D E S L c o m m a n d , a n d t h e D E S L c o m m a n d h a s t o b e c o n t i n u o u s l y i s s u e d i n t h e n u m b e r o f c l o c k s s p e c i f i e d b y I REFC . The Self-Refresh exit function is asynchronous operation. It is required that one A u t o - R e f r e s h c o m m a n d i s i s s u e d t o a v o i d t h e v i o l e n c e o f t h e r e f r e s h p e r i o d j u s t a f t e r I REFC from Self-Refresh exit. - 52 - REV. 0.0 Nov. 2002 K4C89363AF Power Down Mode( P D="L" ) When all banks are in the idle state and all DQ outputs are in Hi-Z states, the K4C89363AF become Power Down Mode by asserting PD is "Low". When the device enters the Power Down Mode, all input and output buffers except for PD , CLK, C L K and QS. Therefore, the power dissipation lowers. To exit the Power Down Mode, PD has to be brought to "High" and the DESL command has to be issued for IP D A c y c l e a f t e r P D g o e s h i g h . T h e P o w e r D o w n e x i t f u n c t i o n i s a s y n c h r o n o u s o p e r a t i o n . Mode Register Set (1st command + 2nd command = RDA + MRS) When all banks are in the idle state, issuing the MRS command following to the RDA command can program the Mode Register. In a point to notice, the read mode started with the RDA command is canceled by the MRS command having gone into the next clock of the RDA command instead of the LAL command. The data to be set in the Mode Register is transferred using A0 to A14, BA0 and BA1 address inputs. The K4C89363AF have two mode registers. These are Regular and Extended Mode Register. The Regular or Extended Mode Register is chosen by BA0 and BA1 in the MRS command.The Regular Mode Register designates the operation mode for a read or write cycle. The Regular Mode Register has four function fields. The four fields are as follows : (R-1) Burst Length field to set the length of burst data (R-2) Burst Type field to designate the lower address access sequence in a burst cycle (R-3) C A S Latency field to set the access time in clock cycle (R-4) Test Mode field to use for supplier only. The Extended Mode Register has two function fields. The two fields are as follows: (E-1) DLL Switch field to choose either DLL enable or DLL disable (E-2) Output Driver Impedance Control field. (E-3) Data Strobe Select Once these fields in the Mode Register are set up, the register contents are maintained until the Mode Register is set up again b y another MRS command or power supply is lost. The initial value of the Regular or Extended Mode Register after power-up is undefined, therefore the Mode Register Set command must be issued before proper operation. - 53 - REV. 0.0 Nov. 2002 K4C89363AF • Regular Mode Register/Extended Mode Register change bits (BA0, BA1) These bits are used to choose either Regular MRS or Extended MRS BA1 0 0 1 BA0 0 1 X A14~A0 Regular MRS cycle Extended MRS cycle Reserved Regular Mode Register Fields (R-1) Burst Length field (A2 to A0) This field specifies the data length for column access using the A2 to A0 pins and sets the Burst Length to be 2 or 4 words. A2 0 0 0 0 1 (R-2) Burst Type field (A3) A1 0 0 1 1 X A0 0 1 0 1 X Burst Length Reserved 2 words 4 words Reserved Reserved This Burst Type can be chosen Interleave mode or Sequential mode. When the A3 bit is " 0", Sequential mode is selected. When the A3 bit is "1", Interleave mode is selected. Both burst types support burst length of 2 and 4 words. A3 0 1 • Addressing sequence of Sequential mode (A3) Burst Type Sequential Interleave A column access is started from the inputted lower address and is performed by incrementing the lower address input to the device. C A S Latency = 4 (Free Running QS mode) CK CK Command RDA LAL QS DQ Data 0 Data 1 Data 2 Data 3 Addressing sequence for Sequential mode Data Data 0 Data 1 Data 2 Data 3 Access Address n Burst Length 2 words (Address bits is LA0) n+1 n+2 n+3 not carried from LA0~LA1 4 words(Address bits is LA1, LA0) not carried from LA1~LA2 - 54 - REV. 0.0 Nov. 2002 K4C89363AF Functional Description (Continued) • Addressing sequence of Inteleave mode A column access is started from the inputted lower address and is performed by interleaving the address bits in the sequence shown as the following. Addressing sequence for Interleave mode Data Data 0 Data 1 Data 2 Data 3 (R-3) C A S Latency field (A6 to A4) This field specifies the number of clock cycles from the assertion of the LAL command following the RDA command to the first data read. The minimum values of C A S Latency depends on the frequency of CLK. In a write mode, the place of clock which should input write data is C A S Latency cycles - 1. Access Address ...A8 A7 A6 A5 A4 A3 A2 A1 A0 ...A8 A7 A6 A5 A4 A3 A2 A1 A 0 ...A8 A7 A6 A5 A4 A3 A2 A 1 A 0 ...A8 A7 A6 A5 A4 A3 A2 A 1 A 0 Burst Length 2 words 4 words Addressing sequence for Interleave mode A6 0 0 0 0 1 1 1 1 A5 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 CAS Latency Reserved Reserved Reserved Reserved 4 5 6 Reserved (R-4) Test Mode field (A7) This bit is used to enter Test Mode for supplier only and must be set to "0" for normal operation. (R-5) Reserved field in the Regular Mode Register • Reserved bits (A8 to A14) These bits are reserved for future operations. They must be set to "0" for normal operation. - 55 - REV. 0.0 Nov. 2002 K4C89363AF Extended Mode Register Fields (E-1) DLL Switch field (A0) This bit is used to enable DLL. When the A0 bit is set "0", DLL is enabled. (E-2) Output Driver Impedance Control field (A1 to A4) This field is used to choose Output Driver Strength. Four types of Driver Strength are supported. QS and DQ Driver Strength can be chosen separately. A2-A1 specified the DQ Driver Strength. A4-A3 specified the QS Driver Strength. QS A4 0 0 1 1 (E-3) Strobe Select (A6/A5) DQ Output Driver Impedance Control A3 0 1 0 1 A2 0 0 1 1 A1 0 1 0 1 Normal Output Driver Strong Output Driver Weaker Output Driver Reserved Two types of strobe are supported. This field is used to choose the type of data strobe. (1) Unidirectional DS/QS mode Data strobe is separated DS for write strobe and QS for read strobe. DS is used to sample write data at write operation. QS is aligned with read data at Read operation. (2) Unidirectional DS/Free running QS mode Data strobe is separated DS for write strobe and QS for read strobe. DS is used to sample write data at write operation. QS is aligned with read data and always clocking A6 0 0 1 1 (E-4)Reserved fied (A7 to A14) A5 0 1 0 1 Strobe Select Reserved Reserved Unidirectional DS/QS mode Unidirectional DS/Free running QS mode These bits are reserved for future operations and must be set to "0" for normal operation. - 56 - REV. 0.0 Nov. 2002 K4C89363AF Package Outline Drawing (FBGA 144ball, 1.0 x 0.8 mm) - will be added - 57 - REV. 0.0 Nov. 2002 K4C89363AF General Information Organization 288M(x32) 288M(x36) F6 (667Mbps) K4C89323AF-GCF6 K4C89363AF-GCF6 FB (600Mbps ) K4C89323AF-GCFB K4C89363AF-GCFB F5 (500Mbps ) K4C89323AF-GCF5 K4C89363AF-GCF5 1 2 3 4 5 6 7 8 9 10 11 K 4 C XX XX X X X Memory DRAM - X X XX Speed Temperature & Power Small Classification Density and Refresh Organization Bank Package Version Interface (VDD & VDDQ) 1. SAMSUNG Memory 2. DRAM : 4 3. Small Classification C : Network-DRAM :K 8. Version F : 7th Generation 9. P a c k a g e T : TSOP II (400mil x 875mil) G : 144 FBGA 10. Temperature & Power 4. Density & Refresh 89 : 288M 8K/32ms 5. Organization 32 36 : x32 : x36 C : (Commercial, Normal) 11. Speed F6 : 667Mbps/pin (333MHz, CL=6) 6. Bank 3 : 4 Bank 7. Interface (VDD & VDDQ) A: SSTL-2(2.5V, 1.8V) FB : 600Mbps /pin (300MHz, CL=6) F5 : 500Mbps/pin (250MHz, CL=6) - 58 - REV. 0.0 Nov. 2002
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