SI-3033ZD-TL

IOUT = 3 A, VIN = 10 V Linear Regulator IC SI-3011ZD Data Sheet Description Packages The SI-3011ZD is a linear regulator IC whose maximum output current is 3 A. Output voltage is adjusted by external resistors. The IC has a built-in low saturation PNP bipolar transistor and can operate with a low input/output voltage difference. The IC has various functions including the Output On/Off Function, the Overcurrent Protection and the Thermal Shutdown, and achieves a linear regulator circuit with few external components. TO263-5L Features Specifications ● Adjustable Output Voltage (VOUT = 1.2 V to 5.0 V) ● Low Dropout Voltage, ΔVDIF ≤ 0.6 V (IOUT = 3 A) ● Output On/Off Function ● Protections Overcurrent Protection (OCP): Fold-back Thermal Shutdown (TSD) with Hysteresis: Autorestart ● ● ● ● Typical Application Not to scale Recomended Input Voltage, VIN = 2.4 V to 6.0 V Reference Voltage, VREF = 1.1 V ± 2% Output Current, IOUT = 3.0 A Dropout Voltage, ΔVDIF ≤ 0.6 V (IOUT = 3 A) Applications ● Audio Visual Equipment ● Office Automation Equipment ● White Goods VC VIN GND VO ADJ SI-3011ZD 1 2 3 4 5 ON/OFF VIN D1 VOUT R1 CIN COUT R2 SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 1 SI-3011ZD Contents Description ------------------------------------------------------------------------------------------------------ 1 Contents --------------------------------------------------------------------------------------------------------- 2 1. Absolute Maximum Ratings----------------------------------------------------------------------------- 3 2. Thermal Resistance Characteristics ------------------------------------------------------------------- 3 3. Recommended Operating Range ----------------------------------------------------------------------- 4 4. Electrical Characteristics -------------------------------------------------------------------------------- 4 5. Performance Curves -------------------------------------------------------------------------------------- 5 6. Derating Curve -------------------------------------------------------------------------------------------- 7 7. Block Diagram --------------------------------------------------------------------------------------------- 8 8. Pin Configuration Definitions --------------------------------------------------------------------------- 8 9. Typical Application --------------------------------------------------------------------------------------- 9 10. Physical Dimensions ------------------------------------------------------------------------------------ 10 10.1. Land Pattern Example --------------------------------------------------------------------------- 10 11. Marking Diagram --------------------------------------------------------------------------------------- 11 12. Operational Description ------------------------------------------------------------------------------- 12 12.1. Constant Voltage Control------------------------------------------------------------------------ 12 12.2. Output Voltage Setting --------------------------------------------------------------------------- 12 12.3. Overcurrent Protection Function (OCP) ----------------------------------------------------- 12 12.4. Thermal Shutdown (TSD) ----------------------------------------------------------------------- 12 12.5. Output On/Off Function ------------------------------------------------------------------------- 12 13. Design Notes ---------------------------------------------------------------------------------------------- 13 13.1. Considerations in Circuit Configuration ----------------------------------------------------- 13 13.2. External Components ---------------------------------------------------------------------------- 13 13.3. PCB Pattern Layout ------------------------------------------------------------------------------ 13 13.4. Thermal Design ------------------------------------------------------------------------------------ 13 Important Notes ---------------------------------------------------------------------------------------------- 15 SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 2 SI-3011ZD 1. Absolute Maximum Ratings Unless otherwise specified, TA = 25 °C. Parameter Symbol Rating Unit 10 V 6 V 3 A 3 W TJ −30 to 125 °C TOP −30 to 85 °C TSTG −40 to 125 °C VIN Pin Voltage VIN VC Pin Voltage VC Output Current IOUT Power Dissipation Operating Ambient Temperature (2) Storage Temperature (1) (2) 2. VC ≤ VIN PD Junction Temperature (2) Conditions Mounted on the board (1) Glass-epoxy board (40 mm × 40 mm), copper area 100% When the junction temperature increases to 135 °C or more, the thermal shutdown is activated. Thermal Resistance Characteristics Parameter Symbol Thermal Resistance between Junction and Ambient Thermal Resistance between Junction and Case(2) θJ-A Conditions Min. Typ. Max. Unit — — 33.3 °C/W — — 3 °C/W (1) θJ-C TC Figure 2-1. (1) (2) Case Temperature Measurement Point The IC is mounted on the glass-epoxy board (40 mm × 40 mm) with copper area 100%. The case temperature (°C) is measured at the point defined in Figure 2-1. SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 3 SI-3011ZD 3. Recommended Operating Range Parameter VIN Pin Voltage Output Current Output Voltage Operating Ambient Temperature Operating Junction Temperature (3) (4) Symbol VIN IOUT VOUT TOP(A) TOP(J) Min. (3) 0 1.2 −20 −20 Max. 6(4) 3(2) 5 85 100 Unit V A V °C °C When setting the output voltage to 2.0 V or lower, set the input voltage to 2.4 V or higher. The following equation shows the relationship between VIN, VOUT, and IOUT. Thus, Dropout Voltage (VIN − VOUT) and/or IOUT may be limited in some conditions. PD = (VIN − VOUT ) × IOUT 4. Electrical Characteristics Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming out of the IC (sourcing) is negative current (−). Unless otherwise specified, TA = 25 °C. Parameter Symbol Conditions (1) Min Typ. Max Unit VIN = VOUT + 1 V, 1.078 1.100 1.122 Reference Voltage VREF V IOUT = 10 mA VIN = 3.3 V to 5 V, — — 10 Line Regulation ΔVLINE IOUT = 10 mA, mV VOUT = 2.5 V VIN = 3.3 V, — — 40 Load Regulation ΔVLOAD IOUT = 0 A to 10 mA, mV VOUT = 2.5 V — — 0.6 Dropout Voltage ΔVDIF IOUT = 3 A V Output Voltage Temperature — — ΔVOUT/ΔTA TJ = 0 °C to 100 °C ±0.05 mV/°C Coefficient VIN = VOUT + 1 V, — — Ripple Rejection Ratio RREJ 60 DB f = 100 Hz to 120 Hz Overcurrent Protection Operating VIN = VOUT + 1 V, — — IS1 3.2 A Current (2) IOUT = 10 mA VIN = VOUT + 1 V, — Quiescent Current IQ IOUT = 10 mA, 1.0 1.5 mA VC = 2 V Circuit Current during Regulator VIN = VOUT + 1 V, — IQ(OFF) — 1 μA Output Off VC = 0 V VC Pin Voltage (Output On) VC_IH 2 — — V — 0.8 VC Pin Voltage (Output Off) VC_IL — V — 100 VC Pin Current (Output On) IC_IH VC = 2.7 V — μA −5 — VC Pin Current (Output Off) IC_IL VC = 0 V 0 μA (1) Following equation shows the relationship between VIN, VOUT, and IOUT. Thus, Dropout Voltage (VIN − VOUT) or IOUT may be limited in some conditions. PD = (VIN − VOUT ) × IOUT (2) After the Overcurrent Protection is activated, IS1 is measured when the output voltage decreases by 5% from the reference output voltage (IOUT = 10 mA). SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 4 SI-3011ZD 5. Performance Curves Output Voltage, VOUT (V) Dropout Voltage, ΔVDIF (V) Unless otherwise specified, TA = 25 °C. Input Voltage, VIN (V) Output Current, IOUT (A) Dropout Voltage Figure 5-2. Output Rise Characteristics Output Voltage, VOUT (V) GND Pin Current (mA) Figure 5-1. Input Voltage, VIN (V) Figure 5-3. GND Pin Current Input Voltage, VIN (V) Figure 5-4. SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 Line Regulation 5 Output Voltage, VOUT (V) Output Voltage, VOUT (V) SI-3011ZD Output Current, IOUT (A) Output Current, IOUT (A) Load Regulation Figure 5-6. Overcurrent Protection Characteristics Output Voltage, VOUT (V) VC Pin Current, IC (μA) Figure 5-5. VC Pin Voltage, VC (V) Figure 5-7. VOUT – VC SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 VC Pin Voltage, VC (V) Figure 5-8. I C – VC 6 Output Voltage, VOUT (V) SI-3011ZD Junction Temperature, TJ (°C) Figure 5-9. 6. Thermal Shutdown Characteristics Derating Curve 4.0 Copper area 40 mm × 40 mm (θJ-A = 33.3 °C/W) 3.5 Copper area 20 mm × 40 mm (θJ-A = 37 °C/W) Power Dissipation, PD (W) Copper area 20 mm × 20 mm (θJ-A = 44 °C/W) 3.0 2.5 2.0 1.5 Copper area 10 mm × 10 mm (θJ-A = 53 °C/W) 1.0 0.5 0.0 -25 0 25 50 75 100 125 Ambient Temperature, TA (°C) Figure 6-1. Power Dissipation, PD vs. Ambient Temperature, TA SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 7 SI-3011ZD Block Diagram 8. Pin Configuration Definitions Pin Number Pin Name 1 VC On/off signal input 2 VIN Voltage input VC VIN GND VO ADJ 7. 3 GND Ground 1 4 VO Voltage output 5 ADJ Output voltage setting resistor connection 2 3 4 5 (Back Side) ― Function Heatsink (A heatsink is internally connected to the GND pin. In order to improve heat dissipation, be sure to solder the heatsink of the IC to copper trace on PCB. The copper area should be as wide as possible.) SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 8 SI-3011ZD 9. Typical Application VC VIN GND VO ADJ SI-3011ZD 1 2 3 4 5 ON/OFF VIN D1 VOUT R1 CIN COUT R2 Figure 9-1. Typical Application (VOUT > 1.8 V) VC VIN GND VO ADJ SI-3011ZD 1 2 3 4 5 ON/OFF VIN D1 VOUT R1 R3 CIN COUT R2 Figure 9-2. Typical Application (VOUT ≤ 1.8 V) Table 9-1 Reference Value of External Components (VIN = 6 V, VOUT = 5 V) Symbol Part Type Reference Value CIN Electrolytic capacitor/ ceramic capacitor 10 μF COUT Electrolytic capacitor ≥ 47 μF R1 Resistor 35.4 kΩ R2 Resistor 10 kΩ R3 Resistor 10 kΩ D1 Diode See Section 13.2. Remarks CIN is required when the input line contains inductance, or the wiring is long. CIN should be connected as close as possible to the VIN and GND pins with short traces. Ceramic capacitors cannot be used. Adjust resistance according to the output voltage. See Section 12.2. See Section 12.2. Add R3 when VOUT ≤ 1.8 V. Add D1 when VOUT > 3.3 V. Select a diode that has sufficient Surge Forward Current tolerance against the discharge current of COUT. SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 9 SI-3011ZD 10. Physical Dimensions ● TO263-5L E L1 A (E) H D D1 L4 (L1) C2 E1 A2 A1 c e L c Symbol A A1 A2 b b1 c c1 C2 D D1 E E1 e b L3 b PLATING b1 c c1 BASE METAL SECTION C-C H L L1 L3 L4 θ θ1 θ2 Min. 4.40 0 2.59 0.77 0.76 0.34 0.33 1.22 9.05 6.86 10.06 7.50 Nom. 4.57 0.10 2.69 — 0.81 — 0.38 — 9.15 — 10.16 — 1.70 BSC 14.70 15.10 2.00 2.30 1.17 1.27 0.25 BSC 2.00 REF 0° — 5° 7° 1° 3° Max. 4.70 0.25 2.79 0.90 0.86 0.47 0.43 1.32 9.25 7.50 10.26 8.30 15.50 2.60 1.40 8° 9° 5° NOTES: ● Dimensions in millimeters ● Bare lead frame: Pb-free (RoHS compliant) ● Dimensions do not include mold burrs. 10.1. Land Pattern Example 11 ±0.2 9 ±0.2 6.8 ±0.1 9 ±0.1 3.7 ±0.05 4 ±0.1 1.7 ±0.1 1 ±0.05 Dimensions in millimeters. SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 10 SI-3011ZD 11. Marking Diagram Specific Device Code (See Table 11-1.) YMDXXX Lot Number: Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) D is the period of days represented by: 1: the first 10 days of the month (1st to 10th) 2: the second 10 days of the month (11th to 20th) 3: the last 10–11 days of the month (21st to 31st) XXX is the control number 3011Z 1 5 Table 11-1 Specific Device Code Specific Device Code Part Number 3011Z SI-3011ZD SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 11 SI-3011ZD 12. Operational Description All the characteristic values given in this section are typical values, unless they are specified as minimum or maximum. See Figure 9-1 and Figure 9-2 for symbols used in the description. 12.1. Constant Voltage Control The IC consists of some circuit such as a reference voltage, an error amplifier, and a PNP transistor. To regulate the output voltage, the emitter-to-collector voltage of the PNP transistor is linear controlled so that the ADJ pin voltage becomes equal to the reference voltage by the internal error amplifier. The thermal design must be taken into account, because the product of the emitter-collector voltage (Dropout Voltage) and the output current result in the loss of the IC. 12.2. Output Voltage Setting Output voltage is adjusted by external resistors, R1 and R2 (see Figure 9-1 and Figure 9-2). The ADJ pin is for feedback signal input to set the output voltage. Do not apply any voltage other than this feedback signal to the ADJ pin. The feedback current flowing through R1 and R2 is set to about 100 μA. The reference voltage of the ADJ pin, VREF, is 1.10 V. R2 is calculated by Equation (1). R2 = VREF 1.10 (V) = = 11 (kΩ) 100 (μA) 100 (μA) (1) Output voltage, VOUT, is calculated by Equation (2). VOUT = R1 + R2 × VREF R2 (2) Thus, R1 is calculated by using Equation (3). R1 = R2 × (VOUT − VREF ) VREF ＝ 10 kΩ × (VOUT − 1.10 V) 1.10 V 12.3. Overcurrent Protection Function (OCP) The IC has Overcurrent Protection (OCP) with the fold-back characteristic that the output current at the short circuit load (VOUT = 0 V) is smaller than that at OCP activation (see Figure 5-6). In the short circuit load, the loss (VIN × IO) of a fold-back system is less than the loss of the constant current or fold-forward system. When the voltage across the output capacitor is 0 V at IC startup, the IC gradually increases the output voltage while limiting the output current with OCP. 12.4. Thermal Shutdown (TSD) The IC has the Thermal Shutdown (TSD) with hysteresis. When the junction temperature of the IC increases to 130 °C or more, TSD is activated, and turns off the internal PNP transistor to shutdown the load current. The temperature hysteresis of TSD is about 30 °C. When the junction temperature decreases to about 100 °C after the load current shutdown, the IC restarts the constant voltage control. The TSD protects the IC against the heat generation when the loss of the IC increases due to the instantaneous short-circuit of the load. This does not guarantee the operation including the reliability in the short-circuit state for long period or the state where the heat generation continues. 12.5. Output On/Off Function The output is turned on/off by the input signal to the VC pin. When the VC pin voltage, VC, is 2 V or more, the output is supplied. When VC is 0.8 V or less, the output is turned off. When the VC pin is open, the output is turned off. Since the VC pin input is equivalent to the low power Schottky TTL circuit (LS-TTL), the VC pin can be driven directly by LS-TTL. Note that the voltage applied to the VC pin should not exceed the maximum rating of 6 V. (3) If the calculation result does not match the value defined by the E series, adjustment resistors should be added in series or parallel to R1. When setting the output voltage to ≤ 1.8 V, add R3 as shown in Figure 9-2. R3 is about 10 kΩ. SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 12 SI-3011ZD 13. Design Notes 13.2. External Components 13.1. Considerations in Circuit Configuration ● Input Capacitor, CIN The capacitor, CIN, connected to the VIN pin is a bypass capacitor for suppressing noise and stabilizing voltage. Use electrolytic or ceramic capacitor for CIN. The capacitance is about 0.47 μF to 22 μF. The overcurrent protection of the IC has the fold-back characteristic. To avoid startup failure, do not use the circuit configurations as follows: ● ● ● ● Constant current circuit is connected to the IC. CV/CC circuit is connected to the IC. Load 2 is stacked on Load 1 (see in Figure 13-1). The output voltage setting resistor is connected between the GND pin and Ground (see Figure 13-2). U2 VIN VO GND Load 2 U1 VIN VO GND Load 1 ● Output Capacitor The output capacitor, COUT, is connected to the VO pin. COUT is a capacitor for phase compensation and is an electrolytic capacitor of ≥ 47 μF. Select an electrolytic capacitor with a series equivalent resistance (ESR) in the range of 0.2 Ω to 2 Ω. If a low ESR type capacitor such as a ceramic capacitor is used for the output capacitor, the output voltage may oscillate. ● Protection Diode for Reverse Biasing If the output voltage is 3.3 V or higher, connect the diode, D1, for reverse bias protection. The IC is protected when a reverse bias is applied between input and output such as when the input voltage is turned off. D1 is not required if the output voltage is less than 3.3 V. 13.3. PCB Pattern Layout Figure 13-1 Stacked on Loads (Do not connect Load 2.) ● Input/ output Capacitor, CIN, COUT Place CIN and COUT as close as possible to the IC with a minimum length of traces to the VIN and VO pins. U1 VIN VIN ● Output Voltage Setting Resistor, R1, R2 R1 and R2 should be placed as close as possible to the IC. R2 should be connected to the ADJ and GND pins with a minimum length of traces. VO GND R1 Load R2 Ground Figure 13-2 Output Voltage Setting (Do not connect R2.) ● Ground Ground traces should be as wide and short as possible so that EMI levels can be reduced. 13.4. Thermal Design Generally, the heat dissipation of an IC depends on the size and material of the board and the copper area. To improve the thermal performance, the copper area of the part where the backside of the IC is soldered should be as large as possible. Figure13-3 shows the derating of the IC. When using the IC, ensure a sufficient margin. Follow the procedure below to design heat dissipation. (1) Measure the maximum ambient temperature, TA(MAX) of the IC. (2) Change the input/output conditions and check the power dissipation, PD. Calculate the maximum SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 13 SI-3011ZD power dissipation, PD(MAX) with the Equation (4). PD = (VIN − VOUT ) × IOUT (4) (3) Determine the copper area by confirming the intersection of ambient temperature and power dissipation by the thermal derating characteristics shown in Figure13-3. For reference, Figure13-3 shows the relationship between the copper area and thermal resistance of a single-sided copper foil board, FR-4. Junction – Ambient Termal Resistance θJ-A (°C/W) 55 50 45 40 35 30 0 200 400 600 800 1000 1200 1400 1600 Copper Area (mm2) Thermal Resistance – Copper Area Reference Characteristics (Single-sided Copper Foil Board, FR-4) Figure13-3 SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 14 SI-3011ZD Important Notes ● All data, illustrations, graphs, tables and any other information included in this document (the “Information”) as to Sanken’s products listed herein (the “Sanken Products”) are current as of the date this document is issued. The Information is subject to any change without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative that the contents set forth in this document reflect the latest revisions before use. ● The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment, disaster/crime alarm systems, various safety devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein. ● In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically, chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. ● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid the occurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility, preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the Sanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please refer to the relevant specification documents and Sanken’s official website in relation to derating. ● No anti-radioactive ray design has been adopted for the Sanken Products. ● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, all information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the Sanken Products. ● Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you, users or any third party, resulting from the Information. ● No information in this document can be transcribed or copied or both without Sanken’s prior written consent. ● Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights and any other rights of Sanken. ● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty of merchantability, and implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is delivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, course of dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, and reliability). ● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use or both of any particular controlled substances, including, but not limited to, the EU RoHS Directive, so as to be in strict compliance with such applicable laws and regulations. ● You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each country including the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan, and follow the procedures required by such applicable laws and regulations. ● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including the falling thereof, out of Sanken’s distribution network. ● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible errors or omissions in connection with the Information. ● Please refer to our official website in relation to general instructions and directions for using the Sanken Products, and refer to the relevant specification documents in relation to particular precautions when using the Sanken Products. ● All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s). DSGN-CEZ-16003 SI-3011ZD-DSE Rev.1.1 SANKEN ELECTRIC CO., LTD. Sep. 11, 2020 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2020 15