SI-8033W

1-1-3 DC/DC Converter ICs SI-8000W Series Surface-Mount, Separate Excitation Step-down Switching Mode ■Features ■Absolute Maximum Ratings • Surface-mount package (SOP8) Parameter • Output current: 0.6A • High efficiency: 75 to 80% Symbol Ratings DC Input Voltage VIN 35 Unit V Power Dissipation PD 1 W °C Junction Temperature Tj –30 to +125 • Requires only 4 discrete components Storage Temperature Tstg –40 to +125 °C • Internally-adjusted phase correction and output voltage adjustment performed internally Thermal Resistance (Junction to 7-Pin Lead) θ j-L 22 °C/W Thermal Resistance (Junction to Ambient Air)*1 θ j-a 100 °C/W *1: Glass-epoxy board of 40 × 40mm (copper laminate area 4.3%) • Built-in reference oscillator (60kHz) ns • Built-in overcurrent and thermal protection circuits ■Applications • Onboard local power supplies ■Recommended Operating Conditions Ratings Symbol Parameter SI-8033W D es ig • Power supplies for telecommunication equipment Unit 7 to 33 V SI-8050W VIN Output Current Range IO 0 to 0.6 A Tjop –30 to +125 °C rN Operating Junction Temperature Range 5.3 to 28 ew DC Input Voltage Range ■Electrical Characteristics (Ta=25°C) Symbol SI-8033W min. VO Output Voltage 3.17 3.30 Conditions 75 Temperature Coefficient of Output Voltage ∆VO/∆Ta RREJ Ripple Rejection ec o Conditions m Conditions Overcurrent Protection Starting Current IS1 N ot R Conditions 20 max. 5.00 5.20 80 60 80 30 30 VIN=20V, IO=0.1 to 0.4A ±0.5 ±0.5 45 45 f=100 to 120HZ f=100 to 120HZ 0.61 VIN=15V 100 VIN=10 to 30V, IO=0.3A VIN=15V, IO=0.1 to 0.4A 0.61 kHZ VIN=20V, IO=0.3A 80 VIN=20V V % VIN=20V, IO=0.3A VIN=8 to 28V, IO=0.3A m Load Regulation ICs 60 Unit typ. VIN=20V, IO=0.3A VIN=15V, IO=0.3A ∆VOLINE ∆VOLOAD 4.80 60 en f Conditions 3.43 VIN=15V, IO=0.3A Conditions Line Regulation min. de Conditions Oscillation Frequency SI-8050W max. VIN=15V, IO=0.3A η Efficiency 14 typ. d Parameter fo Ratings 40 mV mV mV/ °C dB A SI-8000W Series ■External Dimensions (SOP8) (Unit : mm) 5.1±0.4 1.27 0.15+0.1 –0.05 6 5 1 2 3 4 6.2±0.3 7 4.4±0.2 8 o1 0° 1.27 es ig ■Typical Connection Diagram 1 ew D ■Block Diagram VIN 3 SW OCP Reg. VIN rN OSC TSD Reset Drive 4 VOS Amp. 1 L1 200µH SW VIN SI-8000W + GND 5 to 8 VOS 3 VO 4 D1 + C2 330µF SJPB-D4 (Sanken) GND GND d VREF C1 100µF fo Comp. 5 to 8 de GND en ■Reference Data m Copper Laminate Area vs. Power Dissipation Tj=100°C Area of PC board : 40 × 40mm m 1.2 ns 1.5±0.1 Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 0.1g 0.05±0.05 0.10 0.12 M 1.55±0.15 0t 0.995max. 0.4±0.1 Pin Assignment q VIN w N.C e SW r VOS t GND y GND u GND i GND 0.5±0.1 0.4±0.1 Copper Laminate Area vs. Thermal Resistance θ j-a 140 Area of PC board : 40 × 40mm Ta=25°C Ta=50°C ec o 120 0.6 100 R 0.8 Thermal Resistance θ j-a (°C/W) Ta=80°C 0.4 N ot Power Dissipation PD (W) 1 0.2 0 10 100 Copper Laminate Area (mm2) (GND Terminal) 1000 80 60 40 10 100 1000 Copper Laminate Area (mm2) (GND Terminal) ICs 15