SMA6852MZLF2452

SMA6850MX/MZ Series High Voltage 3-Phase Motor Drivers Features and Benefits ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ Description Built-in pre-drive IC MOSFET power element CMOS compatible input (3.3 to 5 V) High-side gate driver using bootstrap circuit or floating power supply Built-in protection circuit for controlling power supply voltage drop Built-in overtemperature detection circuit (TD) Output of fault signal during operation of protection circuits Output current 1.5, 2, and 2.5 A Small SIP (SMA 24-pin) The SMA6850MX/MZ inverter power module (IPM) series provides a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 230 VAC input voltage, and up to 2.5 A (continuous) output current. They can withstand voltages of up to 500 V (MOSFET breakdown voltage). The SMA6850MX/MZ power package includes an IC with all of the necessary power elements (six MOSFETs) and pre-driver ICs (two), needed to configure the main circuit of an inverter. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Packages: Power SIP Applications include residential white goods (home applications) and commercial appliance motor control: • Air conditioner fan • Small ventilation fan • Dishwasher pump Not to scale Leadform 2451 Leadform 2452 Functional Block Diagram VB 1 VB 2 VB3 VCC1 VBB 1 VBB 2 UVLO HIN1 HIN2 HIN3 Input Logic UVLO UVLO UVLO High Side Level Shift Driver COM1 U V W1 W2 VCC2 VREG LIN1 LIN2 LIN3 7.5V Reg. UVLO Input Logic Low Side Driver COM2 FO Thermal Detection A Figure 1. Driver block diagram SMA6850MXMZ SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/ LS 3 LS 2 LS1 A Implemented in low-side MIC; propagation delay in detecting MOSFET temperature increase High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Selection Guide Output Current Part Number Packing MOSFET Breakdown Voltage, VDSS(min) (V) Continuous, IO(max) (A) Pulsed, IOP (max) (A) SMA6852MZ 18 pieces per tube 500 1.5 2.25 SMA6853MX 18 pieces per tube 500 2.5 3.75 SMA6854MZ 18 pieces per tube 600 1.5 2.25 Absolute Maximum Ratings, valid at TA = 25°C Characteristic Symbol Remarks Rating SMA6852MZ MOSFET Breakdown Voltage VDSS SMA6853MX VCC = 15 V, ID = 100 μA, VIN = 0 V Logic Supply Voltage VCC Between VCC and COM Bootstrap Voltage VBS Between VB and HS (U,V, and W phases) SMA6854MZ Output Current, Continuous IO Output Current, Pulsed IOP VIN Allowable Power Dissipation PD 500 V 500 V 600 V 20 V 20 V SMA6852MZ 1.5 A SMA6853MX 2.5 A SMA6854MZ 1.5 A SMA6852MZ 2.25 A 3.75 A 2.25 A SMA6853MX PW ≤ 100 μs, duty cycle = 1% SMA6854MZ Input Voltage Unit TC = 25°C –0.5 to 7 V 28 W Thermal Resistance (Junction to Case) RθJC All elements operating 4.46 °C/W Thermal Resistance (Junction to Ambient) RθJA All elements operating 31.25 °C/W Case Operating Temperature °C TCOP –20 to 100 Junction Temperature (MOSFET) TJ 150 °C Storage Temperature Tstg –40 to 150 °C Recommended Operating Conditions Characteristic Symbol Remarks SMA6852MZ Main Supply Voltage VBB SMA6853MX Between VBB and LS SMA6854MZ Min. Typ. Max. Units – 280 400 V – – 400 V – 300 450 V 13.5 – 16.5 V Logic Supply Voltage VCC Minimum Input Pulse TW(min) 0.5 – – μs tdead 1.5 – – μs Dead Time Between VCC and COM All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 2 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Typical Application Diagram 1 2 3 SMA685xMx 9 10 VB1 VB2 VB3 4 HO 1 VCC1 HS1 HVIC 8 7 6 5 24 HO 2 HS2 12 M HIN 1 HIN 2 HIN 3 HO 3 COM1 HS3 11 14 23 VCC 2 LO 1 17 MC U 20 19 18 LVIC LIN1 LIN2 LO 2 13 LIN3 LO 3 16 22 21 VREG 15 FO COM 2 15 V NOTE: ▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them. ▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is necessary. ▪ This IPM does not have an overcurrent detection feature. It is recommended to implement the feature externally. When an overcurrent condition occurs, the application MCU must stop driving the IPM within 2 μs. ▪ Snubber capacitors should be surge suppressor film capacitors with sufficient rating to suppress surge voltavges. To determine the capacitance for an application, please verify the surge voltage in the actual application. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 3 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions Logic Supply Voltage VCC Between VCC and COM Logic Supply Current ICC SMA6853MX SMA6852MZ Input Voltage Input Voltage Hysteresis Input Current V – 4 6 mA – 2.5 4.0 mA – 3.8 – mA – 2.0 2.5 V VIL VCC = 15 V, output off 1.0 1.5 – V VCC = 15 V – 0.5 – V IIH High side, VCC = 15 V, VIN = 5 V – 50 100 μA IIL Low side, VCC = 15 V, VIN = 0 V – – 2 μA 9.0 10.0 11.0 V 9.5 10.5 11.5 V – 0.5 – V 10.0 11.0 12.0 V 10.5 11.5 12.5 V – 0.5 – V 0 – 1.0 V VIhys VUVHhys VUVLL VUVLhys Output Voltage for Regulator Units 16.5 VCC = 15 V, output on VUVLH Overtemperature Detection Threshold Temperature (activation and deactivation) Max 15 SMA6854MZ VUVHH FO Terminal Output Voltage Typ VIH VUVHL Undervoltage Lock Out VCC = 15 V, IREG = 0 A Min 13.5 VFOL VFOH High side, between VB and U, V, or W High side, hysteresis Low side, between VCC and COM Low side, hysteresis VCC = 15 V TDH TDL VCC = 15 V, no heatsink TDhys VREG IREG = 35 mA, TC = –20°C to 100°C 4.0 – 5.5 V 135 150 165 °C 105 120 135 °C – 30 – °C 6.75 7.5 8.25 V Bootstrap Diode Leakage Current ILBD VR = 500 V – – 10 μA Bootstrap Diode Forward Voltage VFBD IF = 0.15 A – 1.1 1.3 V Bootstrap Diode Series Resistor RBD MOSFET Breakdown Voltage VDSS SMA6852MZ 17.6 22 26.4 Ω SMA6853MX 17.6 22 26.4 Ω SMA6854MZ 48 60 72 Ω SMA6852MZ 500 – – V 500 – – V 600 – – V SMA6853MX VCC = 15 V, ID = 100 μA, VIN = 0 V SMA6854MZ MOSFET Leakage Current MOSFET On State Resistance MOSFET Diode Forward Voltage SMA6850MXMZ IDSS RDS(on) VSD VCC = 15 V, VDS = 500 V, VIN = 0 V – – 100 μA SMA6852MZ VCC = 15 V, ID = 0.75 A, VIN = 5 V – 3.6 4.0 Ω SMA6853MX VCC = 15 V, ID = 1.25 A, VIN = 5 V – 2.0 2.4 Ω SMA6854MZ VCC = 15 V, ID = 1.25 A, VIN = 5 V – 3.0 3.5 Ω SMA6852MZ VCC = 15 V, ISD = 0.75 A, VIN = 0 V – 1.1 1.5 V SMA6853MX VCC = 15 V, ISD = 1.25 A, VIN = 0 V – 1.1 1.5 V SMA6854MZ VCC = 15 V, ISD = 1.25 A, VIN = 0 V – 1.0 1.5 V SANKEN ELECTRIC CO., LTD. 4 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ SMA6852MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Switching Time, High Side Symbol Min Typ Max Units tdH(on) – 530 – ns trH – 95 – ns – 130 – ns – 385 – ns trr Conditions VBB = 300 V, VCC = 15 V, ID = 1.5 A, 0 V ≤ VIN ≤ 5 V tdH(off) tfH – 40 – ns tdL(on) – 530 – ns trL Switching Time, Low Side – 95 – ns – 120 – ns tdL(off) – 445 – ns tfL – 30 – ns Min Typ Max Units tdH(on) – 650 – ns trH – 100 – ns – 150 – ns – 520 – ns trr VBB = 300 V, VCC = 15 V, ID = 1.5 A, 0 V ≤ VIN ≤ 5 V SMA6853MX SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Switching Time, High Side Symbol trr Conditions VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V tdH(off) tfH – 50 – ns tdL(on) – 700 – ns – 100 – ns – 150 – ns tdL(off) – 580 – ns tfL – 40 – ns Min Typ Max Units tdH(on) – 530 – ns trH – 55 – ns – 125 – ns – 510 – ns trL Switching Time, Low Side trr VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V SMA6854MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Switching Time, High Side Symbol trr Conditions VBB = 150 V, VCC = 15 V, ID = 2 A, 0 V ≤ VIN ≤ 5 V tdH(off) tfH – 50 – ns tdL(on) – 530 – ns – 60 – ns – 125 – ns tdL(off) – 540 – ns tfL – 55 – ns trL Switching Time, Low Side SMA6850MXMZ trr VBB = 150 V, VCC = 15 V, ID = 2 A, 0 V ≤ VIN ≤ 5 V SANKEN ELECTRIC CO., LTD. 5 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ 5V HIN 2 kΩ LIN 100 kΩ COM V DS HINx and LINx Terminals Internal Equivalent Circuit 5V ID 100 Ω Switching Characteristics Definitions 200 kΩ FO COM FO Terminal Internal Equivalent Circuit Truth Table Mode Normal Thermal Detection (TD)1 UVLO ( VCC )2 UVLO ( VB )3 Hin Lin H-side MOSFET L-side MOSFET L L Off Off H L On Off L H Off On H H On On L L Off Off H L On Off L H Off On H H On On L L Off Off H L Off Off L H Off Off H H Off Off L L Off Off H L Off Off L H Off On H H Off On 1The Thermal Detection function drives the FO pin output to logic high. The external microcontroller should detect this condition. 2Returning to the Normal mode of operation from a V CC UVLO condition, a low-side MOSFET resumes switching on the first logic high of a LINx input. 3Returning to the Normal mode of operation from a V UVLO condition, a high-side MOSFET resumes switching on the rising B edge of an HINx input. Note: To prevent a shoot-through condition, the external microcontroller should not drive HINx = LINx = H at the same time. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 6 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ High Side Driver Input/Output Timing Diagrams HIN VUVHH VB-HS VUVHL UVLO Release VCC1 VUVLL VUVLH A HO A After a high-side UVLO is released, HO output is activated at the rising edge of HIN. High-side UVLO conditions are not reflected in the FO pin output. Low Side Driver Input/Output Timing Diagrams LIN VCC VUVHH VUVHL UVLO Release LO B FO TDH TDL TJ B SMA6850MXMZ After a low-side UVLO is released, LO output is activated at the logic high of an LINx input. Low-side UVLO conditions drive the FO pin to logic high. SANKEN ELECTRIC CO., LTD. 7 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Pin-out Diagrams Leadform 2451 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 Leadform 2452 24 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 24 Chamfer Side Chamfer on Opposite Side Terminal List Table SMA6850MXMZ Number 1 Name VB1 Function High side bootstrap terminal (U phase) 2 VB2 High side bootstrap terminal (V phase) 3 VB3 High side bootstrap terminal (W phase) 4 VCC1 High side logic supply voltage 5 COM1 High side logic GND terminal 6 HIN3 High side input terminal (W phase) 7 HIN2 High side input terminal (V phase) 8 HIN1 High side input terminal (U phase) 9 VBB1 Main supply voltage 1 (connect to VBB2 externally) 10 VBB2 Main supply voltage 2 (connect to VBB1 externally) 11 W1 Output of W phase (connect to W2 externally) 12 V 13 LS2 Source terminal of V phase Output of V phase 14 W2 Output of W phase (connect to W1 externally) 15 LS3 Source terminal of W phase 16 VREG Internal regulator output terminal 17 LS1 Source terminal of U phase 18 LIN3 Low side input terminal (W phase) 19 LIN2 Low side input terminal (V phase) 20 LIN1 Low side input terminal (U phase) 21 COM2 22 FO 23 VCC2 24 U Low side GND terminal Overtemperature detection fault-signal output terminal Low side logic supply voltage Output of U phase SANKEN ELECTRIC CO., LTD. 8 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Package Outline Drawing Leadform 2451 Dual rows, 24 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row Gate protrusion 31 ±0.2 4 ±0.2 2X Gate protrusion 1.2 ±0.1 BSC 10.2 ±0.2 Branding Area 2X Exposed tie bar 3 ±0.5 BSC 2.2 ±0.7 BSC R1 REF 4.4 REF +0.15 – 0.05 C 0.7 View A 1 2 3 4 5 6 7 8 9 10 11 12 13 1.27 ±0.1 A 1.27 ±0.6 B 0.6 +0.15 – 0.05 14 15 16 17 18 19 20 21 22 23 2.2 ±0.7 BSC 24 0.7 MAX A Measured at pin exit from case B Measured at pin tips C Maximum dambar protrusion 0.55 +0.2 – 0.1 Leadform: 2451 Terminal core material: Cu Terminal plating: Ni and solder (Sn 97.5%, Ag 2.5%) plating Case material: Epoxy resin 0.7 MAX Deflection at pin bend View A Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, lot: YMDD# Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date # is the letter X for the SMA6853MX series or the reference number 2nd line, type: SMA6852MZ, SMA6853M, or SMA6854MZ Leadframe plating Pb-free. Device composition complies with the RoHS directive. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 9 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Package Outline Drawing Leadform 2452 Dual rows, 24 alternating pins; vertical case mounting; pin #1 opposite chamfer side Gate protrusion 31 ±0.2 4 ±0.2 2X Gate protrusion 1.2 ±0.1 BSC 10.2 ±0.2 2X Exposed tie bar Branding Area 5 ±0.5 9.5 +0.7 – 0.5 R1 REF 0.5 +0.15 – 0.05 4.5 REF 1.27 ±0.5 A 4.5 ±0.5 0.6 +0.15 – 0.05 View A 2 1 A 4 3 6 5 8 7 Measured at pin tips 10 9 12 11 14 13 16 15 18 17 20 19 22 21 24 23 0.7 MAX Leadform: 2452 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) 0.7 MAX Deflection at pin bend View A Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, lot: YMDD# Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date # is the letter X for the SMA6853MX series or the reference number 2nd line, type: SMA6852MZ, SMA6853M, or SMA6854MZ Leadframe plating Pb-free. Device composition complies with the RoHS directive. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 10 High Voltage 3-Phase Motor Drivers SMA6850MX/MZ Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials SC102 Dow Corning Toray Silicone Co., Ltd. SMA6850MXMZ Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 380±5°C 5 s • Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. SANKEN ELECTRIC CO., LTD. 11 SMA6850MX/MZ High Voltage 3-Phase Motor Drivers • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (TJ) affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. • The contents in this document must not be transcribed or copied without Sanken’s written consent. SMA6850MXMZ SANKEN ELECTRIC CO., LTD. 12