ASM3P2779AF-06OR

ASM3P2779A Peak EMI Reducing Solution The ASM3P2779A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. Features • Generates an EMI optimized clock signal at the output. • Integrated loop filter components. The ASM3P2779A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation.’ • Operates with a 3.3 / 2.5V Supply. • Operating current less than 4mA. • CMOS design. • Input frequency range: 13MHz to 30MHz for 2.5V 13MHz to 30MHz for 3.3V • Generates a 1X low EMI spread spectrum clock of the input frequency. • Frequency deviation: ±1% (Typ) @ 16MHz Input Applications Frequency. The ASM3P2779A is targeted towards all portable devices like MP3 players and digital still cameras. • Available in 6L-TSOP (6L-TSOT-23). Product Description Key Specifications Description The ASM3P2779A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2779A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The ASM3P2779A allows significant system cost savings by reducing the number of circuit board layers, ferrite beads and shielding that are traditionally required to pass EMI regulations. Specification Supply voltages VDD = 3.3V / 2.5V Cycle-to-Cycle Jitter ±200pS (Typ) Output Duty Cycle 45/55% Modulation Rate Equation FIN/640 Frequency Deviation ±1% (Typ) @ 16MHz Block Diagram VDD PD PLL Modulation XIN / CLKIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT VSS ©2010 SCILLC. All rights reserved. OCTOBER 2010 – Rev. 4.1 Publication Order Number: ASM3P2779/D ASM3P2779A Pin Configuration (6L-TSOP Package) PD 1 XOUT 2 ASM3P2779A XIN / CLKIN 3 6 VSS 5 ModOUT 4 VDD Pin Description Pin# Pin Name 1 Type PD Description I Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 XIN / CLKIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 4 VDD P Power supply for the entire chip. 5 ModOUT O Spread spectrum clock output. 6 VSS P Ground connection. Specifications Description Frequency Range Specification For 2.5V Supply For 3.3V Supply 13MHz < CLKIN < 30MHz 13MHz < CLKIN < 30MHz Modulation Equation FIN/640 Frequency Deviation ±1% (Typ) @ 16MHz Absolute Maximum Ratings Symbol VDD, VIN TSTG Parameter Rating Unit Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C 0 to +70 °C TA Operating temperature Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Parameter VDD Description Supply Voltage Min Max Unit 2.375 3.6 V -40 TA Operating Temperature (Ambient Temperature) +85 °C CL Load Capacitance 15 pF CIN Input Capacitance 7 pF Rev. 4 | Page 2 of 7 | www.onsemi.com ASM3P2779A DC Electrical Characteristics for 2.5V Supply Symbol Parameter VIL Min Typ Max Unit V Input low voltage VSS-0.3 0.8 VIH Input high voltage 2.0 VDD+0.3 V IIL Input low current -35 µA IIH Input high current 35 µA IXOL XOUT output low current (@ 0.5V, VDD = 2.5V) 3 mA IXOH XOUT output high current (@ 1.8V, VDD = 2.5V) 3 mA VOL Output low voltage (VDD = 2.5 V, IOL = 8mA) VOH Output high voltage (VDD = 2.5 V, IOH = 8mA) 0.6 IDD Static supply current ICC Dynamic supply current (2.5V, 16MHz and no load) V 1 VDD 2.0 Operating Voltage tON uA 3.0 2.375 mA 2.5 2 Power-up time (first locked cycle after power-up) ZOUT V 1.8 Output impedance 2.625 V 5 mS 50 Ω Notes: 1. XIN / CLKIN pin and PD pin are pulled low. 2. VDD and XIN / CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 2.5V Supply Symbol CLKIN ModOUT fd Min Typ Max Unit Input frequency 13 30 MHz Output frequency 13 30 MHz Frequency Deviation Input Frequency = 13MHz ±1.15 Input Frequency = 30MHz ±0.6 % 1 Output rise time (measured from 0.7V to 1.7V) 0.7 1.4 1.8 nS 1 Output fall time (measured from 1.7V to 0.7V) 0.4 0.9 1.1 nS tLH tHL Parameter tJC Jitter (cycle-to-cycle) tD Output duty cycle ±200 45 Note: 1. tLH and tHL are measured into a capacitive load of 15pF. Rev. 4 | Page 3 of 7 | www.onsemi.com 50 pS 55 % ASM3P2779A DC Electrical Characteristics for 3.3V Supply Symbol Parameter VIL Min Typ Max Unit V Input low voltage VSS-0.3 0.8 VIH Input high voltage 2.0 VDD+0.3 V IIL Input low current -35 µA IIH Input high current 35 µA IXOL XOUT output low current (@ 0.4V, VDD = 3.3V) 3 mA IXOH XOUT output high current (@ 2.5V, VDD = 3.3V) 3 mA VOL Output low voltage (VDD = 3.3 V, IOL = 8mA) VOH Output high voltage (VDD = 3.3 V, IOH = 8mA) 0.4 IDD Static supply current ICC Dynamic supply current (3.3V, 16MHz and no load) V 1 VDD 2.0 Operating Voltage tON uA 3.5 2.7 mA 3.3 2 Power-up time (first locked cycle after power-up) ZOUT V 2.5 Output impedance 3.6 V 5 mS 45 Ω Notes: 1. XIN / CLKIN pin and PD pin are pulled low. 2. VDD and XIN / CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 3.3V Supply Symbol CLKIN ModOUT fd Min Input frequency 13 Output frequency 13 Frequency Deviation Input Frequency = 13MHz Input Frequency = 30MHz Typ v Max Unit 30 MHz 30 MHz ±1.15 ±0.6 % 1 Output rise time (measured from 0.8 to 2.0V) 0.5 1.1 1.3 nS 1 Output fall time (measured at 2.0V to 0.8V) 0.3 0.8 0.9 nS tLH tHL Parameter tJC Jitter (cycle-to-cycle) tD Output duty cycle Note: 1. tLH and tHL are measured into a capacitive load of 15pF. Modulation Profile Rev. 4 | Page 4 of 7 | www.onsemi.com ±200 45 50 pS 55 % ASM3P2779A Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 16MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance(CP) 18pF Shunt capacitance 7pF maximum ESR 25 Ω Note: Note: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency. Typical Crystal Interface Circuit R Rx Crystal CL CL CL = 2*(CP – CS), Where CP = Load capacitance of crystal CS = Stray capacitance due to CIN, PCB, Trace etc. Typical Application Schematic VDD C1 0.1µF C2 2.2µF VDD ASM3P2779A Rs ModOUT VSS Rev. 4 | Page 5 of 7 | www.onsemi.com ModOUT Clock ASM3P2779A Package Information 6L-TSOP Package Dimensions Symbol Inches Min A Max Millimeters Min Max 0.04 1.00 A1 0.00 0.004 0.00 0.10 A2 0.033 0.036 0.84 0.90 b 0.012 0.02 0.30 0.50 H 0.005 BSC 0.127 BSC D 0.114 BSC 2.90 BSC B 0.06 BSC 1.60 BSC e 0.0374 BSC 0.950 BSC C 0.11 BSC 2.80 BSC L 0.0118 0.02 0.30 0.50 θ 0° 4° 0° 4° Rev. 4 | Page 6 of 7 | www.onsemi.com ASM3P2779A Ordering Information Part Number Marking ASM3P2779AF-06OR A4L ASM3I2779AF-06OR A5L Package Type 6L-TSOP(6L-TSOT-23)., TAPE & REEL, Pb Free 6L-TSOP(6L-TSOT-23)., TAPE & REEL, Pb Free Temperature 0°C to +70°C -40°C to +85°C A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free. are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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