LB11867RV-MPB-H

LB11867RV Variable Speed Single‐phase Full‐wave Pre‐driver for Fan Motor Monolithic Digital IC www.onsemi.com Overview LB11867RV is a single-phase bipolar driving motor pre-driver with the variable speed function compatible with external PWM signal. With a few external parts, a highly-efficient and highly-silent variable drive fan motor with low power consumption can be achieved. This product is best suited for driving of the server requiring large air flow and large current and the fan motor of consumer appliances. SSOP16 CASE 565AM Features • Single-phase Full-wave Driving Pre-driver • • • • • • • • MARKING DIAGRAM ⇒ Low-saturation Drive Using External PMOS−NMOS Enables High-efficiency Low Power-consumption Drive Variable Speed Control Possible with External PWM Input ⇒ Separately-excited Upper Direct PWM (f =30 kHz) Control Method Ensures Highly Silent Speed Control Current Limiting Circuit Incorporated ⇒ Chopper Type Current Limiting Made at Startup and during Lock Reactive Current Cut Circuit Incorporated ⇒ Reactive Current before Phase Changeover is Cut, Ensuring Highly Silent and Low Power-consumption Drive Minimum Speed Setting Pin ⇒ Minimum Speed can be Set by Setting the Resistance Soft Start Setting Pin Lock Protection and Automatic Reset Circuits Incorporated RD (Lock Detection) Output Thermal Shutdown Circuit Incorporated Typical Applications • • • • XXXXXXXXXX YMDDD XXXX Y M DDD = Specific Device Code = Year = Month = Additional Traceability Data PIN ASSIGNMENT 1 16 OUT2P OUT1P OUT2N OUT1N VCC Computing & Peripherals Industrial Server Vending Machine SGND 5VREG SENSE RMI S−S VTH CT CPWM IN+ RD IN− 8 (Top View) 9 ORDERING INFORMATION See detailed ordering and shipping information on page 9 of this data sheet. © Semiconductor Components Industries, LLC, 2014 March, 2018 − Rev. 2 1 Publication Order Number: LB11867RV/D LB11867RV SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Symbol Parameter VCC max Conditions Ratings Unit VCC Pin Maximum Supply Voltage 18 V IOUTN max OUTN Pin Maximum Output Current 20 mA IOUTP max OUTP Pin Maximum Sink Current 20 mA VOUT max OUT Pin Output Withstand Voltage 18 V VVTH, VRMI max VTH, RMI Pins Withstand Voltage 7 V S−S Pin Withstand Voltage 7 V VRD max RD Output Pin Withstand Voltage 19 V IRD max RD Pin Maximum Output Current 10 mA 5VREG Pin Maximum Output Current 20 mA 800 mW −30 to 95 °C −55 to 150 °C VS−S max I5VREG max Pd max Allowable Power Dissipation With specified substrate (Note 1) Topr Operating Temperature (Note 2) Tstg Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Specified substrate: 114.3 mm × 76.1 mm × 1.6 mm, glass epoxy board. 2. Tj max = 150°C must not be exceeded. RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Symbol VCC VTH, RMI VICM Parameter Conditions VCC Supply Voltage VTH, RMI Input Voltage Range Hall Input Common-phase Input Voltage Range Ratings Unit 5.5 to 16 V 0 to 5 V 0.2 to 3 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V) Symbol Min Typ Max Unit During drive 5.5 7.5 9.5 mA During lock protection 5.5 7.5 9.5 mA I5VREG = 5 mA 4.80 4.95 5.10 V Current Limiting Voltage 185 200 215 mV VCPWMH CPWM Pin “H” Level Voltage 2.8 3.0 3.2 V VCPWML CPWM Pin “L” Level Voltage 0.9 1.1 1.3 V ICPWM1 CPWM Pin Charge Current VCPWM = 0.5 V 24 30 36 mA ICPWM2 CPWM Pin Discharge Current VCPWM = 3.5 V 21 27 33 mA FPWM CPWM Oscillation Frequency C = 220 pF − 30 − kHz VCTH CT Pin “H” Level Voltage 2.8 3.0 3.2 V ICC1 Parameter Circuit Current ICC2 5VREG VLIM 5VREG Voltage Conditions VCTL CT Pin “L” Level Voltage 0.9 1.1 1.3 V ICT1 CT Pin Charge Current VCT = 0.5 V 1.6 2.0 2.5 mA ICT2 CT Pin Discharge Current VCT = 3.5 V 0.16 0.20 0.25 mA RCT CT Pin Charge/Discharge Ratio ICT1/ICT2 8 10 12 times IS−S S−S Pin Discharge Current VS−S = 1 V 0.4 0.5 0.6 mA www.onsemi.com 2 LB11867RV ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 12 V) (continued) Symbol Parameter Conditions Min Typ Max VONH OUTN Output H-level Voltage IO = 10 mA − VONL OUTN Output L-level Voltage IO = 10 mA − 0.9 1.00 V VOPL OUTP Output L-level Voltage IO = 10 mA − 0.5 0.65 V VHN Hall Input Sensitivity IN+, differential voltage (including offset and hysteresis) − ±10 ±20 mV VRDL RD Output L-level Voltage IRD = 5 mA − 0.15 0.30 V IRDL RD Pin Leakage Current VRD = 19 V − − 20 mA VTH/RMI Pin Bias Current CPWM = VTH/RMI = 2 V − − 0.1 mA IVTH/IRMI IN− VCC−0.85 VCC−1.00 Unit V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Allowable Power Dissipation, Pd max − mW 1000 Mounted on a specified board: 114.3 × 76.1 × 1.6 mm glass epoxy board 800 600 400 352 200 0 −30 95 0 30 60 90 Ambient Temperature, TA − 5C Figure 1. Pd max − TA www.onsemi.com 3 120 LB11867RV BLOCK DIAGRAM Figure 2. Block Diagram TRUTH TABLE − DRIVE LOCK CPWM = H VTH, RMI, S−S = L IN− IN+ CT OUT1P OUT1N OUT2P OUT2N FG Mode H L L L L OFF H L OUT1 → 2 drive L H OFF H L L L OUT2 → 1 drive H L OFF L OFF H OFF Lock protection L H OFF H OFF L OFF H TRUTH TABLE − SPEED CONTROL CT, S−S = L VTH, RMI CPWM IN− IN+ OUT1P OUT1N OUT2P OUT2N Mode L H H L L L OFF H OUT1 → 2 drive L H OFF H L L OUT2 → 1 drive H L H L OFF L OFF H Regeneration mode L H OFF H OFF L NOTE: For VTH, RMI, and S−S pins, refer to the timing chart. www.onsemi.com 4 LB11867RV APPLICATION CIRCUIT Figure 3. Application Circuit Example (12 V) This also has a soft switch section with ±30 mV (input signal differential voltage). It is also recommended that the Hall input level is minimum 100 mV(p−p). *5: CPWM Pin Pin to connect the capacitor for generation of the PWM basic frequency The use of CP = 220 pF causes oscillation at f = 30 kHz, which is the basic frequency of PWM. As this is used also for the current limiting canceling signal, be sure to connect the capacitor even when the speed control is not made. *6: RMI Pin Minimum speed setting pin. Perform pull-up with 5VREG when this pin is not to be used. If the IC power supply is likely to be turned OFF first when the pin is used with external power supply, be sure to insert the current limiting resistor to prevent inflow of large current. (The same applies to the VTH pin.) *1: Power-GND Wiring SGND is connected to the control circuit power supply system. *2: Power Stabilization Capacitor For the power stabilization capacitor on the signal side, use the capacitance of 1 mF or more. Connect VCC and GND with a thick and shortest pattern. *3: Power Stabilization Capacitor on the Power Side For the power stabilization capacitor on the power side, use the capacitance of 1 mF or more. Connect the power supply on the power side and GND with a thick and shortest pattern. *4: IN+, IN− Pins Hall signal input pin. Wiring should be short to prevent carrying of noise. If noise is carried, insert the capacitor between IN+ and IN− pins. The Hall input circuit functions as a comparator with hysteresis (15 mV). www.onsemi.com 5 LB11867RV *10: CT Pin Pin to connect the lock detection capacitor. The constant-current charge and discharge circuits incorporated cause locking when the pin voltage becomes 3.0 V and unlocking when it is 1.1 V. Connect the pin to GND when it is not to be used (locking not necessary). *11: S−S Pin Pin to connect the soft-start setting capacitor. Connect the capacitor between 5VREG and S−S pin. This pin enables setting of the soft start time according to the capacity of the capacitor. See the timing char. Connect the pin to GND when it is not to be used. *7: VTH Pin Speed control pin. Connect this pin to GND when it is not used (at full speed). For the control method, refer to the timing chart. For control with pulse input, insert the current limiting resistor and use the pin with the frequency of 20 kHz to 100 kHz (20 kHz to 50 kHz recommended). *8: SENSE Pin Current limiting detection pin. When the pin voltage exceeds 0.2 V, the current is limited and the operation enters the lower regeneration mode. Connect this pin to GND when it is not to be used. *9: RD Pin Lock detection pin. In open collector output, L upon rotation and H when locked (using pull-up resistance). Keep this pin open when it is not to be used. www.onsemi.com 6 LB11867RV CONTROL TIMING CHART (SPEED CONTROL) Figure 4. Control Timing Chart − Speed Control when the VTH voltage is low. The upper output TR is turned OFF when the VTH voltage is high, regenerating the coil current in the lower TR. Therefore, as the VTH voltage decreases, the output ON-DUTY increases, causing increase in the coil current, raising the motor rotation speed. 3. Full Speed Mode The full speed mode becomes effective when the VTH voltage is 1.1 V or less. (Set VTH = GND when the speed control is not to be made.) 1. Minimum Speed Setting (Stop) Mode The low-speed fan rotation occurs at the minimum speed set with the RMI pin. When the minimum speed is not set (RMI pin pulled up to 5VREG), the motor stops. 2. Low Speed ⇔ High Speed PMW control is made by comparing the CPWM oscillation voltage (1.1 V ⇔ 3.0 V) and VTH voltage. Both upper and lower output TRs are turned ON www.onsemi.com 7 LB11867RV CONTROL TIMING CHART (SOFT START) 1. At VTH < RMI Voltage Figure 5. At VTH < RMI Voltage 2. At VTH > RMI Voltage Figure 6. At VTH > RMI Voltage Adjust the S−S pin voltage gradient by means of the capacitance of the capacitor between the S−S pin and 5VREG. Recommended capacitor: 0.1 mF to 1 mF www.onsemi.com 8 LB11867RV ORDERING INFORMATION Package Wire Bond Shipping† (Qty / Packing) LB11867RV−MPB−H SSOP16 (225mil) (Pb−Free / Halogen Free) Au−wire 90 / Fan−Fold LB11867RV−TLM−E SSOP16 (225mil) (Pb−Free) Au−wire 2,000 / Tape & Reel LB11867RV−TLM−H SSOP16 (225mil) (Pb−Free / Halogen Free) Au−wire 2,000 / Tape & Reel LB11867RV−W−AH SSOP16 (225mil) (Pb−Free / Halogen Free) Cu−wire 2,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SSOP16 (225mil) CASE 565AM ISSUE A GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT* 5.80 (Unit: mm) 1.0 0.32 0.65 NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON66065E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 DATE 23 OCT 2013 SSOP16 (225MIL) http://onsemi.com 1 XXXXXXXXXX YMDDD XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON66065E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# S−010 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE. 30 JAN 2012 A ADDED MARKING AND SOLDER FOOTPRINT INFORMATION. REQ. BY D. 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