SSD40P04-20D

SSD40P04-20D Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -36A, -40V, RDS(ON) 30mΩ RoHS Compliant Product A suffix of “-C” specifies halogen free DESCRIPTION These miniature surface mount MOSFETs utilize high cell density process. Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry. Typical applications are PWMDC-DC converters, power management in portable and battery-powered products such as computers, printers, battery charger, telecommunication power system, and telephones power system. TO-252(D-Pack) FEATURES     Low RDS(on) provides higher efficiency and extends battery life. Miniature TO-252 surface mount package saves board space. High power and current handling capability. Extended VGS range (±25) for battery pack applications. A B C D PRODUCT SUMMARY VDS(V) -40 PRODUCT SUMMARY RDS(on) m( 30@VGS= -10V 40@VGS= -4.5V K GE HF ID(A) -36 -29  Gate  Drain M J N O P REF.  Source A B C D E F G H Millimeter Min. Max. 6.4 6.8 5.20 5.50 2.20 2.40 0.45 0.58 6.8 7.3 2.40 3.0 5.40 6.2 0.8 1.20 REF. J K M N O P Millimeter Min. Max. 2.30 REF. 0.70 0.90 0.50 1.1 0.9 1.6 0 0.15 0.43 0.58 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) PARAMETER SYMBOL RATINGS Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current b a a UNIT V V A A A W °C °C / W °C / W VDS VGS ID @TA=25℃ IDM IS PD @TA=25℃ TJ, TSTG RθJA RθJC THERMAL RESISTANCE RATINGS a -40 ±20 36 ±40 -30 50 -55 ~ 175 50 3.0 Continuous Source Current (Diode Conduction) Total Power Dissipation Operating Junction and Storage Temperature Range Maximum Thermal Resistance Junction-Ambient a Maximum Thermal Resistance Junction-Case Notes： a. Surface Mounted on 1” x 1” FR4 Board. b. Pulse width limited by maximum junction temperature. http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 14-Jul-2010 Rev.B Page 1 of 5 SSD40P04-20D Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -36A, -40V, RDS(ON) 30mΩ ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) PARAMETER Gate-Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Current a Drain-Source On-Resistance a Forward Transconductance a Diode Forward Voltage SYMBO MIN. TYP. MAX. UNIT Static VGS(th) IGSS IDSS ID(on) RDS(ON) gfs VSD -1 -41 31 -0.7 ±100 -1 -5 30 40 nA μA A mΩ S V TEST CONDITIONS VDS= VGS, ID = -250 μA VDS = 0V, VGS= ±25V VDS= -24V, VGS= 0V VDS= -24V, VGS=0V, TJ=55°C VDS = -5V, VGS= -10V VGS= -10V, ID= -36A VGS= -4.5V, ID= -29A VDS= -15V, ID= -36A IS= -41 A, VGS= 0 V Dynamic b Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Qg Qgs Qgd Ciss Coss Crss 13.9 5.2 5.8 1583 278 183 pF nC VDS = -15 V VGS = -4.5 V ID = -36 A VDS = -15 V VGS = 0 V f = 1MHz Switching Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Td(on) Tr Td(off) Tf 15 12 62 46 nS VDD= -15 V ID= -41 A VGEN = -10 V RL= 15  RG= 6  Notes a. Pulse test：Pulse width ≦ 300 μs, duty cycle ≦ 2％. b. Guaranteed by design, not subject to production testing. http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 14-Jul-2010 Rev.B Page 2 of 5 SSD40P04-20D Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -36A, -40V, RDS(ON) 30mΩ CHARACTERISTIC CURVE http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 14-Jul-2010 Rev.B Page 3 of 5 SSD40P04-20D Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -36A, -40V, RDS(ON) 30mΩ CHARACTERISTIC CURVE http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 14-Jul-2010 Rev.B Page 4 of 5 SSD40P04-20D Elektronische Bauelemente P-Ch Enhancement Mode Power MOSFET -36A, -40V, RDS(ON) 30mΩ CHARACTERISTIC CURVE http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. 14-Jul-2010 Rev.B Page 5 of 5