ECLAMP2504K

ESD/EMI Protection for Color LCD Interfaces PROTECTION PROTECTION PRODUCTS - EMIClamp® Description The EClamp® 2504K device is a low pass filter array with integrated TVS diodes. It is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of color LCD panels in cellular phones and other portable electronics. The device consists of four identical circuits comprised of TVS diodes for ESD protection, and a 3-pole inductor - capacitor network for EMI/RFI filtering. A typical inductor value of 17nH and a capacitor value of 12pF are used to achieve 20dB minimum attenuation from 800MHz to 2.7GHz. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4. The EClamp2504K is in a 8-pin, SLP1713P8 package. It measures 1.7 x 1.3 x 0.50mm. The leads are spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. The small package makes it ideal for use in portable electronics such as cell phones, digital still cameras, and PDAs. EClamp2504K PRELIMINARY Features Bidirectional EMI/RFI filter with integrated TVS for ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, ±15kV (air), ±8kV (contact) Filter performance: 20dB minimum attenuation 800MHz to 2.7GHz T VS working voltage: 5V Inductor: 17nH (Typical) Capacitors: 12pF (Typical at VR = 2.5V) Protection and filtering for four lines Solid-state technology Mechanical Characteristics SLP1713P8 8-pin package Pb-Free, Halogen Free, RoHS/WEEE Compliant Nominal Dimensions: 1.7 x 1.3 x 0.50mm Lead Pitch: 0.4mm Lead finish: NiPdAu Marking : Marking Code and Date Code Packaging : Tape and Reel Applications Color LCD Protection Cell Phone CCD Camera Lines Clamshell Cell Phones Circuit Diagram (Each Line) Package Configuration 1.70 12 17nH IN 12pF 12pF OUT 1.30 0.40 BSC GND 0.50 Device Schematic (4X) Revision 04/14/2010 8 Pin SLP package (Bottom Side View) Nominal Dimensions in mm 1 www.semtech.com EClamp2504K PROTECTION PRODUCTS Maximum Ratings R ating ESD p er IEC 61000-4-2 (Air) ESD p er IEC 61000-4-2 (Contact) Junction Temp erature Op erating Temp erature Storage Temp erature Symbol VESD TJ Top TSTG Value +/- 20 +/- 15 125 -40 to +85 -55 to +150 PRELIMINARY Units kV o C C C o o Electrical Characteristics (T = 25oC) P ar am et er T VS Reverse Stand-Off Voltage T VS Reverse Breakdown Voltage T VS Reverse Leakage Current DC Resistance Filter Cut-Off Frequency Inductance Capacitance Total Capacitance S y m b ol VRWM V BR IR RDC fc L C1 , C2 C1 + C2 Con d i t i on s Mi n i mu m Ty p i c a l M ax i m u m 5 Units V V μA Ohms MHz nH It = 1mA VRWM = 3.3V 6 8 0.03 18 10 0.1 ZSource = ZLoad = 50 Ohms 250 17 VR = 2.5V, f = 1MHz Input to Gnd, Each Line VR = 2.5V, f = 1MHz 10 20 12 24 15 30 pF pF © 2010 Semtech Corp. 2 www.semtech.com EClamp2504K PROTECTION PRODUCTS Typical Characteristics Typical Insertion Loss S21 (Each Line) CH1 S 21 LOG 6 dB / R EF 0 dB 1: -4. 46 dB 250 MHz 2: -26.206 dB 800 MHz 1 PRELIMINARY Analog Crosstalk (Each Line) CH1 S21 LOG 20 dB /R EF 0 dB 0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB -48 dB 1 MHz S TART . 030 MHz 10 MHz 100 MHz 2 3 4 3: -34.349 dB 1.8 GHz 4: -33.371 dB 2.7 GHz 1 3 GHz GHz S TOP 3 000. 000000 MHz START . 030 MHz STOP 3 000. 000000 MHz ESD Clamping (+8kV Contact) ESD Clamping (-8kV Contact) Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator Capacitance vs. Reverse Voltage (Normalized to 2.5 volts) 2 1.5 CJ(VR) / CJ(VR=2.5) 1 0.5 f = 1 MHz 0 0 1 2 3 4 5 Reverse Voltage - VR (V) © 2010 Semtech Corp. 3 www.semtech.com EClamp2504K PROTECTION PRODUCTS Device Connection The EClamp2504K is comprised of four identical circuits each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The device is in an 8-pin SLP package. Electrical connection is made to the 8 pins located at the bottom of the device. A center tab serves as the ground connection. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering performance of the device. As frequency increases, the effect of the inductance becomes more dominant. This effect is given by Equation 1. Equation 1: The Impedance of an Inductor at Frequency XLF PRELIMINARY Figure 1 - Pin Identification and Configuration (Top Side View) In 1 In 2 In 3 In 4 1 8 Gnd Out 1 Out 2 Out 3 Out 4 4 5 Pin 1-4 5-8 Center Tab Identification Inp ut Lines Outp ut Lines Ground XLF(L, f ) = 2 * π * f * L Where: L= Inductance (H) f = Frequency (Hz) Via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in Figure 2. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Bringing the ground plane closer to the signal layer (preferably the next layer) also reduces ground loop inductance. Multiple vias in the device ground pad will result in a lower inductive ground loop over two exterior vias. Vias with a diameter d are separated by a distance y run between layers separated by a distance x. The inductance of the loop path is given by Equation 2. Thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency filter characteristics. Figure 2 - Inductance of Rectangular Wire Loops Ground Via 1 Ground Via 2 d x Signal Layer y Ground Layer Layer Equation 2: Inductance of Rectangular Wire Loop LRECT(d, x , y) = 10.16 * 10 −9 * x * ln Where: d = Diameter of the wire (in) x = Length of wire loop (in) y = Breath of wire loop (in) [ [ ] + y * ln[ ]] 2* y d 2*x d © 2010 Semtech Corp. 4 www.semtech.com EClamp2504K PROTECTION PRODUCTS Applications Information Figure 3 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in Equation 2 is highly insensitive to parameter d) . Figure 4 shows a typical insertion loss (S21) plot for the device using Semtech’s filter evaluation board with 50 Ohm traces and the recommended via configuration. PRELIMINARY Figure 4 - Filter Characteristics Using Recommended Layout with Internal Vias CH1 S 21 LOG 6 dB / R EF 0 dB 1: -4. 46 dB 250 MHz 2: -26.206 dB 800 MHz 1 0 dB -6 dB -12 dB -18 dB -24 dB -30 dB -36 dB -42 dB 2 3 4 3: -34.349 dB 1.8 GHz 4: -33.371 dB 2.7 GHz Figure 3 - Recommended Layout Using Ground Vias -48 dB 1 MHz S TART . 030 MHz 10 MHz 100 MHz 1 3 GHz GHz STOP 3 000. 000000 MHz © 2010 Semtech Corp. 5 www.semtech.com EClamp2504K PROTECTION PRODUCTS Applications Information - Spice Model PRELIMINARY Line In 0.5nH L 16nH 0.5nH Line Out EClamp2504K Spice Model EClamp2504K Spice Parameters Parameter IS BV VJ RS IB V CJO TT M N EG Unit Amp Volt Volt Ohm Amp Farad sec --eV D1 (T VS) 1.48E-14 7.44 0.75 0.53 1E-3 19.4E-12 2.541E-9 0.25 1.1 1.11 D2 (T VS) 1.48E-14 7.44 0.75 0.53 1E-3 19.4E-12 2.541E-9 0.25 1.1 1.11 © 2010 Semtech Corp. 6 www.semtech.com EClamp2504K PROTECTION PRODUCTS Outline Drawing - SLP1713P8 PRELIMINARY A D B DIM PIN 1 INDICATOR (LASER MARK) E DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .018 .020 .022 .000 .001 .002 (.005) .006 .008 .010 .065 .067 .070 .047 .051 .055 .049 .051 .054 .008 .012 .016 .016 BSC .008 .010 .012 8 .003 .004 0.45 0.50 0.55 0.00 0.02 0.05 (0.13) 0.15 0.20 0.25 1.65 1.70 1.775 1.20 1.30 1.40 1.25 1.30 1.375 0.20 0.30 0.40 0.40 BSC 0.20 0.25 0.30 8 0.08 0.10 A aaa C A2 A1 C SEATING PLANE A A1 A2 b D D1 E E1 e L N aaa bbb 1 E1 N e/2 e D1 2 LxN E/2 bxN bbb CAB D/2 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP1713P8 P X DIM C G H K P X Y Z DIMENSIONS INCHES MILLIMETERS (.050) (1.27) .027 0.69 .012 0.30 .055 1.40 .016 0.40 0.20 .008 0.58 .023 .073 1.85 Z G Y K H (C) NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. © 2010 Semtech Corp. 7 www.semtech.com EClamp2504K PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information Part Number Qty per Reel 3000 R eel Size 7 Inch PIN 1 INDICATOR 2504K YYWW EClamp 2504K.TCT EMIClamp and EClamp are marks of Semtech Corporation Note: YYWW = Date Code Tape and Reel Specification Pin 1 Location User Direction of feed Device Orientation in Tape A0 1.51 +/-0.10 mm B0 1.91 +/-0.10 mm K0 0.66 +/-0.10 mm Tape Width B, (Max) D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000) D1 E 1.750±.10 mm (.069±.004) F K (MAX) P 4.0±0.1 mm (.157±.004) P0 4.0±0.1 mm (.157±.004) P2 T(MAX) W 8.0 mm + 0.3 mm - 0.1 mm (.312±.012) 8 mm 4.2 mm (.165) 0.8 mm ±0.05 (.031) 3.5±0.05 mm (.138±.002) 2.4 mm (.094) 2.0±0.05mm (.079±.002) 0.4 mm (.016) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com © 2010 Semtech Corp. 8