SD12

Single Line TVS Diode for ESD Protection in Portable Electronics PROTECTION PROTECTION PRODUCTS Description The SDxx TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA’s. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxx series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. The SDxx is in a SOD-323 package and will protect one unidirectional line. They are available with working voltages of 5 volts (SD05) and 12 volts (SD12). These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications where board space is at a premium. They may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). SD05 and SD12 Features 350 Watts peak pulse power (tp = 8/20µs) Transient protection for data lines to IEC 61000-4-2 (ESD) ±25kV (air), ±10kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Suitable replacement for MLV’s in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V and 12V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel per EIA 481 Applications Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDA’s) Notebooks, Desktops, and Servers Portable Instrumentation Pagers Peripherals Schematic & PIN Configuration SOD-323 (Top View) Revision 07/12/04 1 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20µs) ESD Voltage (HBM Waveform p er IEC 61000-4-2) Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbol Pp k VESD TL TJ TSTG Value 350 30 260 (10 sec.) -55 to +125 -55 to +150 Units Watts kV °C °C °C Electrical Characteristics SD05 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 5V, T=25°C IPP = 5A, tp = 8/20µs IPP = 24A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 6 10 9.8 14.5 24 350 Conditions Minimum Typical Maximum 5 Units V V µA V V A pF SD12 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Peak Pulse Current Junction Cap acitance Symbol VRWM V BR IR VC VC IP P Cj It = 1mA VRWM = 12V, T=25°C IPP = 5A, tp = 8/20µs IPP = 15A, tp = 8/20µs tp = 8/20µs VR = 0V, f = 1MHz 13.3 1 19 25 15 150 Conditions Minimum Typical Maximum 12 Units V V µA V V A pF  2004 Semtech Corp. 2 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) 110 100 % of Rated Power or PP I 90 80 70 60 50 40 30 20 10 0 Power Derating Curve 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (µs) 100 1000 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 td = IPP/2 e -t Clamping Voltage vs. Peak Pulse Current Waveform Parameters tr = 8µs td = 20µs 30 25 SD12 20 15 10 5 0 0 5 10 15 20 25 30 Peak Pulse Current - IPP (A) SD05 Waveform Parameters tr = 8µs td = 20µs Capacitance vs. Reverse Voltage 350 300 Capacitance - C j ( pF ) Forward Voltage -VF (V) 7.00 f =1 H Mz Clamping Voltage - VC (V) Forward Voltage vs. Forward Current 6.00 5.00 4.00 3.00 2.00 1.00 0.00 SD12 SD05 250 200 150 100 50 0 0 2 4 6 8 10 12 14 R everse V oltage - V (V R) S 12 D S0 D5 Waveform Parameters: tr = 8µs td = 10µs 0 5 10 15 20 25 30 35 40 45 Forward Current - IF (A)  2004 Semtech Corp. 3 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Applications Information Device Connection Options The SDxx TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint.  2004 Semtech Corp. 4 www.semtech.com Device Schematic and Pin Configuration Size Comparison to 0805 MLV SOD-323 Note: Nominal dimensions in inches 0805 MLV Component Placement Comparison 0805 MLV on 0805 Solder Pad SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad SD05 and SD12 PROTECTION PRODUCTS Outline Drawing Land Pattern  2004 Semtech Corp. 5 www.semtech.com SD05 and SD12 PROTECTION PRODUCTS Marking Codes Part Number SD05 SD12 Marking Code 5U 6U Ordering Information Par t Number SD05.TC SD12.TC SD05.TCT SD12.TCT Lead Finish SnPb SnPb Pb free Pb free Qty per Reel 3,000 3,000 3,000 3,000 R eel Size 7” 7” 7” 7” Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804  2004 Semtech Corp. 6 www.semtech.com