SDC15TC

TVS Diode Array for ESD Protection of 12V Data & Power Lines PROTECTION PROTECTION PRODUCTS Description The SDC15 transient voltage suppressor (TVS) is designed to protect components which are connected to data and transmission lines from voltage surges caused by ESD (electrostatic discharge), EFT (electrical fast transients), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The dual-junction common-cathode design allows the user to protect one data or power line operating at +/-12 volts. The low profile SOT23 package allows flexibility in the design of “crowded” circuit boards. The SDC15 TVS will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, “Human Body Model” for air and contact discharge. SDC15 Features u 300 watts peak pulse power (tp = 8/20µs) u 40 watts peak pulse power (tp = 10/1000µs) u Transient protection for data & power lines to u u u u u IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (1.2/50µs) Protects one bidirectional line Low clamping voltage Low leakage current High surge capability Solid-state silicon avalanche technology Mechanical Characteristics u u u u JEDEC SOT23 package Molding compound flammability rating: UL 94V-0 Marking : DC15 Packaging : Tape and Reel per EIA 481 Applications u u u u u u RS-232 Data Lines Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC 12V DC Supply Protection Circuit Diagram Schematic & PIN Configuration SOT23 (Top View) Revision 9/2000 1 www.semtech.com SDC15 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Pow er (tp = 8/20µ s) Peak Pulse Current (tp = 8/20µ s) N on-Rep etitive Peak Forw ard Current (tp =100us) Th ermal Resistance, Junction to A mb ient Lead Sold ering Temp erature Op erating Temp erature Storage Temp erature Symbo l Pp k I PP IFSMAX qJA TL TJ TSTG Value 300 10 4 556 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A A °C/W °C °C °C Electrical Characteristics SDC15 Par ame te r Reverse Stand -Off Voltage Reverse Breakd ow n Voltage Symbo l V RWM V BR It= 1mA , Betw een Pin 1 & 2 (each d irection) V RWM = 12.8V, T=25°C Betw een Pin 1 & 2 (each d irection) IF= 100mA , Pin 1 to 3 and Pi n 2 t o 3 14.3 Co nd itio ns Minimum Typ ical Maximum 12.8 16.4 Units V V Reverse Leakage Current IR 100 nA Forw ard Voltage VF 1.3 V Temp erature Coefficient of V BR Clamp ing Voltage aV B R VC IPP = 1.9A , tp = 10/10000µ s Betw een Pin 1 & 2 (each d irection) V R = 0V, f = 1MHz Pi n 1 t o 2 12 21.2 mV /°C V Junction Cap acitance Cj 120 pF ã 2000 Semtech Corp. 2 www.semtech.com SDC15 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - PPP (kW) 110 100 90 % of Rated Power or I PP Power Derating Curve 1 80 70 60 50 40 30 20 10 0.1 0.01 0.1 1 10 Pulse Duration - tp (µ s) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 10 td = IPP/2 e -t Clamping Voltage vs. Peak Pulse Current 25 Waveform Parameters: tr = 8µs td = 20µs Clamping Voltage - VC (V) 20 Bidirectional (Pin 1 to 2) 15 Waveform Parameters: tr = 8µs td = 20µs 1 2 3 4 5 6 7 8 9 10 11 12 Peak Pulse Current - IPP (A) Forward Voltage vs. Forward Current 3 2.5 Forward Voltage - V F (V) 2 1.5 1 0.5 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Forward Current - IF (A) Waveform Parameters: tr = 8µs td = 20µs ã 2000 Semtech Corp. 3 www.semtech.com SDC15 PROTECTION PRODUCTS Applications Information Device Connection for Protection of One Data Line The SDC15 is designed to protect one data or I/O line operating at +/- 12 volts. Connection options are as follows: l Device Schematic & Pin Configuration l Common mode protection: Pin 1 is connected to the data line and pin 2 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Differential protection: Pin 1 is connected to one line and pin 2 is connected to the second line. Pin 3 is not connected. RS-232 Transceiver Protection Example Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended: l l l l l l Place the SDC15 near the input terminals or connectors to restrict transient coupling. Minimize the path length between the SDC15 and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. ã 2000 Semtech Corp. 4 www.semtech.com SDC15 PROTECTION PRODUCTS Outline Drawing - SOT23 Land Pattern - SOT23 Note 1 : Grid placement courtyard is 8 x 8 elements (4mm x 4mm) in accordance with the international grid detailed in IEC Publication 97. ã 2000 Semtech Corp. 5 www.semtech.com SDC15 PROTECTION PRODUCTS Ordering Information Par t Numbe r SDC15.TC SDC15.TG Wo r king Vo ltage 12.8V 12.8V Qty p e r R e e l 3,000 10,000 R e e l Size 7 Inch 13 Inch Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 ã 2000 Semtech Corp. 6 www.semtech.com