S1C0-3639080001-00000000-00001

Product Data Sheet Superior Efficacy & Lumen output with Small Form Factor SPR05F0D S1C0-3639080001-00000000-00001 RoHS Product Brief Description Features and Benefits • • Super high Flux output and high Luminance • • The Z-Power series is designed for high flux output applications with high current operation capability. It incorporates state of the art SMD design and low thermal resistant material. The Z Power LED is ideal light sources for directional lighting applications such as Spot Lights, various outdoor applications and high performance torches . • Designed for high current operation • SMT solderable • Lead Free product • RoHS compliant Key Applications • Architectural Lighting • Stage Lighting • Exterior Lighting Rev00, Oct. 2018 www.seoulsemicon.com Product Data Sheet Table of Contents Index • Product Brief 1 • Table of Contents 2 • Performance Characteristics 3 • Characteristics Graph 5 • Mechanical Dimensions 9 • Reflow Soldering Characteristics 10 • Emitter Tape & Reel Packaging 11 • Packaging Information 12 • Product Nomenclature 13 • Handling of Silicone Resin for LEDs 14 • Precaution For Use 15 • Company Information 18 Rev00, Oct. 2018 2 www.seoulsemicon.com Product Data Sheet Performance Characteristics Table 1. Electro-Optical characteristics at 1400mA (Ta=25℃, RH30%) Value Parameter Red Luminous Flux Symbol Typ. Max. - 101 - lm 632 nm - V ФV [1] Peak Wavelength Λp Red Dominant Wavelength Λd Full Width at Half Maximum Δλ [3] Forward Voltage (Red) Unit Min. Red : 632 618 17 VF - 2Θ ½ View Angle 625 2.24 120 deg. Table 2. Absolute Maximum Ratings Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - - 4500 mA Junction Temperature Tj - - 125 ºC Storage Temperature Tstg - 10 - 85 ºC - - 8 kV ESD Sensitivity(HBM) [3] Notes : (1) SSC maintains a tolerance of 7% on power measurements. (2) Tolerance is 0.06V on forward voltage measurements (3) The zener diode is included to protect the product from ESD. Rev00, Oct. 2018 3 www.seoulsemicon.com Product Data Sheet Performance Characteristics Table 3. Bin Code Description Brightness IF = 1400mA Color Bin Flux [lm] Radiant Power [mW] RA 90 ~ 115 - RB 115 ~ 140 - RC 140 ~ 180 - RD 180 ~ 225 - Red Wavelength IF = 1400mA Color Bin Dominant Wavelength [nm] R1 618 ~ 624 R2 624 ~ 632 Red Rev00, Oct. 2018 4 www.seoulsemicon.com Product Data Sheet Characteristics Graph Relative Spectral Power Distribution Color Spectrum (IF=1400mA, Ta=25℃, RH30%) 1.0 Red 0.8 0.6 0.4 0.2 0.0 300 400 500 600 700 800 Wavelength [nm] Forward Voltage vs. Forward Current, Ta=25℃ 5.0 Forward Voltage[V] 4.5 4.0 3.5 3.0 Red 2.5 2.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Current[A] Rev00, Oct. 2018 5 www.seoulsemicon.com Product Data Sheet Characteristics Graph Forward Current vs. Normalized Relative Luminous Flux, Ta=25℃ 2.5 Relative Output [%] 2.0 1.5 1.0 Red 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Current [A] Forward Current vs Dominant Wavelength, Ta=25℃ 700 500 400 300 Red 200 100 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Forward Current [A] Rev00, Oct. 2018 6 www.seoulsemicon.com Dominant Wavelength [nm] Dominant Wavelength [nm] 600 Product Data Sheet Characteristics Graph Junction Temperature vs. Relative Light Output at IF=1400mA 1.0 Relative Output[%] 0.9 0.8 0.7 0.6 Red 0.5 0.4 0.3 25 50 75 100 125 o Junction Temperature[ C] Junction Temperature vs. Forward Voltage at IF=1400mA Relative Forward Voltage [V] 0.0 -0.2 -0.4 -0.6 Red -0.8 -1.0 25 50 75 100 125 o Junction Temperature[ C] Rev00, Oct. 2018 7 www.seoulsemicon.com Product Data Sheet Characteristics Graph Junction Temperature vs. Dominant Wavelength at IF=1400mA 700 Dominant Wavelength [nm] 600 500 400 300 Red 200 100 0 25 50 75 100 125 o Junction Temperature[ C] Rev00, Oct. 2018 8 www.seoulsemicon.com Product Data Sheet Mechanical Dimensions (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.1mm Rev00, Oct. 2018 9 www.seoulsemicon.com Product Data Sheet Reflow Soldering Characteristics IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LED will be damaged. (2) Repairs should not be done after the LED have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LED during heating. (5) After soldering, do not warp the circuit board. Rev00, Oct. 2018 10 www.seoulsemicon.com Product Data Sheet Emitter Tape & Reel Packaging Labeling X10X11X12X13X14X15 500 ############### SPR05F0D SPR05F0D Full code form X1X2X3X4X5X6X7X8 -X1 : Company -X2 : Z-Power LED series number -X3 X4 : Color Specification -X5 : PKG Series -X6 : Lens Type (Flat) -X7 : PCB Type -X8 : Power (A:15W / B:40W / C:60W / D:8W) Rank X10X11X12X13 X14X15X16X17X18X19X20X21 -X10X11X12X13X14X15X16X17 : Brightness (Flux, mW) -X18X19X20 X21 : Dominant or Peak Wavelength [nm] Lot No #1#2#3#4#5#6 - #7#8#9#10 - #11#12#13 - #1 #2 : Year - #7 #8 #9 #10 - #3 #4 : Month - #11 #12 #13 - #5 #6 : Day Rev00, Oct. 2018 11 : Mass order : Tray No. www.seoulsemicon.com Product Data Sheet Packaging Information Rev00, Oct. 2018 12 www.seoulsemicon.com Product Data Sheet Color BinNomenclature Structure Product Part Numbering System Part Number Code Description Part Number Value X1 Company S Seoul Semiconductor X2 Level of Integration 1 Discrete LED X3X4 Technology C0 Color X5X6X7X8 Dimension 3639 PKG size X9X10 Power 08 W X11X12 CRI 00 X13X14 Type 01 X15X16X17 Characteristic code Flux Rank 000 X18X19X20 Characteristic code Vf Rank 000 X21X22 Characteristic code Color Step 00 X23X24 Type 00 X25X26X27 Internal code 001 Rev00, Oct. 2018 13 00 Full / 1 Red / 2 Green / 3 Blue / 4 White www.seoulsemicon.com Product Data Sheet Handling of Silicone Resin for LED (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LED should only be handled from the side. By the way, this also applies to LED without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) Avoid leaving fingerprints on silicone resin parts. Rev00, Oct. 2018 14 www.seoulsemicon.com Product Data Sheet Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Z5 Series LED in a dry box with a desiccant . The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing / Temperature : 5 ~ 30℃ Humidity : less than RH60% b. If the package has been opened more than 1 year (MSL 2) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LED are in operation the maximum current should be decided after measuring the package temperature. (10) The appearance and specifications of the product may be modified for improvement without notice. (11) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. Rev00, Oct. 2018 15 www.seoulsemicon.com Product Data Sheet Precaution for Use (12) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LED and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (13) Attaching LEDs, do not use adhesives that outgas organic vapor. (14) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (15) LED is sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LED may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment) Rev00, Oct. 2018 16 www.seoulsemicon.com Product Data Sheet Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device Rev00, Oct. 2018 17 www.seoulsemicon.com Product Data Sheet Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LED as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. Rev00, Oct. 2018 18 www.seoulsemicon.com