Z-Power LED
X10490
Technical
Data
Sheet
RoHS
Specification
SAWW9H0A
Rev. 00
Aug. 2012
1
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
SAWW9H0A
SAWW9H0A
Features
• Super high flux output
and high luminance
• Designed for high
current operation
• SMT solderable
• Lead free product
• RoHS compliant
Description
The Acrich series of LEDs are designed for AC operation and
high flux output applications.
Acrich LEDs are an environmentally friendly semiconductor
lighting source that can be directly connected to an AC power
source without any DC conversion required.
Acrich’s thermal management performance exceeds other
power LED solutions by incorporating state-of-the-art SMD
design and use of specialized thermal emission material.
Acrich is an ideal light source for general purpose illumination
applications
Applications
•
•
•
•
LED bulb
Spot light
Architectural lighting
Street light
* The appearance and specifications of the product can be changed
for improvement without notice.
Rev. 00
Aug. 2012
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Full code of SAWW9H0A
1. Part Number Form : X1X2X3X4X5X6X7X8 – X9X10X11
X1
Company
S
SSC
X2
Package series
A
Acrich
X3
W
Color
Warm White
X4
W
X5
Series number
9
X6
Voltage
H
X7
PCB type
0
Emitter
X8
Revision No.
A
Rev0
X9
Luminous flux
-
-
X10
Color bin
-
-
X11
Voltage
-
-
LF
MJT4040
Color bin
U3
109.0 ~ 118.5
V1
118.5 ~ 136.0
Voltage
G0~G5
A
60~63
B
63~66
C
66~68
H0~H5
V2
136.0 ~ 154.0
2. Sticker Diagram on Reel & Aluminum Vinyl Bag
X9 X10 X11
X1 X2 X3 X4 X5 X6 X7 X8
Rev. 00
Aug. 2012
3
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Outline dimensions
Anode
Cathode
Notes :
[1] All dimensions are in millimeters. (tolerance is ±0.20mm )
[2] Scale : none
[3] The appearance and specifications of the product may be changed for improvement without notice
[4] Electrical ly neutral thermal path
Rev. 00
Aug. 2012
4
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Characteristics of SAWW9H0A
1. Cool white
1-1 Electro-Optical characteristics at IF= 20mA, Ta=25ºC
Value
Parameter
Symbol
Unit
Min
Typ
Max
ФV [2]
-
128
-
lm
Correlated Color Temperature [3]
CCT
2,600
-
3,200
K
CRI
Ra
80
-
-
-
Forward Voltage
VF
60
64
68
V
Thermal resistance
Rth
6
ºC/W
View Angle
2Θ 1/2
125
deg.
Luminous Flux
[1]
1-2 Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
30
mA
Power Dissipation
PD
1.95
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-30 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +110
ºC
ESD Sensitivity
-
-
-
* Notes :
[1] Acrich series maintains a tolerance of 10% on flux and power measurements.
[2] ФV is the total luminous flux output as measured with an integrating sphere.
[3] Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram.
CCT 5% tester tolerance
Rev. 00
Aug. 2012
5
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Binning structure graphical representation
0.44
2700K
2600K
2900K
3000K
0.42
H1
H0
3200K
G1
G0
H3
Y
H2
G3
G2
0.40
H4
H5
G5
G4
0.38
0.42
0.44
0.46
0.48
X
Rev. 00
Aug. 2012
6
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Emitter Carrier & Reel Packaging
Notes :
[1] Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
[2] Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
[3] Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 00
Aug. 2012
7
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Packing
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
b
a
Rev. 00
Aug. 2012
8
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Soldering
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
* Caution
1. Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be
damaged.
2. Repairs should not be done after the LEDs have been soldered. When
repair is unavoidable, suitable tools must be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
Rev. 00
Aug. 2012
9
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Precaution for use
(1) Storage
To avoid the moisture penetration, we recommend storing Acrich LEDs in a dry box
with a desiccant . The recommended storage temperature range is 5C to 30C and a maximum
humidity of RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMD techniques when the LED is to be soldered dipped as separation of the lens
may affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week(MSL_2A) or the color of the
desiccant changes, components should be dried for 10-12hr at 60±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or shredded in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When
washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(10) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for
storage.
(11) The appearance and specifications of the product may be modified for improvement without notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) The slug is isolated from anode electrically.
Therefore, we recommend that you don’t isolate the heat sink.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
Rev. 00
Aug. 2012
10
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
(16) Please note Acrich runs on high voltage so use caution when near the leads
or if a dome is inadvertently removed while circuit is active.
(17) Please do not touch any of the circuit board, components or terminals with
bare hands or metal while circuit is electrically active.
(18) Please do not add or change wires while Acrich circuit is active.
Rev. 00
Aug. 2012
11
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not
handle this product with acid or sulfur material in sealed space.
Rev. 00
(7) Avoid leaving fingerprints on silicone resin parts.
Aug. 2012
12
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서식번호 : SSC-QP-7-07-25 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
Handling of Silicone Resin LEDs
No
Change
Date
Change Issue
Version
00
01
02
03
04
05
06
07
Rev. 00
Aug. 2012
13
www.seoulsemicon.com
서식번호 : SSC-QP-7-07-25 (Rev.00)
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