SSC-SFT825N-S

*Customer: SPECIFICATION Preliminary ITEM MODEL [Contents] Top View LED SSC-SFT825N-S 1. Features ------------------------------------------------------------- 2 2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. R ank o f S FT825N-S - ---------- ----- ---------- ----- --------4 5 7 6. R ank of Color ------ - ------ ---- --- ------ ---- --- ------ ---- 7. Soldering Profile ---------------------------------------------------- 8. Outline Dimension ---------------------------------------------------- 8 9. Packing ----------------------------------------------------------------- 9 10. Reel Packing Structure ------------------------------------------11. L ot number - ------------------------ --------------- --------10 11 12. Precaution for Use --------------------------------------------------- 12 13. C haracterist ic Diagram - --------------------------------------- 1 3 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 1/13 - 1. Features Pb-free Reflow Soldering application RoHS Compliant 6-Pin (R,G,B separate) type White colored SMT package and diffused (milky color) Suitable for all SMT assembly methods ESD-withstand voltage : up to 2 kV (MIL-STD-883D) Encapsulating Resin : hard silicone resin High Reliability (silicone resin) 2. Application Indoor and outdoor displays LCD Backlights etc. R G B – displays Automotive Signage and Channel letter Indicator 3. Absolute Maximum Ratings *1 Parameter Forward Current Forward Peak Surge Current *2 Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature Symbol IF IFM VR Pd Topr Tstg 81 *3 (Ta=25ºC) Red 30 100 Value Green 30 100 5 120 263 *3 Blue 30 100 114 *3 Unit mA mA V *4 mW ºC ºC -40 ~ +100 -40 ~ +100 *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 1msec of pulse width and D 1/10 of duty ratio. *2 IFM was measured at TW *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 2/13 - 4. Electro-Optical Characteristics Parameter Forward Voltage Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue Red Green Blue R, G, B Symbol VF Condition IF =20mA IF =20mA IF =20mA VR=10V (per die) IF =20mA (per chip) IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA IF =20mA (per die) Min 1.8 3.0 3.0 620 520 455 Typ 2.1 3.2 3.2 700 1200 400 632 518 453 623 527 460 14 33 23 120 Max 2.3 3.53.51 1 1 1100 1600 560 625 535 465 - (Ta=25ºC) Unit V Reverse Current Luminance Intensity *1 IR IV µA mcd Peak Wavelength λP λd ∆λ 2 θ½ nm Dominant Wavelength nm Spectral Bandwidth Viewing Angle *3 nm deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 3/13 - 5. Rank of SFT825N-S SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 4/13 - 6. Rank of Color 0.9 0.8 0.7 0.6 0.5 520 525 515 530 535 540 510 545 550 555 505 560 565 570 500 575 580 585 590 495 595 600 Green AB y 0.4 0.3 0.2 Red 610 620 630 830 490 485 480 Bluish White 0.1 475 2 0 Blue 47460 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 5/13 - 0.30 g 0.28 h f d b e 0.26 y c 0.24 0.22 a 0.20 0.22 0.24 0.26 0.28 0.30 x SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 6/13 - 7. Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [°C] Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 260 240 220 200 180 150 ~ Pre-heating Rising 5 °C/sec Cooling -5 °C/sec 0 Time [Hr] (2) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 7/13 - 8. Outline Dimension And Material Package Outlines 654 Package Marking (Cathode ) 123 Circuit Diagram Blue Anode 6 Green Anode 5 Red Anode 4 Recommended Solder Pad 1 2 3 Blue Cathode Green Cathode Red Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Hard Silicone Resin (Diffused) Ag Plating Copper Alloy SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 8/13 - 9. Packing Package Marking 2.0±0.05 MA X.5 3.7±0.1 1.7±0.1 2.9±0.1 MA X.5 4±0.1 11.4 ± 0.1 180 +0 -3 2.0 ± 0.2 LABLE 13 ±0.2 9.0 ± 0.3 30° 10 22 (1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm 60 ( Tolerance: ±0.2, Unit: mm ) (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 9/13 - 10. Reel Packing Structure Reel XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE XXXX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : c 1 XXXXXX RoHS b SEOUL SEMICONDUCTOR CO., LTD. a SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 10/13 - 11. Lot Number The lot number is composed of the following characters; SFT MFT #~# First Part Name Year (6 for 2006, 7 for 2007, 8 for 2008 ) Month ( 01 for Jan., 02 for Feb., 11 for Nov., 12 for Dec.) Day ( 01, 02, 03, 04, 28, 29, 30, 31.) The number of the internal quality control # ~# XXX QUANTITY : 2000 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT825N-S SEOUL SEMICONDUCTOR CO., LTD. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 11/13 - 12. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 12/13 - 13. Characteristic Diagram Forward Current vs. Forward Voltage (TA=25ºC) 100 Relative Luminous Intensity vs. Forward Current 6 (TA=25ºC) 50 Blue Red Green Relative Luminosity (a.u.) 5 RED BLUE GREEN Forward Current IFP [mA] 4 20 10 3 5 2 1 1 0 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 0 20 40 60 80 100 120 Forward Voltage VF [V] Forward Current IFP [mA] Forward Current Derating Curve Radiation Diagram (TA=25ºC) 1 CHIP ON 30 Red, Green, Blue Forward Current IF [mA] 0 3 CHIP ON 20 -30 30 10 -60 60 0 0 20 40 60 80 100 -90 90 Ambient Temperature Ta [ºC] SSC-QP-7-03-08(REV.00) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-SFT825N-S - 13/13 -