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SGM2005-2.5

SGM2005-2.5

  • 厂商:

    SGMICRO(圣邦微)

  • 封装:

  • 描述:

    SGM2005-2.5 - Low Power, Low Dropout, 150mA, RF - Linear Regulators - Shengbang Microelectronics Co,...

  • 数据手册
  • 价格&库存
SGM2005-2.5 数据手册
SGM2005 GENERAL DESCRIPTION The SGM2005 series low-power, low-noise, low-dropout, CMOS linear voltage regulators operate from a 2.5V to 5.5V input and deliver up to 150mA. They are the perfect choice for low voltage, low power applications. An ultra low ground current ( 150µA at 150mA output ) makes these parts attractive for battery operated power systems. The SGM2005 series also offer ultra low dropout voltage (150mV at 150mA output) to prolong battery life in portable electronics. Systems requiring a quiet voltage source, such as RF applications, will benefit from the SGM2005 series’ ultra low output noise (30µVRMS) and high PSRR. An external noise bypass capacitor connected to the device’s BP pin can further reduce the noise level. The output voltage is preset to voltages in the range of 1.5V to 5.0V. Other features include a 10nA logic-controlled shutdown mode, foldback current limit and thermal shutdown protection. Devices come in 6-pin DFN-6 package. Low Power, Low Dropout, 150mA, RF - Linear Regulators FEATURES - Low Output Noise: 30µVRMS typ(10Hz to 100KHz) - Ultra-Low Dropout Voltage: 150mV at 150mA output - Low 77µA No-Load Supply Current - Low 150µA Operating Supply Current - at 150mA Output High PSRR: 73dB at 1KHz Thermal-Overload Protection Output Current Limit Preset Output Voltages (±2.7% Accuracy) 10nA Logic-Controlled Shutdown Available in Multiple Output Voltage Versions Fixed Outputs of 1.8V, 2.5V, 2.8V, 3.0V and 3.3V PIN CONFIGURATIONS(TOP VIEW) SGM2005 APPLICATIONS Cellular Telephones Cordless Telephones PCS Telephones PCMCIA Cards Modems MP3 Player Hand-Held Instruments Palmtop Computers Electronic Planners Portable/Battery-Powered Equipment EN GND IN 1 2 3 DFN-6 6 5 4 BP NC OUT NC = NO CONNECT Shengbang Microelectronics Co, Ltd Tel: 86/451/84348461 www.sg-micro.com REV. B ORDERING INFORMATION MODEL SGM2005-1.8 SGM2005-2.5 SGM2005-2.8 SGM2005-3.0 SGM2005-3.3 VOUT(V) 1.8V 2.5V 2.8V 3.0V 3.3V PINPACKAGE SPECIFIED TEMPERATURE RANGE ORDERING NUMBER SGM2005-1.8YD6/TR SGM2005-2.5YD6/TR SGM2005-2.8YD6/TR SGM2005-3.0YD6/TR SGM2005-3.3YD6/TR PACKAGE MARKING Y518 Y525 Y528 Y530 Y533 PACKAGE OPTION DFN-6 DFN-6 DFN-6 DFN-6 DFN-6 - 40°C to +85°C - 40°C to +85°C - 40°C to +85°C - 40°C to +85°C - 40°C to +85°C Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 Tape and Reel, 3000 ABSOLUTE MAXIMUM RATINGS IN to GND.....................................................................- 0.3V to +6V Output Short-Circuit Duration ...........................................Infinite EN to GND...................................................................- 0.3V to +6V OUT, BP to GND............................................- 0.3V to (VIN + 0.3V) Power Dissipation, PD @ TA = 25°C DFN-6 ................................................................................... 300mW Package Thermal Resistance DFN-6,θJA ...........................................................................200℃/W Operating Temperature Range..............................- 40°C to +85°C Junction Temperature...........................................................+150°C Storage Temperature.............................................- 65°C to +150°C Lead Temperature (soldering, 10s).....................................+260°C ESD Rating..................................................................................4 kV Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL OPERATION CIRCUIT INPUT 2.5V TO 5.5V IN CIN 1μF ON OFF OUT OUTPUT SGM 2005 EN GND BP COUT 1μ F CBP 0.01μF 2 SGM2005 ELECTRICAL CHARACTERISTICS PARAMETER Input Voltage Output Voltage Accuracy(1) Maximum Output Current Current Limit Ground Pin Current Dropout Voltage (2) Line Regulation(1) Load Regulation Output Voltage Noise Power Supply Rejection Rate SHUTDOWN EN Input Threshold EN Input Bias Current Shutdown Supply Current Shutdown Exit Delay(3) THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis TSHDN ΔTSHDN VIH VIL IB(SHDN) IQ(SHDN) VIN = 2.5V to 5.5V EN = 0V and EN = 5.5V EN = 0.4V CBP = 0.01µF COUT = 1µF, No load ΔVLNR ΔVLDR ILIM IQ No load, EN = 2V IOUT = 150mA, EN = 2V IOUT = 1mA IOUT = 150mA SYMBOL VIN (VIN = VOUT (NOMINAL) + 0.5V (1), TA = - 40°C to +85°C, unless otherwise noted. Typical values are at TA = + 25°C.) CONDITIONS IOUT =1mA to150mA, TA = +25°C VOUT + 0.5V≤VIN≤ 5.5V MIN 2.5 -2.7 150 160 600 77 150 1 150 0.03 0.0008 30 78 73 2.0 0.4 TA = +25°C TA = +85°C TA = +25°C TA = +85°C TA = +25°C 0.01 0.01 0.01 0.01 30 1 1 190 0.15 0.002 145 TYP MAX 5.5 +2.7 UNITS V % mA mA µA mV %/V %/mA µVRMS dB dB VIN = 2.5V or (VOUT + 0.5V) to 5.5V, IOUT = 1mA IOUT = 0.1mA to 150mA, COUT = 1µF f = 10Hz to 100KHz, CBP = 0.01µF, COUT = 10µF CBP = 0.1µF, ILOAD = 50mA, COUT = 1µF f = 100Hz, f = 1KHz, en PSRR V µA µA µs 160 15 ℃ ℃ Specifications subject to change without notice. Note 1: VIN = VOUT(NOMINAL) + 0.5V or 2.5V, whichever is greater. Note 2: The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT + 0.5V. (Only applicable for VOUT = +2.5V to +3.3V.) Note 3: Time needed for VOUT to reach 95% of final value. 3 SGM2005 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Load Current 2.9 3.4 Output Voltage vs.Load Current Output Voltage(V) Output Voltage(V) VOUT = 2.8V 2.85 3.35 2.8 3.3 2.75 3.25 VOUT = 3.3V 3.2 2.7 0 50 100 Load Current(mA) 150 0 50 100 Load Current(mA) 150 Ground Pin Current vs.Load Current 160 150 Ground Pin Current(µA) Ground Pin Current(µA) 200 Ground Pin Current vs.Input Voltage VOUT = 2.8V 160 Iload = 50mA 140 130 120 110 100 90 80 70 60 0 50 100 Load Current(mA) 150 VOUT = 2.8V VOUT = 3.3V 120 80 No Load 40 0 0 1 2 3 4 Input Voltage(V) 5 6 Ground Pin Current vs.Input Voltage 200 VOUT = 3.3V Ground Pin Current(µA) 160 120 80 40 0 0 1 2 3 4 Input Voltage(V) 5 6 Iload = 50mA Output Voltage(V) 5 4 3 2 1 0 0 6 Output Voltage vs.Input Voltage No Load VOUT = 3.3V No Load VOUT = 2.8V 1 2 3 4 Input Voltage(V) 5 6 4 SGM2005 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Output Voltage vs.Temperature 2.9 ILOAD = 150mA Output Voltage(V) Output Voltage vs.Temperature 3.4 ILOAD = 150mA Output Voltage(V) 3.35 2.85 2.8 3.3 2.75 VOUT = 2.8V 2.7 -40 -25 -10 5 20 35 50 Temperature(℃) 65 80 95 3.25 VOUT = 3.3V 3.2 -40 -25 -10 5 20 35 50 Temperature(℃) 65 80 95 Ground Pin Current vs.Temperature 260 240 Ground Pin Current( μA) 220 Dropout Voltage vs.Load Current 220 200 180 Dropout Voltage(mV) 160 140 120 100 80 60 40 20 0 95 200 180 160 140 120 100 80 60 -40 -25 -10 5 20 35 50 Temperature(℃) 65 80 ILOAD = 150mA VOUT = 2.8V VOUT = 3.3V TA = +85℃ TA = +25℃ TA = -40℃ VOUT = 2.8V 0 15 30 45 60 75 90 105 120 135 150 Load Current(mA) Dropout Voltage vs.Load Current 180 160 Dropout Voltage(mV) TA = +85℃ TA = +25℃ TA = -40℃ Current limit(mA) 1000 900 800 700 600 500 400 300 200 100 Current limit vs.Temperature 140 120 100 80 60 40 20 0 0 15 30 45 60 75 90 105 120 135 150 Load Current(mA) VOUT = 3.3V VOUT = 3.3V VOUT = 2.8V -50 -35 -20 -5 10 25 40 Temperature(℃) 55 70 85 5 SGM2005 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. 6 SGM2005 TYPICAL OPERATING CHARACTERISTICS VIN = VOUT(NOMINAL) + 0.5V or 2.5V (whichever is greater), CIN = 1µF, COUT = 1µF, CBP = 0.01µF, TA = +25℃, unless otherwise noted. Power-Supply Rejection Ratio vs.Frequency 100 90 80 PSRR(dB) 70 60 50 40 30 20 0.01 COUT = 1μF 0.1 1 10 Frequency(kHz) 100 1000 COUT = 10μF Output Noise Spectral Density vs.Frequency 10 Output Noise Spectral Density (μV/√Hz) CBP = 0.1μF ILOAD = 50mA VIN = VOUT+1V CBP = 0.01μF ILOAD = 50mA 1 COUT = 1μF 0.1 COUT = 10μF 0.01 0.01 0.1 1 10 100 1000 Frequency(kHz) Output Noise vs.Load Current 50 45 Output Noise(µVRMS) 40 35 30 25 20 15 10 5 0 1 10 100 Load Current(mA) 1000 VOUT = 2.8V f = 10Hz to 100kHz CBP = 0.01μF COUT = 10μF VOUT = 3.3V 7 SGM2005 Application Notes When LDO is used in handheld products, Attention must be paid to voltage spike which would damage SGM2005. In such applications, voltage spike will be generated at changer interface and VBUS pin of USB interface when changer adapters and USB equipments are hot-inserted. Besides this, handheld products will be tested on the production line on the condition of no battery. Test Engineer will apply power from the connector pin which connects with positive pole of the battery. When external power supply is turned on suddenly, the voltage spike will be generated at the battery connector. The voltage spike will be very high, it always exceeds the absolute maximum input voltage (6.0V) of LDO. In order to get robust design. Design Engineer needs to clear up this voltage spike. Zener diode is a cheap and effective solution to eliminate such voltage spike. For example, BZM55B5V6 is a 5.6V small package Zener diode which can be used to remove voltage spike in cell phone design. The schematic is shown in below: Vcc Input BZM55B5V6 1uF C1 IN SGM2005 EN GND BP VOUT C2 4.7uF VOUT 0.01uF Control 8 SGM2005 PACKAGE OUTLINE DIMENSIONS DFN-6 0.350±0.050 1.200±0.100 PIN #1 IDENTIFICATION 2.000±0.050 N4 0.650±0.050 N6 2.000±0.050 0.700±0.100 N3 N1 Top View 0.250±0.050 Bottom View 0.203±0.025 NOTES: 1. All dimensions are in millimeters. 0.750±0.050 Side View 0~0.050 9 SGM2005 REVISION HISTORY Location 03/07— Data Sheet changed from REV. A to REV. B Changed to TYPICAL OPERATING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Page Shengbang Microelectronics Co, Ltd Unit 3, ChuangYe Plaza No.5, TaiHu Northern Street, YingBin Road Centralized Industrial Park Harbin Development Zone Harbin, HeiLongJiang 150078 P.R. China Tel.: 86-451-84348461 Fax: 86-451-84308461 www.sg-micro.com 10 SGM2005
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