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SGM4062YDE8G/TR

SGM4062YDE8G/TR

  • 厂商:

    SGMICRO(圣邦微)

  • 封装:

    TDFN8L_2X2MM

  • 描述:

    具有LDO模式的过压保护IC和Li+充电器前端保护IC

  • 数据手册
  • 价格&库存
SGM4062YDE8G/TR 数据手册
SGM4062 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode GENERAL DESCRIPTION FEATURES The SGM4062 is designed for front-end protection of ● Input Over-Voltage Protection Li-Ion battery charger. ● Battery Over-Voltage Protection ● Up to 18V Input Voltage The SGM4062 works like a linear regulator, and ● Up to 1.5A Load Current Capability constantly monitors the input voltage and battery ● Soft-Start and Soft-Stop Function voltage to maintain an output voltage of 5.1V, and the  Prevent Inrush Currents and Voltage Spikes input voltages reach the input over-voltage threshold ● Thermal Shutdown Protection (VOVP = 6.8V). ● Enable Function The SGM4062 has temperature monitoring function. ● Fault Status Indication When the temperature exceeds 145℃, the device will ● Available in Green MSOP-8 (Exposed Pad) and switch off. The SGM4062 provides a fault status TDFN-2×2-8L Packages indication when it is controlled by the processor. The SGM4062 is available in Green TDFN-2×2-8L and MSOP-8 (Exposed Pad) packages and is rated over APPLICATIONS the -40℃ to +85℃ temperature range. Portable Internet Devices and Accessory Mobile Phones and PDAs Handheld Equipment MP3 Players TYPICAL APPLICATION AC Adapter OUT VDC IN CIN 2.2μF VBAT GND SGM4062 Charging Circuit RBAT 10kΩ RPU 47kΩ FAULT VSS COUT 2.2μF CE System RFAULT 47kΩ RCE 47kΩ Figure 1. Typical Application Circuit SG Micro Corp www.sg-micro.com JANUARY 2016 – REV. A. 2 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 PACKAGE/ORDERING INFORMATION MODEL SGM4062 PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE ORDERING NUMBER TDFN-2×2-8L -40℃ to +85℃ SGM4062YDE8G/TR MSOP-8 (Exposed Pad) -40℃ to +85℃ SGM4062YPMS8G/TR PACKAGE MARKING 4062 XXXX SGM4062 YPMS8 XXXXX PACKING OPTION Tape and Reel, 3000 Tape and Reel, 3000 NOTE: XXXX = Date Code. XXXXX = Date Code and Vendor Code. Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If you have additional comments or questions, please contact your SGMICRO representative directly. ABSOLUTE MAXIMUM RATINGS Voltage Range (with Respect to VSS) IN ..................................................................... -0.3V to 28V OUT ....................................... -0.3V to MIN (VIN + 0.3V, 6V) FAULT , CE , VBAT ............................................. -0.3V to 6V Output Source Current (OUT Pin)...................................... 2A Output Sink Current ( FAULT Pin) ................................. 15mA Package Thermal Resistance TDFN-2×2-8L, θJA .................................................... 75℃/W MSOP-8 (Exposed Pad), θJA .................................. 140℃/W Junction Temperature .................................................+150℃ Storage Temperature Range ........................ -65℃ to +150℃ Lead Temperature (Soldering, 10s) ............................+260℃ ESD Susceptibility HBM (SGM4062YPMS8G) .......................................... 3000V HBM (SGM4062YDE8G) ............................................. 4000V MM ................................................................................. 200V RECOMMENDED OPERATING CONDITIONS IN Voltage Range, VI ...........................................3.3V to 18V Current, OUT Pin, IO ............................................ 1.5A (MAX) Operating Temperature Range ....................... -40℃ to +85℃ SG Micro Corp www.sg-micro.com OVERSTRESS CAUTION Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Functional operation of the device at any conditions beyond those indicated in the Recommended Operating Conditions section is not implied. ESD SENSITIVITY CAUTION This integrated circuit can be damaged if ESD protections are not considered carefully. SGMICRO recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because even small parametric changes could cause the device not to meet the published specifications. DISCLAIMER SG Micro Corp reserves the right to make any change in circuit design, or specifications without prior notice. JANUARY 2016 2 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 PIN CONFIGURATIONS (TOP VIEW) (TOP VIEW) 8 OUT VSS 2 7 NC NC 3 6 VBAT FAULT 4 5 CE TDFN-2×2-8L IN 1 8 OUT VSS 2 7 NC NC 3 6 VBAT FAULT 4 5 CE GND 1 GND IN MSOP-8 (Exposed Pad) PIN DESCRIPTION PIN NAME 1 IN 2 VSS Ground Terminal. Connect to the thermal pad and to the ground. 3, 7 NC No Connection. 4 FAULT 5 CE 6 VBAT Battery Voltage Sense Input Pin. Connect a 10kΩ resistor to pack positive terminal. 8 OUT Output Terminal to the Charging System. Connect a ceramic capacitor (2.2μF MIN) between OUT and VSS. Exposed Pad GND Exposed Pad. The exposed pad is electrically connected to VSS internally. The exposed pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. SG Micro Corp www.sg-micro.com FUNCTION Power Input Pin. Connect a ceramic capacitor (1μF MIN) between IN and VSS. Open-Drain Device Status Output Pin. Active-Low Chip Enable Input Pin. JANUARY 2016 3 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 ELECTRICAL CHARACTERISTICS (TA = +25℃, CE = LOW, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 2.5 2.65 2.8 V INPUT Under-Voltage Lockout, Input Power Detected Threshold UVLO VIN = 0V to 3V Hysteresis on UVLO Vhys(UVLO) VIN = 3V to 0V Deglitch Time, Input Power Detected Status tDGL(PGOOD) Time measured from VIN = 0V to 5V, 1μs rise-time Operating Current Standby Current IDD ISTDBY 225 mV 9 ms VIN = 5V, no load on OUT pin 185 260 μA CE = HIGH, VIN = 5.5V 0.5 2 μA 5 μA 120 170 mV 5.1 5.3 V INPUT-TO-OUTPUT CHARACTERISTICS Q1 Off-State Leakage Current IOFF CE = HIGH, VIN = 5.5V Dropout Voltage IN to OUT VDO VIN = 5V, IOUT = 0.5A INPUT OVER-VOLTAGE PROTECTION Output Voltage Input Over-Voltage Protection Threshold VO(REG) VIN = 5.5 to VOVP - Vhys(OVP), no load on OUT pin 4.9 VOVP 6.35 6.8 7.05 V Hysteresis on OVP Vhys(OVP) 50 120 280 mV Input Over-Voltage Protection Propagation Delay (1) tPD(OVP) VIN = 6V to 9V Recovery Time from Input Over-Voltage Condition tREC(OVP) Time measured from VIN = 9V to 6V, 1μs fall-time 200 ns 9 ms BATTERY OVER-VOLTAGE PROTECTION Battery Over-Voltage Protection Threshold Hysteresis on BVOVP Input Bias Current on VBAT Pin Deglitch Time, Battery Over-Voltage Detected BVOVP VOVP - Vhys(OVP) > VIN > 4.5V 4.275 4.35 Vhys(BVovp) VOVP - Vhys(OVP) > VIN > 4.5V 190 IVBAT tDGL(BVovp) VIN > 4.5V, time measured from VVBAT rising from 4.1V to 4.5V to FAULT going low 4.41 V 255 320 mV 20 180 nA 180 μs TJ(OFF) 145 ℃ TJ(OFF-HYS) 15 ℃ THERMAL PROTECTION Thermal Shutdown Temperature Thermal Shutdown Hysteresis LOGIC LEVELS ON CE Logic LOW Input Voltage VIL Logic HIGH Input Voltage VIH Input LOW Current IIL Input HIGH Current IIH Output LOW Voltage Off-State Leakage Current, HI-Z 0.4 1.4 V V 0.3 1.5 μA V CE = 1.8V 9 15 μA VOL ISINK = 5mA 0.14 0.3 V IIkg V FAULT = 5V 0.01 25 μA LOGIC LEVELS ON FAULT NOTE: 1. Not tested. Specified by design. SG Micro Corp www.sg-micro.com JANUARY 2016 4 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 TYPICAL PERFORMANCE CHARACTERISTICS TA = +25℃, CIN = COUT = 2.2μF, unless otherwise noted. Normal Power-On Showing Soft-Start 500mA/div VOUT IOUT VIN 500mV/div 2V/div 2V/div VIN 5V/div 2V/div ROUT = 5Ω OVP at Power-On VOUT VFAULT Time (2ms/div) Time (2ms/div) Recovery from OVP OVP Response for Input Step VFAULT 2V/div 5V/div 2V/div VIN VIN = 6V to 9V Step VIN VOUT 2V/div 2V/div VOUT VFAULT 2V/div VIN = 10V to 6V Step Time (200μs/div) Time (2ms/div) Slow Input Ramp into OVP Event 2V/div VFAULT 2V/div VOUT VIN VOUT 2V/div VIN Time (200μs/div) SG Micro Corp www.sg-micro.com JANUARY 2016 5 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 TYPICAL PERFORMANCE CHARACTERISTICS (continued) TA = +25℃, CIN = COUT = 2.2μF, unless otherwise noted. Soft-Stop during OCP Event Battery OVP Event 2V/div VOUT IOUT 1A/div 2V/div VOUT VIN 2V/div VFAULT Time (40μs/div) Time (40μs/div) Leakage Current (VBAT Pin) vs. Temperature 40 30 20 10 0 -50 -25 0 25 50 75 Under-Voltage Lockout vs. Temperature 2.8 Under-Voltage Lockout (V) Leakage Current (nA) 50 VIN Rising 2.7 2.6 2.5 2.4 VIN Falling 2.3 -50 100 -25 Temperature (℃) 50 4.2 5.2 5.1 5.0 VVBAT Falling -25 0 25 50 Temperature (℃) SG Micro Corp www.sg-micro.com 75 V IN = 5.5V 4.9 4.0 -50 100 5.3 4.3 4.1 75 Output Voltage Regulation vs. Temperature V O(REG) (V) BV OVP (V) 25 5.4 VVBAT Rising 4.4 0 Temperature (℃) Battery Over-Voltage Protection Threshold vs. Temperature 4.5 500mV/div 2V/div VIN = 3.8V to 4.5V Step VBAT 100 -50 -25 0 25 50 75 100 Temperature (℃) JANUARY 2016 6 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode SGM4062 TYPICAL PERFORMANCE CHARACTERISTICS (continued) TA = +25℃, CIN = COUT = 2.2μF, unless otherwise noted. OVP Threshold vs. Temperature Supply Current vs. Input Voltage 7.2 250 VOVP Rising Supply Current (μA) V OVP (V) 7.0 6.8 6.6 VOVP Falling 6.4 200 150 IC Enabled 100 50 IC Disabled 0 6.2 -50 -25 0 25 50 Temperature (℃) SG Micro Corp www.sg-micro.com 75 100 0 3 6 9 12 Input Voltage (V) 15 18 JANUARY 2016 7 SGM4062 Over-Voltage Protection IC and Li+ Charger Front-End Protection IC with LDO Mode REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. JANUARY 2016 ‒ REV.A.1 to REV.A.2 Added Functional Block Diagram section............................................................................................................................................................. 8 DECEMBER 2013 ‒ REV.A to REV.A.1 Added MSOP-8 (Exposed Pad) package ........................................................................................................................................................... All Changes from Original (OCTOBER 2012) to REV.A Changed from product preview to production data ............................................................................................................................................. All SG Micro Corp www.sg-micro.com JANUARY 2016 8 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS TDFN-2×2-8L D e N8 E1 D1 L E k N4 N1 b BOTTOM VIEW TOP VIEW 1.20 0.65 0.60 1.95 A A1 A2 SIDE VIEW 0.24 0.50 RECOMMENDED LAND PATTERN (Unit: mm) Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.700 0.800 0.028 0.031 A1 0.000 0.050 0.000 0.002 A2 0.203 REF 0.008 REF D 1.900 2.100 0.075 0.083 D1 1.100 1.300 0.043 0.051 E 1.900 2.100 0.075 0.083 E1 0.500 0.700 0.020 0.028 k b 0.200 MIN 0.180 e L SG Micro Corp www.sg-micro.com 0.008 MIN 0.300 0.007 0.500 TYP 0.250 0.012 0.020 TYP 0.450 0.010 0.018 TX00056.000 PACKAGE INFORMATION PACKAGE OUTLINE DIMENSIONS MSOP-8 (Exposed Pad) D1 1.80 E1 E 1.55 4.8 E2 b 1.02 e 0.65 0.41 RECOMMENDED LAND PATTERN (Unit: mm) D L A A1 c θ A2 Symbol Dimensions In Millimeters MIN MAX Dimensions In Inches MIN MAX A 0.820 1.100 0.032 0.043 A1 0.020 0.150 0.001 0.006 A2 0.750 0.950 0.030 0.037 b 0.250 0.380 0.010 0.015 c 0.090 0.230 0.004 0.009 D 2.900 3.100 0.114 0.122 D1 1.700 1.900 0.067 0.075 e 0.65 BSC 0.026 BSC E 2.900 3.100 0.114 0.122 E1 4.750 5.050 0.187 0.199 E2 1.450 1.650 0.057 0.065 L 0.400 0.800 0.016 0.031 θ 0° 6° 0° 6° SG Micro Corp www.sg-micro.com TX00016.000 PACKAGE INFORMATION TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS P2 W P0 Q1 Q2 Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 Q3 Q4 B0 Reel Diameter K0 A0 P1 Reel Width (W1) DIRECTION OF FEED NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF TAPE AND REEL Reel Diameter Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P0 (mm) P1 (mm) P2 (mm) W (mm) Pin1 Quadrant TDFN-2×2-8L 7″ 9.5 2.30 2.30 1.10 4.0 4.0 2.0 8.0 Q1 MSOP-8 (Exposed Pad) 13″ 12.4 5.20 3.30 1.50 4.0 8.0 2.0 12.0 Q1 SG Micro Corp www.sg-micro.com TX10000.000 DD0001 Package Type PACKAGE INFORMATION CARTON BOX DIMENSIONS NOTE: The picture is only for reference. Please make the object as the standard. KEY PARAMETER LIST OF CARTON BOX Length (mm) Width (mm) Height (mm) Pizza/Carton 7″ (Option) 368 227 224 8 7″ 442 410 224 18 13″ 386 280 370 5 SG Micro Corp www.sg-micro.com DD0002 Reel Type TX20000.000
SGM4062YDE8G/TR 价格&库存

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SGM4062YDE8G/TR
    •  国内价格
    • 1+0.99180

    库存:0

    SGM4062YDE8G/TR
    •  国内价格
    • 1+1.04799
    • 30+1.00799
    • 100+0.96799
    • 500+0.88799
    • 1000+0.84799
    • 2000+0.82399

    库存:3000