SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
GENERAL DESCRIPTION
FEATURES
The SGM8651/2/3/4/5 are high precision, low noise,
● Rail-to-Rail Output
low distortion, rail-to-rail output CMOS voltage feedback
● Input Offset Voltage: 2mV (TYP)
operational amplifiers offering ease of use and low cost.
● Gain-Bandwidth Product: 50MHz
They have a wide input common mode voltage range
● High Slew Rate: 66V/μs
and output voltage swing, running at single-supply
● Settling Time to 0.1% with 2V Step: 60ns
voltage from 2.5V to 5.5V.
● Overload Recovery Time: 25ns
Despite being low cost, the SGM8651/2/3/4/5 provide
excellent overall performance. They offer wide gainbandwidth product to 50MHz and a typical low power of
2.3mA/amplifier.
The SGM8651/2/3/4/5‘s low distortion and fast settling
make them ideal for buffering high speed A/D or D/A
converters. The SGM8653/5 has a power-down disable
feature
that
reduces
the
supply
current
to
75μA/amplifier. These features make the SGM8653/5
ideal for portable and battery-powered applications
where size and power are critical. All are specified over
the extended -40℃ to +125℃ temperature range.
● Low Noise: 8.7nV/
Hz
● Operates on 2.5V to 5.5V Supply
● Input Voltage Range: -0.2V to 3.8V with VS = 5V
● Low Supply Current:
2.3mA/Amplifier (TYP)
75μA/Amplifier Shutdown Current for SGM8653/5
● -40℃ to +125℃ Operating Temperature Range
● Small Packaging:
SGM8651 Available in Green SOT-23-5 and
SOIC-8 Packages
SGM8652 Available in Green MSOP-8 and SOIC-8
Packages
SGM8653 Available in Green SOT-23-6 and
SOIC-8 Packages
SGM8654 Available in Green TSSOP-14 and
SOIC-14 Packages
SGM8655 Available in a Green MSOP-10 Package
APPLICATIONS
Data Acquisition
Process Control
Audio Processing
Video Processing
Active Filter
Test Equipment
Cell Phone PA Control
Broadband Communication
A-to-D Driver
D-to-A Driver
SG Micro Corp
www.sg-micro.com
JANUARY 2013 – REV. C. 2
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
PACKAGE/ORDERING INFORMATION
MODEL
SGM8651
SGM8652
SGM8653
SGM8654
SGM8655
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SOT-23-5
-40℃ to +125℃
SGM8651XN5/TR
8651
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM8651XS/TR
SGM8651XS
Tape and Reel, 2500
MSOP-8
-40℃ to +125℃
SGM8652XMS/TR
SGM8652XMS
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM8652XS/TR
SGM8652XS
Tape and Reel, 2500
SOT-23-6
-40℃ to +125℃
SGM8653XN6/TR
8653
Tape and Reel, 3000
SOIC-8
-40℃ to +125℃
SGM8653XS/TR
SGM8653XS
Tape and Reel, 2500
SOIC-14
-40℃ to +125℃
SGM8654XS14/TR
SGM8654XS14
Tape and Reel, 2500
TSSOP-14
-40℃ to +125℃
SGM8654XTS14/TR
SGM8654XTS14
Tape and Reel, 3000
MSOP-10
-40℃ to +125℃
SGM8655XMS/TR
SGM8655XMS
Tape and Reel, 3000
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, +VS to -VS ............................................. 7.5V
Input Common Mode Voltage ..... (-VS) - 0.5V to (+VS) + 0.5V
Package Thermal Resistance @ TA = +25℃
SOT-23-5, θJA .......................................................... 190℃/W
SOT-23-6, θJA .......................................................... 190℃/W
SOIC-8, θJA .............................................................. 125℃/W
MSOP-8, θJA ............................................................ 216℃/W
MSOP-10, θJA .......................................................... 216℃/W
Operating Temperature Range .................... -55℃ to +150℃
Junction Temperature .................................................+160℃
Storage Temperature Range ....................... -65℃ to +150℃
Lead Temperature (Soldering, 10s) ............................+260℃
ESD Susceptibility
HBM ............................................................................. 1000V
MM ................................................................................. 400V
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged by ESD if you don’t
pay attention to ESD protection. SGMICRO recommends that
all integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage. ESD damage can range from subtle
performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage
because very small parametric changes could cause the
device not to meet its published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit design, or specifications without prior notice.
SG Micro Corp
www.sg-micro.com
JANUARY 2013
2
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
PIN CONFIGURATIONS
SGM8651 (TOP VIEW)
OUT
-VS
+IN
1
5
SGM8651/8653 (TOP VIEW)
NC
1
8
DISABLE
(SGM8653 ONLY)
-IN
2
7
+VS
+IN
3
6
OUT
-VS
4
5
NC
+VS
2
3
4
-IN
SOT-23-5
SOIC-8
SGM8653 (TOP VIEW)
SGM8652 (TOP VIEW)
OUT
1
6
+VS
-VS
2
5
DISABLE
+IN
3
NC = NO CONNECT
4
OUTA
1
8
+VS
-INA
2
7
OUTB
+INA
3
6
-INB
-VS
4
5
+INB
-IN
SOT-23-6
SOIC-8/MSOP-8
SGM8653 (TOP VIEW)
SGM8654 (TOP VIEW)
OUTA
1
10
+VS
-INA
2
9
OUTB
+INA
3
8
-INB
-VS
4
7
+INB
DISABLE
5
6
MSOP-10
SG Micro Corp
www.sg-micro.com
OUTA
1
14
OUTD
-INA
2
13
-IND
+INA
3
12
+IND
+VS
4
11
-VS
+INB
5
10
+INC
-INB
6
9
-INC
OUTB
7
8
OUTC
DISABLE
TSSOP-14/SOIC-14
JANUARY 2013
3
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
ELECTRICAL CHARACTERISTICS
(At TA = +25℃, VS = 5V, RL = 600Ω connected to VS/2, unless otherwise noted.)
SGM8651/2/3/4/5
PARAMETER
CONDITIONS
TYP
+25℃
Dynamic Performance
Gain-Bandwidth Product (GBP)
Slew Rate
Settling Time to 0.1%
Overload Recovery Time
Noise Performance
Input Voltage Noise Density (en)
DC Performance
Input Offset Voltage (VOS)
Input Offset Voltage Drift
Input Bias Current (IB)
Input offset Current (IOS)
Open-Loop Gain (AOL)
G = +10
G = +1, 2V Output step
G = +1, 2V Output step
VIN·G = +VS
50
66
60
25
f = 100kHz
f = 1MHz
16
8.7
VOUT = 0.3V to 4.7V, RL = 150Ω
VOUT = 0.2V to 4.8V, RL = 1kΩ
±2
4.5
6
2
80
104
Input Characteristics
Input Common Mode Voltage Range (VCM)
Common Mode Rejection Ratio(CMRR) VCM = -0.1V to 3.5V
Output Characteristics
Output Voltage Swing from Rail
Output Current
Closed-Loop Output Impedance
RL = 150Ω
RL = 1kΩ
f < 100kHz, G = +1
Power-Down Disable
(SGM8653/5 Only)
Turn-On Time
Turn-Off Time
DISABLE Voltage-Off
DISABLE Voltage-On
-0.2 to +3.8
80
0.12
0.03
127
0.08
SG Micro Corp
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+25℃
0℃ to -40℃ to -40℃to
+70℃
+85℃
+125℃
nV/
nV/
MIN/
MAX
TYP
TYP
TYP
TYP
Hz
TYP
TYP
MAX
TYP
TYP
TYP
MIN
MIN
Hz
±8
±8.9
±9.5
±9.8
75
92
74
91
74
91
73
80
mV
μV/℃
pA
pA
dB
dB
66
65
65
62
V
dB
TYP
MIN
V
V
mA
Ω
TYP
TYP
MIN
TYP
ns
ns
V
V
TYP
TYP
MAX
MIN
100
96
89
82
0.8
2
ΔVS = 2.7V to 5.5V,
VCM = (-VS) + 0.5
UNITS
MHz
V/μs
ns
ns
220
150
Power Supply
Operating Voltage Range
Quiescent Current (per Amplifier)
Supply Current when Disabled per
Amplifier (SGM8653/5 Only)
Power Supply Rejection Ratio (PSRR)
MIN/MAX OVER TEMPERATURE
2.3
2.5
5.5
2.9
2.7
5.5
3.4
2.7
5.5
3.8
2.7
5.5
4
V
V
mA
MIN
MAX
MAX
75
120
127
130
137
μA
MAX
80
67
67
65
62
dB
MIN
JANUARY 2013
4
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS
At TA= +25℃, VS = 5V, G = +2, RF = 887Ω, RG = 887Ω, CL = 47pF, and RL= 600Ω, unless otherwise noted.
Closed-Loop Gain vs. Frequency
G = +10
0
G = +1
-20
-40
0.01
1
10
Frequency (MHz)
100
CL = 30pF
-3
VIN
-6
+
V+
-12
CL
VR F = 887Ω
0.1
Small Signal Overshoot (%)
G = +100
12
G = +10
8
G = +1
4
Vo
-
30
16
CL = 20pF
Rs
SGM8653
-9
1000
20
CL = 47pF
0
-15
0.1
Output Impedance vs. Frequency
1
(RL is
Optional)
10
100
Frequency (MHz)
1000
Small Signal Overshoot vs. Load Capacitance
V O = 0.2V P-P
25 G = + 1
-overshoot
20
15
+overshoot
10
5
0
0
0.1
1
10
100
Frequency (kHz)
1000
0
10000
V S = 5V
CL = 47pF
V IN = 2V
G = +1
Time (100μs/div)
SG Micro Corp
www.sg-micro.com
10
20
30
40
50
60
70
Capacitance (pF)
Small Signal Step Response
Large Signal Step Response
Output Voltage (500mV/div)
Output Impedance (Ω)
CL = 100pF
RL =600 Ω
20
V o = 0.1V P-P
G = +1
3
RG = 887 Ω
G = +100
Normalized Gain (dB)
40
V S = 5V
RL = 600Ω
CL = 47pF
Capacitive Load vs. Frequency
6
V S = 5V
CL = 47pF
V IN = 200mV
G = +1
Output Voltage (50mV/div)
Closed-Loop Gain (dB)
60
Time (400ns/div)
JANUARY 2013
5
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA= +25℃, VS = 5V, G = +2, RF = 887Ω, RG = 887Ω, CL = 47pF, and RL= 600Ω, unless otherwise noted.
CMRR and PSRR vs. Frequency
1000
80
Voltage Noise (nV/√Hz)
CMRR, PSRR (dB
100
CMRR
60
40
PSRR
20
0
0.01
0.1
1
10
100
10
1
0.01
100
Input Voltage Noise Spectral Density
vs. Frequency
0.1
Frequency (MHz)
Output Voltage (1V/div)
V S = ±2.5V
V IN = 1.77V
G = +2
0V
Maximum Output Voltage vs. Frequency
120
CMRR, PSRR (dB
Output Voltage (V p-p)
4
V S = 2.7V
2
Maximum Output Voltage
1 w ithout Slew -Rate
Induced Distortion
0
0.1
1
V OUT = 2.4V
Frequency (MHz)
SG Micro Corp
www.sg-micro.com
100
CMRR and PSRR vs. Temperature
RL = 150Ω
110
100
PSRR
90
80
70
10
1000
Time (200ns/div)
5 V S = 5.5V
3
100
V S = ±2.5V
f IN = 5MHz
G = +2
Time (25ns/div)
6
10
Large-Signal Disable/Enable Response
Overload Recovery Time
2.5V
1.77V
1
Frequency (kHz)
CMRR
60
-50 -30 -10 10
30
50
70
90 110 130
Temperature (℃)
JANUARY 2013
6
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA= +25℃, VS = 5V, G = +2, RF = 887Ω, RG = 887Ω, RL = 150Ω connected to Vs/2, unless otherwise noted.
80
RL = 1kΩ
110
Shutdown Current (μA)
Open–Loop Gain (dB)
Shutdow n Current vs. Temperature
Open-Loop Gain vs. Temperature
120
100
90
RL = 150Ω
80
70
-50 -30 -10 10 30 50 70
Temperature (℃)
Output Voltage (V)
Supply Current (mA)
65
V S = 3V
60
V S = 2.7V
55
50
45
Sourcing Current
135℃
2
25℃
V S = 3V
1
135℃
25℃
-50℃
Sinking Current
0
20
Temperature (℃)
40
60
80
100
120
Output Current (mA)
Output Voltage Sw ing vs. Output Current
Channel Separation vs. Frequency
5
-40
4
135℃
3
25℃
V S = 5V
Channel Separation (dB)
Output Voltage (V)
-50℃
0
90 110 130
90 110 130
Output Voltage Sw ing vs. Output Current
3
V S = 3V
70
V S = 5V
70
40
-50 -30 -10 10 30 50 70
Temperature (℃)
90 110 130
Supply Current vs. Temperature
3
2.8
2.6
2.4
V S = 5V
2.2
2
1.8
1.6
V S = 2.7V
1.4
1.2
1
-50 -30 -10 10 30 50
75
-50℃
Sourcing Current
2
135℃
1
25℃
-50℃
Sinking Current
0
0
25
50
75
100
Output Current (mA)
SG Micro Corp
www.sg-micro.com
125
150
-50
-60
-70
-80
-90
-100
-110
-120
0.001
0.01
0.1
1
Frequency (MHz)
10
100
JANUARY 2013
7
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
At TA= +25℃, VS = 5V, G = +2, RF = 887Ω, RG = 887Ω, RL = 150Ω connected to VS/2, unless otherwise noted.
Percentage of Amplifiers (%)
24
21
18
Offset Voltage Production Distribution
Typical production
distribution of
packaged units.
15
12
9
6
3
0
-8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8
Offset Voltage (mV)
SG Micro Corp
www.sg-micro.com
JANUARY 2013
8
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
APPLICATION NOTES
Driving Capacitive Loads
The SGM8651/2/3/4/5 can directly drive 47pF in
unity-gain without oscillation. The unity-gain follower
(buffer) is the most sensitive configuration to capacitive
loading. Direct capacitive loading reduces the phase
margin of amplifiers and this results in ringing or even
oscillation. Applications that require greater capacitive
driving capability should use an isolation resistor
between the output and the capacitive load like the
circuit in Figure 1. The isolation resistor RISO and the
load capacitor CL form a zero to increase stability. The
bigger the RISO resistor value, the more stable VOUT will
be. Note that this method results in a loss of gain
accuracy because RISO forms a voltage divider with the
RLOAD.
VOUT
VIN
The SGM8651/2/3/4/5 family operates from either a
single 2.7V to 5.5V supply or dual ±1.35V to ±2.75V
supplies. For single-supply operation, bypass the power
supply +VS with a 0.1µF ceramic capacitor which should
be placed close to the +VS pin. For dual-supply operation,
both the +VS and the -VS supplies should be bypassed to
ground with separate 0.1µF ceramic capacitors. 2.2µF
tantalum capacitor can be added for better performance.
Good PC board layout techniques optimize performance
by decreasing the amount of stray capacitance at the
operational amplifier’s inputs and output. To decrease
stray capacitance, minimize trace lengths and widths
by placing external components as close to the device
as possible. Use surface-mount components whenever
possible.
For the high speed operational amplifier, soldering the
part to the board directly is strongly recommended. Try
to keep the high frequency current loop area small to
minimize the EMI (electromagnetic interference).
RISO
SGM8651
Power Supply Bypassing and Layout
CL
+VS
Figure 1. Indirectly Driving Heavy Capacitive Load
An improved circuit is shown in Figure 2. It provides DC
accuracy as well as AC stability. RF provides the DC
accuracy by connecting the inverting input with the
output. CF and RISO serve to counteract the loss of
phase margin by feeding the high frequency component
of the output signal back to the amplifier’s inverting
input, thereby preserving phase margin in the overall
feedback loop.
+VS
10μF
10μF
0.1μF
0.1μF
VN
VN
SGM8651
VOUT
VOUT
SGM8651
VP
10μF
VP
-VS (GND)
0.1μF
CF
RF
-VS
RISO
SGM8651
VIN
VOUT
CL
RL
Figure 3. Amplifier with Bypass Capacitors
Grounding
Figure 2. Indirectly Driving Heavy Capacitive Load with
DC Accuracy
For non-buffer configuration, there are two other ways
to increase the phase margin: (a) by increasing the
amplifier’s closed-loop gain or (b) by placing a
capacitor in parallel with the feedback resistor to
counteract the parasitic capacitance associated with
inverting node.
SG Micro Corp
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A ground plane layer is important for high speed circuit
design. The length of the current path in an inductive
ground return will create an unwanted voltage noise.
Broad ground plane areas will reduce the parasitic
inductance.
Input-to-Output Coupling
To minimize capacitive coupling, the input and output
signal traces should not be in parallel. This helps
reduce unwanted positive feedback.
JANUARY 2013
9
SGM8651/SGM8652/SGM8654
SGM8653/SGM8655
50MHz, Rail-to-Rail Output
CMOS Operational Amplifiers
TYPICAL APPLICATION CIRCUITS
Differential Amplifier
The circuit shown in Figure 4 performs the difference
function. If the resistor ratios are equal (R4/R3 = R2/R1),
then VOUT = (VP - VN) × R2/R1 + VREF.
R2
R1
VN
SGM8651
VOUT
Active Low-Pass Filter
The low-pass filter shown in Figure 6 has a DC gain of
(-R2/R1) and the -3dB corner frequency is 1/2πR2C.
Make sure the filter bandwidth is within the bandwidth
of the amplifier. Feedback resistors with large values
can couple with parasitic capacitance and cause
undesired effects such as ringing or oscillation in
high-speed amplifiers. Keep resistor values as low as
possible and consistent with output loading consideration.
VP
C
R3
R4
R1
R2
VIN
VREF
SGM8651
Figure 4. Differential Amplifier
Instrumentation Amplifier
VOUT
R3 = R1 // R2
The circuit in Figure 5 performs the same function as
that in Figure 4 but with the high input impedance.
Figure 6. Active Low-Pass Filter
R2
Driving Video
R1
SGM8651
VN
SGM8651
VP
R3
VOUT
The SGM8651/2/3/4/5 can be used in video applications
like in Figure 7.
VIN
R4
SGM8651
SGM8651
75Ω
75Ω
CABLE
VREF
RF
Figure 5. Instrumentation Amplifier
VOUT
RG
75Ω
G = 1 + RF/RG
Figure 7. Typical Video Driving
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
JANUARY 2013 ‒ REV.C.1 to REV.C.2
Page
Changed Pin Configurations section .................................................................................................................................................................... 4
APRIL 2009 ‒ REV.C to REV.C.1
Page
Changed from 16 pin to 14 pin........................................................................................................................................................................... All
SG Micro Corp
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JANUARY 2013
10
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-5
1.90
D
e1
E1
2.59
E
0.99
b
e
0.69
0.95
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
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L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00033.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOT-23-6
D
e1
e
2.59
E
E1
0.99
b
0.95
0.69
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
c
0.2
Dimensions
In Inches
MIN
MAX
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950 BSC
0.037 BSC
e1
1.900 BSC
0.075 BSC
SG Micro Corp
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L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
TX00034.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-8
0.6
D
e
2.2
E1
E
5.2
b
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.006
0.010
D
4.700
5.100
0.185
0.200
E
3.800
4.000
0.150
0.157
E1
5.800
6.200
0.228
0.244
e
SG Micro Corp
www.sg-micro.com
1.27 BSC
0.050 BSC
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
TX00010.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-8
b
E1
E
4.8
1.02
e
0.41
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
A1
c
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
0.820
1.100
0.032
0.043
A1
0.020
0.150
0.001
0.006
A2
0.750
0.950
0.030
0.037
b
0.250
0.380
0.010
0.015
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
0.199
e
SG Micro Corp
www.sg-micro.com
0.650 BSC
0.026 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
TX00014.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
MSOP-10
b
E1
4.8
E
1.02
e
0.5
0.3
RECOMMENDED LAND PATTERN (Unit: mm)
D
L
A
θ
c
A1
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
A
0.820
1.100
A1
0.020
A2
0.750
b
0.180
Dimensions
In Inches
MIN
MAX
0.032
0.043
0.150
0.001
0.006
0.950
0.030
0.037
0.280
0.007
0.011
c
0.090
0.230
0.004
0.009
D
2.900
3.100
0.114
0.122
E
2.900
3.100
0.114
0.122
E1
4.750
5.050
0.187
e
SG Micro Corp
www.sg-micro.com
0.500 BSC
0.199
0.020 BSC
L
0.400
0.800
0.016
0.031
θ
0°
6°
0°
6°
TX00015.000
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
TSSOP-14
D
E
E1
5.94
1.78
e
b
0.42
0.65
RECOMMENDED LAND PATTERN (Unit: mm)
L
A
A1
θ
A2
Symbol
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
1.200
0.047
A
A1
c
H
0.050
0.150
0.002
0.006
A2
0.800
1.050
0.031
0.041
b
0.190
0.300
0.007
0.012
c
0.090
0.200
0.004
0.008
D
4.860
5.100
0.191
0.201
E
4.300
4.500
0.169
0.177
E1
6.250
6.550
0.246
0.258
0.700
0.02
e
L
0.650 BSC
0.500
H
θ
SG Micro Corp
www.sg-micro.com
0.026 BSC
0.25 TYP
1°
0.028
0.01 TYP
7°
1°
7°
TX00019.001
PACKAGE INFORMATION
PACKAGE OUTLINE DIMENSIONS
SOIC-14
D
E
5.2
E1
2.2
e
b
0.6
1.27
RECOMMENDED LAND PATTERN (Unit: mm)
L1
R1
R
A3
A A2
h
L2
θ
A1
Symbol
h
L
Dimensions
In Millimeters
MIN
MAX
Dimensions
In Inches
MIN
MAX
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
1.65
0.049
0.065
A3
0.55
0.75
0.022
0.030
b
0.36
0.49
0.014
0.019
D
8.53
8.73
0.336
0.344
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
e
L
1.27 BSC
0.45
L1
0.80
0.018
1.04 REF
L2
0.157
0.050 BSC
0.032
0.040 REF
0.25 BSC
0.01 BSC
R
0.07
0.003
R1
0.07
0.003
h
0.30
0.50
0.012
0.020
θ
0°
8°
0°
8°
SG Micro Corp
www.sg-micro.com
TX00011.001
PACKAGE INFORMATION
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
P2
W
P0
Q1
Q2
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
Q3
Q4
B0
Reel Diameter
A0
P1
K0
Reel Width (W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
Reel
Diameter
Reel Width
W1
(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P0
(mm)
P1
(mm)
P2
(mm)
W
(mm)
Pin1
Quadrant
SOT-23-5
7″
9.5
3.20
3.20
1.40
4.0
4.0
2.0
8.0
Q3
SOT-23-6
7″
9.5
3.17
3.23
1.37
4.0
4.0
2.0
8.0
Q3
SOIC-8
13″
12.4
6.40
5.40
2.10
4.0
8.0
2.0
12.0
Q1
MSOP-8
13″
12.4
5.20
3.30
1.50
4.0
8.0
2.0
12.0
Q1
MSOP-10
13″
12.4
5.20
3.30
1.20
4.0
8.0
2.0
12.0
Q1
TSSOP-14
13″
12.4
6.95
5.60
1.20
4.0
8.0
2.0
12.0
Q1
SOIC-14
13″
16.4
6.60
9.30
2.10
4.0
8.0
2.0
16.0
Q1
SG Micro Corp
www.sg-micro.com
TX10000.000
DD0001
Package Type
PACKAGE INFORMATION
CARTON BOX DIMENSIONS
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF CARTON BOX
Length
(mm)
Width
(mm)
Height
(mm)
Pizza/Carton
7″ (Option)
368
227
224
8
7″
442
410
224
18
13″
386
280
370
5
SG Micro Corp
www.sg-micro.com
DD0002
Reel Type
TX20000.000
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