PC3Q64J0000F

‘REPARED BY: DATE SHARP ELECTRONIC SHARP COMPONENTS CROUP SPEC No. PILE No. ED-93032 ISSUE April PACE 12 9, Pages REPRESENTATIVE CORPORATION DIVISION 0 PHOTOVOLTAICS baOPTO-ELECTRONIC 0 ELECTRONIC SPECIFICATION DIV. DEVICES DI’ COMPONENTS DIV. 0 0 1. This specification sheets include the contents Sharp Corporation (“Sharp”). Please keep them important information. Please don’t reproduce them \;i’thout Sharp’s consent, 2. ?lease ( :; obey This Main the instructions device is designed uses of this device mentioned below under the copyright of with reasonable care as or cause anyone reproduce for for general electronic are as follows; . Computer OA equipment -Telecommunication * Measuring equipment *Tooling machine etc. c * Home appliance, l (2) Please take in case this high reliability. proper device steps in is used Please extremely don’t use high for the reliability uses mentioned .Telecommunication . Medical element), 0 CUSTC.LIER’S DATE BY APPROVAL use of this device. equipment. equipment equipment (Terminal) I order to maintain reliabflity for the uses mentioned belov -Unit concerning control and safety of automobile etc.) *Gas leak detection box and burglar alarm box [ *Fire *Other 0) .AV actual a vehicle breaker safety below equipment equipment and which (air plane, * Traffic equipment, which safety, require train, signal etc. 3 require (Trunk) (relating etc. to any fatal 1 PRESENTED BY T. Fla tsrimura , Department General Engineering Dept., Opto-Electronic ELECOM Group SHARP CORPORATION 1993 Manager of TI Devices Div. PAGE 1. Application This specification photocoupler Model 2. outline and characteristics of Outline Refer 3. applies to the No. PC3Q64. to the attached Ratings 3.1 drawing No. CY5888K02. and characteristics Absolute maximum ratings Ta=25'C 1 Parameter , Input *l Forward *2 Peak forward *l Power 1 I !Output , I Symbol current Rating / +50 IFM i 21 p i 70 35 ! j I1 6 i IF current ! ! dissipation Collector-emitter voltage VCEO Emitter-collector voltage VECO 1 I 1 Ic I 50 PC I 150 Collector current *l Collector power *l Total power Operating I dissipation factors of absolute maximum rating are shown in Fig. 1 'L 4. *2 Pulse 5 lOOps, *3 AC for *4 For 10 s Cuty ratio 40 "u 60%RH, f=60Hz : 0.001 (Refer I I mW V ( vi ;mt; , i ! mW i I due to ambient to Fig. mA A temperature The derating temperature 1 min., ; 1 dissipation *1 width j Unit 5) 3.2 Electra-optical characteristics Ta=25"C - Parameter Forward j Symbol MIN. / "F ___-._./ j ct I - voltage Input Terminal Dark output capacitance current Collector-emitter breakdown voltage Collector current Collector-emitter saturation voltage Transfer characteristics Isolation j 250 1 100 ; d - 1 I v /Ic=O.lmA j IF=0 6 - 1 / ; ; " Ic 0.2 j 1 ] 4.0 j / d I 1j 0.1 j 0.2 ! / ' i- Riso 5x1010 loll / I Floating capacitance i Cf I Response time (Rise) Response time (Fall) 1 I &E=20", , - 1 / '"CE(sat) resistance 30 'IF='2Oti I i pF $=O, f=lkHz 1.0 I 0.6 1 1 18 / tr - ' 4 tf - 1 3 j / / II " 35 BVCEO 1 I 1.4 /- : Conditions 1.2 I I / BVECO I Emitter-collector brakdown voltage 1 i- 'CEO MAX. 1 Unit/ f ' TYP. j IF=0 I ;I~=l@ki, I IF=0 1 I &=tld /"CE=5" 1 ; " i1F=+20ti /Ic=lmA 1 1 $rj iDC500V /40 ?r 60%RH 1 I i pF fV=O, f=lMHz 1 I / i 18 j ,,s VCE=2V I Ic=2mA ,1 us lRL=lOOO I I (PAGE IMODEL No. I 4. pc3Q64 I Reliability Refer 5. to the Incoming Refer 6. attached sheet, Page 7. sheet, Page 8. inspection to the attached Supplements 6.1 Isolation voltage shall be measured following Short between anode and cathode on the primary between collector and Emitter on the secondary (2) The dielectric be used, (3) The waveform of applied (It is recommended that in insulation oil) withstand 6.3 (I) This product is not (2) This product is (3) This product incorporates Refer AC input with voltage shall the isolation product Package is tester This 6.5 the (1) 6.2 6.4 in zero-cross UL : Under attached preparation side side. and circuit shall be a sine wave. voltage be measured type. designed assembled as radiation with sheet, non coherent Page hardened. electrical specifications to the method. 9 to 11. input light and output. emitting diode. 3 jh4ODEL I 7. PC3Q64 I Notes 7.1 For cleaning * Cleaning (1) Solvent (2) Ultrasonic conditions: cleaning: * The cleaning Solvent: cleaning: shall Solvent te perature 45°C Immersion 3 min. or less or less Affection to device by ultrasonic cleaning has different affection by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etcIf user carries out ultrasonic cleaning, user should select fit condition that doesn't occur defect. be carried Ethyl Freon out alcohol, TE.TF, with solvent Methyl alcohol, Daiflon-solvent below. Isopropyl S3-E alcohol Please refrain from using Chloro Fluoro Carbon type solvent to clean devices as much as possible since it is restricted to protect the ozonosphere. Before you use alternative solvent you are requested to confirm that it does not damage package resin. 7.2 On mounting In mounting this device, please perform soldering reflow satisfied with the conditions indicated in page 12. And please pay attention not to occur the temperature rising of the package sectionally. 8. Others Any doubt as to this specification upon mutual consultation of the both shall be determined parties. . 1 PAGE No. in good faith 4 SHARI= PC3Q64 Date I--- code Page 5 *l Iiurr -i 1lax. 0.2 l-t Pin Nos* connection and internal diagram e @Qa Q@ aDQ!J @ T P C 3 Q.6 4 Q m d $1 4 -.-cu d - d l tl W I Epoxy resin .’ Date code is composed of 2-digit to DIN standard and the,following number marked weekly code First week :1 Second week : 2 Third weed : 3 Fouth week : 4 Fifth, Sixth week : 5 UNIT Name rawin 0. according . :l/lmm PC3Q64 Outline Dimensions cy5888KO2 1 SHARP Page 6 Fig. -‘Tr 1 Forward ambient 0 Ambient2~empe~~tu~~ Fig . 3 '!'~"(oC) Collector power dissipation vs. ambient temperature - Fig. current vs. temperature 4.2 n 2 Diode power vs. ambient Ambitnt Fig. 4 - dissipation temperature 55 75 fzmperature Total power vs. ambient 100 Ta ("C) dissipation temperature .a 200 150 \ 100 - 100 -- \ 50 -1501 -30 Ambiint 5 Peak VS. ?zrnpe?\tuJ: T'aoo(“C) forward current duty ratio Pulse width S 100~ Ta = 25C Duty ratio “l * I 4. Reliability The reliability of products shall PC3Q64 be satisfied with Confidence ! / Test Items Test level Conditions ] j Solderability Soldering heat Terminal (Bending) strength Variable vibration Failure Judgement Criteria : 10%/20% Samples (n)l Defective(C) , I n=ll, C=O *2 i 260°C, 10 s ! 1 ; VF > u x 1.2 I/ j I CEO ‘, u x 2 I IC < L x 0.7 n=ll, C=O n=ll, C=O 1 n=ll, C=O ' , I 1 / / frequency Weight : lNtO.lkgf] 1 time/each terminal 15000m/s2{1500G], 0.5ms 3 times/?X, ?Y, ?Z direction i 100 2, 2000 s 100 Hz/4 j 4 times/X,Y,Z direction 1 200m/s2t20G] min. -40°C Q, +125"C (30min.) (30min.) j 20 cycle test High temp. and high humidity storage i +85"C, i ] n=ll, 9 1 ! i n=22, 'CE(sat) >ux1.2 : 1 cycle i 85%RH, 500h j , jU: i I storage 1 +125"C, storage i -4O"C, / life lOOOh ' Ta=25"C, IF=?5OmA Ptot=l-/OmW, lOOOh / *1 Solder shall lead and pin adhere at the hole or other *2 The lead pin root of lead depth pins. *3 Terminal bending Weight dipped (Refer direction : lNfO.lkgf) / I I Upper specification. is shown below. C=() n=22, C=O I n=22, C=O n=22, C=O n=22, C=O limit Lower specification limit area of 95% or more of immersed holes shall not be concentrated into solder shall to the below) C=O ! lOOOh :L: Low temp. Operation : 90%, LTPD 5 s shock temp. below. i 23O"C, Temperature cycling High listed *l *3 Mechanical items 7 I be away 0.2mm ! portion of on one portion. from the IPAGE IMODEL rb. I 5. Incoming I inspection 5.1 Inspection (1) items Electrical characteristics VCE(sat J, VFY ICE09 (2) 5.2 PC3Q64 method and Inspection A single sampling plan, MIL-STD-105D is applied. items are shown below. Major defect Minor defect Riso, Viso Aplpearance Sampling Defect Ic, 1 Inspection Electrical Unreadable Appearance the above level normal inspection The AQL according item characteristics marking defect except mensioned. level to I 1 Inspection ! i ! I 1 Normal inspection Normal inspection II the based on inspection level AQL(%) I II II j ! ! I j 0.1 0.4 8 MODEL Noa 6.2 Package 6.2.1 (1) (2) Taping Tape conditions structure (Refer and The tape shall pressed on the static electricity. have a structure carrier tape of Reel and structure Direction of attached sheet, Page Dimensions in which a cover hard vinylchloride (Refer to shall be of corrugated attached drawing. product insertion the tape is sealed heatto protect against attached cardboard (Refer to the with attached Joint of tape to and repair Adhesiveness tape carrier taped of The exfoliation 0.2Ni20gf)s 6.2.3 sheet, Page its dimensions sheet, 11) Page 11) shall direct to the Rolling anode mark at tape cover The way carrier tape. tape in failure sha 11 be joint one reel cover and of the carrier cutting tape portion tape force lN{lOOgf]for method less. devices The way to repair tap’ed failure devices cut a bottom and after replacing to good devices, with a cutter, shall be sealed with adhesive tape. 6.2.2 10) 4 The (5) to the Dimensions Product direction in the hole side on the (4) between the carrier tape and cover angle from 160” to 180”. tape shall be quanfity Wind the tape back on the reel so that the cover tape will be outside Attach more than 20cm of blank tape to the trailer and the the tape. leader of the tape and fix the both ends with adh sive tape. One reel shall contain 1000 PCS. 6.2.4 Marking The outer packaging * Model 6 -2.3 - Storage No. Safety case * Number shall of be marked pieces with following information. * Production delivered date condition Taped procuts 5 ‘L 30°C and 6.2.6 9 specifications The taping reel as shown in the (3) PAGE pc3Q64 shall be stored at the humidities lower protection There shall characteristecs during the tempera ure than 70ZRH. lower than shipping be no deformation of due to shipping. component or degradation of electrical SHARI= Tape Page 10 structure and Dimensions I 5” max Dimension 1 A list i C (Unit t :‘mm) D E F G I 24. oto. 3 I 11. 5?0. 1 I 1.75+0. 1 12.OYJ.l 2.0+0.1 4.WO.I 10.4io. 05 I 3.oio.1 I 7.4iO.l Ii )1.5’>’ I LO.8+-O.1 Page 11 SHARI= Reel structure and DimensTons Dimension a list b. 330 25.5Al.5 Direction (Unit : mm) f lO;!l. 0 1310. 5 23:l. 0 2.010.5 of product d 2. Ok 5 insertion Pull-out direction MODEL I’b. PAGE PC3Q64 Precautions I. If solder for Soldering Photocouplers reflow: be done at the It is recommended that only one soldering the temperature profile as temperature and the time within shown in the figure. , 2 min. --__-_-- L-- --; Ii37, ! * 1 min:' '1.5 2. Other i; c 1 min. ‘!1 i min. precautions An infrared localized temperature the resin lamp used to heat up for soldering may cause a temperature rise in the resin. So keep the package within that specified in Item 1. Also avoid immersing part in the solder. 12