PC457L0NIP

PC457L0NIP Series PC457L0NIP Series High Speed 1Mb/s, High CMR Mini-flat Package ∗OPIC Photocoupler ■ Description ■ Agency approvals/Compliance PC457L0NIP Series contains a LED optically coupled to an OPIC chip. It is packaged in a 5 pin Mini-flat. Input-output isolation voltage(rms) is 3.75 kV. High speed response (TYP. 1Mb/s) and CMR is MIN. 15 kV/µs. 1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC457L) 2. Approved by VDE (VDE0884) (as an option), file No. 5911UG (as model No. PC457L) 3. Package resin : UL flammability grade (94V-0) ■ Applications ■ Features 1. Programmable controller 2. Inverter 1. Mini-flat 5 pin package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High speed response (tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs) 4. High noise immunity due to high instantaneous common mode rejection voltage (CMH : MIN. 15kV/µs, CML : MIN. −15kV/µs) 5. High isolation voltage between input and output (Viso(rms) : 3.75 kV) ∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Sheet No.: D2-A05101EN Date Nov. 28. 2003 © SHARP Corporation PC457L0NIP Series ■ Internal Connection Diagram 6 5 4 1 3 4 5 1 6 3 Anode Cathode GND VO (Open collector) VCC ■ Outline Dimensions (Unit : mm) 3.6±0.3 1.27±0.25 6 1.27±0.25 3.6±0.3 1.27±0.25 4 6 SHARP mark "S" P C4 57L 4.4±0.2 SHARP mark "S" 5 2. Mini-flat Package (VDE0884 option) [ex. PC457L0YIP] Anode mark 5 1.27±0.25 4 P C4 5 7 L Anode mark 4.4±0.2 1. Mini-flat Package [ex. PC457L0NIP] 4 VDE0884 Identification mark Date code 1 3 Date code 0.4±0.1 1 Factory identification mark 0.4±0.1 Factory identification mark 5.3±0.3 Epoxy resin 3 5.3±0.3 Epoxy resin 0.1±0.1 2.6±0.2 6˚ 0.5+0.4 −0.2 7.0+0.2 −0.7 0.2±0.05 45˚ 0.2±0.05 0.1±0.1 2.6±0.2 45˚ 6˚ 0.5+0.4 −0.2 7.0+0.2 −0.7 Product mass : approx. 0.1g Sheet No.: D2-A05101EN 2 PC457L0NIP Series Date code (2 digit) A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M ·· N · 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D Mark P R S T U V W X A B C ·· · repeats in a 20 year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan Indonesia Philippines China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production. Sheet No.: D2-A05101EN 3 PC457L0NIP Series ■ Absolute Maximum Ratings (Ta=25˚C) Parameter Symbol Rating Unit *1 Forward current IF 25 mA Input V Reverse voltage 5 V R *2 Power dissipation P 45 mW VCC −0.5 to +30 Supply voltage V VO −0.5 to +20 Output voltage V Output IO Output current 8 mA *3 PO Power dissipation 100 mW *3 Ptot 100 mW Total power dissipation Topr −55 to +85 ˚C Operating temperature Tstg −55 to +125 ˚C Storage temperature *4 Isolation voltage Viso (rms) kV 3.75 *5 Soldering temperature Tsol 270 ˚C *1 When ambient temperature goes above 70˚C, the power dissipation goes down at 0.8mA/˚C. (Fig.3) *2 When ambient temperature goes above 70˚C, the power dissipation goes down at 1.5mW/˚C. (Fig.4) *3 When ambient temperature goes above 70˚C, the power dissipation goes down at 1.8mW/˚C. (Fig.4) *4 40 to 60%RH, AC for 1minute, f=60Hz *5 For 10s ■ Electro-optical Characteristics*7 Response time Parameter Symbol Forward voltage VF Reverse current IR Input Terminal capacitance Ct High level output current (1) IOH (1) High level output current (2) IOH (2) *6 High level output current (3) IOH (3) Output High level supply current (1) ICCH (1) *6 High level supply current (2) ICCH (2) Low level supply current ICCL Low level output voltage VOL Current transfer ratio (1) CTR (1) *6 Current transfer ratio (2) CTR (2) RISO Isolation resistance Cf Floating capacitance Transfer "High→Low" propagation delay time tPHL charactPLH "Low→High" propagation delay time teristics Instantaneous common mode rejection voltage CMH (High level output) Instantaneous common mode rejection voltage (Low level output) CML (Ta=25˚C) Unit V µA pF nA µA µA µA µA µA V % % Ω pF MIN. − − − − − − − − − − 19 15 5×1010 − TYP. 1.7 − 60 3 − − 0.02 − 120 − − − 1011 0.6 MAX. 1.95 10 250 500 1.0 50 1.0 2.0 − 0.4 50 − − 1.0 − 0.2 0.8 µs − 0.4 0.8 µs IF=0, VCC=5V, VCM=1.0kV(p-p), RL=1.9kΩ 15 30 − kV/µs IF=16mA, VCC=5V, VCM=1.0kV(p-p), RL=1.9kΩ −15 −30 − kV/µs Conditions IF=16mA VR=5V V=0, f=1MHz IF=0, VCC=5.5V, VO=5.5V IF=0, VCC=15V, VO=15V IF=0, VCC=15V, VO=OPEN IF=16mA, VCC=15V, VO=OPEN IF=16mA, VCC=4.5V, IO=2.4mA IF=16mA, VCC=4.5V, VO=0.4V, RL=1.9kΩ DC500V, 40 to 60%RH V=0, f=1MHz IF=16mA, VCC=5V RL=1.9Ω *6 Ta=0 to 70˚C *7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 6 ) and GND (pin 4 ) near the device, when it measures transfer characteristics and the output side characteristics. Sheet No.: D2-A05101EN 4 PC457L0NIP Series ■ Model Line-up Taping 3 000pcs/reel −−−−−− Approved VDE0884 Model No. PC457L0NIP PC457L0YIP Package Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Sheet No.: D2-A05101EN 5 PC457L0NIP Series Fig.1 Test Circuit for Propagation Delay Time IF IF 0.01µF VCC Pulse input Pulse width 10µs Duty ratio 1/10 RL 0V VO tPHL CL IF Monitor tPLH VO 5V 1.5V *CL includes the probe and wiring capacitance. 100Ω VOL Fig.2 Test Circuit for Instantaneous Common Mode Rejection Voltage IF 0.01µF SW B VCM VCC A 1.0kV RL 0V VO CMH VO 2V (IF=0) CL + − CML 0.8V VO GND (IF=16mA) VCM 5V When SW is A VOL When SW is B *CL includes the probe and wiring capacitance. Fig.3 Forward Current vs. Ambient Temperature Fig.4 Power Dissipation vs. Ambient Temperature Power dissipation P, PO (mW) Forward current IF (mA) 20 15 10 80 60 P 45 40 20 5 70 0 −55 PO 100 25 0 25 85 50 75 100 70 0 −55 125 Ambient temperature Ta (˚C) 0 25 50 85 75 100 125 Ambient temperature Ta (˚C) Sheet No.: D2-A05101EN 6 PC457L0NIP Series Fig.5 Forward Current vs. Forward Voltage Fig.6 Relative Current Transfer Ratio vs. Forward Current 200 Relative current transfer ratio (%) Forward current IF (mA) 100 10 Ta=25˚C Ta=0˚C Ta=50˚C 1 Ta=−25˚C Ta=70˚C Ta=−55˚C 0.1 1.0 1.2 1.4 1.6 VCC=4.5V VO=0.4V Ta=25˚C 150 100 50 CTR=100% at IF=16mA 1.8 0 0.1 2.0 1 Forward voltage VF (V) Fig.7 Output Current vs. Output Voltage 150 Ta=25˚C 16 VCC=5V Dotted line shows pulse characteristics Relative current transfer ratio (%) Output current IO (mA) IF=16mA VCC=4.5V VO=0.4V 140 14 12 IF=25mA 10 IF=20mA 8 IF=15mA 6 IF=10mA 4 IF=5mA 130 120 110 100 90 80 70 2 60 0 50 −55 −40 0 2 4 6 8 10 12 14 16 18 20 CTR=100% at Ta=25˚C Output voltage VO (V) Propagation delay time tPHL, tPLH (ns) 10 VCC=VO=15V VCC=VO=30V 0 25 50 20 40 60 80 100 800 IF=0 VCC=VO=5.5V 0.1 −25 0 Fig.10 Propagation Delay Time vs. Ambient Temperature 100 1 −20 Ambient temperature Ta (˚C) Fig.9 High Level Output Current vs. Ambient Temperature 1 000 100 Fig.8 Relative Current Transfer Ratio vs. Ambient Temperature 18 High level output current IOH (nA) 10 Forward current IF (mA) 75 IF=16mA VCC=5V RL=1.9kΩ 600 tPLH 400 200 0 −55 −40 100 tPHL −20 0 20 40 60 80 100 Ambient temperature Ta (˚C) Ambient temperature Ta (˚C) Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. Sheet No.: D2-A05101EN 7 PC457L0NIP Series ■ Design Considerations ● Recommended operating conditions Parameter Input current Supply voltage Fan out (TTL load) Operating temperature Symbol IF VCC N Topr MIN. 7 − − 0 MAX. 16 − 5 +70 TYP. − 5 − − Unit mA V − ˚C ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. ● Design guide In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. ● Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5years) into the design consideration. ● Recommended Foot Print (reference) 1.5 0.8 1.27 1.27 6.3 (Unit : mm) ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Sheet No.: D2-A05101EN 8 PC457L0NIP Series ■ Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ( package surface : 250˚C peak) 200 Reflow 220˚C or more, 60s or less Preheat 150 to 180˚C, 120s or less 100 0 0 1 2 3 4 (min) Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please don't solder more than twice. Hand soldering Hand soldering should be completed within 3s when the point of solder iron is below 400˚C. Please don't solder more than twice. Other notices Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. Sheet No.: D2-A05101EN 9 PC457L0NIP Series ● Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials: Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. ● Presence of ODC This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. Sheet No.: D2-A05101EN 10 PC457L0NIP Series ■ Package specification ● Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E G D J MAX . H H A B C I 5˚ K Dimensions List A B 12.0±0.3 5.5±0.1 H I 7.4±0.1 0.3±0.05 C 1.75±0.1 J 3.1±0.1 D 8.0±0.1 K 4.0±0.1 E 2.0±0.1 (Unit : mm) F G +0.1 4.0±0.1 φ1.5−0 Reel structure and Dimensions e d c g Dimensions List a b 370 13.5±1.5 e f ±1.0 21 2.0±0.5 f a b (Unit : mm) c d ±1.0 80 13±0.5 g 2.0±0.5 Direction of product insertion Pull-out direction [Packing : 3 000pcs/reel] Sheet No.: D2-A05101EN 11 PC457L0NIP Series ■ Important Notices with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: D2-A05101EN 12