PC4SD21NTZ Series
VDRM : 800V
Zero cross type
DIP 6pin
Phototriac Coupler for triggering
PC4SD21NTZ
Series
∗
Non-zero cross type is also available.
(PC4SD11NTZ Series)
■ Description
■ Agency approvals/Compliance
PC4SD21NTZ Series Phototriac Coupler include an
infrared emitting diode (IRED) optically coupled to an
output Phototriac.
These devices feature full wave control and are
ideal isolated drivers for medium to high current Triacs.
DIP package provides 5.0kV isolation from input to
output with superior commutative noise immunity.
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. 4SD21)
2. Approved by CSA, file No. CA95323 (as model No.
4SD21)
3. Optionary available VDE Approved ( ∗ ) (DIN EN
60747-5-2), file No. 40008189 (as model No.
4SD21)
4. Package resin : UL flammability grade (94V-0)
(∗)
■ Features
DIN EN60747-5-2 : successor standard of DIN VDE0884.
Up to Date code "RD"(December 2003), approval of DIN
VDE0884.
From Date code "S1"(January 2004), approval of DIN
EN60747-5-2.
(∗∗)
Reinforced insulation type is also available.
(PC4SF21YVZ Series)
1. High repetitive peak off-state voltage (VDRM : 800V)
2. Zero crossing functionality (VOX : MAX. 20V)
3. IFT ranks available (see Model Line-up section in this
datasheet)
4. 6 pin DIP package
5. Superior noise immunity (dV/dt : MIN. 500V/µs)
6. Lead-free components are also available (see Model
Line-up section in this datasheet)
7. Double transfer mold construction (Ideal for Flow
Soldering)
8. High isolation voltage between input and output
(Viso (rms) : 5.0kV)
■ Applications
1. Triggering for Triacs used to switch on and off
devices which require AC Loads.
For example heaters, fans, motors, solenoids, and
valves.
2. AC line control in power supply applications.
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D2-A07901EN
Date Mar. 31. 2004
© SHARP Corporation
PC4SD21NTZ Series
■ Internal Connection Diagram
Anode
Cathode
3 NC
5
4 Anode/Cathode
5 No external connection
4
6 Cathode/Anode
Zero Crossing Circuit
1
1
6
2
3
2
■ Outline Dimensions
(Unit : mm)
1. Through-Hole [ex. PC4SD21NTZ]
2. Wide Through-Hole Lead-Form [ex. PC4SD21NVZ]
±0.3
1.2
6
Model No.
4
SHARP
mark
"S"
6.5±0.5
Date code (2 digit)
3
Date code (2 digit)
Factory identification mark
7.12±0.5
1
7.62±0.3
3.25±0.5
θ
θ
2.54
θ : 0 to 13˚
0.5±0.1
Model No.
SHARP
mark
"S"
Rank mark
4SD21
Anode
mark
1.2±0.3
6
6.5±0.5
5
Rank mark
4SD21
Anode
mark
Date code (2 digit)
1
2
Date code (2 digit)
3
1
Factory identification mark
7.12±0.5
3
Factory identification mark
7.62±0.3
0.35±0.25
0.26±0.1
1.0+0.4
−0
2
7.12±0.5
7.62±0.3
3.5±0.5
2.54±0.25
Model No.
4
0.25±0.25
SHARP
mark
"S"
±0.1
0.26
4. Wide SMT Gullwing Lead-Form [ex. PC4SD21NWP]
0.6±0.2
4
±0.5
10.16
Product mass : approx. 0.35g
1.2±0.3
5
0.5
±0.25
3. SMT Gullwing Lead-Form [ex. PC4SD21NXP]
6
TYP.
Epoxy resin
Product mass : approx. 0.35g
0.6±0.2
±0.3
7.62
2.9±0.5
0.5TYP.
3.5±0.5
2.9±0.5
0.5±0.1
Factory identification mark
7.12±0.5
Epoxy resin
2.54±0.25
3
2
3.5±0.5
2
Anode
mark
3.5±0.5
1
Rank mark
4SD21
2.7MIN.
Anode
mark
Model No.
6.5±0.5
Rank mark
4SD21
4
5
6.5±0.5
5
Epoxy resin
2.54±0.25
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
6
3.25±0.5
0.6
SHARP
mark
"S"
1.2±0.3
0.6±0.2
±0.2
0.75±0.25
Epoxy resin
10.16±0.5
0.75±0.25
MAX.
12.0
Product mass : approx. 0.33g
Product mass : approx. 0.34g
Sheet No.: D2-A07901EN
2
PC4SD21NTZ Series
■ Outline Dimensions
(Unit : mm)
5. Through-Hole VDE option [ex. PC4SD21YTZ]
6. Wide Through-Hole Lead-Form VDE option
[ex. PC4SD21YVZ]
1.2±0.3
6
Model No.
SHARP
mark
"S"
Rank mark
2
Anode
mark
4
Date code (2 digit)
3
Date code (2 digit)
Factory identification mark
7.12±0.5
1
0.5TYP.
3.25±0.5
Factory identification mark
7.12±0.5
θ
θ
Epoxy resin
θ : 0 to 13˚
±0.25
2.54
0.5±0.1
Product mass : approx. 0.35g
0.6±0.2
Model No.
6
SHARP
mark
"S"
Rank mark
4SD21
4
5
4
Rank mark
4SD21
Anode
mark
4
Date code (2 digit)
2
Date code (2 digit)
3
1
Factory identification mark
7.12±0.5
7.12±0.5
7.62±0.3
0.26±0.1
3.5±0.5
2.54±0.25
1.0+0.4
−0
2
VDE
identification mark
3
Factory identification mark
7.62±0.3
0.35±0.25
VDE
identification mark
0.25±0.25
1
Model No.
3.5±0.5
Anode
mark
1.2±0.3
6.5±0.5
4
6.5±0.5
SHARP
mark
"S"
5
±0.1
0.26
8. Wide SMT Gullwing Lead-Form VDE option
[ex. PC4SD21YWP]
1.2±0.3
6
±0.5
10.16
Product mass : approx. 0.35g
7. SMT Gullwing Lead-Form VDE option
[ex. PC4SD21YXP]
0.6±0.2
±0.3
7.62
0.5
2.9±0.5
3.5±0.5
7.62±0.3
0.5±0.1
2
VDE
identification mark
Epoxy resin
2.54±0.25
3
TYP.
1
VDE
identification mark
Rank mark
4SD21
2.7MIN.
4
Model No.
2.9±0.5
Anode
mark
6.5±0.5
4SD21
4
5
6.5±0.5
4
3.5±0.5
5
Epoxy resin
2.54±0.25
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
6
3.25±0.5
0.6
SHARP
mark
"S"
1.2±0.3
0.6±0.2
±0.2
0.75±0.25
Epoxy resin
10.16±0.5
0.75±0.25
MAX.
12.0
Product mass : approx. 0.33g
∗Pin
5
Product mass : approx. 0.34g
is not allowed external connection
Sheet No.: D2-A07901EN
3
PC4SD21NTZ Series
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
1st digit
Year of production
A.D
Mark
2002
A
2003
B
2004
C
2005
D
2006
E
2007
F
2008
H
2009
J
2010
K
2011
L
2012
M
··
N
·
2nd digit
Month of production
Month
Mark
January
1
February
2
March
3
April
4
May
5
June
6
July
7
August
8
September
9
October
O
November
N
December
D
Mark
P
R
S
T
U
V
W
X
A
B
C
··
·
repeats in a 20 year cycle
Factory identification mark
Factory identification Mark
Country of origin
no mark
Japan
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Rank mark
Refer to the Model Line-up table
Sheet No.: D2-A07901EN
4
■ Absolute Maximum Ratings
Parameter
Symbol
Rating
Forward current
IF
50
Input
Reverse voltage
VR
6
RMS ON-state current
IT(rms)
0.1
*3
Output Peak one cycle surge current
1.2
Isurge
Repetitive peak OFF-state voltage VDRM
800
*1
5.0
Viso (rms)
Isolation voltage
−30 to +100
Topr
Operating temperature
−55 to +125
Tstg
Storage temperature
*2
270 *4
Tsol
Soldering temperature
(Ta=25˚C)
Unit
mA
V
A
A
V
kV
˚C
˚C
˚C
1mm
PC4SD21NTZ Series
Soldering area
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 f=50Hz sine wave
*4 Lead solder plating models: 260˚C
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Repentitive peak OFF-state current
ON-state voltage
Output Holding current
Critical rate of rise of OFF-state voltage
Zero cross voltage
Transfer Minimum trigger current
characteristics Isolation resistance
Turn-on time
Rank C
Rank D
(Ta=25˚C)
Symbol
VF
IR
IDRM
VT
IH
dV/dt
VOX
Conditions
IF=20mA
VR=3V
VD=VDRM
IT=0.1A
VD=4V
−
VD=1/√2 ·VDRM
IF=8mA, Resistance load
IFT
VD=4V, RL=100Ω
RISO
ton
DC500V,40 to 60%RH
VD=4V, RL=100Ω, IF=20mA
MIN. TYP.
1.2
−
−
−
−
−
−
−
−
0.1
500 1 000
−
−
−
−
−
−
5×1010 1011
−
−
MAX.
1.4
10
3
2.5
3.5
−
20
5
3
−
50
Unit
V
µA
µA
V
mA
V/µs
V
mA
Ω
µs
Sheet No.: D2-A07901EN
5
PC4SD21NTZ Series
■ Model Line-up (1) (Lead-free components)
Lead Form
Through-Hole
Shipping Package
DIN
EN60747-5-2
Model No.
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
-
Approved
SMT Gullwing
Sleeve
50pcs/sleeve
-
Wide Through-Hole
Approved
-
Rank mark
IFT[mA]
(VD=4V,
RL=100Ω)
C
D
MAX.5
MAX.3
Rank mark
IFT[mA]
(VD=4V,
RL=100Ω)
C
D
MAX.5
MAX.3
Rank mark
IFT[mA]
(VD=4V,
RL=100Ω)
C
D
MAX.5
MAX.3
Rank mark
IFT[mA]
(VD=4V,
RL=100Ω)
C
D
MAX.5
MAX.3
Approved
PC4SD21NTZCF PC4SD21YTZCF PC4SD21NXZCF PC4SD21YXZCF PC4SD21NVZCF PC4SD21YVZCF
PC4SD21NTZDF PC4SD21YTZDF PC4SD21NXZDF PC4SD21YXZDF PC4SD21NVZDF PC4SD21YVZDF
Wide SMT Gullwing
Sleeve
50pcs/sleeve
-
Approved
SMT Gullwing
Wide SMT Gullwing
Taping
1 000pcs/reel
-
Approved
-
Approved
PC4SD21NWZCF PC4SD21YWZCF PC4SD21NXPCF PC4SD21YXPCF PC4SD21NWPCF PC4SD21YWPCF
PC4SD21NWZDF PC4SD21YWZDF PC4SD21NXPDF PC4SD21YXPDF PC4SD21NWPDF PC4SD21YWPDF
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Through-Hole
Shipping Package
DIN
EN60747-5-2
Model No.
Lead Form
Shipping Package
DIN
EN60747-5-2
Model No.
-
Approved
SMT Gullwing
Sleeve
50pcs/sleeve
-
Wide Through-Hole
Approved
-
Approved
PC4SD21NTZC PC4SD21YTZC PC4SD21NXZC PC4SD21YXZC PC4SD21NVZC PC4SD21YVZC
PC4SD21NTZD PC4SD21YTZD PC4SD21NXZD PC4SD21YXZD PC4SD21NVZD PC4SD21YVZD
Wide SMT Gullwing
Sleeve
50pcs/sleeve
-
Approved
SMT Gullwing
-
Wide SMT Gullwing
Taping
1 000pcs/reel
Approved
-
Approved
PC4SD21NWZC PC4SD21YWZC PC4SD21NXPC PC4SD21YXPC PC4SD21NWPC PC4SD21YWPC
PC4SD21NWZD PC4SD21YWZD PC4SD21NXPD PC4SD21YXPD PC4SD21NWPD PC4SD21YWPD
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A07901EN
6
PC4SD21NTZ Series
Fig.2 RMS ON-state Current vs.
Ambient Temperature
70
175
60
150
RMS ON-state current Ir (rms) (mA)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
50
40
30
20
10
125
100
75
50
25
0
0
−30
0
50
−30
100
0
50
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Minimum Trigger Current vs.
Ambient Temperature
10
Minimum trigger current IFT (mA)
Ta=75˚C
Forward current IF (mA)
VD=4V
RL=100Ω
9
100
50
50˚C
25˚C
0˚C
10
5
−25˚C
8
7
6
5
4
3
2
1
1
0.9
1
1.1
1.2
1.3
1.4
0
−40
1.5
−20
Forward voltage VF (V)
0
20
40
60
Fig.6 ON-state Voltage vs.
Ambient Temperature
1.3
IT=100mA
2.4
1.2
2.2
ON-state voltage VT (V)
Relative repetitive peak OFF-state voltage
VDRM (Tj=Ta)/VDRM (Tj=25˚C)
100
Ambient temperature T (˚C)
Fig.5 Relative Repetitive Peak OFF-state
Voltage vs. Ambient Temperature
1.1
1
0.9
0.8
0.7
−40
80
2
1.8
1.6
1.4
1.2
−20
0
20
40
60
80
1
−40
100
Ambient Temperature Ta (˚C)
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Sheet No.: D2-A07901EN
7
PC4SD21NTZ Series
Fig.7 Holding Current vs.
Ambient Temperature
Fig.8 Repetitive Peak OFF-state Current vs.
Ambient Temperature
10−5
1
Repetitive peak OFF-state current IDRM (A)
Holding Current IH (mA)
VD=4V
0.1
0.01
−40
−20
0
20
40
60
80
10−6
10−7
10−8
10−9
−40
100
VD=800V
−20
Ambient temperature Ta (˚C)
20
40
60
80
100
Ambient Temperature Ta (˚C)
Fig.9 Turn-on Time vs. Forward Current
100
0
Fig.10 Zero-cross Voltage vs.
Ambient Temperature
20
VD=4V
RL=100Ω
Resistance load,
IF=8mA
18
Zero-cross voltage VOX (V)
Turn-on time tON (µs)
16
10
14
12
10
8
6
4
2
0
−40
1
1
10
100
−20
0
20
40
60
80
100
Ambient temperature Ta (˚C)
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference.
Sheet No.: D2-A07901EN
8
PC4SD21NTZ Series
■ Design Considerations
● Design guide
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.
Please refrain from using these devices in a direct drive configuration. These Phototriac Coupler are
intended to be used as triggering device for main Triacs. Please ensure that the output rating of these
devices will be sufficient for triggering the main output Triac of your choice. Failure to do may result in
malfunctions.
For applications with inductive loads such as motors,please use caution in utilizing a zero crossing type
Phototraiac Coupler as this may cause undesired operations due to the phase difference between voltage
and current of load.
For designs that will experience excessive noise or sudden changes in load voltage, please include an
appropriate snubber circuit as shown in the below circuit. Please keep in mind the Sharp Phototriac Coupler
incorporate superrior dV/dt ratings which can eliminate the need for a snubber circuit.
For over voltage protection, a Varistor may be used.
● Degradation
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should
provide at least twice the minimum required triggering current from initial operation.
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
Wide SMT Gullwing Lead-form
10.2
1.7
1.7
2.54
2.54
2.54
2.54
8.2
2.2
2.2
(Unit : mm)
Sheet No.: D2-A07901EN
9
PC4SD21NTZ Series
● Standard Circuit (Medium/High Power Triac Drive Circuit)
PC4SD21NTZ
1
6
Load
2
5
3
Triac
AC Line
4
Zero Crossing
Circuit
Note) Please add the snubber circuit according to a condition.
Any snubber or varistor used for the above mentioned scenarios should be located
as close to the main output triac as possible.
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A07901EN
10
PC4SD21NTZ Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300
Terminal : 260˚C peak
( package surface : 250˚C peak)
200
Reflow
220˚C or more, 60s or less
Preheat
150 to 180˚C, 120s or less
100
0
0
1
2
3
4
(min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
Sheet No.: D2-A07901EN
11
PC4SD21NTZ Series
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
Sheet No.: D2-A07901EN
12
PC4SD21NTZ Series
■ Package specification
● Sleeve package
1. Through-Hole or SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12.0
±2
5.8
10.8
520
6.7
(Unit : mm)
2. Wide Through-Hole or Wide SMT Gullwing
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15.0
±2
5.9
10.8
520
6.35
(Unit : mm)
Sheet No.: D2-A07901EN
13
PC4SD21NTZ Series
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
J
G
I
5˚
X.
MA
H
H
A
B
C
E
K
Dimensions List
A
B
±0.3
16.0
7.5±0.1
H
I
±0.1
10.4
0.4±0.05
C
1.75±0.1
J
4.2±0.1
D
12.0±0.1
K
7.8±0.1
E
2.0±0.1
F
4.0±0.1
(Unit:mm)
G
+0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
330
17.5±1.5
e
f
23±1.0
2.0±0.5
f
a
b
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07901EN
14
PC4SD21NTZ Series
2. Wide SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
D
G
E
I
J
MA
X.
H
H
A
B
C
Dimensions List
A
B
24.0±0.3
11.5±0.1
H
I
±0.1
12.2
0.4±0.05
5˚
K
C
1.75±0.1
J
4.15±0.1
D
12.0±0.1
K
7.6±0.1
E
2.0±0.1
(Unit : mm)
F
G
+0.1
4.0±0.1
φ1.5−0
Reel structure and Dimensions
e
d
c
g
Dimensions List
a
b
a
330
e
23±1.0
f
b
25.5±1.5
f
2.0±0.5
(Unit : mm)
c
d
±1.0
100
13±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
Sheet No.: D2-A07901EN
15
PC4SD21NTZ Series
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.
· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this publication.
Sheet No.: D2-A07901EN
16
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