PQ1CZ21H2ZZ

PQ1CZ21H2Z PQ1CZ21H2Z Low Dissipation Current at OFF-state Chopper Regulator ■ Features ■ Outline Dimensions 1. Maximum switching current:1.5A 2. Low dissipation current at OFF-state (Iqs=Max. 1µA) 3. Built-in oscillation circuit (Oscillation frequency:TYP.100kHz) 4. Built-in overheat/overcurrent protection function 5. Variable output voltage (Output variable range:Vref to 35V/−Vref to −30V) [Possible to select step-down output/inversing output according to external connection circuit] PQ1CZ21H2ZZ:sleeve-packaged product PQ1CZ21H2ZP:tape-packaged product 2.3±0.5 6.6MAX. 5.2 ±0.5 (0.5) 3 (1.7) 5.5±0.5 MIN. 9.7MAX. Epoxy resin 1CZ21H +0.2 0.5−0.1 1. Facsimiles 2. Printers 3. Switching power supplies 1 2 3 1 ■ Absolute Maximum Ratings Parameter Input voltage Output adjustment terminal voltage Dropout voltage *2 Output-COM voltage *3 ON/OFF control voltage Switching current *4 Power dissipation *5 Junction temperature Operating temperature Storage temperature *6 Soldering temperature (0.5) 4−(1.27) 2 3 4 5 4 5 (Ta=25°C) Symbol Rating VIN 40 VADJ 7 VI-O 41 VOUT −1 VC −0.3 to +40 1.5 ISW 8 PD Tj 150 Topr −40 to +85 Tstg −40 to +150 Tsol 260 (0.9) 2.5 (0 to 0.25) ■ Applications *1 (Unit : mm) VIN VOUT GND (Common to heat sink) OADJ ON/OFF control ∗ ( ) : Typical dimensions Unit V V V V V A W ˚C ˚C ˚C ˚C *1 Voltage between VIN terminal and COM terminal *2 Voltage between VOUT terminal and COM terminal *3 Voltage between ON/OFF control and COM terminal *4 PD:With infinite heat sink *5 Overheat protection may operate at the condition Tj:125˚C to 150˚C *6 For 10s Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ PQ1CZ21H2Z (Unless otherwise specified, condition shall be VIN=12V, IO=0.2A, VO=5V, ON-OFF terminal=2.7V, Ta=25˚C) MIN. TYP. MAX. Unit Symbol Conditions ■ Electrical Characteristics Parameter Output saturation voltage Reference voltage Reference voltage temperature fluctuation Load regulation Line regulation Efficiency Oscillation frequency VSAT Vref ∆Vref |RegL| |RegI| η fO ∆fO IL Oscillation frequency temperature fluctuation Overcurrent detecting level ON threshold voltage Output ON control current Output OFF control current Stand-by current Output OFF-state consumption current VTH(ON) IC (ON) IC (OFF) ISD IQS ISW=1A − Tj=0 to 125˚C IO=0.2 to 1A VIN=8 to 35V IO=1A − Tj=0 to 125˚C No L, C, D 4 terminal=0V, 5 terminal 5 terminal=2.7V 5 terminal=0.4V VIN=40V, 5 terminal=0V VIN=40V, 4 terminal=3V − 1.235 0.9 1.26 1.5 1.285 − − − − 80 − 1.55 0.8 − − − − ±0.5 0.1 0.5 82 100 ±3 2 1.5 − − − 8 − 1.5 2.5 − 120 − 2.6 2 200 2 1 12 V V % % % % kHz % A V µA µA µA mA Fig.1 Standard Test Circuit 4 1 ISD Iqs L 210µH IO VO 2 PQ1CZ21H2Z A R2 5 + + VIN A CIN 100µF Load 3 IC (ON) IC (OFF) R1 1kΩ ON/OFF control logic 5 pin Output LOW OFF HIGH ON OPEN OFF L : HK-14D100-2110 (made by Toho Co.) D :ERC80-004 (made by Fuji electronics Co.) Fig.2 Power Dissipation vs. Ambient Temperature Fig.3 Overcurrent Protection Characteristics (Typical value) 7 10 Ta=25°C VIN=12V VO=5V 6 PD : With infinite heat sink Output voltage VO (V) Power dissipation PD (W) 8 CO 470µF D 5 5 4 3 2 1 0 −40 −20 0 0 20 40 60 80 85 Ambient temperature Ta (°C) Note) Oblique line prtion:Overheat protection may operate in this area 0 0.5 1 1.5 2 2.5 Output current IO (A) 3 3.5 4 PQ1CZ21H2Z Fig.4 Efficiency vs. Input Current 100 Fig.5 Switching Current vs. Output Saturation Voltage 1.2 VO=12V, IO=1A VO=12V, IO=0.2A Tj=25°C Output saturation voltage VSAT (V) Tj=25°C Efficiency η (%) 90 80 VO=5V, IO=1A 70 VO=5V, IO=0.2A 60 1 0.8 0.6 0.4 0.2 0 50 0 10 20 30 0 40 0.5 Fig.6 Reference Voltage Fluctuation vs. Junction Temperature 2 1 VIN=12V VO=5V Tj=25˚C VIN=12V VO=5V 1 Load regulation RegL(%) Reference voltage fluctuation ∆Vref (%) 1.5 Fig.7 Load Regulation vs. Output Current 2 0 −1 −2 −50 −25 0.5 0 −0.5 0 25 50 75 100 125 0 0.2 0.4 Junction temperature Tj (°C) 2 Oscillation frequency fluctuation ∆fO (%) 0.5 0 Tj=25°C VO=5V IO=0.2A −0.5 5 10 15 20 25 Input voltage VIN (V) 30 0.8 1 1.2 Fig.9 Oscillation Frequency Fluctuation vs. Junction Temperature 1 0 0.6 Output current IO (A) Fig.8 Line Regulation vs. Input Voltage Line regulation RegI (%) 1 Switching current ISW (A) Input voltage VIN (V) 35 40 VIN=12V VO=5V 0 −2 −4 −6 −8 −10 −50 −25 0 25 50 75 Junction temperature Tj (°C) 100 125 PQ1CZ21H2Z Fig.10 Overcurrent Detection Level Fluctuation vs. Junction Temperature Fig.11 ON Threshold Voltage vs. Junction Temperature 2 VIN=12V 4 ON threshold voltage VTH (ON) (V) Overcurrent detecting level fluctuation ∆IL (%) 6 2 0 −2 −4 −6 −8 −50 −25 0 25 50 75 100 1.5 1 0.5 0 −50 125 −25 Junction temperature Tj (°C) 0 25 Fig.12 Operating Consumption Current vs. Input Voltage Operating consumptioon current IQ' (mA) 10 Tj=25°C VO=5V 9 IO=1A 8 IO=0.2A 7 No load 6 5 0 10 20 30 40 Input voltage VIN (V) Fig.13 Power Dissipation vs. Ambient Temperature (Typical Value) 3 Power dissipation PD (W) Cu area 740mm2 2 PWB Cu area 180mm2 PWB Cu Cu area 100mm2 Cu area 70mm2 1 Cu area 36mm2 0 −40 −20 0 Material : Glass-cloth epoxy resin Size : 50×50×1.6mm Cu thickness : 35µm 20 40 50 75 100 Junction temperature Tj (°C) 60 Ambient temperature Ta (°C) 80 85 125 150 PQ1CZ21H2Z Fig.14 Block Diagram 1 2 Voltage regulator _ PWM COMP. + ON/ OFF 5 1 2 3 4 5 F/F Overcurrent detection circuit VIN VOUT GND (Common to heat sink) Oadj ON/OFF control Q R OSC. S ERROR AMP. _ + 4 Vref Overheat detection circuit 3 Fig.15 Step Down Type Circuit Diagram (5V output) 4 L 210µH 1 VO 5V 2 PQ1CZ21H2Z 5 R2 3kΩ + VIN 8 to 35V + Load 3 D CIN 100µF CO 470µF R1 1kΩ ON/OFF control signal Fig.16 Polarity Inversion Type Circuit Diagram (-5V output) 4 L 130µH 1 2 PQ1CZ21H2Z R2 3kΩ 5 + VIN 5 to 30V + Load 3 D CIN 100µF CO 2200µF R1 1kΩ VO −5V ON/OFF control signal PQ1CZ21H2Z ■ Precautions for Use 1. External connection (1) Wiring condition is very important. Noise associated with wiring inductance may cause problems. For minimizing inductance, it is recommended to design the thick and short pattern (between large current diodos, input/output capacitors, and terminal 1,2.) Single-point grounding (as indicated) should be used for best results. (2) High switching speed and low forward voltage type schottky barrier diode should be recommended for the catch-diode D because it affects the efficiency. Please select the diode which the current rating is at least 1.2 times greater than maximum swiching current. (3) The output ripple voltage is highly influenced by ESR(Equivalent Series Resistor)of output capacitor, and can be minimized by selecting Low ESR capacitor. (4) An inductor should not be operated beyond its maximum rated current so that it may not saturate. (5) When voltage that is higher than VIN 1 , is applied to VOUT 2 , there is the case that the device is broken. Especially, in case VIN 1 is shorted to GND in normal condition, there is the case that the device is broken since the charged electric charge in output capacitor (CO) flows into input side. In such case a schottly barrier diode or a silicon diode shall be recommended to connect as the following circuit. 4 L 1 VO 2 PQ1CZ21H2Z 5 VIN + R2 + 3 Load D CO CIN R1 C-MOS or TTL 1 PQ1CZ21H2Z 2 PQ1CZ21H2Z ■ Thermal Protection Design Internal power dissipation(P)of device is generally obtained by the following equation. P=ISW(Average.) × VSAT×D' + VIN(voltage between VIN to COM terminal)× IQ '(consumption current) Step down type –––––––––––––– Ton VO+VF ––––––––––––– D'(Duty)= –––––––– T(period)= VIN–VSAT+VF ISW(Average)= IO(Output current.) Polarity inversion type –––––––––––––––––––– |VO|+VF Ton D'(Duty)= –––––––– = –––––––––––––––––––– T(period) VIN+|VO|–VSAT+VF 1 ISW(Average)= –––––––– × IO(Output current.) 1–D' VF : Forward voltage of the diode When ambient temperature Ta and power dissipation PD(MAX)during operation are determined, use Cu plate which allows the element to operate within the safety operation area specified by the derating curve. Insufficient radiation gives an unfavorable influence to the normal operation and reliability of the device. ■ ON/OFF Control Terminal 1. In the following circuit,when ON/OFF control terminal 5 becomes low by switching transistor Tr on, output voltage may be turned OFF and the device becomes stand-by mode. Dissipation current at stand-by mode becomes Max.1µA. 2. ON/OFF control terminal 5 is compatible with LS-TTL. It enables to be directly drive by TTL or C-MOS standard logic (RCA4000 series). If ON/OFF control terminal is not used, it is recommended to directly connect applicable terminals with input terminal. 4 1 IO L 2 VO PQ1CZ21H2Z 5 R2 + VIN + Load 3 D CIN CO R1 C-MOS or TTL Application Circuits NOTICE ●The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. ●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. ●Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). ●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. ●If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. ●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. ●Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115