SIPMOS® Small-Signal Transistor
BSS 229
q q q q q q q
VDS 250 V ID 0.07 A RDS(on) 100 Ω
N channel Depletion mode High dynamic resistance Available grouped in VGS(th)
1
2
3
Type
Ordering Code
Tape and Reel Information
Pin Configuration Marking Package 1 G 2 D 3 S SS229 TO-92
BSS 229 Q62702-S600 E6296: 1500 pcs/reel; 2 reels/carton; source first Maximum Ratings Parameter Drain-source voltage Drain-gate voltage, RGS = 20 kΩ Gate-source voltage Gate-source peak voltage, aperiodic Continuous drain current, TA = 25 ˚C Pulsed drain current, Max. power dissipation,
Symbol
Values 250 250 ± 14 ± 20 0.07 0.21 0.63 – 55 … + 150 ≤ 200 E 55/150/56
Unit V
VDS VDGR VGS Vgs ID ID puls Ptot Tj, Tstg RthJA
– –
A W ˚C K/W –
TA = 25 ˚C TA = 25 ˚C
Operating and storage temperature range Thermal resistance, chip-ambient (without heat sink) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
Semiconductor Group
1
04.97
BSS 229
Electrical Characteristics at Tj = 25 ˚C, unless otherwise specified. Parameter Symbol min. Static Characteristics Drain-source breakdown voltage VGS = − 3 V, ID = 0.25 mA Gate threshold voltage VDS = 3 V, ID = 1 mA Drain-source cutoff current VDS = 250 V, VGS = − 3 V Tj = 25 ˚C Tj = 125 ˚C Gate-source leakage current VGS = 20 V, VDS = 0 Drain-source on-resistance VGS = 0 V, ID = 0.014 A Dynamic Characteristics Forward transconductance VDS ≥ 2 × ID × RDS(on)max, ID = 0.07 A Input capacitance VGS = 0, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0, VDS = 25 V, f = 1 MHz Reverse transfer capacitance VGS = 0, VDS = 25 V, f = 1 MHz Turn-on time ton, (ton = td(on) + tr) VDD = 30 V, VGS = − 2 V ... + 5 V, RGS = 50 Ω, ID = 0.15 A Turn-off time toff, (toff = td(off) + tf) VDD = 30 V, VGS = − 2 V ... + 5 V, RGS = 50 Ω, ID = 0.15 A Values typ. max. Unit
V(BR)DSS
250 – − 1.4 – − 0.7
V
VGS(th) IDSS
− 1.8
– –
– – 10 75
100 200 100
nA µA nA
IGSS
–
RDS(on)
– 100
Ω
gfs
0.05 0.10 85 6 2 4 10 10 15 –
S pF – 120 10 3 6 15 13 20 ns
Ciss Coss
–
Crss
–
td(on) tr td(off) tf
– – – –
Semiconductor Group
2
BSS 229
Electrical Characteristics (cont’d) at Tj = 25 ˚C, unless otherwise specified. Parameter Reverse Diode Continuous reverse drain current TA = 25 ˚C Pulsed reverse drain current TA = 25 ˚C Diode forward on-voltage IF = 0.14 A, VGS = 0 Symbol min. Values typ. max. A – – – 0.8 Unit V V V V V V V 0.07 0.21 V – Symbol Limit Values min. Range of VGS(th) Threshold voltage selected in groups: F G A B C D
1)
Unit
IS ISM
–
VSD
1.2
VGS(th) Grouping
Test Condition –
max. 0.15 – 1.385 – 1.485 – 1.585 – 1.685 – 1.785 – 1.885
∆VGS(th) VGS(th)
– – 1.535 – 1.635 – 1.735 – 1.835 – 1.935 – 2.035
VDS1 = 0.2 V; VDS2 = 3 V; ID = 10 µA
1) A specific group cannot be ordered separately. Each reel only contains transistors from one group.
Semiconductor Group
3
BSS 229
Characteristics at Tj = 25 ˚C, unless otherwise specified. Total power dissipation Ptot = f (TA) Safe operating area ID = f (VDS) parameter: D = 0.01, TC = 25 ˚C
Typ. output characteristics ID = f (VDS) parameter: tp = 80 µs
Typ. drain-source on-resistance RDS(on) = f (ID) parameter: VGS
Semiconductor Group
4
BSS 229
Typ. transfer characteristics ID = f (VGS) parameter: tp = 80 µs, VDS ≥ 2 × ID × RDS(on)max.
Typ. forward transconductance gfs = f (ID) parameter: VDS ≥ 2 × ID × RDS(on)max., tp = 80 µs
Drain-source on-resistance RDS(on) = f (Tj) parameter: ID = 0.014 A, VGS = 0 V, (spread)
Typ. capacitances C = f (VDS) parameter: VGS = 0, f = 1 MHz
Semiconductor Group
5
BSS 229
Gate threshold voltage VGS(th) = f (Tj) parameter: VDS = 3 V, ID = 1 mA, (spread)
Forward characteristics of reverse diode IF = f (VSD) parameter: tp = 80 µs, Tj, (spread)
Drain current ID = f (TA) parameter: VGS ≥ 3 V
Drain-source breakdown voltage V(BR) DSS = b × V(BR)DSS (25 ˚C)
Semiconductor Group
6
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