EZR32LG330F128R67G-B0

EZR32LG Wireless MCUs EZR32LG330 Data Sheet EZR32LG330 Wireless MCU family with ARM Cortex-M3 CPU, USB, and sub-GHz Radio The EZR32LG Wireless MCUs are the latest in Silicon Labs family of wireless MCUs delivering a high performance, low energy wireless solution integrated into a small form factor package. By combining a high performance sub-GHz RF transceiver with an energy efficient 32-bit MCU, the EZR32LG family provides designers the ultimate in flexibility with a family of pin-compatible devices that scale with 64/128/256 kB of flash and support Silicon Labs EZRadio or EZRadioPRO transceivers. The ultra-low power operating modes and fast wake-up times of the Silicon Labs energy friendly 32-bit MCUs, combined with the low transmit and receive power consumption of the sub-GHz radio, result in a solution optimized for battery powered applications. 32-Bit ARM Cortex wireless MCUs applications include the following: • Energy, gas, water and smart metering • Health and fitness applications • Consumer electronics • Alarm and security systems • Building and home automation KEY FEATURES • Silicon Labs’ first 32-bit Wireless MCUs • Based on ARM Cortex M3 (LG) and M4 (WG) CPU cores with 256 kB of flash and 32 kB RAM • Best-in-class RF performance with EZradio and EZRadioPro transceivers • Ultra-low power wireless MCU • Low transmit and receive currents • Ultra-low power standby and sleep modes • Fast wake-up time • Low Energy sensor interface (LESENSE) • Rich set of peripherals including 12-bit ADC and DAC, multiple communication interfaces (USB, UART, SPI, I2C), multiple GPIO and timers • AES Accelerator with 128/256-bit keys silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 EZR32LG330 Data Sheet Feature List 1. Feature List The LG highlighted features are listed below. MCU Features • ARM Cortex-M3 CPU platform • Up to 48 MHz • 64/128/256 kB Flash w/32 kB RAM • Hardware AES with 128/256-bit keys • Flexible Energy Management System • 20 nA @ 3 V Shutoff Mode • 0.65 µA @ 3 V Stop Mode • 211 µA/MHz @ 3 V Run Mode • Timers/Counters • 4× Timer/Counter • 4×3 Compare/Capture/PWM channels • Low Energy Timer • Real-Time Counter • 16/8-bit Pulse Counter • Watchdog Timer • Communication interfaces • 2× USART (UART/SPI) • 2× UART • 2× Low Energy UART • 2× I2C Interface with SMBus support • Universal Serial Bus (USB) • Ultra low power precision analog peripherals • 12-bit 1 Msamples/s ADC • On-chip temperature sensor • 12-bit 500 ksamples/s DAC • 2× Analog Comparator • 2x Operational Amplifier • Low Energy Sensor Interface (LESENSE) • Up to 38 General Purpose I/O pins silabs.com | Smart. Connected. Energy-friendly. RF Features • Frequency Range • 142-1050 MHz • Modulation • (G)FSK, 4(G)FSK, (G)MSK, OOK • Receive sensitivity up to -133 dBm • Up to +20 dBm max output power • Low active power consumption • 10/13 mA RX • 18 mA TX at +10 dBm • 6 mA @ 1.2 kbps (Preamble Sense) • Data rate = 100 bps to 1 Mbps • Excellent selectivity performance • 69 dB adjacent channel • 79 dB blocking at 1 MHz • Antenna diversity and T/R switch control • Highly configurable packet handler • TX and RX 64 byte FIFOs • Automatic frequency control (AFC) • Automatic gain control (AGC) • IEEE 802.15.4g compliant System Features • • • • • Power-on Reset and Brown-Out Detector Debug Interface Temperature range -40 to 85 °C Single power supply 1.98 to 3.8 V QFN64 package Rev. 1.1 | 1 EZR32LG330 Data Sheet Ordering Information 2. Ordering Information The table below shows the available EZR32LG330 devices. Table 2.1. Ordering Information Ordering Radio Flash (kB) RAM (kB) Power Am- Max Sensiplifier (dBm) tivity (dBm) Supply Voltage (V) Package EZR32LG330FxxxR55G EZRadio 64-256 32 +13 -116 1.98 - 3.8 QFN64 EZR32LG330FxxxR60G EZRadioPro 64-256 32 +13 -129 1.98 - 3.8 QFN64 EZR32LG330FxxxR61G EZRadioPro 64-256 32 +16 -129 1.98 - 3.8 QFN64 EZR32LG330FxxxR63G EZRadioPro 64-256 32 +20 -129 1.98 - 3.8 QFN64 EZR32LG330FxxxR67G EZRadioPro 64-256 32 +13 -133 1.98 - 3.8 QFN64 EZR32LG330FxxxR68G EZRadioPro 64-256 32 +20 -133 1.98 - 3.8 QFN64 EZR32LG330FxxxR69G EZRadioPro 64-256 32 +13 & 20 -133 1.98 - 3.8 QFN64 Table 2.2. Flash Sizes Example Part Number Flash Size EZR32LG330F64R55G 64 kB EZR32LG330F128R55G 128 kB EZR32LG330F256R55G 256 kB Note: Add an "(R)" at the end of the device part number to denote tape and reel option. Visit www.silabs.com for information on global distributors and representatives. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 2 EZR32LG330 Data Sheet System Overview 3. System Overview 3.1 Introduction The EZR32LG330 Wireless MCUs are the latest in Silicon Labs family of wireless MCUs delivering a high performance, low energy wireless solution integrated into a small form factor package. By combining a high performance sub-GHz RF transceiver with an energy efficient 32-bit ARM Cortex-M3, the EZR32LG family provides designers with the ultimate in flexibility with a family of pin-compatible parts that scale from 64 to 256 kB of flash and support Silicon Labs EZRadio or EZRadioPRO transceivers. The ultra-low power operating modes and fast wake-up times combined with the low transmit and receive power consumption of the sub-GHz radio result in a solution optimized for low power and battery powered applications. For a complete feature set and in-depth information on the modules, the reader is referred to the EZR32LG Reference Manual. The EZR32LG330 block diagram is shown below. Figure 3.1. Block Diagram 3.1.1 ARM Cortex-M3 Core The ARM Cortex-M3 includes a 32-bit RISC processor which can achieve as much as 1.25 Dhrystone MIPS/MHz. A Memory Protection Unit with support for up to 8 memory segments is included, as well as a Wake-up Interrupt Controller handling interrupts triggered while the CPU is asleep. The EZR32 implementation of the Cortex-M3 is described in detail in EZR32 Cortex-M3 Reference Manual. 3.1.2 Debugging These devices include hardware debug support through a 2-pin serial-wire debug interface and an Embedded Trace Module (ETM) for data/instruction tracing. In addition there is also a 1-wire Serial Wire Viewer pin which can be used to output profiling information, data trace and software-generated messages. 3.1.3 Memory System Controller (MSC) The Memory System Controller (MSC) is the program memory unit of the EZR32LG microcontroller. The flash memory is readable and writable from both the Cortex-M3 and DMA. The flash memory is divided into two blocks: the main block and the information block. Program code is normally written to the main block. Additionally, the information block is available for special user data and flash lock bits. There is also a read-only page in the information block containing system and device calibration data. Read and write operations are supported in the energy modes EM0 and EM1. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 3 EZR32LG330 Data Sheet System Overview 3.1.4 Direct Memory Access Controller (DMA) The Direct Memory Access (DMA) controller performs memory operations independently of the CPU. This has the benefit of reducing the energy consumption and the workload of the CPU, and enables the system to stay in low energy modes when moving, for instance, data from the USART to RAM or from the External Bus Interface to a PWM-generating timer. The DMA controller uses the PL230 µDMA controller licensed from ARM. 3.1.5 Reset Management Unit (RMU) The RMU is responsible for handling the reset functionality of the EZR32LG. 3.1.6 Energy Management Unit (EMU) The Energy Management Unit (EMU) manages all the low energy modes (EM) in EZR32LG microcontrollers. Each energy mode manages if the CPU and the various peripherals are available. The EMU can also be used to turn off the power to unused SRAM blocks. 3.1.7 Clock Management Unit (CMU) The Clock Management Unit (CMU) is responsible for controlling the oscillators and clocks on-board the EZR32LG. The CMU provides the capability to turn on and off the clock on an individual basis to all peripheral modules in addition to enable/disable and configure the available oscillators. The high degree of flexibility enables software to minimize energy consumption in any specific application by not wasting power on peripherals and oscillators that are inactive. 3.1.8 Watchdog (WDOG) The purpose of the watchdog timer is to generate a reset in case of a system failure, to increase application reliability. The failure may, for example, be caused by an external event, such as an ESD pulse, or by a software failure. 3.1.9 Peripheral Reflex System (PRS) The Peripheral Reflex System (PRS) system is a network which lets the different peripheral module communicate directly with each other without involving the CPU. Peripheral modules which send out Reflex signals are called producers. The PRS routes these reflex signals to consumer peripherals which apply actions depending on the data received. The format for the Reflex signals is not given, but edge triggers and other functionality can be applied by the PRS. 3.1.10 Universal Serial Bus Controller (USB) The USB is a full-speed USB 2.0 compliant OTG host/device controller. The USB can be used in Device, On-the-go (OTG) Dual Role Device or Host-only configuration. In OTG mode the USB supports both Host Negotiation Protocol (HNP) and Session Request Protocol (SRP). The device supports both fullspeed (12 MBit/s) and low speed (1.5 MBit/s) operation. The USB device includes an internal dedicated Descriptor-Based Scatter/Garther DMA and supports up to 6 OUT endpoints and 6 IN endpoints, in addition to endpoint 0. The on-chip PHY includes all OTG features, except for the voltage booster for supplying 5 V to VBUS when operating as host. 3.1.11 Inter-Integrated Circuit Interface (I2C) The I2C module provides an interface between the MCU and a serial I2C-bus. It is capable of acting as both a master and a slave, and supports multi-master buses. Both standard-mode, fast-mode and fast-mode plus speeds are supported, allowing transmission rates all the way from 10 kbit/s up to 1 Mbit/s. Slave arbitration and timeouts are also provided to allow implementation of an SMBus compliant system. The interface provided to software by the I2C module allows both fine-grained control of the transmission process and close to automatic transfers. Automatic recognition of slave addresses is provided in all energy modes. 3.1.12 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) The Universal Synchronous Asynchronous serial Receiver and Transmitter (USART) is a very flexible serial I/O module. It supports full duplex asynchronous UART communication as well as RS-485, SPI, MicroWire and 3-wire. It can also interface with ISO7816 SmartCards, and I2S devices. 3.1.13 Pre-Programmed UART Bootloader The bootloader presented in application note AN0003 is pre-programmed in the device at factory. Autobaud and destructive write are supported. The autobaud feature, interface, and commands are described further in the application note. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 4 EZR32LG330 Data Sheet System Overview 3.1.14 Universal Asynchronous Receiver/Transmitter (UART) The Universal Asynchronous serial Receiver and Transmitter (UART) is a very flexible serial I/O module. It supports full- and half-duplex asynchronous UART communication. 3.1.15 Low Energy Universal Asynchronous Receiver/Transmitter (LEUART) The unique LEUART™, the Low Energy UART, is a UART that allows two-way UART communication on a strict power budget. Only a 32.768 kHz clock is needed to allow UART communication up to 9600 baud/s. The LEUART includes all necessary hardware support to make asynchronous serial communication possible with minimum of software intervention and energy consumption. 3.1.16 Timer/Counter (TIMER) The 16-bit general purpose Timer has 3 compare/capture channels for input capture and compare/Pulse-Width Modulation (PWM) output. TIMER0 also includes a Dead-Time Insertion module suitable for motor control applications. 3.1.17 Real Time Counter (RTC) The Real Time Counter (RTC) contains a 24-bit counter and is clocked either by a 32.768 kHz crystal oscillator, or a 32.768 kHz RC oscillator. In addition to energy modes EM0 and EM1, the RTC is also available in EM2. This makes it ideal for keeping track of time since the RTC is enabled in EM2 where most of the device is powered down. 3.1.18 Backup Real Time Counter (BURTC) The Backup Real Time Counter (BURTC) contains a 32-bit counter and is clocked either by a 32.768 kHz crystal oscillator, a 32.768 kHz RC oscillator or a 1 kHz ULFRCO. The BURTC is available in all Energy Modes and it can also run in backup mode, making it operational even if the main power should drain out. 3.1.19 Low Energy Timer (LETIMER) The unique LETIMER™, the Low Energy Timer, is a 16-bit timer that is available in energy mode EM2 in addition to EM1 and EM0. Because of this, it can be used for timing and output generation when most of the device is powered down, allowing simple tasks to be performed while the power consumption of the system is kept at an absolute minimum. The LETIMER can be used to output a variety of waveforms with minimal software intervention. It is also connected to the Real Time Counter (RTC), and can be configured to start counting on compare matches from the RTC. 3.1.20 Pulse Counter (PCNT) The Pulse Counter (PCNT) can be used for counting pulses on a single input or to decode quadrature encoded inputs. It runs off either the internal LFACLK or the PCNTn_S0IN pin as external clock source. The module may operate in energy mode EM0 - EM3. 3.1.21 Analog Comparator (ACMP) The Analog Comparator is used to compare the voltage of two analog inputs, with a digital output indicating which input voltage is higher. Inputs can either be one of the selectable internal references or from external pins. Response time and thereby also the current consumption can be configured by altering the current supply to the comparator. 3.1.22 Voltage Comparator (VCMP) The Voltage Supply Comparator is used to monitor the supply voltage from software. An interrupt can be generated when the supply falls below or rises above a programmable threshold. Response time and thereby also the current consumption can be configured by altering the current supply to the comparator. 3.1.23 Analog to Digital Converter (ADC) The ADC is a Successive Approximation Register (SAR) architecture, with a resolution of up to 12 bits at up to one million samples per second. The integrated input mux can select inputs from 8 external pins and 6 internal signals. 3.1.24 Digital to Analog Converter (DAC) The Digital to Analog Converter (DAC) can convert a digital value to an analog output voltage. The DAC is fully differential rail-to-rail, with 12-bit resolution. It has two single ended output buffers which can be combined into one differential output. The DAC may be used for a number of different applications such as sensor interfaces or sound output. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 5 EZR32LG330 Data Sheet System Overview 3.1.25 Operational Amplifier (OPAMP) The EZR32LG330 features 2 Operational Amplifiers. The Operational Amplifier is a versatile general purpose amplifier with rail-to-rail differential input and rail-to-rail single ended output. The input can be set to pin, DAC or OPAMP, whereas the output can be pin, OPAMP or ADC. The current is programmable and the OPAMP has various internal configurations such as unity gain, programmable gain using internal resistors, etc. 3.1.26 Low Energy Sensor Interface (LESENSE) The Low Energy Sensor Interface (LESENSE™), is a highly configurable sensor interface with support for up to 16 individually configurable sensors. By controlling the analog comparators and DAC, LESENSE is capable of supporting a wide range of sensors and measurement schemes, and can for instance measure LC sensors, resistive sensors and capacitive sensors. LESENSE also includes a programmable FSM which enables simple processing of measurement results without CPU intervention. LESENSE is available in energy mode EM2, in addition to EM0 and EM1, making it ideal for sensor monitoring in applications with a strict energy budget. 3.1.27 Backup Power Domain The backup power domain is a separate power domain containing a Backup Real Time Counter, BURTC, and a set of retention registers, available in all energy modes. This power domain can be configured to automatically change power source to a backup battery when the main power drains out. The backup power domain enables the EZR32LG330 to keep track of time and retain data, even if the main power source should drain out. 3.1.28 Advanced Encryption Standard Accelerator (AES) The AES accelerator performs AES encryption and decryption with 128-bit or 256-bit keys. Encrypting or decrypting one 128-bit data block takes 52 HFCORECLK cycles with 128-bit keys and 75 HFCORECLK cycles with 256-bit keys. The AES module is an AHB slave which enables efficient access to the data and key registers. All write accesses to the AES module must be 32-bit operations (i.e., 8- or 16-bit operations are not supported). 3.1.29 General Purpose Input/Output (GPIO) In the EZR32LG330, there are 38 General Purpose Input/Output (GPIO) pins, which are divided into ports with up to 16 pins each. These pins can individually be configured as either an output or input. More advanced configurations like open-drain, filtering and drive strength can also be configured individually for the pins. The GPIO pins can also be overridden by peripheral pin connections, like Timer PWM outputs or USART communication, which can be routed to several locations on the device. The GPIO supports up to 16 asynchronous external pin interrupts, which enables interrupts from any pin on the device. Also, the input value of a pin can be routed through the Peripheral Reflex System to other peripherals. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 6 EZR32LG330 Data Sheet System Overview 3.1.30 EZRadio® and EZRadioPro® Transceivers The EZR32LG family of devices is built using high-performance, low-current EZRadio and EZRadioPro RF transceivers covering the sub-GHz frequency bands from 142 to 1050 MHz. These devices offer outstanding sensitivity of upto –133 dBm (using EZRadioPro) while achieving extremely low active and standby current consumption. The EZR32LG devices using the EZRadioPro transceiver offer frequency coverage in all major bands and include optimal phase noise, blocking, and selectivity performance for narrow band and licensed band applications, such as FCC Part 90 and 169 MHz wireless Mbus. The 69 dB adjacent channel selectivity with 12.5 kHz channel spacing ensures robust receive operation in harsh RF conditions, which is particularly important for narrow band operation. The active mode TX current consumption of 18 mA at +10 dBm and RX current of 10 mA coupled with extremely low standby current and fast wake times is optimized for extended battery life in the most demanding applications. The EZR32LG devices can achieve up to +27 dBm output power with built-in ramping control of a low-cost external FET. The devices can meet worldwide regulatory standards: FCC, ETSI, and ARIB. All devices are designed to be compliant with 802.15.4g and WMbus smart metering standards. The devices are highly flexible and can be programmed and configured via Simplicity Studio, available at www.silabs.com. Communications between the radio and MCU are done over USART, PRS and IRQ, which requires the pins to be configured in the following way: Table 3.1. Radio MCU Communication Configuration EZR32LG Pin Radio Assignment EZR32LG Function Assignment PE8 SDN GPIO Output PE9 nSEL Bit-Banged SPI.CS (GPIO Output) PE10 SDI US0_TX #0 PE11 SDO US0_RX #0 PE12 SCLK US0_CLK #0 PE13 nIRQ GPIO_EM4WU5 (GPIO Input with IRQ enabled) PE14 GPIO1 PRS Input PA15 GPIO0 PRS Input silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 7 EZR32LG330 Data Sheet System Overview 3.1.30.1 EZRadio® and EZRadioPRO® Transceivers GPIO Configuration The EZRadio and EZRadioPRO Transceivers have 4 General Purpose Digital I/O pins. These GPIOs may be configured to perform various radio-specific functions, including Clock Output, FIFO Status, POR, Wake-up Timer, TRSW, AntDiversity control, etc. Two of the radio GPIO pins are directly connected to pins on the package (GPIO2 and GPIO3). However, the remaining two radio GPIO pins (GPIO0 and GPIO1) connect internally on the EZR32LG to the pins shown in 3.1.30 EZRadio® and EZRadioPro® Transceivers. These radio GPIOs may be routed to external package pins using the EZR32LG’s peripheral reflex system (PRS). Note that the maximum frequency of the GPIO pins routed through PRS pins may be limited to ~10 MHz. Below is some example code illustrating how to configure the EZR32LG PRS system to output the radio GPIO0/GPIO1 functions to EZR32LG pins PA0 / PA1, respectively. Note that the radio GPIO0/GPIO1 functions could also be connected to EZR32LG pins PF3/ PF4. /* PRS routing radio GPIO0 and GPIO1 to external pin PA0&PA1 */ / * Note that this code example uses the emlib library functions for CMU, GPIO, and PRS */ /* Enable PRS clock */ CMU_ClockEnable(cmuClock_PRS, true); /* Setup input pins */ GPIO_PinModeSet(gpioPortA, 15, gpioModeInput, 0); GPIO_PinModeSet(gpioPortE, 14, gpioModeInput, 0); /* Setup output pins */ GPIO_PinModeSet(gpioPortA, 0, gpioModePushPull, 0); GPIO_PinModeSet(gpioPortA, 1, gpioModePushPull, 0); /* Configure INT/PRS channels */ GPIO_IntConfig(gpioPortA, 15, false, false, false); GPIO_IntConfig(gpioPortE, 14, false, false, false); /* Setup PRS */ PRS_SourceAsyncSignalSet(0, PRS_CH_CTRL_SOURCESEL_GPIOH, PRS_CH_CTRL_SIGSEL_GPIOPIN15); PRS_SourceAsyncSignalSet(1, PRS_CH_CTRL_SOURCESEL_GPIOH, PRS_CH_CTRL_SIGSEL_GPIOPIN14); PRS->ROUTE = (PRS_ROUTE_CH0PEN | PRS_ROUTE_CH1PEN); /* Make sure PRS sensing is enabled (should be by default) */ GPIO_InputSenseSet(GPIO_INSENSE_PRS, GPIO_INSENSE_PRS); silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 8 EZR32LG330 Data Sheet System Overview 3.2 Configuration Summary The features of the EZR32LG330 are a subset of the feature set described in the EZR32LGReference Manual. The table below describes device specific implementation of the features. Table 3.2. Configuration Summary Module Configuration Pin Connections Cortex-M3 Full configuration NA DBG Full configuration DBG_SWCLK, DBG_SWDIO, DBG_SWO MSC Full configuration NA DMA Full configuration NA RMU Full configuration NA EMU Full configuration NA CMU Full configuration CMU_OUT0, CMU_OUT1 WDOG Full configuration NA PRS Full configuration NA USB Full configuration USB_VBUS, USB_VBUSEN, USB_VREGI, USB_VREGO, USB_DM, USB_DMPU, USB_DP, USB_ID I2C0 Full configuration I2C0_SDA, I2C0_SCL I2C1 Full configuration I2C1_SDA, I2C1_SCL USARTRF0 Full configuration with IrDA US0_TX, US0_RX, US0_CLK, US0_CS USART1 Full configuration with I2S US1_TX, US1_RX, US1_CLK, US1_CS USART2 Full configuration with I2S US2_TX, US2_RX, US2_CLK, US2_CS UART0 Full configuration U0_TX, U0_RX UART1 Full configuration U1_TX, U1_RX LEUART0 Full configuration LEU0_TX, LEU0_RX LEUART1 Full configuration LEU1_TX, LEU1_RX TIMER0 Full configuration with DTI TIM0_CC[2:0], TIM0_CDTI[2:0] TIMER1 Full configuration TIM1_CC[2:0] TIMER2 Full configuration TIM2_CC[2:0] TIMER3 Full configuration TIM3_CC[2:0] RTC Full configuration NA BURTC Full configuration NA LETIMER0 Full configuration LET0_O[1:0] PCNT0 Full configuration, 16-bit count register PCNT0_S[1:0] PCNT1 Full configuration, 8-bit count register PCNT1_S[1:0] PCNT2 Full configuration, 8-bit count register PCNT2_S[1:0] ACMP0 Full configuration ACMP0_CH[7:0], ACMP0_O ACMP1 Full configuration ACMP1_CH[7:0], ACMP1_O VCMP Full configuration NA silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 9 EZR32LG330 Data Sheet System Overview Module Configuration Pin Connections ADC0 Full configuration ADC0_CH[7:0] DAC0 Full configuration DAC0_OUT[1:0] OPAMP Full configuration Outputs: OPAMP_OUTx, OPAMP_OUTxALT, Inputs: OPAMP_Px, OPAMP_Nx AES Full configuration NA GPIO 38 pins Available pins are shown in 5.4 GPIO Pinout Overview 3.3 Memory Map The EZR32LG330 memory map is shown below with RAM and flash sizes for the largest memory configuration. Figure 3.2. EZR32LG330 Memory Map with Largest RAM and Flash Sizes silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 10 EZR32LG330 Data Sheet Electrical Specifications 4. Electrical Specifications 4.1 Test Conditions 4.1.1 Typical Values The typical data are based on TAMB = 25°C and VDD = 3.0 V, as defined in Table 4.3 General Operating Conditions on page 12, by simulation and/or technology characterisation unless otherwise specified. 4.1.2 Minimum and Maximum Values The minimum and maximum values represent the worst conditions of ambient temperature, supply voltage and frequencies, as defined in Table 4.3 General Operating Conditions on page 12, by simulation and/or technology characterisation unless otherwise specified. 4.2 Absolute Maximum Ratings The absolute maximum ratings are stress ratings, and functional operation under such conditions are not guaranteed. Stress beyond the limits specified in the table below may affect the device reliability or cause permanent damage to the device. Functional operating conditions are given in Table 4.3 General Operating Conditions on page 12. Table 4.1. Absolute Maximum Ratings Parameter Storage temperature range Maximum soldering temperature External main supply voltage Voltage on any I/O pin Symbol Test Condition Min Typ Max Unit -55 ─ 1501 °C ─ ─ 260 °C VDDMAX 0 ─ 3.8 V VIOPIN -0.3 ─ VDD+0.3 V TSTG TS Latest IPC/ JEDEC JSTD-020 Standard Note: 1. Based on programmed devices tested for 10000 hours at 150 ºC. Storage temperature affects retention of preprogrammed calibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data retention for different temperatures. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 11 EZR32LG330 Data Sheet Electrical Specifications 4.3 Thermal Characteristics Table 4.2. Thermal Conditions Parameter Symbol Test Condition Min Typ Max Unit Ambient temperature range TAMB -40 ─ 85 °C Junction temperature value TJ ─ ─ 1051 °C +13/+16 dBm on 2-layer board ─ ─ 61.8 °C/W +20 dBm on 4layer board ─ ─ 20.72 °C/W -55 ─ 150 °C Thermal impedance junction to ambient TIJA Storage temperature range TSTG Note: 1. Values are based on simulations run on 2 layer and 4 layer PCBs at 0m/s airflow. 2. Based on programmed devices tested for 10000 hours at 150 ºC. Storage temperature affects retention of preprogrammed calibration values stored in flash. Please refer to the Flash section in the Electrical Characteristics for information on flash data retention for different temperatures. 4.4 General Operating Conditions Table 4.3. General Operating Conditions Parameter Symbol Min Typ Max Unit TAMB -40 ─ 85 °C VDDOP 1.98 ─ 3.8 V Internal APB clock frequency fAPB ─ ─ 48 MHz Internal AHB clock frequency fAHB ─ ─ 48 MHz Ambient temperature range Operating supply voltage Table 4.4. Environmental Parameter Symbol Test Condition Min Typ Max Unit ESD (Human Body Model HBM) VESDHBM TAMB=25 °C ─ ─ 2000 V ESD (Charged Device Model, CDM) VESDCDM TAMB=25 °C ─ ─ 500 V Latch-up sensitivity passed: ±100 mA/1.5 × VSUPPLY(max) according to JEDEC JESD 78 method Class II, 85 °C. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 12 EZR32LG330 Data Sheet Electrical Specifications 4.5 Current Consumption Table 4.5. Current Consumption Parameter EM0 current. No prescaling. Running prime number calculation code from Flash. (Production test condition = 14 MHz) Symbol IEM0 Test Condition Min Typ Max Unit 48 MHz HFXO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 211 225 µA/MHz 48 MHz HFXO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 211 230 µA/MHz 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 212 220 µA/MHz 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 213 223 µA/MHz 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 214 224 µA/MHz 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 215 226 µA/MHz 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 216 231 µA/MHz 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 217 237 µA/MHz 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 218 239 µA/MHz 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 219 239 µA/MHz 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 224 242 µA/MHz 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 224 250 µA/MHz 1.2 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 257 285 µA/MHz 1.2 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 261 293 µA/MHz silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 13 EZR32LG330 Data Sheet Electrical Specifications Parameter EM1 current (Production test condition = 14 MHz) Symbol IEM1 EM2 current IEM2 EM3 current IEM3 EM4 current IEM4 Test Condition Min Typ Max Unit 48 MHz HFXO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 63 75 µA/MHz 48 MHz HFXO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 65 76 µA/MHz 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 64 75 µA/MHz 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 65 77 µA/MHz 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 65 76 µA/MHz 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 66 78 µA/MHz 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 67 79 µA/MHz 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 68 82 µA/MHz 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 68 81 µA/MHz 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 70 83 µA/MHz 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 74 87 µA/MHz 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 76 89 µA/MHz 1.2 MHz HFRCO. all peripheral clocks disabled, VDD= 3.0 V, TAMB=25 °C ─ 106 120 µA/MHz 1.2 MHz HFRCO. all peripheral clocks disabled, VDD= 3.0 V, TAMB=85 °C ─ 112 129 µA/MHz EM2 current with RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=25 °C ─ 0.951 1.7 µA EM2 current with RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=85 °C ─ 3.01 4.01 µA VDD= 3.0 V, TAMB=25 °C ─ 0.65 1.3 µA VDD= 3.0 V, TAMB=85 °C ─ 2.65 4.0 µA VDD= 3.0 V, TAMB=25 °C ─ 0.02 0.055 µA VDD= 3.0 V, TAMB=85 °C ─ 0.44 0.9 µA Note: 1. Using backup RTC. silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 14 EZR32LG330 Data Sheet Electrical Specifications 4.6 Transitions between Energy Modes The transition times are measured from the trigger to the first clock edge in the CPU. Table 4.6. Energy Modes Transitions Parameter Symbol Min Typ Max Unit Transition time from EM1 to EM0 tEM10 ─ 0 ─ HFCORECLK cycles Transition time from EM2 to EM0 tEM20 ─ 2 ─ µs Transition time from EM3 to EM0 tEM30 ─ 2 ─ µs Transition time from EM4 to EM0 tEM40 ─ 163 ─ µs 4.7 Power Management The EZR32LG requires the AVDD_x, VDD_DREG and IOVDD_x pins to be connected together (with optional filter) at the PCB level. For practical schematic recommendations, please see the application note, AN0002: EFM32 Hardware Design Considerations. Table 4.7. Power Management Parameter Symbol Test Condition Min Typ Max Unit BOD threshold on falling external supply voltage VBODextthr- 1.74 ─ 1.96 V BOD threshold on falling internally regulated supply voltage VBODintthr- 1.57 ─ 1.7 V BOD threshold on rising external supply voltage VBODextthr+ ─ 1.85 1.98 V Power-on Reset (POR) threshold on rising external supply voltage VPORthr+ ─ ─ 1.98 V Delay from reset is released until program execution starts tRESET Applies to Power-on Reset, Brown-out Reset and pin reset. ─ 163 ─ µs Voltage regulator decoupling capacitor. CDECOUPLE X5R capacitor recommended. Apply between DECOUPLE pin and GROUND ─ 1 ─ µF silabs.com | Smart. Connected. Energy-friendly. Rev. 1.1 | 15 EZR32LG330 Data Sheet Electrical Specifications 4.8 Flash Table 4.8. Flash Parameter Symbol Flash erase cycles before failure ECFLASH Flash data retention RETFLASH Test Condition Min Typ Max Unit 20000 ─ ─ cycles TAMB