AS227-000

DATA SHEET AS227-000/099: 20 MHz to 2.0 GHz, 4 W pHEMT SP3T Switch Applications J3 V3  Transmit/receive switching for telematic systems at elevated power levels Features  Broadband frequency range: 20 MHz to 2.0 GHz  Very low insertion loss: 0.5 dB typical @ 0.9 GHz  High isolation: 26 dB typical @ 0.9 GHz  High input power compression: 0.1 dB @ > +37 dBm  Low current consumption: 500 MHz operation. Use larger value capacitors for lower frequency operation. Technical Description Electrical and Mechanical Specifications The AS227-000/099 is controlled using three voltage inputs, V1, V2, and V3 (pins 1, 3, and 6, respectively). Depending on the voltage level applied to these pins, the common RF port (RFC) is connected to one of three RF ports (J1, J2, or J3) using a low insertion loss path, while the path between RFC and the other RF ports are in an isolation state. The absolute maximum ratings of the AS227-000/099 are provided in Table 2. Electrical specifications are provided in Table 3 and the operating characteristics are specified in Table 4. When the control voltages are toggled, the states between RFC and the other RF ports are also toggled. Typical performance characteristics of the AS227-000/099 are illustrated in Figures 3 through 7. The state of the AS227-000 is determined by the logic provided in Table 5. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 2 February 10, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201596B DATA SHEET • AS227-000/099 SP3T SWITCH Table 2. AS227-000 Absolute Maximum Ratings (Note 1) Parameter Symbol Minimum Maximum Units 0 +6 V Control voltage VCTL RF input power (VCTL > 0.9 GHz) PIN +36 dBm Operating temperature TOP –40 +85 °C Storage temperature TSTG –65 +150 °C Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. AS227-000/099 Electrical Specifications (Note 1) (VCTL = 0-3 V, TOP = +25 C, PIN = 0 dBm, Characteristic Impedance = 50 Ω, Unless Otherwise Noted) Parameter Symbol Test Condition Insertion loss 0.02 to 0.5 GHz 0.5 to 1.0 GHz 1.0 to 2.0 GHz Isolation 0.02 to 0.5 GHz 0.5 to 1.0 GHz 1.0 to 2.0 GHz Return loss (Note 2) Switching characteristics: Rise/fall On/off 0.1 dB Input Compression Point IP0.1dB Control voltage: Low (@ 20 μA max) High (@100 μA max) High (@ 200 μA max) VCTL_L VCTL_H VCTL_H Min Typical Max Units 0.45 0.50 0.70 0.60 0.70 0.90 dB dB dB 32 26 20 dB dB dB 0.02 to 1.0 GHz 1.0 to 2.0 GHz 18 14 dB dB 10/90% or 90/10% RF 50% VCTL to 90/10% RF 200 300 ns ns @ 48 MHz @ 900 MHz +35 +38 dBm dBm 30 24 18 0 2.7 5.0 V V V Note 1: Performance is guaranteed only under the conditions listed in this Table. Note 2: Return loss state. Lower frequency return loss is dependent on value of the DC blocking capacitors. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 201596B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2014 3 DATA SHEET • AS227-000/099 SP3T SWITCH Typical Performance Characteristics (VCTL = 0-3 V, TOP = +25 C, PIN = 0 dBm, Characteristic Impedance [ZO] = 50 Ω, CBL = 100 pF, Unless Otherwise Noted) 0 0 –10 –15 –0.6 Isolation (dB) Insertion Loss (dB) –0.4 RFC to J2 RFC to J3 –5 RFC to J1 RFC to J2 RFC to J3 –0.2 –0.8 –1.0 –1.2 –20 –25 –30 –1.4 –35 –1.6 –40 –1.8 –45 –50 –2.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.5 1.0 2.0 2.5 3.0 0 RFC to J1 RFC to J3 –5 –10 RFC to J1 RFC to J2 –10 –15 Isolation (dB) –15 –20 –25 –30 –35 –20 –25 –30 –35 –40 –40 –45 –45 –50 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Frequency (GHz) –50 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency (GHz) Figure 5. Isolation vs Frequency (RFC to J2 n Insertion Loss) Figure 6. Isolation vs Frequency (RFC to J3 in Insertion Loss) 0 RFC to J1 RFC to J2 RFC to J3 –5 –10 Return Loss (dB) 4.0 0 –5 –15 –20 –25 –30 –35 –40 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Frequency (GHz) Figure 7. Return Loss vs Frequency (Insertion Loss State) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 4 3.5 Figure 4. Isolation vs Frequency (RFC to J1 in Insertion Loss) Figure 3. Insertion Loss vs Frequency Isolation (dB) 1.5 Frequency (GHz) Frequency (GHz) February 10, 2014 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201596B 3.5 4.0 DATA SHEET • AS227-000/099 SP3T SWITCH Table 4. Truth Table Note: V1 (Pin 1) V2 (Pin 3) V3 (Pin 6) RFC to J1 Path RFC to J2 Path RFC to J3 Path VHIGH VLOW VLOW Insertion Loss Isolation Isolation VLOW VHIGH VLOW Isolation Insertion Loss Isolation VLOW VLOW VHIGH Isolation Isolation Insertion Loss VLOW = 0 to 0.2 V, VHIGH = 2.7 to 5 V. Any state other than described in this Table places the device in an undefined state. An undefined state does not damage the device. Evaluation Board Description Package and Handling Information The AS227-000/099 is evaluated in a plastic package format to determine its performance characteristics. An Evaluation Board schematic diagram is provided in Figure 8. An assembly drawing for the Evaluation Board is shown in Figure 9. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The AS227-000 chips are shipped in Gel-Paks. The AS227-099 wafers are shipped on film frames (see singulated wafer format dimensions in Figure 11). Chip Dimensions Chip dimensions are shown in Figure 10. The AS227-000/099 has no backside metal and must be attached using conductive epoxy. C1 RF Common Port DC Control Voltage DC Control Voltage C4 RF Input/Output C2 RF Input/Output C3 RF Input/Output DC Control Voltage Note: Use 47 pF blocking capacitors (C1, C2, C3, C4) for >500 MHz operation. Higher values recommended for lower frequency operation. Exposed paddle must be grounded. Use 10 nF blocking capacitors (C1, C2, C3, C4) for