CXG1016N

CXG1016N High-Frequency SPDT Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1016N is a high power antenna switch MMIC. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply Features • Single positive power supply operation • Low insertion loss 0.45 dB (Typ.) at 1.5 GHz • Isolation 20 dB (Typ.) at 1.5 GHz • High power switching P1 dB (Typ.) 33 dBm at 1.5 GHz VCTL (H)=3.0 V 37 dBm at 1.5 GHz VCTL (H)=4.0 V Applications Antenna switch for digital cellular telephones 8 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Control voltage Vctl 7 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition • Control voltage V °C °C 0/4 V Structure GaAs J-FET MMIC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96525-TE CXG1016N Electrical Characteristics VCTL (L)=0 V, VCTL (H)=4 V, PIN=32 dBm, REF=75 kΩ Item Insertion Loss Isolation Insertion Loss Isolation Insertion Loss Isolation VSWR Switching Time Symbol IL1 ISO1 IL1.5 ISO1.5 IL2 ISO2 VSWR TSW Test Condition f=1.0 GHz f=1.5 GHz Min. 20 17 14 Typ. 0.4 23 0.45 20 0.5 17 100 Max. 0.7 0.75 0.8 1.5 ns (Ta=25 °C) Unit dB dB dB dB dB dB f=2.0 GHz VCTL (L)=0 V, f=2 GHz Item 1 dB Compression Point 1 dB Compression Point Symbol P1 dB (3) P1 dB (4) Test Condition VCTL (H)=3 V VCTL (H)=4 V Min. 31 35 Typ. 33 37 Max. (Ta=25 °C) Unit dBm dBm VCTL (L)=0 V, RRF=75 kΩ Item Control Current Control Current Control Current Symbol ICTL (1) ICTL (2) ICTL (3) Test Condition VCTL (H)=3 V VCTL (H)=4 V VCTL (H)=5 V Min. Typ. 120 170 250 Max. 170 220 300 (Ta=25 °C) Unit µA µA µA Block Diagram Package Outline/Pin Configuration CTLB Port3 Port1 Port2 Port1 GND CTLA 1 2 3 4 8pin SSOP (PLASTIC) 8 Port3 7 GND 6 GND 5 Port2 VCTLA High Low VCTLB Low High Port1-Port2 ON Port1-Port3 OFF Port1-Port2 OFF Port1-Port3 ON —2— CXG1016N Recommended Circuit CTLB 100pF Port1 100pF Port3 1 8 75kΩ 2 100pF CXG1016N 7 3 CTLA 100pF 6 100pF Port2 4 5 75kΩ Example of Representative Characteristics (Ta=25 °C) Insertion Loss and Isolation vs. Input Power 0 Insertion Loss -2 -4 VCTL (H)=5V VCTL (H)=4V VCTL (H)=3V -10 0 Insertion Loss [dB] -6 VCTL (H)=3V VCTL (H)=4V VCTL (H)=5V Isolation -20 @1.5GHZ 24 28 32 36 Input Power [dBm] Insertion Loss and Isolation vs. Frequency 0 Insertion Loss -1 -10 0 40 44 -30 Insertion Loss [dB] -2 Isolation -3 -20 -30 -4 -40 -50 1 Frequency [GHz] 2 3 -50 —3— Isolation [dB] Isolation [dB] CXG1016N Package Outline Unit : mm 8PIN SSOP (PLASTIC) ∗3.0 ± 0.1 + 0.2 1.25 – 0.1 0.1 8 5 A ∗4.4 ± 0.1 1 4 0.65 + 0.08 0.24 – 0.07 B 0.25 0.13 M 0.1 ± 0.05 6.4 ± 0.2 (0.22) (0.15) + 0.025 0.17 – 0.015 + 0.08 0.24 – 0.07 0° to 10° DETAIL A DETAIL B NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-8P-L01 SSOP008-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER ALLOY 0.04g —4— (0.5) 0.6 ± 0.15