CXG1101TN

CXG1101TN SP3T Antenna Switch for TDMA800/1900/AMPS800 Triple Mode Application Description The SP3T is a high power antenna switch MMIC for use in TDMA800/1900/AMPS800 triple mode handsets. One Antenna can be routed to one of AMPS, PCS Tx and PCS Rx. This IC is designed using the Sony's JFET process for low insertion loss. Features • Low second harmonics < –31dBm at 29dBm @2.8V • Low insertion loss: 0.3dB (Ant. – AMPS) • Small package size: TSSOP-10pin (3.2mm × 2.8mm) Applications TDMA800/1900/AMPS800 triple mode handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings (Ta = 25°C) • Control voltage | VCTL | 5 VCTL (H) – VCTL (L) 5 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –60 to +150 10 pin TSSOP (Plastic) V V °C °C Notes on Handling GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Block Diagram ON Ant 6 CTL1 ON 3 CTL2 ON 1 CTL3 AMPS Tx (TDMA1900 (Tx)) 5 Rx (TDMA1900 (Rx)) Pin Configuration Ant GND CTL1 CTL2 6 7 8 9 5 4 3 2 1 Rx (TDMA1900 (Rx)) GND Tx (TDMA1900 (Tx)) GND AMPS CTL3 10 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E00443B25-PS CXG1101TN Recommended Circuit CRF (100pF) Ant 6 5 CRF (100pF) Rx (TDMA1900 (Rx)) 7 RCTL (1kΩ) CTL1 Cbypass (100pF) RCTL (1kΩ) CTL2 Cbypass (100pF) RCTL (1kΩ) CTL3 Cbypass (100pF) 10 9 8 4 CRF (100pF) 3 Tx (TDMA1900 (Tx)) 2 CRF (100pF) 1 AMPS When using this IC, the following external parts should be used: RCTL: This resistor is used to improve ESD performance. 1kΩ is recommended. CRF: This capacitor is used for RF de-coupling and must be used for all applications. 100pF is recommended. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. –2– CXG1101TN Truth Table On Pass Ant – Rx (TDMA1900 (Rx)) Ant – Tx (TDMA1900 (Tx)) Ant – AMPS CTL1 H L L CTL2 L H L CTL3 L L H Electrical Characteristics VCTL = 0/2.8V control. All measurements are made in a 50Ω system, and unused ports are terminated with 50Ω. Item Symbol Port Ant – Tx Insertion loss IL Ant – Rx Ant – AMPS Ant – Tx Isolation ISO. Ant – Rx Ant – AMPS VSWR Harmonics VSWR 2fo 3fo Ant – Tx Ant – AMPS Ant – Tx Ant – AMPS ∗1, ∗3 Condition ∗1 ∗2 ∗3 Min. — — — 14 14 18 — — — VCTL = 2.8V 32 — ∗4 — Typ. 0.60 0.65 0.30 16 16 21 1.2 –45 –40 35 100 5 (Ta = 25°C) Max. 0.85 0.90 0.55 — — — 1.5 –31 –31 — 500 20 Unit dB dB dB dB dB dB — dBm dBm dBm ns µA 1dB compression input power P1dB Switching speed Control current ∗1 ∗2 ∗3 ∗4 Pin = 29dBm, 1900MHz Pin = 10dBm, 1900MHz Pin = 29dBm, 800MHz No signal input TSW ICTL –3– CXG1101TN Package Outline Unit: mm 10PIN TSSOP(PLASTIC) 1.2MAX ∗2.8 ± 0.1 10 6 0.1 ∗2.2 ± 0.1 + 0.15 0.1 – 0.05 3.2 ± 0.2 1 5 0.5 0.25 0° to 10° 0.22 0.1 M (0.2) + 0.08 0.22 – 0.07 DETAIL A NOTE: “∗” Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g SCT Ass'y ∗2.8 ± 0.1 10 6 10PIN TSSOP(PLASTIC) 1.2MAX 0.1 ∗2.2 ± 0.1 3.2 ± 0.2 (0.1) + 0.025 0.12 – 0.015 + 0.15 0.1 – 0.05 0.25 0° to 10° DETAIL A EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g A 1 5 0.5 0.22 0.1 M (0.2) + 0.08 0.22 – 0.07 NOTE: “∗” Dimensions do not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18µm –4– (0.1) + 0.025 0.12 – 0.015 A 0.45 ± 0.15 0.45 ± 0.15 Sony Corporation