SS8047GT63TR

SS8047 2.5V 1A Positive Voltage Regulator Features Output current in excess of 1A Output voltage accuracy + 3%/-1% Quiescent current, typically 600µA Internal short-circuit current-limit Internal over-temperature protection General Description The SS8047 positive 2.5V voltage regulator features the ability to source 1A of output current. The typical quiescent current is 0.6mA. Familiar regulator features such as over-temperature and over-current protection circuits are provided to prevent it from being damaged by abnormal operating conditions. Applications n n n n n PC motherboard ADSL/Cable Modem Set -Top Box LAN switch/Hub Router Ordering Information SS8047GTXXXX The SS8047 is only available with Pb-free lead finish. Packing Type Pin Option Package Type PACKAGE TYPE GT3 : TO 220 Pb-free GT4 : TO 252 Pb-free GT5 : TO 263 Pb-free GT6 : SOT 223 Pb-free PIN OPTION 1 1 : V OUT 2 : V OUT 3 : GND 4 : GND 5 : V IN 6 : V IN 2 GND V IN V OUT V IN GND V OUT 3 V IN GND V IN V OUT V OUT GND PACKING TR : Tape & Reel TB : Tubes Typical Application [Note 4] : Type of COUT IO VIN C1 1µF Pin Configuration SS8047 IQ VOUT C OUT 10µF Top View Top View Top View 1 2 3 1 2 3 1 2 3 TO-220 TO-252 and TO-263 SOT-223 Rev.2.02 7/06/2004 www.SiliconStandard.com 1 of 11 SS8047 Absolute Maximum Ratings (Note 1) Input Voltage…………………………………....................................................................…..…..…7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature…..……………............................................................…….…..150°C Storage Temperature Range….……......................................................................................…..-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering TO 220 Package………………………….........................................................................…………260°C, 10s TO 252, TO 263, SOT 223 Pac k age…………......................................................................…...260°C, 4s Continuous Power Dissipation (TA = + 25°C) SOT 223(1) ………………………................................................................…….….……….………..0.8W TO 252(1) ………..……………................................................................……….……….….………..1.0W TO 263(1) ………..……………….………................................................................…….….………..1.6W Note (1): See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage…………………………….....................................................................…………….3.3V~6V Temperature Range………………...............................................................................…………0°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 1A, CIN = 1µF, COUT =10 µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER Output Voltage Line Regulation Load Regulation Output Impedance Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature CONDITIONS V IN = 5V, 10mA < IO < 1A V IN = 3.3V, 10mA < IO < 500mA 3.3V < V IN < 6V, IO = 10mA V IN = 5V, 10mA < IO < 1A V IN = 3.3V, 10mA < IO < 500mA 200mA DC and 100mA AC, fo = 120Hz V IN = 5V f i = 120Hz,V ripple =2V P-P , Io = 100mA IO = 1A IO = 500mA IO = 100mA MIN 2.475 TYP 2.50 3 35 25 80 0.6 46 1.15 420 200 1.6 150 MAX 2.575 30 50 UNITS V mV mV mV mΩ mA dB V mV mV A °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note 2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient t emperature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the SS8047 in SOT 223 package, θJA is 156°C/W; in TO 263 package, θJA is 75°C/W, and in the TO 252 package, θJA is 125°C/W (See recommend minimum footprint). The safe operation in SOT 223,TO 252 & TO 263 package, it can see “Typical Performance Characteristics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum. Rev.2.02 7/06/2004 www.SiliconStandard.com 2 of 11 SS8047 Definitions Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value. Dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Rev.2.02 7/6/2004 www.SiliconStandard.com 3 of 11 SS8047 Typical Performance Characteristics (V IN= +5V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Vin (offset=5.0V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA Ch1: Iout (1A/div) Ch2: Vout (offset=2.50V) Output Voltage vs. Load Current 2.600 1200 1100 Dropout Voltage vs. Load Current Dropout Voltage (mV) 0 100 200 300 400 500 600 700 800 900 1000 2.580 1000 900 800 700 600 500 400 300 200 100 Ootput Voltage (V) 2.560 2.540 2.520 2.500 2.480 0 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Load Current (mA) Ground Current vs. Load Current 2.00 1.80 Ground Current (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 700 800 900 1000 Load Current (mA) Rev.2.02 7/6/2004 www.SiliconStandard.com 4 of 11 SS8047 Typical Performance Characteristics (V IN= +3.3V, CIN=1µF, COUT=10µF, TA=25°C, unless otherwise noted.) Line Transient Load Transient Ch1: Vin (offset=3.3V) Ch2: Vout (offset=2.50V) CIN = 1uF Iout=100mA Ch1: Iout (400mA/div) Ch2: Vout is AC coupled Output Voltage vs. Load Current 2.550 2.545 500 450 Dropout Voltage vs. Load Current Ootput Voltage (V) 2.540 2.535 2.530 2.525 2.520 2.515 2.510 2.505 2.500 0 50 100 150 200 250 300 350 400 450 500 550 600 Dropout Voltage (mV) 400 350 300 250 200 150 100 50 0 0 50 100 150 200 250 300 350 400 450 500 550 600 Load Current (mA) Load Current (mA) Ground Current vs. Load Current 2.00 1.80 Ground Current (mA) 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 0 100 200 300 400 500 600 Load Current (mA) Rev.2.02 7/06/2004 www.SiliconStandard.com 5 of 11 SS8047 Safe Operating Area of SOT-223 1200 T A=25°C,Still Air Power Dissipation of SOT-223 1.0 0.9 0.8 1000 Output Current (mA) 800 600 400 200 0 1.2 Maximum Recommended Output Current TA=25¢ J TA=55¢ J TA=85¢ J Power Dissipation (W) 1oz Copper on SOT-223 Package Mounted on recommended mimimum footprint (R£ c A=156°C/W) J 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Still Air 1oz Copper on SOT-223 Package Mounted on recommend mimimum footprint (R£ c A=156°C/W) J 1.6 2.0 2.4 2.8 3.2 3.6 4.0 25 35 45 55 65 75 85 95 105 115 125 Input-Output Voltage Differential VIN-V OUT ( V) Note: VI N(max)