SS8219G

SS8219G Ultra320 Multi-mode LVD/SE SCSI Terminator PRODUCT SUMMARY SPI mode auto-detection/switching. Pin/pin compatible with popular industry standard parts DS2118/9 and UCC5672 DESCRIPTION The S S8 219 G m ulti-mode LVD/SE SCSI terminator provides a smooth transition between modes of the SCSI Parallel Interface. It automatically senses the bus via DIFFSENS and switches the termination to either single-ended (SE) or low voltage differential (LVD) SCSI, based on which type of devices are connected to the bus. If the SS8219G detects an HVD SCSI device, it switches to a high impedance state. A 16-bit wide SCSI bus requires three SS8219G for termination. Th is m ulti-mode terminator contains all t he functions to terminate, auto detect and switch modes for SCSI Parallel Interface (SPI) bus architectures. For SE termination, one regulator and nine precision 110Ω resistors are used. For LVD termination, the SS8219G integrates 18 regulated supplies with nine precision resistor strings. FEATURES Auto-selectable single-ended or LVD termination Meets SCSI-1, SCSI-2, SCSI-3 SPI Ultra (Fast-20), Ultra 2 (SPI-2 LVD), Ultra160 (SPI-3 LVD) and Ultra320 (SPI-4 LVD) standards Supports active negation Channel capacitance of 3pF Operation from 2.9V to 5.5V Thermal protection Hot-swap compatible Tolerance of 5% on termination resistance Available in 28 pin TSSOP or 36 pin SSOP Pb-free, RoHS compliant. APPLICATIONS High performance data storage systems in servers, workstations, high-end and industrial PCs, and RAID disk arrays. PIN CONFIGURATION VREF NC NC R1+ VREF R1+ R1R2+ R2NC/ HS GND R3+ R3R4+ R4R5+ R5DISCNCT GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 TPWR TPWR R9R9+ R8R8+ NC/ HS GND R7R7+ R6R6+ DIFFB DIFFSENSE M/S R1R2+ R2HS/GND HS/GND HS/GND R3+ R3R4+ R4R5+ R5DISCNCT GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 TPWR HVD LVD SE R9R9+ R8R8+ HS/GND HS/GND HS/GND R7R7+ R6R6+ DIFFB DIFFSENSE M/S 28 pin TSSOP 36 pin SSOP 12/06/2005 Rev.3.01 www.SiliconStandard.com 1 of 10 SS8219G ORDERING INFORMATION SS8219GX XX TR = tape and reel; TB = tubes GD = RoHS-compliant TSSOP-28 GS = RoHS-compliant SSOP-36 For example: SS8219GD TR => SS8219 in RoHS-compliant TSSOP-28 supplied on tape and reel APPLICATION INFORMATION Please note for the following sections : DIFFSENS - refers to the SCSI bus signal. DIFFSENSE - refers to the SS8219G pin name and internal circuitry related to differential sensing. DIFFB - refers to the SS8219G pin name and internal circuitry related to monitoring the DIFFSENS line. The SS8219G is used in multi-mode active-termination applications where single ended (SE) and low voltage differential (LVD) devices might coexist. The LVD termination section consists of 18 source/sink amplifiers (VTOP, VBOT), biasing circuitry and nine precision resistor strings (RTOP, RMID, RBOT). The SE termi nation section consists of a 2.85V source/sink regulator with nine precision 110Ω resistors. The DIFFSENSE section consists of a 1.3V, 5mA driver and a sensing circuit (Fig.1). DIFFSENS is used to identify which types of SCSI devices are present on the bus. If the voltage on DIFFSENS is between 0V and 0.5V the bus is singleended; if it is between 0.7V and 1.9V, the bus is LVD; and if it is greater than 2.4V, the bus is HVD. The SS8219G DIFFB pin monitors the DIFFSENS line to determine the proper operating mode of the device. and reflections which can degrade the bus signals. The DIFFSENSE pin can drive the SCSI DIFFSENS line (when M/S is pulled high) to determine the SCSI bus operating mode. The S S8 219 G s witches to the appropriate termination mode for the bus based on the value of the DIFFSENS voltage. These modes are: LVD mode: LVD termination is provided by a precision r esistor string with two amplifiers. This configuration yields a 105Ω differential and 150Ω common mode impedance. A fail safe bias of 112mV is maintained when no drivers are connected to the SCSI bus. SE mode: When the external driver for a given signal line turns o ff, the active terminator will pull that signal l ine to 2 .85 volts (quiescent state). When used with an active-negation driver, the power amp can sink 22mA per line while keeping the voltage reference in regulation. The terminating resistors maintain their 110 Ω value. To maintain the specified regulation, a 4.7µF capacitor is required between the VREF pin and ground of each SS8219G. A high frequency capacitor (0.1µF ceramic recommended) can also be placed on the VREF pin in applications that use fast rise/fall time drivers. A typical SCSI bus configuration is shown in Figure 2. An internal pull-down resistor assures that the SS8219G will still terminate the bus if the DISCNCT pin is left floating. DIFFSENS noise filtering The SS8219G incorporates an internal digital filter to remove the noise signal on the DIFFSENS control line, thereby eliminating erroneous switching between modes. An external filter may also be used in addition to this internal digital filter. HVD Isolation Mode: The SS8219G identifies that there is an HVD (high voltage differential) device on the SCSI bus and isolates the termination pins from the bus. When DISCNCT is pulled high, o r during thermal shutdown, the termination pins are isolated from the SCSI bus and VREF is grounded. The DIFFSENSE driver is shut down during either of these two events. To ensure proper operation, the TPWR pin should be connected to the SCSI bus TERMPWR line. As with all analog circuitry, the TERMPWR lines should be bypassed locally. A 2.2µF capacitor and a 0.01µF high frequency capacitor are recommended between TPWR and ground and placed as close as possible to the SS8219G. The IC should be placed as close as possible to the SCSI connector to minimize both signal and power trace length, thereby reducing the input capacitance 12/06/2005 Rev.3.01 www.SiliconStandard.com 2 of 10 SS8219G BLOCK DIAGRAM (Figure 1) ( 36pin SSO P only ) M/S DIFFS ENS E SE LV D HV D DISC NCT THER MA L SHU TDOW N CIRC UITRY DIFFS ENS E CIRC UITRY V REF V REF 110 Ω CO NTROL LOG IC DIFFB D IFFB R1- R9110 Ω REFER ENC E GENERA TIO N + _ V TOP1 X9 RTO P1 R1- RTO P9 R1- R9R9RMID1 R1+ R1+ R9+ R9+ RBO T1 RBO T9 + _ V BOT1 X9 SE GN D DR IV ER RMID9 12/06/2005 Rev.3.01 www.SiliconStandard.com 3 of 10 SS8219G SCSI BUS CONFIGURATION (Figure 2) TERMPWR 2.2µF TPWR TPWR M/S DISCNCT CONTROL LINES (9) TPWR M/S DISCNCT TERMPWR 2.2µF SS8219G SS8219G DIFFSENSE VREF DIFFB 20K 4.7µF 0.1µF DIFFSENS DIFFSENSE DIFFB VREF 20K 0.1µF 4.7µF 2.2µF TPWR M/S DISCNCT DATA LINES (9) TPWR M/S DISCNCT 2.2µF SS8219G SS8219G VREF DIFFB DIFFB VREF 4.7µF 2.2µF TPWR M/S DISCNCT DATA LINES (9) 4.7µF TPWR M/S DISCNCT 2.2µF SS8219G SS8219G VREF DIFFB DIFFB VREF 4.7µF 4.7µF 12/06/2005 Rev.3.01 www.SiliconStandard.com 4 of 10 SS8219G RECOMMENDED OPERATING CONDITIONS PARAMETER Termpower Voltage Logic 0 Logic 1 Operating Temperature SYMBOL Vtpwr(SE) Vtpwr(LVD) Vil Vih Tamb MIN 4.0 2.9 -0.3 2.0 0 TYP 5 5 MAX 5.5 5.5 +0.8 Vtpwr+0.3 70 UNITS V V V °C ELECTRICAL CHARACTERISTICS (from TA = 0°C to 70°C, unless otherwise spedified) PARAMETER LVD Terminator Section Differential Mode Termination Resistance Common Mode Termination Resistance Differential Mode Bias Common Mode Bias Single Ended Terminator Section Output Capacitance SE Termination Resistance SE Voltage Reference SE output Current Regulator Section Line Regulation Load Regulation Current Limit Sink Current DC Section Termpower Current Input Leakage High Input Leakage Low Output Current High Output Current Low DIFFSENS Section DIFFSENS SE Operating Range DIFFSENS LVD Operating Range DIFFSENS HVD Operating Range DIFFSENSE Driver Output Voltage DIFFSENSE Driver Source Current DIFFSENSE Driver Sink Current Itpmr Iih Iil Ioh Iol Vseor Vlvdor Vhvdor Vdso Idsh Idsl M/S=1; Ids = 0-5mA M/S = 1; Vdso=0V M/S=1; Vdso=2.75V SE mode (No Load) LVD mode (No Load) -1.0 1.0 Vout = 2.4 volts; SE/LVD/HVD Pins only Vout=0.4 volts; SE/LVD/HVD Pins only -1.0 4.0 -0.3 0.7 2.4 1.2 5 20 0.5 1.9 Vtpwr+0.3 1.4 15 200 4 20 mA µA µA mA mA V V V V mA µA SYMBOL Rdm Rcm Vdm Vcm Cout Rse Vref Iose LIREG LOREG ILIM ISINK CONDITION MIN 100 TYP 105 150 112 1.25 MAX 110 190 125 1.375 3 115.5 2.93 25.4 2.5 3.5 UNITS Ω Ω mV V pF Ω Volts mA % % mA mA All lines Open 110 100 1.125 Note Vline = 0-3.0 volts Vline = 0.2 volts 104.5 2.79 110 2.85 1.0 1.3 350 200 Note: guaranteed by Design. 12/10/2005 Rev.3.01 www.SiliconStandard.com 5 of 10 SS8219G Common Mode Bias Vcm vs. Vtpwr 1.375 1.325 Vcm(V) 1.275 1.225 T=-10ºC 1.175 1.125 2.5 3.5 4.5 Vtpwr 5.5 1.175 1.125 -20 0 20 40 60 80 Temperature(ºC) 100 T=80ºC 1.375 1.325 Vcm(V) 1.275 1.225 Vtpwr=2.8V Vtpwr=5.8V Common Mode Bias Vcm vs. Temperature Differential Mode Bias Vdm vs. Vtpwr 0.125 0.12 Vdm(V) 0.115 0.11 0.105 0.1 2.5 3.5 4.5 Vtpwr 5.5 T=80ºC T=-10ºC Vdm(V) 0.125 0.12 0.115 0.11 0.105 0.1 -20 Differential Mode Bias Vdm vs. Temperature@Vtpwr=5V 0 20 40 60 80 Temperature(ºC) 100 Common Mode Termination Resistance Rcm vs. Vtpwr at Temperature=24ºC 190 180 170 Rcm(Ohm) Rcm(Ohm) 160 150 140 130 120 110 2.5 3.5 4.5 Vtpwr 5.5 Common Mode Termination Resistance Rcm vs. Temperature at Vtpwr=5V 190 180 170 160 150 140 130 120 110 -20 0 20 40 60 80 Temperature(ºC) 100 Differential Mode Termination Resistance Rdm vs. Vtpwr 110 109 108 107 106 105 104 103 102 101 100 2.5 110 T=80ºC 108 Rdm(Ohm) 106 104 Differential Mode Termination Resistance Rdm vs. Temperature Vtpwr=2.8V Rdm(Ohm) T=-10ºC Vtpwr=5.8V 102 100 3.5 4.5 Vtpwr 5.5 -20 0 20 40 60 80 Temperature(ºC) 100 12/10/2005 Rev.3.01 www.SiliconStandard.com 6 of 10 SS8219G SE Termination Resistance Rse vs. Vtpwr at T=24ºC; Vline=0V 115 113 Rse(Ohm) 111 109 107 105 3.5 4.5 Vtpwr 5.5 Rse(Ohm) SE Termination Resistance Rse vs. Vtpwr at Vline=0V 115 114 113 112 111 110 109 108 107 106 105 -20 0 Vtpwr=3.8V Vtpwr=5.8V 20 40 60 80 100 Temperature(ºC) SE Termination Resistance Rse vs. Vtpwr at Vtpwr=5V; T=24ºC 115 113 2.89 Rse(Ohm) Vref 111 109 107 105 0 1 Vline 2 3 2.87 2.85 2.83 2.81 2.93 2.91 Vref vs. Ivref at Vtpwr=5V T=80ºC T=-10ºC 2.79 -250 -150 -50 50 150 250 350 Ivref(mA) Vref vs. Temperature at Ivref=0mA 2.93 2.91 2.89 Vtpwr=5.8V Vref vs. Vtpwr at T=24ºC 2.93 2.91 2.89 Vref 2.87 2.85 2.83 2.81 2.79 3.5 Ivref=360mA Ivref=0mA Ivref=-200mA Vref 2.87 2.85 2.83 2.81 2.79 -20 0 20 40 60 80 100 Temperature(ºC) Vtpwr=3.8V 4.5 Vtpwr 5.5 12/10/2005 Rev.3.01 www.SiliconStandard.com 7 of 10 SS8219G PIN DESCRIPTION (for 28pin TSSOP) PIN 1 SYMBOL VREF DESCRIPTION Reference Voltage. 2.85-volt reference in SE mode and 1.25V in LVD mode; must be connected to a 4.7µF capacitor. Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. 2-5,7-12, 18-21, 23-26 6,22 13 14 15 16 17 27,28 Rx+, Rx- NC/ HS GND No Connect/Heat Sink Ground. Should be grounded for heat sinking purpose DISCNCT Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. GND Ground. Terminator ground pin. Connected to ground. Master/slave. Used to select which terminator is the controlling device. M/S pin high enables M/S the DIFFSENSE driver. DIFFSENSE Output to drive the SCSI bus DIFFSENS line. An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB DIFFB pin should be connected by a 0.1µF capacitor to GND and by a 20kΩ resistor to the SCSI bus DIFFSENS line. TPWR Terminator Power. Connect to the SCSI TERMPWR line and de-couple with a 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed. PIN DESCRIPTION (for 36pin SSOP) PIN 1 2,3 4-7,11-16, 22-25, 29-32 8, 9,10,26, 27,28 17 18 19 20 21 33 34 35 36 SYMBOL VREF* NC Rx+ RxHS/GND DISCNCT GND DESCRIPTION Reference Voltage. 2.85-volt reference; must be connected to a 4.7µF capacitor. No Connect. Do not connect these pins. Signal Termination. (X=1,2,3,…..9) Rx+: Ground line for single-ended or positive line for differential applications for the SCSI bus. Rx-: Signal line/active line for single-ended or negative line in differential applications for the SCSI bus. Heat Sink Ground. Connect to large area PC board traces to increase power dissipation capability. Disconnect. When pulled high, the SS8219G isolates its bus pins (Rx+, Rx-) from the SCSI bus. Ground. Terminator ground pin. Connected to ground. Master/slave. Used to select which terminator is the controlling device. M/S pin high enables M/S the DIFFSENSE driver. DIFFSENSE Output to drive the SCSI bus DIFFSENS line. An input pin to detect the type of device (differential or single-ended) on the SCSI bus. The DIFFB DIFFB pin should be connected by a 0.1µF capacitor to GND and 20kΩ resistor to the SCSI bus DIFFSENS line. SE LVD HVD TPWR Single ended mode indicator. It is HIGH when terminator is operating in SE mode. Low Voltage Differential mode indicator. It is HIGH when terminator is operating in LVD mode. High Voltage Differential mode indicator. It is HIGH when terminator is operating in HVD mode Terminator Power. Connect to SCSI bus TERMPWR line and decouple with 2.2µF capacitor. *The VREF keeps the level at 2.85 volts, whether the DISCNCT pin is asserted or not; even if the termination mode is changed. 12/10/2005 Rev.3.01 www.SiliconStandard.com 8 of 10 SS8219G PHYSICAL DIMENSIONS (36pin SSOP - order package option S) C L E1 E h x 45° Θ D A 0.004 C SEATING PLANE e b A1 SYMBOL A A1 b c D e E E1 h L Θ MIN. 2.413 0.203 0.300 0.127 15.748 10.033 7.391 0.381 0.508 0º DIMENSION IN MM TYP. 2.591 0.305 MAX. 2.794 0.406 0.450 0.254 16.002 10.668 MIN. 0.095 0.008 0.012 0.005 0.620 0.395 0.291 0.015 0.020 0º DIMENSION IN INCH TYP. 0.102 0.012 MAX. 0.110 0.016 0.018 0.010 0.630 0.420 15.875 0.800 BASIC 7.493 0.625 0.032 BASIC 0.295 7.595 0.635 1.016 8º 0.289 0.025 0.040 8º Taping Specification Feed Direction Typical SSOP, TSSOP Package Orientation Rev.2.02 12/06/2003 www.SiliconStandard.com 9 of 10 SS8219G PHYSICAL DIMENSIONS (28pin TSSOP - order package option D) D 28 C L E1 E 1 Θ A2 A1 e b A Note: 1. Package body dimensions exclude mold flash protrusions or gate burrs 2. Tolerance ±0.1mm unless otherwise specified 3. Coplanarity : 0.1mm 4. Controlling dimensions are in millimeters. Converted inch dimensions are not necessarily accurate. 5. Follows JEDEC MO-153 SYMBOL A A1 A2 b C D E E1 e L y Θ MIN. ----0.05 0.80 0.19 0.09 9.60 ----4.30 ----0.45 ----0º DIMENSION IN MM NOM. --------1.00 --------9.70 6.40 4.40 0.65 0.60 --------- MAX. 1.20 0.15 1.05 0.30 0.20 9.80 ----4.50 ----0.75 0.10 8º MIN. ----0.002 0.031 0.007 0.004 0.378 ----0.169 ----0.018 ----0º DIMENSION IN INCH NOM. --------0.039 --------0.382 0.252 0.173 0.026 0.024 --------- MAX. 0.048 0.006 0.041 0.012 0.008 0.386 ----0.177 ----0.030 0.004 8º In formation furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties. 12/10/2005 Rev.3.01 www.SiliconStandard.com 10 of 10