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SGB30UFSMSTXV

SGB30UFSMSTXV

  • 厂商:

    SSDI

  • 封装:

  • 描述:

    SGB30UFSMSTXV - 60 mAMP 1000-3500 VOLTS 60 nsec HIGH VOLTAGE RECTIFIER - Solid States Devices, Inc

  • 数据手册
  • 价格&库存
SGB30UFSMSTXV 数据手册
Solid State Devices, Inc. 14701 Firestone Blvd * La Mirada, Ca 90638 Phone: (562) 404-4474 * Fax: (562) 404-1773 ssdi@ssdi-power.com * www.ssdi-power.com SGB10UFSMS thru SGB35UFSMS 60 mAMP 1000-3500 VOLTS 60 nsec HIGH VOLTAGE RECTIFIER FEATURES: Ultra Fast Recovery: 60 nsec Maximum PIV to 3500 Volts Hermetically Sealed Void-Free Construction Metallurgically Bonded 175°C Maximum Operating Temperature Micro Miniature Package TX, TXV, and Space Level Screening Available2/ Designer’s Data Sheet Part Number / Ordering Information 1/ SGB _ _ UF SMS __ 2/ L Screening = None ⏐ ⏐⏐ TX = TX Level ⏐ ⏐⏐ TXV = TXV Level ⏐ ⏐⏐ S = S Level ⏐ ⏐⏐ L Package ⏐⏐ SMS = Surface Mount Square Tab ⏐L Recovery Time ⏐ UF = Ultra Fast ⏐ Voltage L 10 = 1000 V 15 = 1500 V 20 = 2000 V 25 = 2500 V 30 = 3000 V 35 = 3500 V • • • • • • • • ELECTRICAL CHARACTERISTICS Part Number Symbol Units Conditions Volts 25°C Peak Inverse Voltage PIV Average Rectified Current I0 mA 100°C 25°C Maximum Reverse Current IR@PIV μA 100°C Maximum Forward Voltage VF4/ Volts 25°C Maximum Surge Current (1 Cycle) IFSM Amps 25°C Maximum Reverse Recovery Time tRR7/ nsec 25°C Maximum Junction Capacitance CJ pF VR = 100V fT = 1MHZ °C/W Typical Thermal Impedance θJE SGB10UFSMS SGB15UFSMS SGB20UFSMS SGB25UFSMS SGB30UFSMS SGB35UFSMS 1000 1500 2000 2500 3000 3500 60 60 60 60 60 60 50 50 50 50 50 50 0.1 0.1 0.1 0.1 0.1 0.1 10 10 10 10 10 10 9.5 9.5 9.5 9.5 9.5 9.5 5 5 5 5 5 5 60 60 60 60 60 60 1.0 1.0 1.0 1.0 1.0 1.0 165 165 165 165 165 165 1/ For Ordering Information, Price, and Availability – Contact Factory. 2/ Screening based on MIL-PRF-19500. Screening flows available on request. 3/ Operating and testing over 10,000 V/inch may require encapsulation or immersion in a suitable dielectric material. 4/ IF = IO; Max. forward voltage measured with instantaneous forward pulse of 300µsec minimum. 5/ Max. lead temperature for soldering is 250°C, 3/8” from case for 5 sec maximum. 6/ Operating and storage temperature: -65°C to +175°C. 7/ Reverse Recovery Test Conditions: IF=50mA, IR=100mA, IRR=25mA, TA=25°C. 8/ Consult manufacturing for operating curves. Surface Mount Square Tab NOTE: All specifications are subject to change without notification. SCD's for these devices should be reviewed by SSDI prior to release. DATA SHEET #: RV0005E DOC Solid State Devices, Inc. 14701 Firestone Blvd * La Mirada, Ca 90638 Phone: (562) 404-4474 * Fax: (562) 404-1773 ssdi@ssdi-power.com * www.ssdi-power.com SGB10UFSMS thru SGB35UFSMS PACKAGE OUTLINE: Surface Mount Square Tab B A DIM A B C DIMENSIONS MIN 0.090” 0.150” 0.022” 0.002” MAX 0.100” 0.210” 0.028” –– A D C D Dimensions are prior to soldering. NOTE: All specifications are subject to change without notification. SCD's for these devices should be reviewed by SSDI prior to release. DATA SHEET #: RV0005E DOC
SGB30UFSMSTXV 价格&库存

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