BTB08-800B

BTA08, BTB08 T810, T835 Snubberless™, logic level and standard 8 A Triacs Features ■ ■ ■ A2 On-state rms current, IT(RMS) 8 A Repetitive peak off-state voltage, VDRM/VRRM 600 to 800 V Triggering gate current, IGT (Q1) 5 to 50 mA A1 A2 G A2 G A1 A2 Description Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. Logic level versions are designed to interface directly with low power drivers such as microcontrollers. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500 VRMS) complying with UL standards (file ref.: E81734). D2PAK (T8-G) A2 A1 A2 G IPAK (T8-H) A1 A2 G DPAK (T8-B) A2 A1 A2 G A1 A2 G TO-220AB Insulated (BTA08) TO-220AB (BTB08) March 2010 Doc ID 7472 Rev 7 1/12 www.st.com 12 Characteristics BTA08, BTB08 and T8 Series 1 Table 1. Symbol Characteristics Absolute maximum ratings Parameter IPAK/D2PAK/DPAK/ Tc = 110 °C TO-220AB TO-220AB Ins. ITSM I²t dI/dt IGM Non repetitive surge peak on-state current (full cycle, Tj initial = 25 °C) I²t value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range F = 50 Hz F = 60 Hz tp = 10 ms F = 120 Hz tp = 20 µs Tj = 125 °C Tj = 125 °C Tj = 125 °C Tc = 100 °C t = 20 ms t = 16.7 ms 80 A 84 36 50 4 1 - 40 to + 150 - 40 to + 125 A ²s A/µs A W °C Value Unit IT(RMS) On-state rms current (full sine wave) 8 A PG(AV) Tstg Tj Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3 quadrants) T8 BTA08 / BTB08 Unit T810 T835 TW 5 1.3 0.2 15 25 MAX. II MIN. 30 40 5.4 MIN. 2.8 60 400 4.5 15 20 3.5 1.5 30 40 5.4 2.98 60 400 4.5 80 1000 7 A/ms V/µs 35 50 10 10 15 25 35 50 50 70 mA SW 10 CW 35 BW 50 mA V V mA MAX. MAX. MIN. MAX. I - III 10 35 Test conditions Quadrant I - II - III I - II - III I - II - III Symbol IGT (1) VGT VGD IH (2) IL dV/dt (2) VD = 12 V RL = 30 Ω VD = VDRM RL = 3.3 kΩ Tj = 125 °C IT = 100 mA IG = 1.2 IGT VD = 67 %VDRM gate open Tj = 125 °C (dV/dt)c = 0.1 V/µs Tj = 125 °C Tj = 125 °C Tj = 125 °C (dI/dt)c (2) (dV/dt)c = 10 V/µs Without snubber 2/12 Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series Table 3. Symbol Characteristics Standard (4 quadrants) BTA08 / BTB08 Test conditions Quadrant C B 50 100 1.3 0.2 25 40 MAX. II Tj = 125 °C Tj = 125 °C MIN. MIN. 80 200 5 100 400 10 V/µs V/µs 50 50 mA mA V V mA I - II - III IV ALL VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C IT = 500 mA I - III - IV IG = 1.2 IGT ALL 25 50 Unit IGT (1) VGT VGD IH (2) IL VD = 12 V, RL = 33 Ω MAX. MAX. MIN. MAX. dV/dt (2) VD = 67 %VDRM gate open (dV/dt)c (2) (dI/dt)c = 5.3 A/ms Table 4. Symbol VTM (1) Vt0 Rd (2) (2) Static characteristics Test conditions ITM = 11 A, tp = 380 µs Threshold voltage Dynamic resistance VDRM = VRRM Tj = 25 °C Tj = 125 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C MAX. MAX. MAX. MAX. 1 mA Value 1.55 0.85 50 5 Unit V V mΩ µA IDRM IRRM 1. minimum IGT is guaranted at 5% of IGT max. 2. for both polarities of A2 referenced to A1. Table 5. Symbol Rth(j-c) Thermal resistance Parameter IPAK / D2PAK / DPAK / TO-220AB Junction to case (AC) TO-220AB Insulated S = 1 cm² S = 0.5 cm² D2PAK DPAK TO-220AB / TO-220AB Insulated IPAK 2.5 45 70 °C/W 60 100 Value 1.6 °C/W Unit Rth(j-a) Junction to ambient S = Copper surface under tab. Doc ID 7472 Rev 7 3/12 Characteristics BTA08, BTB08 and T8 Series Figure 1. P(W) 10 9 8 7 6 5 4 3 2 1 0 0 1 Maximum power dissipation versus Figure 2. rms on-state current (full cycle) IT(RMS)(A) 10 9 8 7 6 5 4 3 2 On-state rms current versus case temperature (full cycle) BTB / T8 BTA IT(RMS)(A) 2 3 4 5 6 7 8 1 0 0 25 50 TC(°C) 75 100 125 Figure 3. On-state rms current versus ambient temperature (full cycle) Figure 4. Relative variation of thermal impedance versus pulse duration IT(RMS)(A) 3.5 1E+0 K=[Zth/Rth] printed circuit board FR4, copper thickness: 35 µm D2PAK (S=1CM2) Zth(j-c) DPAK/IPAK Zth(j-a) 3.0 2.5 1E-1 2.0 1.5 1.0 0.5 DPAK (S=0.5CM2) TO-220AB/D2PAK Zth(j-a) 1E-2 TC(°C) 0.0 0 25 50 75 100 125 tp(s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5. ITM(A) 100 Tj max. Vto = 0.85V Rd = 50 mΩ On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles ITSM(A) 90 Tj = Tj max. 80 70 60 Non repetitive Tj initial=25°C Repetitive TC=110°C t=20ms One cycle 10 50 Tj = 25°C. 40 30 20 VTM(V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 10 0 1 10 Number of cycles 100 1000 4/12 Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series Characteristics Figure 7. Non-repetitive surge peak on-state current for a sinusoidal 2 2 Figure 8. Relative variation of gate trigger current ITSM(A), I t (A s) 1000 Tj initial=25°C IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2.5 holding current and latching current versus junction temperature (typical values) 2.0 dI/dt limitation: 50A/µs IGT ITSM 1.5 1.0 IH & IL 100 360° α pulse with width tp < 10 ms and corresponding value of I2t I2t 0.5 10 0.01 0.10 1.00 tp(ms) 10.00 Tj(°C) 0.0 -40 -20 0 20 40 60 80 100 120 140 Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) Figure 10. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 Standard types (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.1 1.0 10.0 100.0 T810/SW T835/CW/BW TW Snubberless and Logic level types 1.8 1.6 C 1.4 1.2 1.0 0.8 B (dV/dt)c (V/µs) 0.6 0.4 0.1 1.0 (dV/dt)c (V/µs) 10.0 100.0 Figure 11. Relative variation of critical rate of decrease of main current versus junction temperature (dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 Figure 12. DPAK and D2PAK thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 100 90 80 70 60 50 40 30 20 D2PAK DPAK printed circuit board FR4, copper thickness: 35 µm Tj(°C) 0 0 25 50 75 100 125 10 0 0 4 8 12 16 S(cm²) 20 24 28 32 36 40 Doc ID 7472 Rev 7 5/12 Package information BTA08, BTB08 and T8 Series 2 Package information ● ● Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 Inches Min. 0.169 0.098 0.001 0.027 0.048 0.055 Typ. Max. 0.181 0.106 0.009 0.037 Typ. Max. 4.60 2.69 0.23 0.93 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0° 1.40 A1 A2 B D L L3 A1 B2 C C2 0.60 1.36 9.35 0.017 0.047 0.352 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 B2 B G C R D E 10.28 0.393 5.28 0.192 A2 2mm min. FLAT ZONE G L V2 15.85 0.590 1.40 1.75 0.050 0.055 L2 L3 R V2 8° 0° 8° Figure 13. Footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 6/12 Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series Table 7. DPAK dimensions Package information Dimensions Ref. Millimeters Min. A E B2 C2 L2 A Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 A1 A2 B B2 D H L4 B G A1 R C C2 R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° Figure 14. Footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 Doc ID 7472 Rev 7 7/12 Package information Table 8. IPAK dimensions BTA08, BTB08 and T8 Series Dimensions Ref. Millimeters Min. A A1 A3 A E B2 L2 C2 Inches Min. 0.086 0.035 0.027 0.025 0.204 Typ. Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.035 Typ. Max. 2.40 1.10 1.30 0.90 5.40 0.95 2.20 0.90 0.70 0.64 5.20 B B2 B3 B5 D 0.30 0.45 0.48 6 6.40 2.28 4.40 16.10 9 0.8 0.80 10° 9.40 1.20 1 0.354 0.031 4.60 0.173 0.60 0.60 6.20 6.60 0.017 0.019 0.236 0.252 C C2 0.023 0.023 0.244 0.260 0.090 0.181 0.634 0.370 0.047 0.031 0.039 10° H L L1 B3 B V1 A1 D E e C A3 e G B5 G H L L1 L2 V1 8/12 Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series TO-220AB (NIns. and Ins. 20-up) dimensions Package information Dimensions Ref. Millimeters Min. A a1 B ØI L F A I4 l3 a1 l2 c2 b2 C Inches Min. Typ. Max. 0.625 0.147 Typ. Max. 15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 2.40 6.20 3.75 15.90 0.598 a2 B b1 b2 C c1 c2 14.00 0.511 10.40 0.393 0.88 1.32 4.60 0.70 2.72 2.70 6.60 3.85 0.024 0.048 0.173 0.019 0.094 0.094 0.244 0.147 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 a2 e M F c1 b1 e ØI I4 L l2 l3 M 15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 1.14 2.60 2.95 1.70 1.70 0.104 0.044 0.044 0.102 0.116 0.066 0.066 Doc ID 7472 Rev 7 9/12 Ordering information BTA08, BTB08 and T8 Series 3 Ordering information Figure 15. Ordering information scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac series Insulation A = insulated B = non insulated Current 08 = 8A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level Packing mode RG = Tube BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Figure 16. Ordering information scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 8 = 8A Sensitivity 10 = 10 mA 35 = 35 mA Voltage 600 = 600 V 800 = 800 V Package B = DPAK H = IPAK G = D2PAK R = I2PAK Packing mode Blanck = Tube -TR = Tape and reel Table 9. Product Selector Voltage (xxx) Sensitivity 600 V 800 V X X X X X X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA 10 mA 10 mA 35 mA 35 mA 35 mA Standard Snubberless Standard Snubberless Logic level Logic Level Logic Level Logic Level Snubberless Snubberless Snubberless TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB D2PAK IPAK DPAK D2PAK IPAK X X X X X X X X X X X Type Package Part Number BTA/BTB08-xxxB BTA/BTB08-xxxBW BTA/BTB08-xxxC BTA/BTB08-xxxCW BTA/BTB08-xxxSW BTA/BTB08-xxxTW T810-xxxG T810-xxxH T835-xxxB T835-xxxG T835-xxxH BTB: non insulated TO-220AB package 10/12 Doc ID 7472 Rev 7 BTA08, BTB08 and T8 Series Ordering information 4 Ordering information Table 10. Ordering information Marking BTA/BTB08-xxxyz T8yyxx T8yyxx T8yyxx DPAK T8yy-xxxB-TR T8yy-xxxH T8yyxx T8yyxx IPAK 0.4 g 0.3 g 2500 75 Tape and reel Tube Package TO-220AB D2PAK Weight 2.3 g 1.5 g 1000 75 Tape and reel Tube Base qty Delivery mode 50 50 Tube Tube Order code BTA/BTB08-xxxyzRG T8yy-xxxG T8yy-xxxG-TR T8yy-xxxB xxx = voltage, yy = sensitivity, z = type 5 Revision history Table 11. Date Apr-2002 13-Feb-2006 10-Mar-2010 Document revision history Revision 5A 6 7 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Updated ECOPACK statement and Figure 16. Changes Doc ID 7472 Rev 7 11/12 BTA08, BTB08 and T8 Series Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12 Doc ID 7472 Rev 7