BZW04-23B

BZW04-5V8/376 BZW04-5V8B/376B ® TRANSILTM FEATURES ■ ■ ■ ■ ■ ■ PEAK PULSE POWER : 400 W (10/1000µs) STAND-OFF VOLTAGE RANGE : From 5.8V to 376 V UNI AND BIDIRECTIONAL TYPES LOW CLAMPING FACTOR FAST RESPONSE TIME UL RECOGNIZED DESCRIPTION Transil diodes provide high overvoltage protection by clamping action. Their instantaneous response to transient overvoltages makes them particularly suited to protect voltage sensitive devices such as MOS Technology and low voltage supplied IC’s. DO-15 ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Symbol Parameter Value Unit Peak pulse power dissipation (see note 1) Tj initial = Tamb 400 W Power dissipation on infinite heatsink Tamb = 75°C 1.7 W IFSM Non repetitive surge peak forward current for unidirectional types tp = 10ms Tj initial = Tamb 30 A Tstg Tj Storage temperature range Maximum junction temperature - 65 to + 175 175 °C °C TL Maximum lead temperature for soldering during 10s a 5mm from case. 230 °C PPP P Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCES Symbol Parameter Rth (j-l) Junction to leads Rth (j-a) Junction to ambient on printed circuit. February 2003- Ed : 3A Llead = 10 mm Value Unit 60 °C/W 100 °C/W 1/6 BZW04-xx ELECTRICAL CHARACTERISTICS (Tamb = 25°C) I IF Symbol Parameter VRM Stand-off voltage VBR Breakdown voltage VCL Clamping voltage IRM Leakage current @ VRM IPP Peak pulse current αT Voltage temperature coefficient VF Forward voltage drop Types VCL V RM V I PP IRM @ VRM VBR @ IR min µA VCL @ IPP max note2 Bidirectional VF I RM max Unidirectional VBR VCL @ IPP max 10/1000µs 8/20µs αT C max typ note3 note4 V V mA V A V A 10-4/°C pF BZW04-5V8 BZW04-5V8B 1000 5.8 6.45 10 10.5 38.0 13.4 174 5.7 3500 BZW04-6V4 BZW04-6V4B 500 6.4 7.13 10 11.3 35.4 14.5 160 6.1 3100 BZW04-8V5 BZW04-8V5B 10 8.5 9.5 1 14.5 27.6 18.6 124 7.3 2000 BZW04-10 BZW04-10B 5 10.2 11.4 1 16.7 24.0 21.7 106 7.8 1550 BZW04-13 BZW04-13B 5 12.8 14.3 1 21.2 19.0 27.2 85 8.4 1200 BZW04-15 BZW04-15B 1 15.3 17.1 1 25.2 16.0 32.5 71 8.8 975 BZW04-19 BZW04-19B 1 18.8 20.9 1 30.6 13.0 39.3 59 9.2 800 BZW04-20 BZW04-20B 1 20.5 22.8 1 33.2 12.0 42.8 54 9.4 725 BZW04-23 BZW04-23B 1 23.1 25.7 1 37.5 10.7 48.3 48 9.6 625 BZW04-26 BZW04-26B 1 25.6 28.5 1 41.5 9.6 53.5 43 9.7 575 BZW04-28 BZW04-28B 1 28.2 31.4 1 45.7 8.8 59.0 39 9.8 510 BZW04-31 BZW04-31B 1 30.8 34.2 1 49.9 8.0 64.3 36 9.6 480 BZW04-33 BZW04-33B 1 33.3 37.1 1 53.9 7.4 69.7 33 10.0 450 BZW04-40 BZW04-40B 1 40.2 44.7 1 64.8 6.2 84 27 10.1 370 BZW04-48 BZW04-48B 1 47.8 53.2 1 77.0 5.2 100 23 10.3 320 BZW04-58 BZW04-58B 1 58.1 64.6 1 92.0 4.3 121 19 10.4 270 BZW04-70 BZW04-70B 1 70.1 77.9 1 113 3.5 146 16.0 10.5 230 BZW04-85 BZW04-85B 1 85.5 95.0 1 137 2.9 178 13.0 10.6 200 BZW04-102 BZW04-102B 1 102 114 1 165 2.4 212 11.0 10.7 170 BZW04-128 BZW04-128B 1 128 143 1 207 2.0 265 9.0 10.8 145 BZW04-154 BZW04-154B 1 154 171 1 246 1.6 317 7.0 10.8 125 BZW04-171 BZW04-171B 1 171 190 1 274 1.5 353 6.5 10.8 120 BZW04-188 BZW04-188B 1 188 209 1 328 1.4 388 6.0 10.8 110 BZW04-213 BZW04-213B 1 231 237 1 344 1.5 442 5.2 11.0 100 BZW04-256 BZW04-256B 1 256 285 1 414 1.2 529 4.3 11.0 90 2/6 BZW04-xx Types IRM @ VRM VBR @ IR min max note2 Unidirectional Bidirectional µA VCL @ IPP VCL @ IPP max 10/1000µs 8/20µs αT C max typ note3 note4 V V mA V A V A 10-4/°C pF BZW04-273 BZW04-273B 1 273 304 1 438 1.2 564 4.0 11.0 85 BZW04-299 BZW04-299B 1 299 332 1 482 0.9 618 3.7 11.0 80 BZW04-342 BZW04-342B 1 342 380 1 548 0.9 706 3.2 11.0 75 BZW04-376B 1 376 418 1 603 0.8 776 3.0 11.0 70 BZW04-376 Fig. 1: Peak pulse power dissipation versus initial junction temperature (printed circuit board). % I PP 100 10 s PULSE WAVEFORM 10/1000 s 50 0 t 1000 s Note 2 : Note 3 : Note 4 : Pulse test: tp < 50 ms. ∆VBR = αT * (Tamb - 25) * VBR(25°C) VR = 0 V, F = 1 MHz. For bidirectional types, capacitance value is divided by 2 3/6 BZW04-xx Fig. 2 : Peak pulse power versus exponential pulse duration. PPP (W) 1E5 Tj initial = 25°C 1E4 1E3 1E2 tp (ms ) EXPO. 1E1 0.001 0.01 0.1 1 10 100 Fig. 3 : Clamping voltage versus peak pulse current. Exponential waveform tp = 20 µs________ tp = 1 ms——————tp = 10 ms............... VCL (V) 1000 % Ipp BWZ04 - 376 Tj initial = 25°C 100 BWZ04 - 213 50 0 tr t t t r < 10 s 100 BWZ04 - 33 10 BWZ04 - 8V5 BWZ04 - 5V8 Ipp (A) 1 0.1 1 10 100 1000 Note : The curves of the figure 3 are specified for a junction temperature of 25°C before surge. The given results may be extrapolated for other junction temperatures by using the following formula : ∆VBR = αT * (Tamb -25) * VBR (25°C). For intermediate voltages, extrapolate the given results. 4/6 BZW04-xx Fig. 4a: Capacitance versus reverse applied voltage for unidirectional types (typical values). Fig. 4b: Capacitance versus reverse applied voltage for bidirectional types (typical values). C (pF) C (pF) 10000 10000 BZW04 - 1000 BZW04 - 13 B Z W0 4 - 2 6 B ZW 0 4 - 5 8 100 BZW04 - 171 BZW04 - Tj = 25ø °C f = 1 MHz Tj = 25øC f = 1 MHz 5V8 BZW04 - 5V8B 1000 BZW04 - 13B BZW04 - 26B 342 100 BZW04 - 171B 10 10 10 1 100 Fig. 5: Peak forward voltage drop versus peak forward current (typical values for unidirectional types). Note : Multiply by 2 for units with VBR > 220V. V R (V) BZW04 - 342B V R (V) 1 1 BZW04 - 58B 10 100 Fig. 6: Transient thermal impedance junction ambient versus pulse duration (For FR4 PC Board with L lead = 10mm). Zth (j-a) (°C/W) 100 10 tp(s) 1 0.01 0.1 1 10 100 1000 Fig. 7 : Relative variation of leakage current versus junction temperature. 5/6 BZW04-xx ORDER BZW 04 - 10 B RL PACKAGING: ‘ ‘ = Ammopack tape ‘RL’ = Tape & reel 400W BIDIRECTIONAL No suffix: Unidirectional STAND-OFF VOLTAGE MARKING : Logo, Date Code, Type Code, Cathode Band (for unidirectional types only). PACKAGE MECHANICAL DATA DO-15 (Plastic) REF. DIMENSIONS Millimeters C D Inches C A B Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 Packaging: standard packaging is in tape and reel. Weight = 0.4 g. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 6/6